Download as pdf or txt
Download as pdf or txt
You are on page 1of 5

Results in Materials 8 (2020) 100146

Contents lists available at ScienceDirect

Results in Materials
journal homepage: www.journals.elsevier.com/results-in-materials

Annealer curve characteristics of electrolytically refined tough pitch copper


(Cu-ETP) and oxygen free up-cast copper (Cu-OF) for electrical cable wires
C. Banganayi a, *, K. Nyembwe a, K. Mageza b
a
University of Johannesburg, Department of Metallurgy Johannesburg, South Africa
b
University of Johannesburg, Metal Casting Technology Station (MCTS) Johannesburg, South Africa

A R T I C L E I N F O A B S T R A C T

Keywords: Annealing is a critical step during the wire drawing of copper to produce wires with the required ductility and
Cu-OF conductivity for electrical applications. In this investigation, the characteristics of commercial annealers for wire
Cu-ETP drawing of electrolytically refined tough-pitch copper (Cu-ETP) and oxygen-free upcast copper (Cu-OF) wires
Percentage elongation
were assessed through annealer curves with respect to applied voltage and resulting percentage elongation of final
Resistance annealing
Annealer curve
products. Experiments were carried out on three M315 Niehoff machines of varying speeds used for medium wire
Wire drawing drawing from 2.2 mm diameter to 0.66 mm and 0.53 mm diameters. The results show similarities and differences
Dynamic recrystallisation between annealer curve characteristics of wire drawing machines regarding the required voltage for minimum
and maximum elongation of wires without oxidation depending on the type of copper raw material used. In
particular, the minimum 18% required elongation of wires was achieved with the same applied voltage irre-
spective of the machine speed and type of copper. In addition, Cu-OF reached higher maximum percentage
elongation without oxidation of the wire compared to Cu-ETP.

1. Introduction The metallurgical annealing process of the cold-drawn wires restores the
ductility and electrical conductivity.
Copper plays a crucial role in the development of any country because The literature has shown that the recrystallisation temperature of Cu-
it is the main material used in cables for the distribution of electrical ETP is affected by different amounts of various impurities [4]. According
power to and within human settlements, factories and transportation to the studies, sulphur (S), lead (Pb) and bismuth (Bi) increase the
systems. Copper wires for electrical purposes are manufactured using recrystallisation temperature of pure copper (Cu). It was also found that a
standard grade electrolytically refined tough-pitch copper (Cu-ETP) or 10-ppm increase in S, for example, raises the recrystallisation tempera-
oxygen-free copper (Cu-OF) from an upcast process [1]. The dynamically ture by 60  C. (Fig. 2).
recrystallised grains of the Cu-ETP are equiaxed while the ones of Cu-OF As the residence time of wire during inline annealing is very short
are as-cast, large columnar grains. Fig. 1 shows the typical microstruc- (milliseconds) any increase in impurity levels of copper may be detri-
tures of Cu-ETP and Cu-OF [2,18]. mental to the mechanical properties of the final drawn wire. Control of
the main impurities is also important in maintaining the high conduc-
1.1. Copper wire drawing tivity of copper measured by %IACS (International Annealed Copper
Standard) [5]. There has also been extensive work on the effect of im-
The process of wire drawing of copper involves rod breaking where a purities, such as phosphorous (P), sulphur (S) and oxygen (O), on the
7.9- or 8-mm diameter (Ø) rod is drawn through successive tungsten properties, including electrical conductivity, of Cu-OF [6]. This research
carbide dies of 6 mm Ø down to about 2.2 mm Ø or less. The dies are found that P exists in solid solution in Cu at 300–800  C. P in solution
submerged in a water-soluble lubricant that cools down the wire and decreases conductivity by 0.73% for each l0 ppm to 60 ppm added [6]. In
reduces the wear on the dies during the wire drawing process. The wire is practice P is kept at <5 ppm. (See Annexure A of results of materials used
finally passed through an inline electric resistance annealer which uses in this experiment). Regarding S, only the existence of Cu2S, which is
steam as a reducing environment to prevent oxidation of copper wires thought to cause hot shortness during rolling, has been reported. The
during annealing and helps maintain the bright colour of the copper [3]. presence of O as Cu2O and its effects on hot and cold shortness have been

* Corresponding author.
E-mail addresses: cbanganayi@gmail.com (C. Banganayi), dnyembwe@uj.ac.za (K. Nyembwe), kmageza@uj.ac.za (K. Mageza).

https://doi.org/10.1016/j.rinma.2020.100146
Received in revised form 6 September 2020; Accepted 9 September 2020
Available online 3 October 2020
2590-048X/© 2020 Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
C. Banganayi et al. Results in Materials 8 (2020) 100146

Fig. 1. Microstructure of a) Cu-ETP b) Cu-OF [2,11].

2. Experimental procedure

2.1. Raw materials

A Cu-ETP rod of 7.9 mm Ø and a Cu-OF rod of 8 mm Ø with chemical


compositions, as shown in Annexure A, were used at the start of the wire
drawing process. These copper rods were initially drawn down to 2.2 mm
Ø wire size. The 2.2 mm Ø wire was further drawn down to 0.66 mm Ø
and 0.53 mm Ø using medium wire drawing machines. The wire sizes
used for the experiment were selected because they are the most common
sizes used at the South African copper cable manufacturing plant where
this investigation was carried out.

