Training - AOI Progamming - 201307 - ENG

AOI ZENITH
COMBINED TRAINING MATERIAL

FOR LEVEL 1
July 2013
TS TEAM - Training part
CONFIDENTIALITY
The information contained in this file may be confidential and legally
privileged. If you are not the intended recipient, don’t proceed further
and delete this file and destroy any copies. Any dissemination or use
of this information by a person other than the intended recipient is
unauthorized and may be illegal.
CONFIDENTIAL
REVISION INFORMATION
Revision Description Date By

01 Initial release July 29, 2013 Ian
02
03
04
CONFIDENTIAL
About AOI installation
& AOI Customer Reference
3D AOI INSTALLATION
68 AOI systems installed worldwide
6 systems in Europe
2
13 systems in North America
4 50 systems in Asia
9
15 12
15
4
1
2
4
As of September 2012
Headquarters / Production : Korea

Branch Office: Germany, Ireland, United States, Japan, China, Singapore
Sales & Technical Support Partner: more than 30 partners in 40+ countries
CONFIDENTIAL
AOI CUSTOMER REFERENCE
EMS
Automotive
Consumer
Server
Aerospace/Military
FPCB / Mobile
Back Light / LED Industrial
CONFIDENTIAL
About Kohyoung Technology’s 3D AOI
INNOVATIVE SOLUTIONS SOLVE TECHNICAL BOTTLENECKS
Common Bottlenecks of Koh Young’s Solutions

Existing Systems (Patented Technology)
High density board with

tall obstacles in the neighborhood
8-way Projection
Shiny solder joint inspection
after reflow
Tall component inspection +

solder joint area inspection Multi-frequency Moiré Technology
(much bigger measurement range)
Reduced 2D capabilities? 3 Layer RGB lights(9 channels)
PCB Warp problems

Slope Compensation
+ Position Compensation
CONFIDENTIAL
BIG OBSTACLE PROBLEM
Shadow problem due to high density, tall parts in the neighborhood
40mm tall
component
CONFIDENTIAL
TALL OBSTACLE PROBLEM (CONTINUED)
Koh Young’s 8 way projection eliminates shadow problems due to

tall obstacle
Tall Obstacle 
affecting inspection
quality
CONFIDENTIAL
SHINY SURFACE INSPECTION
Koh Young’s 8 way projection delivers reliable 3D inspection

result on shiny solder joint after reflow oven
CONFIDENTIAL
MEASUREMENT RANGE PROBLEM
Assembled PCB environment requires accurate inspection
from tall components down to tiny solder joint
Koh Young’s Multi-Frequency Moiré enables max. 5mm tall

components inspection under 1um resolution
Max. 5mm tall component inspection
Solder joint
inspection at
high resolution
CONFIDENTIAL
3 LAYERS RGB LIGHTS FOR RICH 2D INSPECTION
3 Layers RGB
(9 channels)
9-channel RGB lights acquire enough 2D

information for inspection
CONFIDENTIAL
About ZENITH Configuration
ZENITH CONFIGURATION
ZENITH(4W, 8W / 15um, 20um / Single, Dual lane)
Review Station Repair Station
SPC S/W Package O.L.P File Server

(Offline Programming PC)
ZENITH Inspection(Auto/Manual)
Review Station Operator reviews result data from ZENITH
O.L.P(Offline
Programming PC)
Job programming & Fine tuning
Repair Station Repair engineer reviews Review Station’s result to repair
File Server Store the important data files(AOI Core files, database and etc.)
SPC S/W Package Engineer analyzes result data
CONFIDENTIAL
AOI CORE FILES FOR RECOVERY
No. Path File Information

1 C:\Kohyoung\AOI AOIGUISetup.ini AOIGUI parameters
Inspection condition
2 C:\Kohyoung\AOI AOIInspCond3.xml
file
3 C:\Kohyoung\AOI AOI_Adimec4150.ccf Z Platform
4 C:\Kohyoung\AOI STC CMB4MCL(10TAP_Ver2).i2c I Platform
C:\Kohyoung\AOI
5 STC P170RG 10TAP 5600us.cam I Platform
C:\Kohyoung\AOI
6 SST.xml WinMCS parameters
C:\Kohyoung\AOI\Vision\Ref Reference & Scale

7 all files(*.ref, *.scl)
files
8 C:\Kohyoung\AOI\Vision\INI all files(*.ini) Vision parameters
*.dat file
9 C:\Program Files\MVTec\HALCON-9.0 Series\license
Ex) license_9-00cb653e.dat
Halcon license
Recommended action
: Copy all of the AOI whole folder & Halcon license file.
CONFIDENTIAL
AOI CORE FILES FOR SIMULATION
No. Path File Information

1. Open AOIGUISetup.ini file
1 C:\Kohyoung\AOI AOIGUISetup.ini 2. “Control + F” and type “thread” to change the value.
3. Change thread value to 1
2 C:\Kohyoung\AOI AOIInspCond3.xml Inspection condition file
3 C:\Kohyoung\AOI\Vision\Ref all files(*.ref, *.scl) Reference & Scale files
4 C:\Kohyoung\AOI\Vision\INI visionconfig.ini Vision parameters
1. Set Save path : AOIGUIS/W’s Option

2. Check “Grab inspection FOV” for simulation
5 Grabbed board image file
Check “Grab board image” to get board image
(*Please check both of them)
CONFIDENTIAL
About Programming Process
& Main S/W
PROGRAMMING PROCESS
Gerber
& CAD Conversion ePM-AOI
CAD
*.KYPCB
Board Level Teaching
(fiducial /bad mark/barcode)
Programming
Package Package Dimension
Library AOIGUI *.KYJOB
Inspection Condition
Defect View
Production
(defect detection)
Result Data
Review/Repair Review (MS SQL)
SPC
(Process Control) SPCS
CONFIDENTIAL
MAIN S/W - EPM-AOI
Gerber + Cad file = KYPcb file
Gerber
Cad
CONFIDENTIAL
MAIN S/W - AOIGUI
Board image grab

Package registration
Inspection condition
Inspection(Manual/Auto)
Defect view
CONFIDENTIAL
MAIN S/W - REVIEW STATION
Review the ZENITH’s defect result.

