Design For

Manufacture
TheThe
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 Design For Manufacture (DFM)

What areas does DFM give consideration to?

•  Common errors in the documentation

•  Good design
•  Required tolerances

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 Design For Manufacture (DFM)

These areas include, but are not limited to, the following points:

•  Procurement documentation problems

•  Data generation problems
•  Solder mask openings / bridges
•  Annular ring / clearance
•  Copper balance / design
•  Copper thickness/ track width
•  Drill diameter / aspect ratio
•  Material yield

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 Procurement Documentation Problems

The most common errors that occur relate to

missing, ambiguous/incomprehensible/conflicting
information.

Our experience shows that this occurs in about

30% of all the of the new articles which are
handled by NCAB Group.

This leads to engineering questions (EQ’s) being

raised that sometimes take time to clarify and can
actually affect delivery dates.
These EQ’s have to be asked or the PCB can be
“perfectly wrong”.

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 Procurement Documentation Problems

Examples of missing information can be seen below

•  Outline information / data / drawings

•  Plated or non plated hole identification
•  Surface finish within the data package
•  Copper thickness
•  Material details
•  Color of solder mask/legend print
•  Thickness of finished board
•  Missing Gerber or drill files
•  Etc

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 Procurement Documentation Problems

Examples of ambiguous/incomprehensibe/conflicting information.

?  The given board thickness does not match the specified build.
?  Legend print is included in the documentation but shall not be
printed.
?  Dimensions listed on the drawing do not match with the Gerber
outline.
?  Number of holes in drill drawing does not match with the number
of holes detailed in the supplied drill file.
?  The hole sizes in drill drawing does not match the sizes in drill
file.
?  Copper thickness in specification is different to the stated build.
?  Specified impedance requirements cannot be achieved based
upon the stated build.

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 Procurement Documentation Problems

Examples of ‘impossible’ information.

!  References are made to all kinds of available standards in the world

without any explanation to support:

?  The PCB shall fulfill relevant parts from IEC-60255

?  Press-fit shall be according to IEC 60352-5
?  The PWB shall fulfill the safety standard EN-50178

!  The specification from the customer contains 52 pages, and

‘hidden’ on page 43 it says that if there are 1.3mm holes within the
data, then they should in fact be produced as 1.4mm with a
tolerance of +0.05/-0.10mm.
!  ……….

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 Procurement Documentation Problems

Conclusions .

ü  As far as is possible, always send the information that is relevant for
the PCB manufacturing. Other notes relating to assembly (for
example) can cause confusion for everyone.

ü  Avoid too much information as this almost always leads to some sort
of “double information”, which in many cases actually causes
conflicting information being provided.

ü  References should always be made to known or internationally

recognised specifications (such as IPC). Otherwise, or if this cannot
be avoided, the specific demand must be extracted and provided in
detail.

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 Data Generation Problems


Copper slivers – left hand image shows them between tracks

This phenomenon is often caused when the ground plane is drawn with
too small apertures or when track and ground are two different files that
are plotted together to form one layer.

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 Data Generation Problems

Unflashed Pads & Drawn Surfaces

Surface and pads are made with small elements/apertures. This creates
large files that sometimes make them impossible to send by e-mail.

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 Data Generation Problems

Flashed Pads & Surface.

This will make it possible for the manufacturer to run DRC, create test
fixtures and add etch compensation.

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 Data Generation Problems

Same net spacing - examples

The designer has allowed the system to deviate from the set
clearance when routing is done within the same net.

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 Data Generation Problems


Same net spacing – what’s the risk?

The result could be that the fine line ‘moves’ at the dry film process
and then re-attaches in such a way that it creates an open circuit.

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 Soldermask Openings / Bridges

This example shows a soldermask enlargement of 0.075mm (3mil)

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 Soldermask Openings / Bridges


Soldermask with maximum displacement

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 Soldermask Openings / Bridges

A B C D GENERAL
A = 160µm
B = 230µm
C = 65µm
D = 100µm
MODERATE
A = 125µm
B = 200µm
C = 50µm
D = 100µm
ADVANCED
A = 100µm
B = 150µm
C = 37µm

Note: Cu thickness ≤ 35um and not including Immersion Sn finish. D = 80µm

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 Soldermask Openings / Bridges

Remove soldermask bridges when the pitch is too small

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 Soldermask Openings / Bridges

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 Soldermask Openings / Bridges


There is an obvious risk when
placing a via hole too close to
a SMD pad.
If the soldermask and via hole
moves towards each other
during the manufacturing
process there is a risk that the
via hole is exposed.
The solder will creep down the
hole in the soldering process
and give a bad soldering result.

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 Soldermask Openings / Bridges


The distance between the
soldermask opening and hole
edge should be at least 0.20mm
to ensure that the hole is
covered with soldermask.

0.20mm With this design the solder will

not creep down the hole in the
soldering process and give a
bad soldering result.

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 Annular Ring / Clearances

In this example the pad is 0.50mm and the drill hole 0.30mm

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 Annular Ring / Clearances

In this example the pad is 0.50mm and the drill hole 0.30mm

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 Annular Ring / Clearances

In this example the pad is 0.50mm and the drill hole 0.30mm

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 Annular Ring / Clearances

A B C

GENERAL MODERATE ADVANCED

A = 150µm A = 125µm A = 100µm
B = 125µm B = 125µm B = 100µm
C = 275µm C = 250µm C = 200µm

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 Annular Ring / Clearances

Tip! Design with tear drops or give acceptance to factory to add tear drops

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 Annular Ring / Clearances


Tear drops – can only benefit when available space!

