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LTC485 (Low Power RS485 Interface Tranceiver - Linear Technologies
LTC485 (Low Power RS485 Interface Tranceiver - Linear Technologies
TYPICAL APPLICATION
Driver Outputs
RO1 VCC1
R
RE1 A
Rt
DE1
DI1 D GND1
Rt
RO2 VCC2
R
RE2
DE2 B
DI2 D GND2
485 TA01a
485 TA01b
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LTC485
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION
(Note 1)
TOP VIEW
Supply Voltage ..........................................................12V
Control Input Voltages .....................–0.5V to VCC + 0.5V RO 1
R
8 VCC
ORDER INFORMATION
LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE
LTC485CN8#PBF LTC485CN8#TRPBF LTC485CN8 8-Lead Plastic DIP 0°C to 70°C
LTC485CS8#PBF LTC485CS8#TRPBF 485 8-Lead Plastic SOIC 0°C to 70°C
LTC485IN8#PBF LTC485IN8#TRPBF LTC485IN8 8-Lead Plastic DIP –40°C to 85°C
LTC485IS8#PBF LTC485IS8#TRPBF 485I 8-Lead Plastic SOIC –40°C to 85°C
LTC485MJ8#PBF LTC485MJ8#TRPBF LTC485MJ8 8-Lead Ceramic DIP –55°C to 125°C
LEAD BASED FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE
LTC485CN8 LTC485CN8#TR LTC485CN8 8-Lead Plastic DIP 0°C to 70°C
LTC485CS8 LTC485CS8#TR 485 8-Lead Plastic SOIC 0°C to 70°C
LTC485IN8 LTC485IN8#TR LTC485IN8 8-Lead Plastic DIP –40°C to 85°C
LTC485IS8 LTC485IS8#TR 485I 8-Lead Plastic SOIC –40°C to 85°C
LTC485MJ8 LTC485MJ8#TR LTC485MJ8 8-Lead Ceramic DIP –55°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VCC = 5V ±5%, unless otherwise noted. (Notes 2 and 3)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
VOD1 Differential Driver Output Voltage (Unloaded) IO = 0 l 5 V
VOD2 Differential Driver Output Voltage (with Load) R = 50Ω (RS422) l 2 V
R = 27Ω (RS485), Figure 1 l 1.5 5 V
ΔVOD Change in Magnitude of Driver Differential R = 27Ω or R = 50Ω, Figure 1 l 0.2 V
Output Voltage for Complementary States
VOC Driver Common Mode Output Voltage R = 27Ω or R = 50Ω, Figure 1 l 3 V
Δ|VOC| Change in Magnitude of Driver Common Mode R = 27Ω or R = 50Ω, Figure 1 l 0.2 V
Output Voltage for Complementary States
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LTC485
ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VCC = 5V ±5%, unless otherwise noted. (Notes 2 and 3)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
VIH Input High Voltage DE, DI, RE l 2 V
VIL Input Low Voltage DE, DI, RE l 0.8 V
IIN1 Input Current DE, DI, RE l ±2 μA
IIN2 Input Current (A, B) DE = 0, VCC = 0V or 5.25V VIN = 12V l ±1 mA
VIN = –7V l –0.8 mA
VTH Differential Input Threshold Voltage for Receiver –7V ≤ VCM ≤ 12V l –0.2 0.2 V
ΔVTH Receiver Input Hysteresis VCM = 0V l 70 mV
VOH Receiver Output High Voltage IO = –4mA, VID = 200mV l 3.5 V
VOL Receiver Output Low Voltage IO = 4mA, VID = –200mV l 0.4 V
IOZR Three-State (High Impedance) Output Current VCC = Max, 0.4V ≤ VO ≤ 2.4V l ±1 μA
at Receiver
RIN Receiver Input Resistance –7V ≤ VCM ≤ 12V l 12 kΩ
SWITCHING CHARACTERISTICS The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VCC = 5V ±5%, unless otherwise noted. (Notes 2 and 3)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
ICC Supply Current No Load, Pins 2, 3, 4 = 0V or 5V Outputs Enabled l 500 900 μA
Outputs Disabled l 300 500 μA
IOSD1 Driver Short-Circuit Current, VOUT = HIGH VO = – 7V l 35 100 250 mA
IOSD2 Driver Short-Circuit Current, VOUT = LOW VO = 10V l 35 100 250 mA
IOSR Receiver Short-Circuit Current 0V ≤ VO ≤ VCC l 7 85 mA
tPLH Driver Input to Output RDIFF = 54Ω, CL1 = CL2 = 100pF, l 10 30 50 ns
tPHL Driver Input to Output (Figures 3 and 5) l 10 30 50 ns
tSKEW Driver Output to Output l 5 10 ns
tr, tf Driver Rise or Fall Time l 3 15 25 ns
tZH Driver Enable to Output High CL = 100pF (Figures 4 and 6) S2 Closed l 40 70 ns
