SiRA99DP

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Vishay Siliconix
P-Channel 30 V (D-S) MOSFET
FEATURES
PowerPAK® SO-8 Single
D • TrenchFET® Gen IV p-channel power MOSFET
D 8
D 7 • Very low RDS(on) minimizes voltage drop and
D 6 reduces conduction loss
5
• Eliminates the need for charge pump
• 100 % Rg and UIS tested
6. 1 • Material categorization: for definitions of compliance
15
m 2 S please see www.vishay.com/doc?99912
m
5 mm 3 S
1 5.1 4 S
G APPLICATIONS S
Top View Bottom View
• Adapter and charger switch
PRODUCT SUMMARY • Battery and circuit protection G
VDS (V) -30 • OR-ing
RDS(on) max. () at VGS = -10 V 0.00170
• Load switch
RDS(on) max. () at VGS = -4.5 V 0.00265
Qg typ. (nC) 84 • Motor drive control P-Channel MOSFET

ID (A) -195 D
Configuration Single

ORDERING INFORMATION
Package PowerPAK SO-8
Lead (Pb)-free and halogen-free SiRA99DP-T1-GE3

ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)

PARAMETER SYMBOL LIMIT UNIT
Drain-source voltage VDS -30
V
Gate-source voltage VGS +16 / -20
TC = 25 °C -195
TC = 70 °C -156
Continuous drain current (TJ = 150 °C) ID
TA = 25 °C -47.9 b, c
TA = 70 °C -38.3 b, c
A
Pulsed drain current (t = 100 μs) IDM -400
TC = 25 °C -94.5
Continuous source-drain diode current IS
TA = 25 °C -5.6 b, c
Single pulse avalanche current IAS -50
L = 0.1 mH
Single pulse avalanche energy EAS 125 mJ
TC = 25 °C 104
TC = 70 °C 66.6
Maximum power dissipation PD W
TA = 25 °C 6.35 b, c
TA = 70 °C 4 b, c
Operating junction and storage temperature range TJ, Tstg -55 to +150
°C
Soldering recommendations (peak temperature) c 260

THERMAL RESISTANCE RATINGS

PARAMETER SYMBOL TYPICAL MAXIMUM UNIT
Maximum junction-to-ambient b t  10 s RthJA 15 20
°C/W
Maximum junction-to-case (drain) Steady state RthJC 0.9 1.2
Notes
a. Package limited
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 54 °C/W
g. TC = 25 °C

S19-0115-Rev. A, 04-Feb-2019 1 Document Number: 71023

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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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 SiRA99DP
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Vishay Siliconix

SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)

PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-source breakdown voltage VDS VGS = 0 V, ID = -250 μA -30 - - V
VDS temperature coefficient VDS/TJ ID = -10 mA - -14 -
mV/°C
VGS(th) temperature coefficient VGS(th)/TJ ID = -250 μA - 6 -
Gate-source threshold voltage VGS(th) VDS = VGS, ID = -250 μA -1 - -2.5 V
Gate-source leakage IGSS VDS = 0 V, VGS = +16 / -20 V - - 100 nA
VDS = -30 V, VGS = 0 V - - -1
Zero gate voltage drain current IDSS μA
VDS = -30 V, VGS = 0 V, TJ = 70 °C - - -15
On-state drain current a ID(on) VDS  -10 V, VGS = -10 V -40 - - A
VGS = -10 V, ID = -20 A - 0.00130 0.00170
Drain-source on-state resistance a RDS(on) 
VGS = -4.5 V, ID = -15 A - 0.00220 0.00265
Forward transconductance a gfs VDS = -15 V, ID = -20 A - 114 - S
Dynamic b
Input capacitance Ciss - 10 995 -
Output capacitance Coss VDS = -15 V, VGS = 0 V, f = 1 MHz - 5000 - pF
Reverse transfer capacitance Crss - 510 -
VDS = -15 V, VGS = -10 V, ID = -20 A - 172.5 260
Total gate charge Qg
- 84 126
nC
Gate-source charge Qgs VDS = -15 V, VGS = -4.5 V, ID = -20 A - 35.6 -
Gate-drain charge Qgd - 27.5 -
Gate resistance Rg f = 1 MHz 0.5 1.3 2.2 
Turn-on delay time td(on) - 23 46
Rise time tr VDD = -15 V, RL = 0.75 , ID  -20 A, - 19 38
Turn-off delay time td(off) VGEN = -10 V, Rg = 1  - 64 128
Fall time tf - 16 32
ns
Turn-on delay time td(on) - 69 138
Rise time tr VDD = -15 V, RL = 0.75 , ID  -20 A, - 183 366
Turn-off delay time td(off) VGEN = -4.5 V, Rg = 1  - 51 102
Fall time tf - 57 114
Drain-Source Body Diode Characteristics
Continuous source-drain diode current IS TC = 25 °C - - -94.5
A
Pulse diode forward current ISM - - -400
Body diode voltage VSD IS = -5 A, VGS = 0 V - -0.71 -1.1 V
Body diode reverse recovery time trr - 75 150 ns
Body diode reverse recovery charge Qrr IF = -20 A, di/dt = 100 A/μs, - 125 250 nC
Reverse recovery fall time ta TJ = 25 °C - 31 -
ns
Reverse recovery rise time tb - 39 -
Notes
a. Pulse test; pulse width  300 μs, duty cycle  2 %
b. Guaranteed by design, not subject to production testing

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.