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 Copper Balance / Design

Redundant pads on inner layers – why?

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 Copper Balance / Design

Example of poor copper balance – two very different sides to one layer!

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 Copper Balance / Design

Poor copper balance leads to Good copper balance leads to

excessive copper plating an even copper plating

Additional copper should be used to balance sparse areas.

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 Copper Balance / Design


Copper balance – before and after!

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 Copper Balance / Design

Good design - thin tracks Poor design - thin tracks

are used ONLY where required. are used on the WHOLE board
(auto routing).

The outcome / yield at a manufacturer is influenced by the distance

that thin tracks runs side by side.

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 Copper Balance / Design

Symmetrical build up Unsymmetrical build up

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 Copper Thickness / Track Width

Normally, the aim during is to achieve an average

copper thickness within the hole of 25µm.
The distribution / thickness on the surface depends
upon the copper balancing and normally a plating
thickness between 15-35µm is achieved.
At 18µm base copper this provides a final copper
thickness in the region of 30-50µm.

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 Copper Thickness / Track Width
35µm

In order to obtain a thicker track you have to start with

a thicker base copper as the photoresist is typically
35µm thick – so attempts to plate more than 25µm will
result in over plating as shown in the above graphic

Normal base copper thickness are 18, 35, 70, 105, etc

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 Copper Thickness / Track Width

Thick base copper can, however, lead to difficulties or

challenges when etching. Because of this there are limits
in how thick/thin the track and gaps can be within the
design the design.

Normally the manufacturer will add an etch

compensation as long as the isolation distance allows it.

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 Copper Thickness / Track Width

This is an example of poor design when specifying 105#m copper. The

design includes 6/6 mil track/clearance in the highlighted section, even
though there is plenty of space to increase this.

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 Copper Thickness / Track Width (outer layer)

B C

GENERAL MODERATE ADVANCED

A B C B C B C
18µm 125µm 125µm 100µm 100µm 75µm 75µm
35µm 150µm 150µm 125µm 125µm 90µm 90µm
70µm 200µm 200µm 175µm 175µm 150µm 150µm
105µm 250µm 250µm 225µm 225µm 200µm 200µm

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 Copper Thickness / Track Width (inner layer)

B C

GENERAL MODERATE ADVANCED

A B C B C B C
18µm 125µm 125µm 100µm 100µm 75µm 75µm
35µm 150µm 150µm 100µm 100µm 90µm 90µm
70µm 200µm 200µm 150µm 150µm 140µm 140µm
105µm 250µm 250µm 225µm 225µm 190µm 190µm

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 Drill Diameter / Aspect Ratio

Aspect ratio is the ratio between the minimum

hole diameter and overall thickness of the
board.
For example; if the board thickness is 1.60mm
and the minimum hole size is 0.40mm, then
the aspect ratio is said to be 1:4

Higher aspect ratios are more difficult to

produce.

Example of 1:15

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 Drill Diameter / Aspect Ratio


When the holes are small it is difficult for the plating solution to flow
through the holes. This leads to very thin plating in the middle of the
hole (if you are using the wrong equipment).
It is more common to now see that manufacturers have an aspect ratio
of 1:8.

Large hole = better solution flow Small hole = ‘tougher’ solution flow

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 Drill Diameter / Aspect Ratio

Blind holes that are drilled with laser or depth controlled drilling must
have an aspect ratio of less than 1:1
It is preferable if the aspect ratio is 0.7:1
If the holes are built in sequence it is possible to have the same aspect
ratio as for plated through holes.

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 Drill Diameter / Aspect Ratio

Drilling of small holes

sets higher demands
on the equipment and
also reduces the
number of boards you
can drill in the stack.
If the smallest drill is
0.20mm you can only
drill a PCB which is
1.60mm thick.

0.50-3.10mm 0.05-0.50mm

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 Drill Diameter / Aspect Ratio

GENERAL
A = 300µm
B = 6-8:1

MODERATE
A = 250µm
B = 8-10:1

ADVANCED
A = 200µm
B = Aspect ratio A B = 12-20:1

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 Material Yield

Since a large part of the cost is related to the raw material (see NCAB
Group presentation on PCB cost drivers for more information!), it is
therefore important for the manufacturer to have a good material yield to
avoid scraping unused processed material.
In Asia the production panel size can be adapted to the board design
(more panel size options), however in Europe it is more common to use
fewer standard panel sizes.

However, this does not mean that material utilisation within Asian
factories is a factor which can be ‘ignored’.

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 Material Yield

Circuit size 10.2 x 7.9

Customer array 12.5”x 11.25”

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 Material Yield
14

12.5

11.25

24

This example shows 2 x customer arrays in one production panel

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 Material Yield
48
24

14

42

6x production panels can be cut from one sheet of raw material

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 Material Yield

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 Material Yield

How to improve the yield?

Circuit size Circuit size

10.2 x 7.9 10.2 x 7.9

Re-design the customer array to 16”x 11.25” - without any impact on PCB
circuit size or function.

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 Material Yield
18

16

11.25

24

Re-design example shows 2x arrays / 4 circuits in one production panel

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 Material Yield
48”
24”

18”

36”

Re-design example shows 4x production panels can be cut from one smaller
sheet of raw material

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 Material Yield

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 Material Yield

The conclusion is that not only can material yields be improved, but
costs can be saved if the re-designs are welcomed – we all benefit
from a good material yield.
This apply to all types of materials and especially RF material that
may cost many times more than a standard FR4 for example.

The NCAB Group welcomes discussions on how we can optimise

material yields and this becomes even more critical when we
consider high running / high volume boards which can have a long
life cycle.

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