tZL Driver Enable to Output Low CL = 100pF (Figures 4 and 6) S1 Closed l 40 70 ns
tLZ Driver Disable Time from Low CL = 15pF (Figures 4 and 6) S1 Closed l 40 70 ns
tHZ Driver Disable Time from High CL = 15pF (Figures 4 and 6) S2 Closed l 40 70 ns
tPLH Receiver Input to Output RDIFF = 54Ω, CL1 = CL2 = 100pF, l 30 90 200 ns
tPHL (Figures 3 and 7) l 30 90 200 ns
tSKD |tPLH – tPHL| Differential Receiver Skew l 13 ns
tZL Receiver Enable to Output Low CRL = 15pF (Figures 2 and 8) S1 Closed l 20 50 ns
tZH Receiver Enable to Output High CRL = 15pF (Figures 2 and 8) S2 Closed l 20 50 ns
tLZ Receiver Disable from Low CRL = 15pF (Figures 2 and 8) S1 Closed l 20 50 ns
tHZ Receiver Disable from High CRL = 15pF (Figures 2 and 8) S2 Closed l 20 50 ns
Note 1: Stresses beyond those listed under Absolute Maximum Ratings Note 3: All typicals are given for VCC = 5V and TA = 25°C.
may cause permanent damage to the device. Exposure to any Absolute Note 4: The LTC485 is guaranteed by design to be functional over a supply
Maximum Rating condition for extended periods may affect device voltage range of 5V ±10%. Data sheet parameters are guaranteed over the
reliability and lifetime. tested supply voltage range of 5V ±5%.
Note 2: All currents into device pins are positive; all currents out ot device
pins are negative. All voltages are referenced to device ground unless
otherwise specified.
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LTC485
TYPICAL PERFORMANCE CHARACTERISTICS
Receiver Output Low Voltage Receiver Output High Voltage Receiver Output High Voltage
vs Output Current vs Output Current vs Temperature
36 –18 4.8
TA = 25°C TA = 25°C I = 8mA
32 –16 4.6
28 –14 4.4
OUTPUT CURRENT (mA)
20 –10 4.0
16 –8 3.8
12 –6 3.6
8 –4 3.4
4 –2 3.2
0 0 3.0
0 0.5 1.0 1.5 2.0 5 4 3 2 –50 –25 0 25 50 75 100 125
OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) TEMPERATURE (°C)
485 G01 485 G02 485 G03
Receiver Output Low Voltage Driver Differential Output Voltage Driver Differential Output Voltage
vs Temperature vs Output Current vs Temperature
0.9 72 2.4
I = 8mA TA = 25°C RI = 54Ω
0.8 64 2.3
0.6 48 2.1
0.5 40 2.0
0.4 32 1.9
0.3 24 1.8
0.2 16 1.7
0.1 8 1.6
0 0 1.5
–50 –25 0 25 50 75 100 125 0 1 2 3 4 –50 –25 0 25 50 75 100 125
TEMPERATURE (°C) OUTPUT VOLTAGE (V) TEMPERATURE (°C)
485 G04 485 G05 485 G06
Driver Output Low Voltage Driver Output High Voltage TTL Input Threshold
vs Output Current vs Output Current vs Temperature
90 –108 1.64
TA = 25°C TA = 25°C
80 –96 1.63
INPUT THRESHOLD VOLTAGE (V)
70 –84 1.62
OUTPUT CURRENT (mA)
60 –72 1.61
50 –60 1.60
40 –48 1.59
30 –36 1.58
20 –24 1.57
10 –12 1.56
0 0 1.55
0 1 2 3 4 0 1 2 3 4 –50 –25 0 25 50 75 100 125
OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) TEMPERATURE (°C)
485 G07 485 G08 485 G09
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LTC485
TYPICAL PERFORMANCE CHARACTERISTICS
Receiver |tPLH – tPHL|
vs Temperature Driver Skew vs Temperature Supply Current vs Temperature
7.5 5.4 640
TIME (ns)
5.5 3.0 400
5.0 2.4 340
DRIVER DISABLED
4.5 1.8 280
4.0 1.2 220
3.0 0 100
–50 –25 0 25 50 75 100 125 –50 –25 0 25 50 75 100 125 –50 –25 0 25 50 75 100 125
TEMPERATURE (°C) TEMPERATURE (°C) TEMPERATURE (°C)
485 G10 485 G11 485 G12
PIN FUNCTIONS
RO (Pin 1): Receiver Output. If the receiver output is en- DI (Pin 4): Driver Input. If the driver outputs are enabled
abled (RE low), then if A > B by 200mV, RO will be high. (DE high), then a low on DI forces the outputs A low and
If A < B by 200mV, then RO will be low. B high. A high on DI with the driver outputs enabled will
RE (Pin 2): Receiver Output Enable. A low enables the force A high and B low.
receiver output, RO. A high input forces the receiver output GND (Pin 5): Ground Connection.
into a high impedance state.