S19-0115-Rev. A, 04-Feb-2019 2 Document Number: 71023

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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
 SiRA99DP
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Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)

Axis Title Axis Title

200 10000 250 10000

160 200
ID - Drain Current (A)

VGS = 10 V thru 4 V

ID - Drain Current (A)

1000 1000
120 150

2nd line

2nd line
1st line

1st line
2nd line

2nd line
80 100
TC = 25 °C
100 100

40 50
VGS = 3 V TC = 125 °C TC = -55 °C
VGS = 2 V
0 10 0 10
0 1 2 3 4 5 0 1 2 3 4 5
VDS - Drain-to-Source Voltage (V) VGS - Gate-to-Source Voltage (V)

Output Characteristics Transfer Characteristics

Axis Title Axis Title

0.0040 10000 100 000 10000

0.0034
RDS(on) - On-Resistance (Ω)

Ciss
C - Capacitance (pF)

1000 10 000 1000

0.0028 VGS = 4.5 V
Coss
2nd line

2nd line
1st line

1st line
2nd line
2nd line

0.0022
100 1000 100
VGS = 10 V Crss
0.0016

0.0010 10 100 10
0 40 80 120 160 200 0 6 12 18 24 30
ID - Drain Current (A) VDS - Drain-to-Source Voltage (V)

On-Resistance vs. Drain Current and Gate Voltage Capacitance

Axis Title Axis Title

10 10000 1.6 10000
RDS(on) - On-Resistance (Normalized)

ID = 20 A
VGS - Gate-to-Source Voltage (V)

8 1.4
VGS = 10 V, 20 A
1000 1000
6 1.2
2nd line

2nd line
1st line

1st line
2nd line

2nd line

4 1.0
VDS = 10 V, 15 V, 20 V 100 100
VGS = 4.5 V, 15 A

2 0.8

0 10 0.6 10
0 36 72 108 144 180 -50 -25 0 25 50 75 100 125 150
Qg - Total Gate Charge (nC) TJ - Junction Temperature (°C)

Gate Charge On-Resistance vs. Junction Temperature

S19-0115-Rev. A, 04-Feb-2019 3 Document Number: 71023

For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
 SiRA99DP
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Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)

Axis Title Axis Title

100 10000 1.0 10000

ID = 250 μA
0.7
10
IS - Source Current (A)

VGS(th) - Variance (V)

1000 1000
0.4

2nd line
2nd line

1st line
1st line

2nd line
2nd line

TJ = 150 °C TJ = 25 °C
1 ID = 5 mA
0.1
100 100
0.1
-0.2

0.01 10 -0.5 10
0 0.2 0.4 0.6 0.8 1.0 1.2 -50 -25 0 25 50 75 100 125 150
VSD - Source-to-Drain Voltage (V) TJ - Junction Temperature (°C)

Source-Drain Diode Forward Voltage Threshold Voltage

Axis Title Axis Title

0.010 10000 500 10000

ID = 20 A
0.008 400
RDS(on) - On-Resistance (Ω)

1000 1000
P - Power (W)

0.006 300
2nd line

2nd line
2nd line
1st line

1st line
2nd line

0.004 200
TJ = 125 °C 100 100

0.002 100

TJ = 25 °C
0 10 0 10
0 2 4 6 8 10 0.001 0.01 0.1 1 10
VGS - Gate-to-Source Voltage (V) t - Time (s)

On-Resistance vs. Gate-to-Source Voltage Single Pulse Power, Junction-to-Ambient

Axis Title
1000 10000
IDM limited
100 μs
100
ID limited
ID - Drain Current (A)

1 ms
1000
10
2nd line
1st line
2nd line

10 ms

1 100 ms
Limited by RDS(on) a
1s 100

10 s
0.1
TA = 25 °C, DC
single pulse BVDSS limited
0.01 10
0.01 0.1 1 10 100
VDS - Drain-to-Source Voltage (V)

Safe Operating Area, Junction-to-Ambient

Note
a. VGS > minimum VGS at which RDS(on) is specified

S19-0115-Rev. A, 04-Feb-2019 4 Document Number: 71023

For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
 SiRA99DP
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Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)

Axis Title
250 10000

200

ID - Drain Current (A)

