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Separation Gap Measurement
Separation Gap Measurement
Separation Gap Measurement
Real-time measurements of the capacitance between the source and the receiver
allowed us to estimate the vacuum gap width precisely. Because the MEMS-based
platform in the vacuum chamber is connected to a capacitance meter via a vacuum
feed-through, the capacitance measurement needs to be calibrated. Furthermore,
the simultaneous measurement of the electrical resistance and capacitance also
results in an additional increase in the measured capacitance due to the internal
capacitance of digital multimeters (DMMs). Consequently, the capacitance
measurement was calibrated with reference capacitors in a configuration
identical to that used in the actual experiment to obtain the following relationship:
Cmeasured = Cactual + Cparallel, where Cmeasured is the measured capacitance outside of the
vacuum chamber and Cactual is the actual capacitance of the device. The capacitance
Cparallel, containing the contribution of the parallel connection including the vacuum
feed-through and the internal capacitance of DMMs, was found to be 153 ±5 pF.
Tailoring near-field thermal
radiation between metallo-dielectric
Thin bonding wires were attached with silver paste onto the corner of the receiver sample surface
and onto the top copper plate, which was electrically connected to the emitter sample via carbon
tape for the gap capacitance measurement with a digital multimeter (Tektronix DMM4050). The
vacuum gap distance can be determined as d=ε0Agap/Cgap , where Cgap is the measured gap
capacitance, and Agap is the overlapping area. The gap distance error is considered as one
standard deviation of three independent measurements from three emitter− receiver pairs
prepared in the same fabrication batch. The gap distances obtained from capacitance
measurements matched with the heights of fabricated SU-8 posts measured by a profilometer
(i.e., 508, 356, and 205 nm, respectively). While the gap distance might be consistent with SU-8
heights at large spacing it is more reasonable to use the gap distance directly measured from
capacitance across the actual vacuum gap where the NFTR occurs between mounted emitter and
receiver samples, rather than to simply take the SU-8 heights from the profilometry to be the gap
distance in case of accidental wafer deformation and dust particles during sample mounting.