ELECTRONICS AND COMMUNICATIONS

RADIO COMMUNICATION CIRCUITS

Chapter 1
Introduction to RF Communication Systems

Huynh Phu Minh Cuong

hpmcuong@hcmut.edu.vn

Department of Telecommunications
Faculty of Electrical and Electronics Engineering
Ho Chi Minh city University of Technology
Dr. Cuong HuynhTelecommunications DepartmentHCMUT 1
 Telecommunications Engineering
-an introduction-

Comm. Comm.
Engineering Network

RF/Microwave
Engineering Signal
& Integrated processing
Circuits

Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT

 Thiết kế, chế tạo các mạch, thành phần
và hệ thống siêu cao tần cho các hệ
thống viễn thông vô tuyến và Radar.
 Vi mạch siêu cao tần
 Mạch và hệ thống siêu cao tần
 Anten và truyền sóng

Comm. Systems

Radar Systems
Cuong Huynh, Ph.D.Telecommunications DepartmentHCMUT
 Introduction to RF Communication Systems
1.1 Wireless Communication Systems
 A system allows the communication of information between two points using Radio
Waves.

 Radio waves are generated (then propagate) and received by antenna.

 The word radio refers to techniques that are used in transmitting and receiving information
or power in the atmosphere or free space, or in transmission lines utilizing electromagnetic
waves—so-called radio waves.
Radio Waves = Electromagnetic waves = Radio Frequency (RF) signal
 Radio waves propagate in a vacuum with the speed of light, c = 3.108 m/s.
 Each radio wave is characterized by magnitude (power), frequency and phase.
 The frequency of a radio wave is f , then the wavelength is = c /f.
 The radio waves are classified based on their frequencies or applications.

Dr. Cuong HuynhTelecommunications DepartmentHCMUT

 Introduction to RF Communication Systems
Wireless Communications Systems
The field of radio frequency (RF) and microwave engineering generally covers the
behavior of AC signals with frequencies in the range of 300 KHz to 300 GHz.
 RF signals : 300 KHz to 300 GHz Wave length: 1 Km – 1mm
 Microwave signals: 300 Mhz – 300 GHz Wave length: 0.1m – 1mm
 Millimeter-wave signals: 30 GHz – 300 GHz Wave length: 10 mm – 1mm

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 Introduction to RF Communication Systems
1.2 Frequency Spectrum
 The radio waves are classified based on their frequencies or applications.

ISM: Industrial, scientific and medical - DBS: Direct broadcast satellite

Dr. Cuong HuynhTelecommunications DepartmentHCMUT
 Introduction to RF Communication Systems
1.3 Wireless communication systems
Major Worldwide Cellular and PCS Telephone Systems

Dr. Cuong HuynhTelecommunications DepartmentHCMUT

Introduction to RF Communication Systems

Dr. Cuong HuynhTelecommunications DepartmentHCMUT

Introduction to RF Communication Systems

Cellular Communication System

Dr. Cuong HuynhTelecommunications DepartmentHCMUT

Introduction to RF Communication Systems

Dr. Cuong HuynhTelecommunications DepartmentHCMUT

 Introduction to RF Communication Systems
1.3 Wireless communication systems
TX

Transmitter
Front-End
TX
RX

Receiver
Front-End

 A typical communication system can be partitioned into a transmitter, a channel,

and a receiver.
 In this course we will study the circuits that interface from the channel to the
receiver/transmitter. These circuits are at the “front-end'” of the transceiver and
Dr. Cuong HuynhTelecommunications DepartmentHCMUT 11
operate at high frequency : TX Front-End and RX Front-End
 Introduction to RF Communication Systems
Generic RF Transceiver
TX: Drive antenna with RX: Sense small signal
high power level (amplify with low noise)

Modulation refers to
a process of turning
information into
(electrical) signals
which are suitable
for transmission.

Dr. Cuong HuynhTelecommunications DepartmentHCMUT

 Introduction to RF Communication Systems
Generic RF Transceiver

 Signals are upconverted/downconverted at TX/RX, by an oscillator controlled by a

Frequency Synthesizer

Dr. Cuong HuynhTelecommunications DepartmentHCMUT

Introduction to RF Communication Systems
A cell phone

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Introduction to RF Communication Systems
Block diagram of the CC1020 IC – Texas Instrument

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Introduction to RF Communication Systems
2.4 GHz IEEE 802.15.4 / ZigBee-ready RF Transceiver

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1.4 Fabrication Technologies for RF Circuits
Microwave/RF Integrated Circuits (MIC’s) consist of three
types of circuit elements:
– Distributed transmission lines (microstrip, strip, etc.)
– Lumped elements (R, L and C)
– Solid state/Semiconductor devices (FETs, BJTs, diodes, etc.)
Microwave integrated circuits (MICs) Technologies replace
bulky and expensive waveguide and coaxial components with small
and inexpensive planar components for smaller size, lighter weight,
lower power requirements, lower cost, and increased complexity.
MICs can be fabricated in forms of HMIC and MMIC/RFIC

Hybrid MICs Hybrid Microwave Integrated Circuits

Monolithic Microwave Integrated Circuits
MIC Radio Frequency Integrated Circuits

MMIC/RFIC
Dr. Cuong HuynhTelecommunications DepartmentHCMUT 17
1.4 Fabrication Technologies for RF Circuits
 Hybrid Microwave Integrated Circuits (HMICs): where
solid state devices and passive elements (both lumped and
distributed) are bonded to its dielectric substrate.
 Single/multiple-level metallization for conductors &
transmissionl ines with discrete circuit elements (such as
transistors, inductors, capacitors, etc.) bonded to the substrate

Dr. Cuong HuynhTelecommunications DepartmentHCMUT 18

1.4 Fabrication Technologies for RF Circuits
 Monolithic Microwave Integrated Circuits (MMICs): is a
type of circuit in which all active and passive elements as well as
transmission lines are integrated into a bulk or onto the surface of a
substance by some special processes such as: deposition, epitaxy,
ion implantation, sputtering, evaporation, diffusion.