1000
150

2nd line
1st line
2nd line
100
100

50

0 10
0 25 50 75 100 125 150
TC - Case Temperature (°C)

Current Derating a

Axis Title Axis Title

125 10000 3.0 10000

100 2.4

1000 1000
P - Power (W)

P - Power (W)

75 1.8
2nd line

2nd line
1st line

1st line
2nd line

2nd line

50 1.2
100 100

25 0.6

0 10 0 10
0 25 50 75 100 125 150 0 25 50 75 100 125 150
TC - Case Temperature (°C) TA - Ambient Temperature (°C)

Power, Junction-to-Case Power, Junction-to-Ambient

Note
a. The power dissipation PD is based on TJ max. = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the
package limit

S19-0115-Rev. A, 04-Feb-2019 5 Document Number: 71023

For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
 SiRA99DP
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Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)

Axis Title
1 10000

Duty cycle = 0.5

Normalized Effective Transient
Thermal Impedance

0.2 Notes 1000

2nd line
1st line
PDM
0.1 0.1
t1
0.05 t2
t1 100
1. Duty cycle, D = t
2
0.02 2. Per unit base = RthJA = 54 °C/W
3. TJM - TA = PDMZthJA (t)

Single pulse
4. Surface mounted
0.01 10
0.0001 0.001 0.01 0.1 1 10 100 1000
Square Wave Pulse Duration (s)

Normalized Thermal Transient Impedance, Junction-to-Ambient

Axis Title
1 10000

Duty cycle = 0.5

Normalized Effective Transient

0.2
Thermal Impedance

0.1 1000
0.05

2nd line
1st line
0.02
0.1
Single pulse
100

0.01 10
0.0001 0.001 0.01 0.1 1
Square Wave Pulse Duration (s)

Normalized Thermal Transient Impedance, Junction-to-Case

Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package / tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?71023.

S19-0115-Rev. A, 04-Feb-2019 6 Document Number: 71023

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 Package Information
www.vishay.com
Vishay Siliconix
PowerPAK® SO-8, (Single/Dual)
H L
E2 K
W E4

D4
θ
1 1

M
Z
2 2

D5
D

D1

D2
D
2
e
3 3

4 4

b
θ
L1
E3
A1 Backside View of Single Pad
θ θ
H L
E2 K
E4
A
c

D3 (2x) D4
E1 Detail Z 1
E
D1
2

D5
K1
D2
3
D2

b
Notes
1. Inch will govern.
2 Dimensions exclusive of mold gate burrs. E3
Backside View of Dual Pad
3. Dimensions exclusive of mold flash and cutting burrs.

MILLIMETERS INCHES
DIM.
MIN. NOM. MAX. MIN. NOM. MAX.
A 0.97 1.04 1.12 0.038 0.041 0.044
A1 - 0.05 0 - 0.002
b 0.33 0.41 0.51 0.013 0.016 0.020
c 0.23 0.28 0.33 0.009 0.011 0.013
D 5.05 5.15 5.26 0.199 0.203 0.207
D1 4.80 4.90 5.00 0.189 0.193 0.197
D2 3.56 3.76 3.91 0.140 0.148 0.154
D3 1.32 1.50 1.68 0.052 0.059 0.066
D4 0.57 typ. 0.0225 typ.
D5 3.98 typ. 0.157 typ.
E 6.05 6.15 6.25 0.238 0.242 0.246
E1 5.79 5.89 5.99 0.228 0.232 0.236
E2 3.48 3.66 3.84 0.137 0.144 0.151
E3 3.68 3.78 3.91 0.145 0.149 0.154
E4 0.75 typ. 0.030 typ.
e 1.27 BSC 0.050 BSC
K 1.27 typ. 0.050 typ.
K1 0.56 - - 0.022 - -
H 0.51 0.61 0.71 0.020 0.024 0.028
L 0.51 0.61 0.71 0.020 0.024 0.028
L1 0.06 0.13 0.20 0.002 0.005 0.008
 0° - 12° 0° - 12°
W 0.15 0.25 0.36 0.006 0.010 0.014
M 0.125 typ. 0.005 typ.
ECN: S17-0173-Rev. L, 13-Feb-17
DWG: 5881

Revison: 13-Feb-17 1 Document Number: 71655

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
 Application Note 826
Vishay Siliconix

RECOMMENDED MINIMUM PADS FOR PowerPAK® SO-8 Single

0.260
(6.61)
0.150
(3.81)

0.024
(0.61)

(3.91)

(4.42)
0.154

0.174
0.026
(0.66)
(1.27)
0.050

0.050 0.032 0.040

(1.27) (0.82) (1.02)

Recommended Minimum Pads

Dimensions in Inches/(mm)

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APPLICATION NOTE

Document Number: 72599 www.vishay.com

Revision: 21-Jan-08 15
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Revision: 09-Jul-2021 1 Document Number: 91000