Operator can judge using 2D & 3D result images.
CONFIDENTIAL
MAIN S/W - SPCS
Defect Ratio, Yield Management, Statistical Analysis
CONFIDENTIAL
MAIN S/W - KY USER MANAGEMENT & REVIEW, SPC SETUP
USER ID Management, Check log on/out history
Setup for REVIEW & SPC

CONFIDENTIAL
About ePM-AOI Programming
DEFINITION
CONFIDENTIAL
About CAD data
DEFINITION
6 main terms of cad files are used in Zenith.
1. Component(CRD)
: It is known as CRD(Component Reference Designator)
2. Package name
: It is representing the physical size of the component. (Length, Width)
3. Part number or Part name
: It is comes from customer’s part number or part name.
Normally, it is different depending on the value of the component.
4. X
: Component’s X position
5. Y
: Component’s Y position
6. Angle(Rotation)
: Component’s angle.
CONFIDENTIAL
PACKAGE & PART NAME & COMPONENT
Package Part Component
(Size of Length, Width, Thickness) (Value) (CRD)
C1005_300um_1uF
C102 C107 C106
C1005_300um_10uF
C1005_300um C104 C113 C202
C1005_300um_100uF C109 C122 C205
C1005_500um C1005_500um_100uF C302 C362 C422
C1608_300um C1608_300um_100uF
C278 C298
CONFIDENTIAL
EXAMPLE OF REAL CAD FILE
Placement Data format
X, Y, Angle
Package Part Component

This needs to be slightly modified to
distinguish the height information
CONFIDENTIAL
About AOIGUI Programming
DEFINITION
CONFIDENTIAL
Package Registration
PACKAGE TYPES - APPLICABLE PACKAGE LIST
Multi Leaded Tantal

Resistor • SoIC • Tantal Diode
• TSOP / PSOP / SOP • Tantal Capacitor
Capacitor QFP Arrays
SOT DPAK Inductor
BGA Type
Aluminum
• BGA QFN
• PGA Capacitor
Connector Crystal LED
CONFIDENTIAL
PACKAGE REGISTRATION - INFORMATION OF BODY AND LEAD
T T Lead
This is the first step of job programming.

Input correct Body & Lead information. (Length, Width, Thickness)
CONFIDENTIAL
PACKAGE REGISTRATION – AOIGUI S/W : PACKAGE EDIT TAB
Set the Proper size for Body and Lead
We can get the thickness result

from Inspection(Manual/Auto)
Body Thickness
Lead Thickness
CONFIDENTIAL
PACKAGE REGISTRATION – EASY ADJUSTMENT FUNCTION
• It is easy to adjust package size in the defect view.
• Click the check box to set as a recommended size of Width,
Length, Height based on the inspection result. (*Short key : CTRL+D)
CONFIDENTIAL
Pre Setting (Body & Lead)
PRE SETTING
The purpose of presetting is :
To set up the general rule for the following items.
• Pre setting
- Body: Body outline finding
- Lead: Lead tip finding
• 3D measurement algorithm
- Base plane
- Slope compensation
CONFIDENTIAL
Extraction
- Body outline finding
- Lead tip finding
Body Outline Finding
(Body location mode)
BODY EXTRACTION
Correct body extraction is the starting point to detect the body related
defects.
Where is the body?
CONFIDENTIAL
BODY OUTLINE FINDING
There are 7 different settings depending on the components type.
1. Full 3D (Adaptive Height Threshold)

2. Full 3D (Fixed Height Threshold)
3. Corner 3D (Fixed Height Threshold)
4. Full Shadow - 2D
5. White Circle - 2D
6. Black Circle - 2D
7. Two Terminal Chip
CONFIDENTIAL
FULL 3D (ADAPTIVE HEI. THS.)
This mode automatically takes body area from the top surface portion
in the 3D measurement information.
Body
CONFIDENTIAL
FULL 3D (FIXED HEI. THS.)
This mode takes the body area at the user-defined height.
Need to input “Height threshold”
Fixed Height Threshold
Body

CONFIDENTIAL
WHY FIXED HEIGHT THRESHOLD IS NEEDED?
When component has a multiple heights, we have to decide which one

is considered as a body.
Body?
Body?
Applicable types of components

CONFIDENTIAL
CORNER 3D
In the case of big size components or many leads, this mode is

sometimes used for the fast inspection speed.
Use only 4 corner’s 3D images to get

body outline.
Save time for making 3D images
of big size body and many leads.
CONFIDENTIAL
FULL SHADOW
When the component height is higher than 5mm, we can check the
body location using the shadow.
If there is other component’s shadow,
this mode will not work well.
3D Light T
Shadow
L Comp. R
Comp.
[Side View] [Top View]
CONFIDENTIAL
WHITE CIRCLE
For the high height aluminum capacitor(higher than 5mm), the body
cannot be extracted using 3D information.
Using 2D light, the white circle can be seen as the edge of the
component. This is regarded as the body.
The user needs to select the necessary 2D light to acquire the best
image.
If there is no problem of rounded body offset, we recommend

you to use Fixed height mode or Odd shape function to get body
outline from black plastic.
CONFIDENTIAL
BLACK CIRCLE
When the color of the circle edge is black, it can be used.

This function is rarely used. Just for Inductor coil.
CONFIDENTIAL
LEAD REGION RECONSTRUCTION
When 2D body extraction is used, still the user might want to measure
the lead in 3D. In this case, Lead Region Reconstruction should be
turned on.
2D
[Turn off] [Turn on]
2D
3D
CONFIDENTIAL
TWO TERMINAL CHIP
To reduce the ambiguity of body finding for chip components, the 2D

and 3D combination can be used.
Body edge is obvious
[Normal case] [Excessive case]
In this case, 2D information is also used to separate the terminal from

the solder joint.
Distinguishable
CONFIDENTIAL
Extra body location
- Lead shoulder for IC
- Resize body for odd-shape
Body inspection on/off

EXTRA BODY LOCATION - LEAD SHOULDER FOR IC
Lead shoulder for IC

- Component body such as SOIC can be extracted as follows when using
only 3D information.
In this case, 2D information is also used to exclude the lead portion.