A (Pin 6): Driver Output/Receiver Input.
DE (Pin 3): Driver Outputs Enable. A high on DE enables
B (Pin 7): Driver Output/Receiver Input.
the driver output. A and B, and the chip will function as a
line driver. A low input will force the driver outputs into a VCC (Pin 8): Positive Supply; 4.75 < VCC < 5.25.
high impedance state and the chip will function as a line
receiver.
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LTC485
TEST CIRCUITS
A
TEST POINT S1
R 1k
RECEIVER VCC
OUTPUT
VOD
CRL 1k
S2
15pF
R VOC
485 F02
B
485 F01
3V
DE
A S1
A CL1
DI RO VCC
RDIFF 5007
B OUTPUT
B CL2 RE UNDER TEST S2
15pF CL
Figure 3. Driver/Receiver Timing Test Circuit Figure 4. Driver Timing Test Load #2
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LTC485
SWITCHING TIME WAVEFORMS
3V
DI 1.5V f = 1MHz, tr ≤ 10ns, tf ≤ 10ns 1.5V
0V
tZL tLZ
5V
A, B 2.3V OUTPUT NORMALLY LOW 0.5V
VOL
VOH
OUTPUT NORMALLY HIGH 0.5V
A, B 2.3V
0V
tZH tHZ 485 F06
VOH
R 1.5V OUTPUT 1.5V
VOL
tPHL f = 1MHz, tr ≤ 10ns, tf ≤ 10ns tPLH
VOD2
A, B 0V INPUT
–VOD2 485 F07
3V
RE 1.5V f = 1MHz, tr ≤ 10ns, tf ≤ 10ns 1.5V
0V
tZL tLZ
5V
R 1.5V OUTPUT NORMALLY LOW 0.5V
FUNCTION TABLES
LTC485 Transmitting LTC485 Receiving
INPUTS OUTPUTS INPUTS OUTPUTS
LINE
RE DE DI CONDITION B A RE DE A–B R
1 1 N Ft 0 1 0 0 0.2V 1
1 0 N Ft 1 0 0 0 ≤ –0.2V 0
0 0 0 Inputs Open 1
1 Ft 1 0 X Z
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LTC485
APPLICATIONS INFORMATION
Basic Theory of Operation (D1) or the N + /P-substrate diode (D2) respectively will
turn on and clamp the output to the supply. Thus, the output
Previous RS485 transceivers have been designed using
stage is no longer in a high impedance state and is not
bipolar technology because the common mode range
able to meet the RS485 common mode range requirement.
of the device must extend beyond the supplies and the
In addition, the large amount of current flowing through
device must be immune to ESD damage and latchup.
either diode will induce the well known CMOS latchup
Unfortunately, the bipolar devices draw a large amount of
condition, which could destroy the device.
supply current, which is unacceptable for the numerous
applications that require low power consumption. The The LTC485 output stage of Figure 9 eliminates these
LTC485 is the first CMOS RS485/RS422 transceiver which problems by adding two Schottky diodes, SD3 and SD4.
features ultralow power consumption without sacrificing The Schottky diodes are fabricated by a proprietary modi-
ESD and latchup immunity. fication to the standard N-well CMOS process. When the
output stage is operating normally, the Schottky diodes
The LTC485 uses a proprietary driver output stage, which
are forward biased and have a small voltage drop across
allows a common-mode range that extends beyond the
them. When the output is in the high impedance state and
power supplies while virtually eliminating latchup and
is driven above VCC or below ground, the parasitic diodes
providing excellent ESD protection. Figure 9 shows the
D1 or D2 still turn on, but SD3 or SD4 will reverse bias
LTC485 output stage while Figure 10 shows a conventional
and prevent current from flowing into the N-well or the
CMOS output stage.
substrate. Thus, the high impedance state is maintained
When the conventional CMOS output stage of Figure 10 even with the output voltage beyond the supplies. With
enters a high impedance state, both the P-channel (P1) no minority carrier current flowing into the N-well or
and the N-channel (N1) are turned off. If the output is then substrate, latchup is virtually eliminated under power-up
driven above VCC or below ground, the P + /N-well diode or power-down conditions.