Dr. Cuong HuynhTelecommunications DepartmentHCMUT 19

1.4 Fabrication Technologies for RF Circuits

Dr. Cuong HuynhTelecommunications DepartmentHCMUT 20

1.4 Fabrication Technologies for RF Circuits

Dr. Cuong HuynhTelecommunications DepartmentHCMUT 21

1.4 Fabrication Technologies for RF Circuits

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1.4 Fabrication Technologies for RF Circuits

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1.4 Fabrication Technologies for RF Circuits

Hybrid MICs MMIC/RFIC

Designed by
Cuong Huynh

Dr. Cuong HuynhTelecommunications DepartmentHCMUT 24

1.4 Fabrication Technologies for RF Circuits
 Hybrid versus Monolithic Microwave Integrated Circuits:
MMIC/RFIC has advantages over HMIC for Cost, Size and weight,
Design flexibility, Broadband performance, Reproducibility, Reliability.

 RF/MW MMIC circuits are important as :

• The trend in advanced microwave electronic systems is toward
increasing integration, reliability, and volume of production with lower
costs.
• The new millimeter-wave circuit applications demand the effects of
bond-wire parasitics to be minimized and use of discrete elements to be
avoided.
• New developments in military, commercial and consumer markets
demand a new approach for mass production and for multi-octave
bandwidth response in circuits.

Dr. Cuong HuynhTelecommunications DepartmentHCMUT 25

1.4 Fabrication Technologies for RF Circuits

CMOS RFIC
Technology
 The metal–oxide–semiconductor field-effect
transistor (MOSFET) was first patented
by Julius Edgar Lilienfeld in 1925, well before
the invention of BJT.
 Due to the fabrication limitation, MOSFET
has not been used until the early years of 1960s.
 CMOS (Complementary MOS p- and n-type
device) was patented by Frank Wanlass in 1967,
initiating a revolution in the semiconductor
industry.
 CMOS initially dominates in the digital
circuit/systems while others for analog.
 Why CMOS now ? Low cost, high integration
and solution for SOC.

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1.4 Fabrication Technologies for RF Circuits

CMOS Technology

 CMOS Transistors
 Interconnect
 Diodes
 Resistors
 Capacitors
 Inductors
 Bipolar Transistors

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1.4 Fabrication Technologies for RF Circuits

CMOS Technology Intel 45 nm CMOS Process

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 Introduction to RF Communication Systems
 Wireless communications, radar and sensing systems play a very important role in our
information-age society in many areas.
 Wireless handheld devices become smaller, cheaper, and more complicated with multiple
functions, making the life of each individual more and more convenient.
 Integrated circuit (IC) is the only technology used to implement the modern electronic devices
and mainly drives the development of the wireless communication and sensing systems.
 Many new applications are emerging.

 Ph.D
Cuong HuynhDepartmentHCMUT
Dr. Cuong HuynhTelecommunications
 Introduction to RF Communication Systems
What are Integrated Circuits ?
 All circuit components including transistors, diode, R, L, C, interconnect, TL, . . . . are implemented
on a semiconductor substrate.

Discrete Circuits (5cm x 5cm) Integrated Circuits (5mmx5mm)

Chip

Why Integrated ?
 Smaller size, reduced cost, increased performance.
 Motivate creativities for new circuits and applications.
Dr. Cuong HuynhTelecommunications DepartmentHCMUT
 Introduction to RF Communication Systems
 The metal–oxide–semiconductor field-effect
transistor (MOSFET) was first patented by Julius
Edgar Lilienfeld in 1925, well before the invention
of BJT.
 Due to the fabrication limitation, MOSFET has
not been used until the early years of 1960s.
 CMOS (Complementary MOS p- and n-type
device) was patented by Frank Wanlass in 1967,
initiating a revolution in the semiconductor
industry.
 CMOS initially dominates in the digital
circuit/systems while others for analog.
 Why CMOS now ? Low cost, high integration and
solution for SOC.
 Idea of integration was in the late 1950’s.
 Prediction of Gordon Moore (one of Intel
founders): the number of transistors on
integrated circuits doubles approximately every
two years.
 Ph.D
Cuong HuynhDepartmentHCMUT
Dr. Cuong HuynhTelecommunications 31
 Comm. Systems

Radar
Dr. Cuong HuynhTelecommunications Systems
DepartmentHCMUT
 Introduction to CMOS RFIC Design
RF/Analog IC
RF RX Mixer VGA Analog

BaseBand IC
CPU, DSP, Mem . .
LNA ADC

T/R

PLL SPI
Switch

PA DAC


TX Mixer VGA

 A modern wireless system/device consists of Digital

(Baseband), Analog and RF sub-systems.
 Building these systems completely in single chips working in RF
and Microwave frequencies has been a reality.
 RF CMOS Technology: low-cost, small-size and high-integration
for single-chip solutions.
 Many applications have been developed in many countries in
the world.
(Wifi, WiMax, UWB, mobile (GSM, WCDMA, LTE), cordless phones, RFID,
.
ZigBee, Bluetooth, TV set top box, sensing and radar)

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 Introduction to RF Communication Systems
Radio Frequency Integrated Circuits: RFIC

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 Introduction to RF Communication Systems
Radio Frequency Integrated Circuits for Communications

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