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Slurry Pump Effects On Distribution and Point of Use CMP Systems
Slurry Pump Effects On Distribution and Point of Use CMP Systems
Slurry Pump Effects On Distribution and Point of Use CMP Systems
2/16/06
09/2003
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Agenda
Part 1 – Distribution Pump Systems
z Filter Efficiency
09/2003
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Agenda
Part 2 – Point of Use Pump Sytems
z Peristaltic Pumps vs. BPS1
z Pressure Affects on Peristaltic Pumps
z Novellus Momentum® Study
– Peristaltic Pump Linearity
– Uniformity & MRR Curves
– Discussion
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Part 1
09/2003
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Bellows Pump Distribution
Configuration
Polisher 3
Recirculation
Bellows Pump Polisher 2
Slurry Distribution System
Loop Filtration System Polisher 1
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Levitronix Distribution Configuration
Polisher 5
Polisher x
From Blending Polisher 4
System Point of Use Polish Heads
Slurry Pumps Polisher 3
Polisher 2
Recirculation
Loop Filtration System Polisher 1
Slurry Distribution
System
Levitronix®
Pump
09/2003
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Slurry Delivery System Large Particle Data
Slurry Distribution Particle Performance
09/2003
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Slurry Delivery System Particle Data
Slurry Distribution Particle Performance
09/2003
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Filter Efficiency
Bellows Pump vs. Levitronix® BPS3
09/2003
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Part 2
09/2003
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Peristaltic Pumps
Benefits
z Simple Design
z Self Priming
z Proven System
Disadvantages
z Flow Surging
z Tubing Particles Shed Into Slurry Stream, Causing Wafer Scratches
z High Maintenance
z Requires Frequent Recalibrations
z Output Flow Dependant on Input Pressure
z Requires Expensive Consumable Pump Tubing
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BPS1 Closed Loop Flow Control
System
Benefits
z Increased Process Flow Rate Accuracy
– Process Flow Rates Independent of Loop Filter Loading
– Process Flow Rates Independent of Distribution Slurry Demand
z Constant Pressure
z Lower Maintenance
z Decreased Downtime
z Eliminates a Consumable Item
z Eliminates Tubing Particle Shedding Into Slurry Stream
z Increased Filter Lifetime
Disadvantages
z Increases System Complexity
z Not Self Priming
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Peristaltic Pumps vs. BPS1
Peristaltic Pump System Levitronix® Closed Loop Flow Control Pump System
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Pressure Affects on Peristaltic Pumps
10.9PSI
10.9PSI
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Novellus Momentum®
Closed Loop Flow Control
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Peristaltic Pump Linearity
Commanded Flow Rate vs. Actual Flow Rate
z 2-Point Calibrated Peristaltic Pump System
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Uniformity & MRR Curves
Peristaltic Pump Removal Rate / Uniformity Curves
09/2003
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Uniformity & MRR Curves
BPS1 Pump Removal Rate / Uniformity Curves
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Peristaltic Pumps vs. BPS1
Oxide Removal Rate / Uniformity Curves
Uniformity Divergence
Under 80mL/min
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Discussion – Uniformity Theory
Slurry flow surging causes variable spatial distributions
between the wafer surface, polish pad, and polish particles.
Flow accuracies of both pump systems are accurate. The
most significant difference is flow surging.
Wafer
Wafer
Slurry
Polish Slurry Polish Particles
Pad Particles Pad
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AMAT MirraMesa®
Closed Loop Flow Control
09/2003
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Peristaltic Pump Linearity
Commanded Flow Rate vs. Actual Flow Rate
z 7-Point Calibrated Peristaltic Pump System
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Uniformity & MRR Curves
Copper Removal Rate / Uniformity Curves
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Uniformity & MRR Curves
Barrier Removal Rate / Uniformity Curves
Uniformity Divergence
under 100mL/min
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Discussion – Uniformity / MRR Theory
MRR and NU divergences occur at low slurry flow
rates.
Slurry flow rate is a major variable for removal rate.
Below 80 mL/min, the peristaltic pump does not
supply the process a constant slurry flow to keep
the process stable.
Peristaltic Pump Rotation Angle vs. Flow
Rate - 200 mL/min Example
300
Flow Rate
250
200
150
100
50
0
12
48
84
120
156
192
228
264
300
336
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Acknowledgements
Benno Milmore, Process Engineer, LSI Logic® Manufacturing
Services, Inc.
Reto Schoeb, CEO, Levitronix®
Rob Stitz, Controls Engineer, Levitronix®.
Gary Rawson, Technologies North America.
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