VCC
VCC
SD3
P1 P1
D1 D1
OUTPUT
LOGIC LOGIC OUTPUT
SD4
N1 D2 N1 D2
Figure 9. LTC485 Output Stage Figure 10. Conventional CMOS Output Stage
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LTC485
APPLICATIONS INFORMATION
The LTC485 output stage will maintain a high impedance Propagation Delay
state until the breakdown of the N-channel or P-channel
Many digital encoding schemes are dependent upon the
is reached when going positive or negative respectively.
difference in the propagation delay times of the driver and
The output will be clamped to either VCC or ground by a
the receiver. Using the test circuit of Figure 13, Figures 11
Zener voltage plus a Schottky diode drop, but this voltage
and 12 show the typical LTC485 receiver propagation
is way beyond the RS485 operating range. This clamp
delay.
protects the MOS gates from ESD voltages well over
2000V. Because the ESD injected current in the N-well or The receiver delay times are:
substrate consists of majority carriers, latchup is prevented |tPLH – tPHL| = 9ns Typ, VCC = 5V
by careful layout techniques.
The driver skew times are:
Skew = 5ns Typ, VCC = 5V
10ns Max, VCC = 5V, TA = –40°C to 85°C
A A
DRIVER DRIVER
OUTPUTS OUTPUTS
B B
RECEIVER RECEIVER
RO RO
OUTPUTS OUTPUTS
100pF
BR
RECEIVER
TTL IN D R
R OUT
tr, tf < 6ns 100Ω
485 F13
100pF
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LTC485
APPLICATIONS INFORMATION
LTC485 Line Length vs Data Rate Figures 17 and 18 show that the LTC485 is able to com-
fortably drive 4000 feet of wire at 110kHz.
The maximum line length allowable for the RS422/RS485
standard is 4000 feet.
100Ω RO
A C COMMON MODE
TTL VOLTAGE (A + B)/2
LTC485 LTC485
D OUT
B
4000 FT 26AWG
NOISE
TTL TWISTED PAIR
GENERATOR
IN DI
485 F14
485 F17
Figure 14. Line Length Test Circuit
Figure 17. System Common Mode Voltage at 110kHz
Using the test circuit in Figure 14, Figures 15 and 16 show
that with ~20VP-P common mode noise injected on the
line, The LTC485 is able to reconstruct the data stream at
RO
the end of 4000 feet of twisted pair wire. COMMON MODE
VOLTAGE (A – B)
DI
RO
COMMON MODE
VOLTAGE (A + B)/2
485 F18
1k
RO
DIFFERENTIAL
VOLTAGE A – B
100
DI
10
10k 100k 1M 2.5M 10M
MAXIMUM DATA RATE
485 F16
485 F19
Figure 16. System Differential Voltage at 19.2kHz Figure 19. Cable Length vs Maximum Data Rate
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LTC485
TYPICAL APPLICATION
Typical RS485 Network
Rt Rt
485 TA02
PACKAGE DESCRIPTION
J8 Package
8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110)
.015 – .060
(0.381 – 1.524)
.008 – .018
0° – 15°
(0.203 – 0.457)
.045 – .065
.125
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE (1.143 – 1.651)
OR TIN PLATE LEADS 3.175
.014 – .026 MIN
.100
(0.360 – 0.660) (2.54)
BSC J8 0801
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LTC485
PACKAGE DESCRIPTION
N8 Package
8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510)
.400*
(10.160)
MAX
8 7 6 5
.255 ± .015*
(6.477 ± 0.381)
1 2 3 4
.065
(1.651)
.008 – .015 TYP
(0.203 – 0.381) .120
(3.048) .020
+.035 MIN (0.508)
.325 –.015
.018 ± .003 MIN
( )
.100
+0.889
8.255 (2.54) (0.457 ± 0.076)
–0.381 N8 1002
BSC
NOTE:
INCHES
1. DIMENSIONS ARE
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
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LTC485
PACKAGE DESCRIPTION
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
.189 – .197
.045 ±.005 (4.801 – 5.004)
.050 BSC NOTE 3
8 7 6 5
.245
MIN .160 ±.005
.150 – .157
.228 – .244
(3.810 – 3.988)
(5.791 – 6.197)
NOTE 3
.030 ±.005
TYP
1 2 3 4
RECOMMENDED SOLDER PAD LAYOUT
.010 – .020
× 45° .053 – .069
(0.254 – 0.508)
(1.346 – 1.752)
.004 – .010
.008 – .010
0°– 8° TYP (0.101 – 0.254)
(0.203 – 0.254)
.016 – .050
.014 – .019 .050
(0.406 – 1.270)
(0.355 – 0.483) (1.270)
NOTE: TYP BSC
INCHES
1. DIMENSIONS IN
(MILLIMETERS)
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm) SO8 0303
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Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
LTC485
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