21 On-Line Study of PCB Design – 1

22. On-Line Study of PCB Design – 2

23. On-Line Study of Arduino Program – 1 & 2
24. On-Line Study of Arduino Program – 3 & 4
25. On-Line Study of Arduino Program – 5 & 6
26. On-Line Study of Arduino Program – 7 & 8
27. On-Line Study of 8051 Microcontroller Program – 1 & 2
28. On-Line Study of 8051 Microcontroller Program – 3 & 4
29. On-Line Study of PLC FBD Program – 1 & 2
30. On-Line Study of PLC FBD Program – 3 & 4
 INDEX

SR. No: Name of the Topic: Page No:

1. 21 On-Line Study of PCB Design – 1 1 to 3
2. 22. On-Line Study of PCB Design – 2 4 to 6
3. 23. On-Line Study of Arduino Program – 1 & 2 7 and 8
4. 24. On-Line Study of Arduino Program – 3 & 4 9 and10
5. 25. On-Line Study of Arduino Program – 5 & 6 11 and 12
6. 26. On-Line Study of Arduino Program – 7 & 8 13 to 16
7. 27. On-Line Study of 8051 Microcontroller 17 and 18
Program – 1 & 2
8. 28. On-Line Study of 8051 Microcontroller 19 and 20
Program – 3 & 4
21 On-Line Study of PCB Design – 1:

Printed circuit boards (PCBs) have become a fundamental staple at the heart of most
electronic systems. In this new series, Robert examines the important aspects that are
critical to good PCB design. Here in Part 1, he shares the step-by-step method he uses to
design four-layer PCBs.
A PCB is a structure that supports and interconnects all kinds of electronic components.
These interconnections are made using pads and traces etched on copper sheets. These
copper sheets are laminated onto a non-conductive substrate, and are interconnected
using metallized through-holes and vias. As you probably know, a PCB can support either
through-hole or surface-mounted components (Figure). Through-hole parts have wire
leads, which pass through the board and are soldered on the other side. Surface-mount
parts have pins that are soldered directly to copper pads on the same side of the board. Of
course, a board may have both variants at the same time—even though this makes
assembly take longer.

Ground system consists of four parts: analog ground, digital ground, enclosure
ground and system ground. A proper grounding design can shield out most
interference, which is very important in electrical equipment.

Page No: 1
Choose a reasonable grounding method. Multi-point grounding and single-point
grounding are two different ways of grounding, that is, we need to choose which one to
use according to the actual situation. When the operating frequency of the equipment
exceeds 10 Mhz, the ground wire impedance value is relatively large because of the
influence of electromagnetic radiation, which directly affects the normal operation of the
equipment. At this time, we should choose the multi-point grounding mode to eliminate
the adverse effects. When the operating frequency of the equipment is lower than 1 MHz,
single point grounding mode should be electromagnetic circulation. When the operating
frequency of the equipment is lower than 1-10 MHz, the grounding mode shall be selected
by referring to the circuit wavelength and ground line length. When the wavelength is less
than 20 times of the ground line length, multi-point grounding shall be selected;
otherwise, single point grounding shall be adopted.

Separate circuits of different properties. The circuit distribution on the circuit board is
very complex. Fox example, there are maybe not only analog circuits but also digital
circuits on the PCB board, the right way is to avoid the mutual interference is to separate
them. The design of separate ground modes can effectively avoid the electromagnetic
interference between each other.

Page No: 2
The cross section of the ground wire should be wide and thick. The selection of grounding
wire with cross section width of 3 mm or more can avoid the instability of grounding
potential caused by the change of current and effectively improve the equipment's anti-
noise performance. Therefore, the wide and thick grounding conductor should be selected
as far as possible.

Page No: 3
22. On-Line Study of PCB Design – 2:

Is the second of a three-part series on printed circuit boards (PCBs). In my previous

column “Understanding Proper PCB Design (Part 1)” (Circuit Cellar 367, February 2021), I
explained why 4-layer PCBs—the simplest form of multilayer PCBs—are ubiquitous, and
how to design them. However, I voluntarily skipped two important and linked subjects:
the PCB layered structure itself and the vertical conductive holes, called “vias,” that make
connections between layers.

A PCB is a laminated stack of dielectric and copper layers. The simplest ones use a single
dielectric layer and 1 or 2 copper layers (single- or double-side). These are inexpensive,
and can be homemade easily, but are limited in terms of both density of connections and
EMC performance. That’s why the vast majority of medium- to high-complexity projects
are using a multilayer PCB. Such circuits can have 4, 6, 8 or even more than 40 layers
(Figure).