(Currently not used)
CONFIDENTIAL
EXTRA BODY LOCATION - RESIZE BODY FOR ODD SHAPE
1. Leads are inside of the body. 2. Using this function,

it is possible to distinguish Body and Leads.
1. 2.
CONFIDENTIAL
Resize body for odd-shape

- When body is extracted as the following white box,
it can bring up some confusion for the lead finding.
The size can be reduced or expanded depending on the setting.
X2
Y1 Originally Y2
extracted body
X1
It is possible to measure the distance in AOIGUI S/W using mouse dragging.
CONFIDENTIAL
Resize body for odd-shape

- The following is the adjusted body shape after putting -300um for Y2.
Originally extracted body
Newly extracted body
CONFIDENTIAL
BODY INSPECTION ON/OFF
When the body cannot be extracted, the user can turn off the body
inspection.
CONFIDENTIAL
Lead Tip Finding
(Tip location mode)
LEAD TIP FINDING
There are 3 different settings to find a lead tip.
1. Auto
2. Semi Auto
3. CAD Define
4. J-Lead
CONFIDENTIAL
LEAD TIP FINDING
CAD
Semi Define
Auto
Auto
CONFIDENTIAL
LEAD TIP FINDING
• Auto
Automatically find the lead tip on the whole pad area.
• Semi Auto
Automatically find the lead tip in a certain range.
*We can set the range.
• Cad Define
Pre-defined lead length position becomes the lead tip.
*Difficult to distinguish Solder joint and Lead tip.
*Lead tip is covered by Solder joint.
*Lead’s length is very short or leadless case.
【Auto】【Semi-Auto】【Cad Define】
Lead Tip Lead Tip Lead Tip
Lead Length(Pre-defined)
■ Searching direction Lead Length(Pre-defined)
From Pad edge to the body Lead Tip Search Margin(Pad End)
Lead Tip Search Margin(Body)
CONFIDENTIAL
3D Measurement Algorithm
- Reference plane setting
- Slope compensation
Reference Plane
REFERENCE PLANE
In order to get the reference plane, the user can set the ROI (Region of
Interest).
Extended ROI
Top(um)
Left(um) Right(um)
Bottom(um)
• By Keyboard : Put the ROI value by Keyboard.

• By Mouse : User can adjust the ROI with Mouse.
• Auto : The size of ROI is automatically set based on the component size.
CONFIDENTIAL
Slope Compensation
SLOPE COMPENSATION
When a board is suffering from the warpage, the slope should be

compensated sometimes.
Before compensation After compensation

CONFIDENTIAL
ITERATIVE PLANE FITTING (BASE TYPE : NORMAL)
CONFIDENTIAL
SLOPE COMPENSATION
There are two types of algorithm
• Split ROI Compensation (Currently not used)
• Iterative Plane Fitting

- Base Type : Normal
- Base Type : Transparent
CONFIDENTIAL
SPLIT ROI COMPENSATION (*CURRENTLY, NOT USED)
The ROI is divided into many sections. Each section is compensated

locally.
① ①
② ②
③
Comp. ③
④ ④
Currently it’s not used.

CONFIDENTIAL
ITERATIVE PLANE FITTING (BASE TYPE : NORMAL)
ROI is divided into 4 sections. It starts to create the plane iteratively.
① ②
Comp.
③ ④
Before Plane Fitting After Plane Fitting
CONFIDENTIAL
ITERATIVE PLANE FITTING (BASE TYPE : TRANSPARENT)
When the FPCB is highly transparent, it’s difficult to decide the

reference plane. (for LED application)
Non-transparent
Transparency area
Component
Because of the transparency of the board, we can see though the

board. In this case, we can just use the non-transparent portion of the
board for the reference plane.
CONFIDENTIAL
Inspection Diversity
ODD SHAPED COMPONENTS INSPECTION
 Programmer defined ROI Simple component Various Odd shaped

 Line detection based on registration components inspection
3D info
CONFIDENTIAL
ABSENCE INSPECTION
 Absence inspection plus,
 Solder volume on PAD, solder bridge between pads
 Gold finger Inspection (foreign material, solder ball)
Solder Volume
Bridge
Gold Finger
CONFIDENTIAL
ALTERNATIVE PART INSPECTION
Same Part Number, BUT Different Shape or Color or Mark
 Case I) Alternative Mark – OCV/R, Polarity Mark

 Case II) Alternative Part – Body Size, Lead Size, Lead Number
CONFIDENTIAL
WARP COMPENSATION (PAD REFERENCING)
 KY uses all the features on the board to fully compensate linear/non-linear warp
 Automatic feature extraction & image plane selection (without any PCB Gerber)
Partially Shrunken
Only this part got shrunken
CONFIDENTIAL
SLOPE COMPENSATION : 3D HEIGHT MEASUREMENT
• Connector Inspection with warp compensation
FPCB Slope
(1.6 mm)
Measured FPCB Slope

Lifted FPCB
(1.6 mm)
(5mm)
Before Warp Compensation
After Compensation
CONFIDENTIAL
PCB WARP
• PCB warp causes the following critical problems;
Shape change due to Offset due to board shift

board slope x,y,θ misalignment caused by rotation
x,y,θ misalignment caused by shrink or
expansion of the board
CONFIDENTIAL
POSITION COMPENSATION : PAD REFERENCING
If the shrinkage or stretch does not linearly occur, it cannot be

compensated by fiducials only.
Partially Shrunken KY’s Solution
Only this part got shrunken
KY uses all the features on the board to fully compensate linear/non-linear

warpages.
CONFIDENTIAL
AOI INSPECTION ALGORITHM
FOR BODY&LEAD
July 2013
TS TEAM - Training part
KOHYOUNG DEFINES DEFECTS AS INSPECTION ITEMS
8 items for Body, 5 items for Lead
Many kinds of defects
Inspection items
(*It is possible to define as below defect types at Review Station)
Pad Overhang Pad Overhang, Rotation, Tombstone
Dimension Wrong Part, Lifted Body, Tombstone, Bill boarding, Broken Part
Missing Missing
Co-planarity Lifted Body, Tombstone, Broken Part
Body
Upside-down Upside-down, Wrong Part
Polarity Polarity
OCV, OCR OCV, OCR, Wrong Part
Absence Absence
Pad Overhang Pad Overhang
Co-planarity Lifted Lead
Lead Missing Missing
Bridge Bridge
Solder Fillet No Solder, Insufficient Solder
Kohyoung defines many kinds of defects as Kohyoung’s inspection items.
CONFIDENTIAL
Inspection Algorithm
(Body)
Dimension
DIMENSION
Put the reference information (width, length, thickness) of the

component. Check the differences with the measurement value.
Reference Information
Thickness
Result ： Width, Length, Thickness
CONFIDENTIAL
MEANING OF VALUES
Measured value < Min Tolerance or Measured value > Max Tolerance
 Dimension Defect
(W) Measured Width / Reference Width

