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Chemical Machining
CM or CHM

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Youtube Links
• https://www.youtube.com/watch?v=HwpolW
RBqkM
• https://www.youtube.com/watch?v=zkdQdd
MZSyM
• https://www.youtube.com/watch?v=2O1TyJG
XuWY

Principle of Chemical Machining

• Chemical machining (CM) is the controlled dissolution of
workpiece material (etching) by means of a strong chemical
reagent (etchant).
• In CM material is removed from selected areas of
workpiece by immersing it in a chemical reagents or
etchants; such as acids and alkaline solutions.
• Material is removed by microscopic electrochemical cell
action, as occurs in corrosion or chemical dissolution of a
metal.
• This controlled chemical dissolution will simultaneously
etch all exposed surfaces even though the penetration rates
of the material removal may be only 0.0025–0.1 mm/min.

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Steps of CHM
• Workpiece preparation: The workpiece material has
to be cleaned in the beginning of chemical
machining process.
- The cleaning operation is carried out to remove the
oil, grease, dust, rust or any substance from the
surface of material.
• The most widely used cleaning process is chemical
method due to less damages occurred comparing to
mechanical.

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• Coating with masking material: The next step is the

coating cleaned workpiece material with masking
material. The selected masking material should be
readily strippable mask, which is chemically
impregnable and adherent enough to stand
chemical abrasion during etching.
• Etching: This step is the most important stage to
produce the required component from the sheet
material. The workpiece material is immersed into
selected etchant to machine the uncovered areas.
• Cleaning masking material: Final step is to remove
masking material from etched part.

• Elements of the process Basically there are two

elements of the process :
1. Resists or Maskant.
2. Etchants.

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Maskant
• Masking material which is called Maskant is used to
protect workpiece surface from chemical etchant.
• Polymer or rubber based materials are generally used
for masking procedure.
• Multiple maskant coatings are used to provide a higher
etchant resistance.
- Long exposure time is needed when thicker and
rougher dip or spray coatings are used.
• Various maskant application methods can be used such
as dip, brush, spray, roller, and electrocoating as well as
adhesive tapes.

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The selected maskant material should have following

properties.
1. Tough enough to withstand handling
2. Well adhering to the work piece surface
3. Easy scribing
4. Inert to the chemical reagent used.
5. Able to withstand the heat used during chemical
machining.
6. Easy and inexpensive removal after chemical
machining etching

• When higher machined part dimensional accuracy

is needed, spraying the mask on the workpiece
through silk screen would provide a better result.
• Thin maskant coating would cause severe problems
such as not withstanding rough handling or long
exposure times to the etchant.
• The application of photo-resist masks which are
generally used in photochemical machining
operation, produce high accuracy, ease of repetition
for multiple part etching, and ease of modification.

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Possible Maskant Materials for different

Workpiece Materials

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Etchants
Etchants are the most influential factor in the chemical
machining of any material.
The best possible etchant should have properties as follows.
a. High etch rate
b. Good surface finish
c. Minimum undercut
d. Compatibility with commonly used maskants
e. High dissolved-material capacity
f. Economic regeneration
g. Etched material recovery

Factors to be considered while selecting the etchant

are :
1. Material to be etched.
2. Type of the maskant.
3. Depth of etch.
4. Surface finish required.
5. MRR.
6. Damage to the work material.

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• https://www.youtube.com/watch?v=OFYAUA
OwrzY

• https://www.youtube.com/watch?v=M1ZCVgd
nnpY

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Application of CHM
• Chemical Milling : It is widely used in aircraft
industry. It is the preparation of complicated
geometry on the workpiece using CHM process.
• Chemical Blanking : In this application cutting is
done on sheet metal workpieces. Metal blanks can
be cut from very thin sheet metal, this cutting may
not be possible by conventional methods.
• Photochemical Machining : It is used in metal
working when close (tight) tolerances and intricate
patterns are to be made. This is used to produce
intricate circuit designs on semiconductor wafers.

Advantages of CHM process are listed below :

(a) Low tooling cost.
(b) Multiple machining can be done on a workpiece
simultaneously.
(c) No application of force so on risk of damage to
delicate or low strength workpiece.
(d) Complicated shapes/patterns can be machined.
(e) Machining of hard and brittle material is possible.
Disadvantages and Limitations of CHM :
(a) Slower process, very low MRR so high cost of
operation.
(b) Small thickness of metal can be removed.
(c) Sharp corners cannot be prepared.
(d) Requires skilled operators.

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Chemical blanking
• It is used for parts that are otherwise typically
produced by mechanical blanking presses from
thin plates and foil material.
• With mechanical presses, vibrations, backlash,
and part distortion will make smaller parts
difficult to produce.
• Chemical blanking becomes a favorable solution
in such a case.
• Typical Applications : Burr Free Etching of PCBs,
Decortive Panels, Thin sheet metal stampings.

Chemical blanking employs the following four steps.

a) Pre-process
Material cleaning - Metal surface is cleaned by degreasing, pickling and
grinding so as to produce a good adhesion of the masking material.
b) Masking
Metal portion not to be removed by etching is covered with chemical
resistant coating. For extra precise applications, photo-resist material is
used.
c) Through-material etching
Since the material is to be penetrated through, etching is applied from both
sides simultaneously.
W/p is either sprayed continuously with a selected etchant like Ferric
Chloride, on those portions where the material is to be removed, or
immersed in a tank of agitated etchant, where the etchant chemically
attacks those portions not masked. Erosion of the work material takes
place both inward & laterally from the exposed (unmasked) surface as
shown in the figure.
d) Post-process
Removal of the resist material, and washing off etchant. If the resist material
is non water soluble, organic solvents are used.

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Chemical Milling

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Process Parameters of CHM

• Type of Etchant.
• Its concentration.
• Operating Temperature.
• Circulation.

Direct Impact on the Accuracy, Surface Finish &

MRR.

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1. MRR
• Depends on the type of etchant.
• Faster MRR tend to have many side effects
including reduction in surface finish, increased
under cut, higher heating & attack on the
bond between the maskant & the work
surface.
• Etch rate : 0.02 to 0.04mm/min.

2. Accuracy
• It depends on the undercut produced.
• Undercut per edge is approximately equal to the
depth of cut.
• Allowance should be provided for undercut.
• Accuracy : 0.01mm can be achieved.

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3. Surface Finish
• Machining rate effects the Surface roughness
& hence the tolerance produced.
• Slow Etching – Will produce a surface finish
similar to the original surface.
• Surface Roughness : 0.1 to 0.8µm
• Under special condotions, 0.025 to 0.05µm is
also possible.

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