Like simple, double-side PCBs, each external copper layer of a multilayer PCB is
chemically etched to make copper pads on which components will be soldered, and traces
interconnecting these pads as required. Moreover, each internal copper layer is also
etched to make additional connections, including ground planes or power distribution
planes. All these layers will be interconnected by vias, and this will form the full wiring of
the design.

One vocabulary note: When talking about dense PCBs, you will often hear the name HDI.
This will be the case especially when using fine-pitch or ball-grid-array (BGA)
components. HDI means “High Density Interconnect,” which is just a way to say that the
PCB will need to have finer copper traces and spaces than usual, and probably very small
holes too. I’m not sure if there is a shared definition of HDI among designers, but the IPC
association defined HDI in its IPC-2226 standard. It is described as a PCB that uses either
copper lines and spaces smaller than 0.1mm or vias of 0.15mm or less. Usually, HDI
boards also use some fancy via types, which I will describe in more detail later.

Page No: 4
Assume that you need a simple 4-layer PCB for your next great project. How will it be
manufactured? Probably, the manufacturer will start with a core, which is nothing more
than a thin double-side PCB (or more precisely a rigid dielectric layer with copper foils on
both sides). The two copper sides are etched, then two thin layers of dielectric are added
on both sides, followed by two more copper foils (Figure, top). These additional layers of
dielectric are called “prepreg,” and are typically woven glass cloth of precise thickness
impregnated with epoxy resin. The stack of panels is then placed under a heated hydraulic
press.

After solidification, the assembly is drilled, plated and etched again to get traces on top
and bottom layers.
Page No: 5
Page No: 6
23. On-Line Study of Arduino Program – 1 & 2:

Arduino Program 1.

This Arduino Program generates delay by Toggling Output at Pin 13 , by making ON Time
of 5 Seconds & OFF Time of 5 Seconds for ON - Board LED connected at Pin No. 13.

Arduino Program 2:

This Arduino Program generates delay by Toggling Output at Pin 12 , by making ON Time
of 400 milli-Seconds & OFF Time of 100 milli-Second for External LED connected at Pin
No. 12 ( i.e. To Make 80 % Duty Cycle ) .

Page No: 7
Page No: 8
24. On-Line Study of Arduino Program – 3 & 4:

Arduino Program 3:

This Arduino Program generates delay by Toggling Output at Pin 10 , by making ON Time
of 5 mile-Seconds & OFF Time of 20 miled-Second at Pin No. 10 ( i.e. To Make 20 % Duty
Cycle ) . We need to see the Output on Oscilloscope for observing such a High-Speed
Signals, which cannot be seen by our naked eyes, since limitations of persistence vision of
eyes).

Arduino Program 4

This Arduino Program generates delay by Toggling Output at Pin 13 by assigning name
“LED1” to Pin No. 13 before starting the void setup() and by making ON Time of 2 Seconds
& OFF Time of 2 Seconds for ON - Board LED connected at Pin No. 13.

Page No: 9
Page No: 10
25. On-Line Study of Arduino Program – 5 & 6:

Arduino Program 5

This Arduino Program generates delay by Toggling Multiple Outputs at Pin Nos. 11 & 12
by assigning name “LED1” to Pin No. 11 and “LED2” to Pin No.12 , before starting the void
setup() and by making ON Time of 5 Seconds & OFF Time of 5 Seconds for both the
External LEDs connected at Pin No. 11 & 12.

Arduino Program 6:

The first part of the sketch defines three variable for the three pins that are to be used.
The 'ledPin' is the output pin and 'buttonApin' will refer to the switch nearer the top of the
breadboard and 'buttonBpin' to the other switch. The ‘setup’ function defines the ledPin as
being an OUTPUT as normal, but now we have the two inputs to deal with. In this case, we
use the set the pinMode to be ‘INPUT_PULLUP’ like this:

Page No: 11
/*

Adafruit Arduino - Lesson 6. Inputs

*/

int ledPin = 5;

int buttonApin = 9;

int buttonBpin = 8;

byte leds = 0;

void setup()

pinMode(ledPin, OUTPUT);

pinMode(buttonApin, INPUT_PULLUP);

pinMode(buttonBpin, INPUT_PULLUP);

void loop()

if (digitalRead(buttonApin) == LOW)

digitalWrite(ledPin, HIGH);

if (digitalRead(buttonBpin) == LOW)

digitalWrite(ledPin, LOW);

Page No: 12
26. On-Line Study of Arduino Program – 7 & 8:

Arduino Program 7

Seven segment displays are used in common household appliances like microwave ovens,
washing machines, and air conditioners. They’re a simple and effective way to display
numerical information like sensor readings, time, or quantities. In this tutorial, we’ll see
how to set up and program single digit and multi-digit seven segment displays on
an Arduino.

Arduino Program 8:

It's easy to understand it. Code repeats itself. All you need is build the project as seen
on image. Upload the code to Arduino and watch the LEDs blink one after another.