Measured Width% [Tolerance Min, Max]
(L) Measured Length / Reference Length
Measured Length% [Tolerance Min, Max]
Extracted body outline
Reference body outline
(L) Measured Thickness / Reference Thickness

Measured Thickness% [Tolerance Min, Max]
CONFIDENTIAL
MEANING OF VALUES AT NEW VERSION 2.3.5
Reference Width / Measured Value
CONFIDENTIAL
EXAMPLE
Bill boarding Width & Thickness problem
Double component Width problem
CONFIDENTIAL
Missing
MISSING
Check the volume & thickness. If less than threshold, it’s reported as
Missing
Chip Component : Check the full 3D information.
CONFIDENTIAL
MEANING OF VALUES
Measured Volume < Threshold  Missing Defect
Measured Volume % [> Threshold%]
Measured Height (CAD Thickness)
CONFIDENTIAL
CONFIDENTIAL
EXAMPLE
Missing 0% volume
Missing 23% volume (*Included Solder volume)
CONFIDENTIAL
Pad Overhang
PAD OVERHANG (BODY)
Check the offset difference between CAD and measured value.

Two different definitions are available.
[Center XY] [Worst Case Corner Offset]

Difference between the CAD center and the When there is some distance from the CAD,
component center the worst length is reported as a result.
Offset (Y)
╋ ╋
Offset (X)
CONFIDENTIAL
MEANING OF VALUES
Measured Offset > Threshold  Pad Overhang Defect
Measured Offset % [< Threshold%]

Measured Offset X, Offset Y, Rotation
CAD Orientation + Rotation (CAD Orientation)
Reference body outline
CONFIDENTIAL
CONFIDENTIAL
EXAMPLE
Pad Overhang, Rotation X : -730.8um, 2.6 degree
Pad Overhang X : 136.5um
CONFIDENTIAL
EXAMPLE
Pad Overhang X : -163.2um
Rotation 2.9 degree
CONFIDENTIAL
MISSING & PAD OVERHANG WITH ODD SHAPE
Higher than 5mm? Shape is not Rectangle?
CONFIDENTIAL
MISSING & PAD OVERHANG WITH ODD SHAPE
This function is for Odd shape component and tall component.

It take a template image(Extract Out line) from component.
Blue : Find good result
Red : Fail
CONFIDENTIAL
Co planarity
CO PLANARITY (BODY)
Measure the height of the body at four points.

Compare the height differences.
CONFIDENTIAL
MEANING OF VALUES
Measured differences > Tolerance  Co-planarity Defect
Height differences in length direction
Height differences in width direction
Point for the height comparison
CONFIDENTIAL
CONFIDENTIAL
EXAMPLE
Co planarity Diff in Width 113.0um [<100um]
Co planarity Diff in Length 260.0um [<100um]
CONFIDENTIAL
Polarity
POLARITY
Where is a mark on the component?
CONFIDENTIAL
POLARITY (2D)
• Brightness
• Line (Bar)
CONFIDENTIAL
POLARITY
CONFIDENTIAL
POLARITY (3D)
DIMPLE
Polarity Mark
CONFIDENTIAL
CHAMFER (3D)
CHAMFER
Polarity Mark
CONFIDENTIAL
Absence
ABSENCE
If there is a component on the location where it is not supposed to

exist. It also check the bridges between pads.
Bridge Inspection
[Algorithm Plan]
Absence inspection
+ Solder fillet
+ Bridge inspection
CONFIDENTIAL
OCV/OCR
OCV/OCR
Optical Character Verification (OCV) is the technical term for pattern

matching. i.e., identifying pattern symbols.
Optical Character Recognition (OCR) is the technical term for reading

characters. i.e., identifying character symbols.
CONFIDENTIAL
OCV/OCR
to recognize logos, signs or any

non-standard text on the body
of a component.
To read a text string and

will attempt to read even
poor quality and damaged text,
making a best guess at the data.
CONFIDENTIAL
OCV/OCR AT VERSION 2.3.3
AOI GUI S/W Image plane select window
Saved
Reference
images
CONFIDENTIAL
OCV/OCR – ADJUST TEACHING ROI AND SEARCHING ROI
Searching
Teaching ROI
ROI CONFIDENTIAL
OCV IMAGE PLANE (ILLUMINATION TYPE)
Using the combination 3D and 2D RGB images(34 sets),

select the best one.
CONFIDENTIAL
OCV/OCR
• Do not select image set that has too much noise.
<Image Quality - GOOD(Normal)> <Image Quality - Bad(Noisy)>
CONFIDENTIAL
EXAMPLE
Teaching ROI & Search ROI
Searching ROI
Teaching ROI
OCV OCV Image is not registered
CONFIDENTIAL
EXAMPLE
OCV Character is not in search area
OCV Good, Measured value > Tolerance %
CONFIDENTIAL
OCV/OCR
Searching
Teaching ROI
ROI CONFIDENTIAL
EXAMPLE
Using the combination 3D and 2D RGB images(24 sets),

select the best one. The text is found and the results are displayed for
every segmented region.
The OCR uses regular expressions to read the text more robustly.
Image Plane Select Window
CONFIDENTIAL
EXAMPLE
OCR Error No registered OCR Image
OCR Error OCR letter is not in search area
CONFIDENTIAL
EXAMPLE
OCR Error OCR pass rate is lower than Tolerance%
OCR Good Good
CONFIDENTIAL
Upside-Down
UPSIDE DOWN
① Inspection by Gray Level ：Check difference of component body

gray level.
② Inspection by Co-planarity of Leads： Detect the (float) to examine

the height of the Leads.
[ Normal Resistor] [ Upside Down] [ Normal SOT ]
[ Upside Down]
CONFIDENTIAL
CONFIDENTIAL
Inspection Algorithm
(Lead)
Pad Overhang
PAD OVERHANG (LEAD)
Measure the differences between the lead edge and the CAD edge.
Footprint
Cad Center
Offset
Measured Lead tip
CONFIDENTIAL
LEAD TIP (INVISIBLE CASE)
Measure the differences between the lead edge and the CAD edge.
But should be careful as below
Good
Where is lead tip (end)?
Solder
Measured Lead Measured Lead
CONFIDENTIAL
MEANING OF VALUES
Measured Lead Offset > Threshold  Pad Overhang
Measured Offset % from Lead center

[< Threshold%]
Result 18.1um, 3.9%
Tolerance: 50% x 466um(Lead width)
CONFIDENTIAL
포인트는 리드 끝이 보여야만 함.
CONFIDENTIAL
Lead Missing
MISSING
Where is a Lead?
CONFIDENTIAL
MISSING
3D AOI uses the height information.
Measured Height &

Gray Level
CONFIDENTIAL
MEANING OF VALUES
Measured height of small red box

Is 351.0um
Average value of all lead is
309.4um. 100 is tolerance.
209~409 is good.
Measured height of small red box

Is 351.0um.
If measured height is in set range
Between 200 to 700, Result is
Good.
CONFIDENTIAL
Average
Measured
Tolerance
CONFIDENTIAL
EXAMPLE
Lead Missing Result 38.7um NG
Lead Missing
CONFIDENTIAL
Co planarity
CO PLANARITY - 2D VS 3D
What we can see from 2D Image?
What we can see from 3D Image?
2D
3D
CONFIDENTIAL
CO PLANARITY (LIFTED LEAD)
Measure the difference between the reference value and the measured
one.
Measured Height
Height
Information
CONFIDENTIAL
MEANING OF VALUES
Measured the height on Lead .

Result is 44.2um.
Result is lower than Cad thick + Tolerance
44.2um<920um
CONFIDENTIAL
CONFIDENTIAL
EXAMPLE
Lead Co-planarity NG 465.5um Measured value> Cad thick + Tolerance
Lead Co-planarity NG 550.9um Measured value> Cad thick + Tolerance
CONFIDENTIAL
Solder Fillet
SOLDER FILLET AT 2D
2D Steep Area
2D algorithm works by projecting red, green , blue light onto a solder fillet
surface at 3 different angle to produce a 2-D image. Joint score means
that it counts blue pixel in the box and if blue pixel area is bigger than
tolerance %, judge it as a good.
Camera Camera
Normal: Solder Joint has a steep area which No Solder: Solder Joint has a flat area which
has blue pixel. has a red pixel.
CONFIDENTIAL
SOLDER FILLET - PAD STEEP AREA(3D+2D)
[3D] Measure joint volume at lead end. [2D] Count blue pixels
Camer
a
Joint Height,
HJOINT
Cad Lead
Standard
Z Thickness Height,
0 HSTANDARD
Underneath
Height, HUS
Lead
• Combine 3D height and 2D blue pixel counting and detect solder

joint defect.
• This method provides more stable joint inspection result
CONFIDENTIAL
SOLDER FILLET - PAD STEEP AREA(3D+2D)
Why “2D only joint inspection” is not enough?

- It’s not easy to separate none wetting solder from excessive solder.
Camer
a
White or red in 2D
But “excessive”
solder
Both “excessive” and “cold”

solder cases, red light is
only visible in the camera. White or red in 2D
But “cold” solder
Camera
White or red in 2D
But “cold” solder
CONFIDENTIAL
SOLDER FILLET - PAD STEEP AREA(3D+2D) (USER DEFINE MODE)
[3D] Measure joint volume at lead end. [2D] Count blue pixels
Camera
Measured height
Joint
Minimum OR
Height
• Measure the height which is higher than User defined Height or

Count the blue pixel.
• This method provides more flexible method for joint inspection.
CONFIDENTIAL
SOLDER FILLET
Bare
copper
2D&3D
Combination
2D&3D Pad steep
CONFIDENTIAL
SOLDER FILLET (COMBINATION VS PAD STEEP)
ROI Area (Volume, Steep(Blue pixel) ROI Area (User define height or Blue pixel)
CONFIDENTIAL
SOLDER FILLET - PAD STEEP AREA(3D + 2D)
What if Solder surface is irregular? Or solder is next to lead?

- It’s not easy to measure with combination mode.
Measured height
Joint Combination mode point

Minimum
Height
Camera
Blue Pixel
2D &3D Steep point
CONFIDENTIAL
SOLDER FILLET BARE COPPER
Bare copper is one of sum options to inspect a no solder.

- This is essential mode for Solder inspection.
Inspect a copper exposure in

yellow box.
If Tolerance % > Measured
copper area,
This is good.
Copper
Area
CONFIDENTIAL
EXAMPLE GOOD
Solder Fillet Good Volume: 100%, Steep area: 98.9%
Solder Fillet Pad steep function Steep area: 92.7 %
CONFIDENTIAL
EXAMPLE
Solder Fillet 2D 27% Steep area(Blue pixel), Tolerance %= 30%
Solder Fillet 3D+2D 37% volume, Steep area=0 %
CONFIDENTIAL
EXAMPLE BARE COPPER
Solder Fillet Bare Copper: 60.0%[<30.0%]
Solder Fillet 3D+2D Bare Copper75.0%[<55.0%]
CONFIDENTIAL
Bridging
BRIDGE
CONFIDENTIAL
BRIDGE
Solder Bridging between leads

Check the height and Gray Bridge between the Lead, to measure the Bridge.
[ Normal Lead Image] [ 2D Bridge Image] [ 3D Bridge Image]
Measured Area
CONFIDENTIAL
MEANING OF VALUES
Measured the length of bridge area %

[> Threshold%]
Measured the gray level is brighter than

[> Threshold%]
Measured the height is higher than
[> Threshold%]
Average value of gray level and height

In bridge area.
CONFIDENTIAL
CONFIDENTIAL
ALGORITHM
Solder Bridging between leads