Page No: 13
int ledPin = 13;
int ledPin1 = 12;
int ledPin2 = 11;
int ledPin3 = 10;
int ledPin4 = 9;
int ledPin5 = 8;
int ledPin6 = 7;
int ledPin7 = 6;
/*

*/

void setup() {
pinMode(ledPin, OUTPUT);
pinMode(ledPin1, OUTPUT);
pinMode(ledPin2, OUTPUT);
pinMode(ledPin3, OUTPUT);
pinMode(ledPin4, OUTPUT);
pinMode(ledPin5, OUTPUT);
pinMode(ledPin6, OUTPUT);
pinMode(ledPin7, OUTPUT);
}

void loop() {
digitalWrite(ledPin, HIGH);
delay(50);
digitalWrite(ledPin, LOW);
delay(50);
digitalWrite(ledPin1, HIGH);
delay(50);
digitalWrite(ledPin1, LOW);
delay(50);
digitalWrite(ledPin2, HIGH);
delay(50);
digitalWrite(ledPin2, LOW);
delay(50);

digitalWrite(ledPin3, HIGH);
delay(50);
digitalWrite(ledPin3, LOW);
delay(50);
digitalWrite(ledPin4, HIGH);
Page No: 14
delay(50);
digitalWrite(ledPin4, LOW);
delay(50);
digitalWrite(ledPin5, HIGH);
delay(50);
digitalWrite(ledPin5, LOW);
delay(50);
digitalWrite(ledPin6, HIGH);
delay(50);
digitalWrite(ledPin6, LOW);
delay(50);
digitalWrite(ledPin7, HIGH);
delay(50);
digitalWrite(ledPin7, LOW);
delay(50);
digitalWrite(ledPin7, HIGH);
delay(50);
digitalWrite(ledPin7, LOW);
delay(50);
digitalWrite(ledPin6, HIGH);
delay(50);
digitalWrite(ledPin6, LOW);
delay(50);
digitalWrite(ledPin5, HIGH);
delay(50);
digitalWrite(ledPin5, LOW);
delay(50);
digitalWrite(ledPin4, HIGH);
delay(50);
digitalWrite(ledPin4, LOW);
delay(50);

digitalWrite(ledPin3, HIGH);
delay(50);
digitalWrite(ledPin3, LOW);
delay(50);
digitalWrite(ledPin2, HIGH);
delay(50);
digitalWrite(ledPin2, LOW);
delay(50);
digitalWrite(ledPin1, HIGH);
delay(50);
Page No: 15
digitalWrite(ledPin1, LOW);
delay(50);
digitalWrite(ledPin, HIGH);
delay(50);
digitalWrite(ledPin, LOW);
delay(50);

Page No: 16
27. On-Line Study of 8051 Microcontroller Program – 1 & 2:

8051 Microcontroller Program – 1

Toggling the Byte Data at Port 1 Output by complementing the Byte Data in Accumulator ,
when Data in the Accumulator is initialized with 55 Hex value , which is outside the LOOP.

8051 Microcontroller Program – 2

Toggling the Single Bit Data at Port Pin 1.7 Output by complementing the CARRY Flag.

Page No: 17
Page No: 18
28. On-Line Study of 8051 Microcontroller Program – 3 & 4:
8051 Microcontroller Program – 3

Program for Testing All I/O Port Pins of 8051 Microcontroller by Toggling all the Port
Outputs with Delay Generation Logic (With Relatively Smaller Delay) .

8051 Microcontroller Program – 4

Program for Testing All I/O Port Pins of 8051 Microcontroller by Toggling all the Port
Outputs with Delay Generation Logic ( With Relatively Larger Delay ) .

Page No: 19
Page No: 20
29. On-Line Study of PLC FBD Program – 1 & 2:

PLC FBD Program – 1

[1] When Inputs I1 =I2 = OFF,

Then Outputs O1 = OFF.

When Inputs I1 = OFF and I2 = ON,

Then Outputs O1 = ON.

Page No: 21
PLC FBD Program – 2

When Inputs I1 = ON and I2 = OFF,

Then Outputs O1 = ON.

When Inputs I1 = ON and I2 = ON,

Then Outputs O1 = ON.

Page No: 22
30. On-Line Study of PLC FBD Program – 3 & 4
PLC FBD Program – 3

When Inputs I1 =I2 = OFF,

Then Outputs O1 = OFF.

When Inputs I1 = OFF and I2 = ON,

Then Outputs O1 = OFF.

PLC FBD Program – 4

When Inputs I1 = ON and I2 = OFF,

Then Outputs O1 = OFF.

Page No: 23
When Inputs I1 = ON and I2 = ON,
Then Outputs O1 = ON.

Page No: 24