Check the height and Gray Bridge between the Lead, to measure the Bridge.
: 2D Gray
: 3D Height
: 2D&3D
: Bridge
<“And” Mode: Bridge> <“Or” Mode: Bridge>
Measured Result ROI Margin From Body[um] ROI Margin From Body[um]
CONFIDENTIAL
CONFIDENTIAL
EXAMPLE BRIDGE
Bridge
Cross Length: 100%,

0.0um[<100%,0.0um]
Region Extraction Mode: OR
(2D) 255.0Gray [255Gray]
(3D) 434.5um [200.0um]
(Bridge) 61.6Gray, 434.5um
Bridge
2D Gray level <120,3D Height

<100㎛ Good
Result : Gray level
194.3 ,Height 378.7
So this is Bridge error
CONFIDENTIAL
Inspection Coverage
(based on the component type)
TYPES OF COMPONENTS
The following components can be handled by Zenith.
Chip Array Resistor Tantal, Diode Transistor PowerTransistor
Al-Cap Special Type SOP QFP&QFN&BGA Connector
CONFIDENTIAL
CAPACITOR
Inspection Items Body Lead
Default /
Add
3D Image
Missing ◎ -
Dimension ◎ -
Pad overhang ◎ - Default
Co planarity ◎ -
Solder Fillet - ◎
Bridge - -
Polarity - -
OCV/R - -
Upside Down - -
Absence - -
Result
Co planarity Solder Fillet Dimension PADOVERHANG
CONFIDENTIAL
REGISTER
Default /
Add 3D Image
Missing ◎ -
Dimension ◎ -
Co planarity ◎ -
Solder Fillet - ◎
Bridge - -
Polarity - -
OCV/R ◎ - Add
Upside Down - -
Absence - -
Result
OCV/R Solder Fillet Dimension PADOVERHANG
CONFIDENTIAL
DIODE
Default /
Add 3D Image
Missing ◎ -
Dimension ◎ -
Co planarity ◎ -
Solder Fillet - ◎
Bridge - -
Polarity ◎ - Add
OCV/R ◎ - Add
Upside Down - -
Absence - -
Result
Co planarity Solder Fillet Polarity PADOVERHANG
CONFIDENTIAL
ALUMINUM CAPACITOR
Default /
Add
3D Image
Missing ◎ -
Dimension ◎ -
Co planarity ◎ ◎
Solder Fillet - ◎
Bridge - -
Polarity ◎ - Add
OCV/R ◎ - Add
Upside Down - -
Absence - -
Result
Co planarity Solder Fillet Polarity PADOVERHANG
CONFIDENTIAL
INDUCTOR
Default /
Add
3D Image
Missing ◎ -
Dimension ◎ -
Solder Fillet - ◎
Bridge - -
Polarity ◎ - Add
OCV/R ◎ - Add
Upside Down - -
Absence - -
Result
Dimension Solder Fillet Polarity PADOVERHANG
CONFIDENTIAL
SOT
Default /
Add
3D Image
Missing ◎ -
Dimension ◎ -
Solder Fillet - ◎
Bridge - ◎ Add
Polarity - -
OCV/R ◎ - Add
Upside Down - -
Absence - -
Result
Co planarity Solder Fillet Co planarity PADOVERHANG
CONFIDENTIAL
SOIC
Default /
Add
3D Image
Missing ◎ ◎
Dimension ◎ -
Pad overhang ◎ ◎ Default
Solder Fillet - ◎
Bridge - ◎
Polarity ◎ - Add
OCV/R ◎ -
Upside Down - -
Absence - -
Result
Co planarity Solder Fillet Polarity Bridge
CONFIDENTIAL
QFP
Default /
Add
3D Image
Missing ◎ ◎
Dimension ◎ -
Pad overhang ◎ ◎ Default
Solder Fillet - ◎
Bridge - ◎
Polarity ◎ - Add
OCV/R ◎ -
Upside Down - -
Absence - -
Result
Co planarity Solder Fillet Polarity Bridge
CONFIDENTIAL
BGA (NO LEAD, NO NEED FOR LEAD INSPECTION)
Default /
Add
3D Image
Missing ◎ -
Dimension ◎ -
Co planarity ◎ -
Solder Fillet - -
Bridge - -
Polarity ◎ - Add
OCV/R ◎ - Add
Upside Down - -
Absence - -
Result
Co planarity Missing Dimension PADOVERHANG
CONFIDENTIAL
Defect Type and Setting method
BODY DEFECTS
GOOD
Tombstone Coplanarity
Missing Upside-down Wrong Part
Pad overhang Billboarding
CONFIDENTIAL
LEAD DEFECTS
Good
No Joint
Excessive Joint （To be developed)
Insufficient Joint
CONFIDENTIAL
DEFECT TYPE
Missing
Missing comp is
detected by
Volume and
Cad height.
Electrode crack
is detected with
Gray level
difference
CONFIDENTIAL
DEFECT TYPE
Pad overhang
Check the offset
difference between
CAD and measured
location value.
2 different definitions
are available.
WCC: (Worst Case

Corner) Farthest
component corner to
pad corner is
calculated used for
this check.
Center XY: Pads

center to center of
component offset
difference.
Unit: May select

percentage (%)or
distance (um).
CONFIDENTIAL
DEFECT TYPE
Body Co planarity
Measure the
height of the
body at four box
points.
Compare the
height
differences
along each axis
for X (Length)
and Y (Width).
CONFIDENTIAL
DEFECT TYPE
Lead Co planarity
Measure the
height of the
Lead at one
point.
Compare the
height
differences with
lead height
averages or an
absolute height
value.
CONFIDENTIAL
DEFECT TYPE
Solder Fillet
Measure the
volume of
solder joint or
height of the
solder joint at
the terminal or
lead toe.
3D: Volume or
Height.
2D Steep:
Count the blue
pixels in the
search box.
Bare Copper:
Check for
copper color in
search area
CONFIDENTIAL
DEFECT TYPE
Bridge
NG DEFECT
Cross Length:
Material is
longer between
pads than
setting value.
2D Color:
Material is
brighter than
setting value.
3D Height:
Material is
higher than
setting height.
String Value:
AND / OR
.
CONFIDENTIAL
DEFECT TYPE
Etc. (OCV/R, Upside Down, Polarity, Electrod Crack)
OCV/R: Image
matching & Pattern
matching
Upside Down:
Check Gray value for
bright color.
Polarity:
Box: Check the gray
level change of mark
area.
Dimple, Chamfer,
and Corner: Measure
height difference
mode.
Crack Check: Insp for

crack on the electrode
with gray level change
CONFIDENTIAL
INSPECTION POINT
& BASIC FINE TUNING
INSPECTION POINT - CAPACITOR
CONFIDENTIAL
INSPECTION POINT - REGISTER
CONFIDENTIAL
BASIC TUNING - CAPACITOR & REGISTER
PKG Type Comp Image Algorithm Insp Tab Setting Tab Detailed Setting Order Additional Info
All inspection starts from this

1-1. Set the Body size( Width & Length)
point. If proper comp size is set,
1-2. Set the Electrode Size(Chip does not have Leads)
Chips BODY 1. PKG Edit then you have completed about
1-3. Perform INSP COMP and check the Body/Lead thickness.
70% of the data so far.
1-4. Enter the Value of Width, Length, & Thickness.
2-1. Select the Body location mode: (Full 3D Adaptive Height)

BODY 2. Pre-Setting 2-2. Set the Base ROI Expansion Mode: (Auto, Mouse, Key) Refer to Pre-Setting manual.
2-3. Higher Measurement: 75%
BODY 3. PadOverhang 3-1. Select the mode (WCC, Center X&Y) (% or Metric) IPC standard is in %.
4-1. Set the Length / Width Difference Threshold (um)

BODY 4. Coplanarity 4-2. Set ROI Leng. Wid. Offset X / Y from Edge of body (um) For tilted or lifted body.
4-3. Set ROI Box Size (um)
BODY 5. Dimension 5-1. Length x Width x Height (Default is 50%~150%) Recommend is 80~120%
BODY 6. Polarity 6-1. No POLARITY. No inspection.
Optional BODY 7. OCV 7-1. Select mode and choose proper illumination. Add inspection.
BODY 8. Missing 8-1. Default value of Missing is set as 30%. Recommend setting of 90%
Recommend setting of 170.

Optional BODY 9. Upside Down 9-1. Set Gray Level value for brightness.
For RESISTORS ONLY.
Optional BODY 10. Absence 10-1. Select Volume % for Absence. Recommend setting of 20%
LEAD 11. Pre-Setting 11-1. No LEAD. No inspection.
LEAD 12. PadOverhang 12-1. No LEAD. No inspection.
13-1. Set the 3D Mode (Volume, Height) or 2D Mode 3D+2D Combination or

LEAD 13. Solder Fillet (Steep_Blue Pixels) or 3D+2D Combination Mode + Bare 3D+2D PAD Steep.
Copper Check. Option is Bare Copper check.
LEAD 14. Coplanarity 14-1. No LEAD. No inspection.

LEAD 15. Bridge 15-1. No LEAD. No inspection.
LEAD 16. Missing 16-1. No LEAD. No inspection.
CONFIDENTIAL
INSPECTION POINT – DIODE
CONFIDENTIAL
BASIC TUNING – DIODE
Standards BODY 1. PKG Edit then you have completed about

BODY 3. PadOverhang 3-1. Select the mode (WCC, Center X&Y) (% or Metric) IPC standard is in %.

BODY 4. Coplanarity 4-2. Set ROI Leng. Wid. Offset X / Y from Edge of body (um) For tilted or lifted body.
If polarity mark has height

BODY 6. Polarity 6-1. Select mode as a BAR type. Choose proper illumination.
Should use HEI mode.
10-1. Select TIP Location Mode: (Auto, Semi, CAD Define). Recommend CAD Define.
LEAD 10. Pre-Setting
10-2. Select Cross Center Search Mode: (OFF or ON). Recommend CC Search ON.
LEAD 11. PadOverhang 11-1. Inward Lead Type. No inspection.
12-1. Set the 3D Mode (Volume, Height) or 2D Mode 3D+2D Combination or

LEAD 12. Solder Fillet (Steep_Blue Pixels) or 3D+2D Combination Mode + Bare 3D+2D PAD Steep.
Copper Check. Option is Bare Copper check.
LEAD 13. Coplanarity 13-1. Inward Lead Type. No inspection.
LEAD 14. Bridge 14-1. Inward Lead Type. No inspection.
LEAD 15. Missing 15-1. Inward Lead Type. No inspection.
CONFIDENTIAL
INSPECTION POINT – CRISTAL (*DIFFERENT BODY THICKNESS)
CONFIDENTIAL
BASIC TUNING - CRISTAL (*DIFFERENT BODY THICKNESS)
2-1. Select the Body location mode: (Full 3D Fixed Height)

Define Fixed Height for Body.
BODY 2. Pre-Setting 2-2. Set the Base ROI Expansion Mode: (Auto, Mouse, Key)
Refer to Pre-Setting manual.
BODY 3. Pad Overhang 3-1. Select the mode (WCC, Center X&Y) (% or Metric) IPC standard is in %.

BODY 4. Co planarity 4-2. Set ROI Length Wid. Offset X / Y from Edge of body (um) For tilted or lifted body.

Optional BODY 6. Polarity 6-1. Select mode as a BOX type. Choose proper illumination.
Recommend Semi, except SOT

10-1. Select TIP Location Mode: (Auto, Semi, CAD Define).
LEAD 10. Pre-Setting Leads use CAD Define.
10-2. Select Cross Center Search Mode: (OFF or ON).
Recommend CC Search ON.
LEAD 11. Pad Overhang 11-1. Define Lead Pad Overhang Threshold. Set MAX % allowance.
12-1. Set the 3D Mode (Volume, Height) or 2D Mode (Steep 3D+2D Combination or
LEAD 12. Solder Fillet Blue Pixels) or 3D+2D Combination Mode + Bare Copper 3D+2D PAD Steep.
Check. Option is Bare Copper check.
13-1. Set MAX Lifted Height (um).
Absolute: Exact Lead Height.
LEAD 13. Co planarity 13-2. Set ROI Search Area.
Relative: Reference Lead Height.
13-3. Set Co planarity Check Mode: (Absolute or Relative).
14-1. Set the Cross length & 3D(Height) & 2D(Gray level) .
LEAD 14. Bridge Recommend AND Extract Logic.
14-2. Set Extraction Logic & ROI Margin (Green Box).
15-1. Set Threshold Mode: (Auto, Manual). Recommend Auto.

Optional LEAD 15. Missing 15-2. Set Height Tolerance: (+/-). Default setting +/- 200.
15-3. Set ROI Search Area. Recommend 150/60/300.
CONFIDENTIAL
INSPECTION POINT - MELF DIODE (*DIFFERENT BODY THICKNESS)
CONFIDENTIAL
BASIC TUNING - MELF DIODE (*DIFFERENT BODY THICKNESS)

2-1. Select the Body location mode: (Full 3D Fixed Height)

Define Fixed Height for Body.
BODY 2. Pre-Setting 2-2. Set the Base ROI Expansion Mode: (Auto, Mouse, Key)
Refer to Pre-Setting manual.


BODY 6. Polarity 6-1. Select mode as a BOX type. Choose proper illumination.
LEAD 10. Pre-Setting No LEAD No inspection.
LEAD 11. Pad Overhang No LEAD No inspection.
Melf LEAD 13. Co planarity No LEAD No inspection.
LEAD 14. Bridge No LEAD No inspection.
LEAD 15. Missing No LEAD No inspection.
CONFIDENTIAL
INSPECTION POINT - SOT
CONFIDENTIAL
BASIC TUNING – SOT





CONFIDENTIAL
INSPECTION POINT - SOIC
CONFIDENTIAL
BASIC TUNING - SOIC



BODY 6. Polarity 6-1. Select mode as a BOX type. Choose proper illumination.
CONFIDENTIAL
INSPECTION POINT - BGA
CONFIDENTIAL
BASIC TUNING - BGA
1-1. Set the Body size( Width & Length) All inspection starts from this
1-2. Set the Electrode Size(Chip does not have Leads) point. If proper comp size is set,
Standards BODY 1. PKG Edit 1-3. Do "Component inspect and check the thickness of Body then you have completed about
and Leads. 70% of the data so far.
2-1. Select the Body location mode:

(Full 3D Adaptive Height)
BODY 2. Pre-Setting 2-2. Set the Base ROI Expansion Mode: Refer to Pre-Setting manual.
(Auto, Mouse, Keyboard)

LEAD 10. Pre-Setting No LEAD No inspection.
LEAD 11. Pad Overhang No LEAD No inspection.
3D+2D Combination or
3D+2D PAD Steep.
Optional LEAD 12. Solder Fillet 12-1. If solder joint is visible depending on lead type.
Option is Bare Copper check.
LEAD 13. Co planarity No LEAD No inspection.
Optional LEAD 14. Bridge Recommend AND Ext Logic.
LEAD 15. Missing No LEAD No inspection.
CONFIDENTIAL
INSPECTION POINT - D PAK
CONFIDENTIAL
INSPECTION POINT - QJP(QUAD J-LEAD PACKAGE)
CONFIDENTIAL
INSPECTION POINT - ALUMINUM CAPACITOR
CONFIDENTIAL
INSPECTION POINT - QFN
CONFIDENTIAL
Thank You !

Training - AOI Progamming - 201307 - ENG

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Training - AOI Progamming - 201307 - ENG

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AOI ZENITH

COMBINED TRAINING MATERIAL

Revision Description Date By

68 AOI systems installed worldwide

Headquarters / Production : Korea

Common Bottlenecks of Koh Young’s Solutions

High density board with

Tall component inspection +

Reduced 2D capabilities? 3 Layer RGB lights(9 channels)

PCB Warp problems

Shadow problem due to high density, tall parts in the neighborhood

Koh Young’s 8 way projection eliminates shadow problems due to

Koh Young’s 8 way projection delivers reliable 3D inspection

Koh Young’s Multi-Frequency Moiré enables max. 5mm tall

9-channel RGB lights acquire enough 2D

SPC S/W Package O.L.P File Server

No. Path File Information

3 C:\Kohyoung\AOI AOI_Adimec4150.ccf Z Platform

4 C:\Kohyoung\AOI STC CMB4MCL(10TAP_Ver2).i2c I Platform

C:\Kohyoung\AOI\Vision\Ref Reference & Scale

8 C:\Kohyoung\AOI\Vision\INI all files(*.ini) Vision parameters

No. Path File Information

2 C:\Kohyoung\AOI AOIInspCond3.xml Inspection condition file

3 C:\Kohyoung\AOI\Vision\Ref all files(*.ref, *.scl) Reference & Scale files

4 C:\Kohyoung\AOI\Vision\INI visionconfig.ini Vision parameters

1. Set Save path : AOIGUIS/W’s Option

Gerber + Cad file = KYPcb file

Board image grab

Review the ZENITH’s defect result.

Setup for REVIEW & SPC

6 main terms of cad files are used in Zenith.

C1005_300um_100uF C109 C122 C205

C1005_500um C1005_500um_100uF C302 C362 C422

Placement Data format

Package Part Component

Multi Leaded Tantal

Capacitor QFP Arrays

SOT DPAK Inductor

Connector Crystal LED

This is the first step of job programming.

We can get the thickness result

Where is the body?

There are 7 different settings depending on the components type.

1. Full 3D (Adaptive Height Threshold)

This mode takes the body area at the user-defined height.

Need to input “Height threshold”

Fixed Height Threshold

Fixed Height Threshold

When component has a multiple heights, we have to decide which one

Fixed Height Threshold

Applicable types of components

In the case of big size components or many leads, this mode is

Use only 4 corner’s 3D images to get

[Side View] [Top View]

If there is no problem of rounded body offset, we recommend

When the color of the circle edge is black, it can be used.

[Turn off] [Turn on]

To reduce the ambiguity of body finding for chip components, the 2D

Body edge is obvious

[Normal case] [Excessive case]

In this case, 2D information is also used to separate the terminal from

- Resize body for odd-shape

3 C:\Kohyoung\AOI\Vision\Ref all files(.ref, .scl) Reference & Scale files