2.2. Wire drawing machines and operating parameters

Fig. 2. Effects of impurities on the recrystallisation temperature [8].


The experiments were carried out on M315and MM315 Niehoff ma-
chines. The machines used for medium wire drawing were equipped with
reported, especially regarding its effects on conductivity and recrystal- inline resistance annealers [16]. These machines are referred to as ma-
lisation temperature. Cu2O is reported to reduce electrical conductivity chine 1, machine 2 and machine 3. Machine 1 was a seven-wire drawing
by 0.126% for each 0.01% of oxygen [6,7]. It is for this reason that when machine used to draw wires from 2.2 mm to 0.53 mm Ø, while machines
producing Cu-OF, the cathodes are remelted in a highly reducing envi- 2 and 3 were single-wire drawing machines used to draw 2.2 mm Ø wire
ronment by lancing carbon monoxide (CO) or using graphite or charcoal to 0.66 mm Ø wire. Castrol Iloform BWS 153 lubricant was used during
[1]. the wire drawing and annealing processes. The pH and fat content of the
lubricant were kept at the operating levels prescribed by the manufac-
1.2. Annealer curves turer. Steam from the lubricant was used as the reducing environment.
The different machine speeds selected for wire drawing varied from 9 to
Annealer curves are graphs that show the variation in the degree of 20 m/s. The speeds for each machine were kept constant throughout the
annealing as a function of percentage elongation as a function of the experiments. The voltage was then varied for all three machines starting
annealer applied voltage during inline resistance annealing [9]. The from a minimum of 13 V to a maximum of 38 V, in line with production
graph has an S-curve, which shows a slow increment of percentage parameters to avoid wire tarnishing due to oxidation at high tempera-
elongation at the beginning followed by a rapid rise and flattening to- tures. The empirical relationship between the speed of the wire and the
wards the end. The S-curve is in line with the three-solid state phe- voltage is given in Equation (1) below.
nomenon involved during metallurgical annealing, namely recovery,
pffiffiffi
recrystallisation and grain growth in the electrical conductor [10]. The UVolts ¼ ð vÞ:k (1)
determination of annealer curves is essential for the optimisation of
copper cable manufacturing, in order to obtain the required electrical where U ¼ voltage, v ¼ speed of wire and k ¼ annealer factor with k ¼
properties, including resistance and conductivity. Because of the differ- 8.2.
ence in the microstructure of the two types of copper cable raw materials, During resistance annealing a current is passed through the wire at
experience has shown that Cu-OF will anneal at higher voltages (and different contact points by means of contact wheels while the wire is
therefore higher temperatures) than Cu-ETP, usually in the order of being transmitted at very high speeds, sometimes up to 60 m/s. The
10–15% or more [11]. heating during resistance annealing is based on the adiabatic heating
Annealer curves of copper wires are very seldom published in scien- which ignores heat loss during heating and only concentrates on the
tific literature as they are considered confidential operational parame- temperature rise. This is based on the following adiabatic heating
ters. In this paper, the annealer curves were derived to determine the equation [12].
common voltage and machine speed for processing different wire sizes of
Cu-ETP and Cu-OF without having to adjust the machine parameters each J2 ðtÞρ ðTÞdt ¼ μCðTÞdT (2)
time a different material was used. As such, the paper provides useful
data for process control during annealing of commercial copper wires. A where: t ¼ time.
better understanding of copper cable response during annealing could be T ¼ temperature
gained from this investigation. ρ(T) ¼ resistivity
μ ¼ density.
C(T) ¼ specific heat.

2
C. Banganayi et al. Results in Materials 8 (2020) 100146

Fig. 3. Graph of voltage vs percentage elongation for 0.53 mm Ø, 7 strands Cu-


Fig. 4. Graph of voltage vs percentage elongation for 0.66 mm Ø Cu-ETP and
ETP and Cu-OF copper run on machine 3 at 9 m/s.
Cu-OF copper run at 11 m/s on machine 2.

J ¼ current density of conductor.


machine 2 for the two types of copper. As can be observed from both
The ohmic heat produced during a time interval, dt, causes a tem-
annealer curves, the minimum required 18% elongation for single wire
perature rise of dT in the conductor [13].
drawing was achieved at 17 V.
The above equation can be integrated and used to find the relation-
Because the wires are further processed by bunching and insulation it
ship between the cross-section area of the wire and current (I), which is
is advised that the percentage elongation be much higher than the
then used to calculate different settings for different wires on different
minimum value to avoid failures at later stages of processing. The highest
machines.
percentage elongation values of 31% were achieved at 23.5 V for both
The experimental determination of an annealer curve was carried out
Cu-ETP and Cu-OF. The wire at this voltage was tarnished due to
following a prescribed and common procedure that was found to be
oxidation. Cu-OF was observed to start tarnishing at 23.5 V while Cu-ETP
practical and to work best. Once the specific speed of the machine was
tarnished earlier at 22.6 V at an elongation of 29.45%. For machine 2,
selected, the voltage was then increased slowly while the samples in the
there is a big operating window for the adjustment of annealer voltages
wire bobbins were separated by a sample marker with the specific
while still achieving the correct elongation and colour of the wire if
voltage written on it. This was done until the wire turned dark or was
current conditions of the machine are to be used. For this machine, a
tarnished. The bobbins were then taken for rewinding while collecting
common voltage range of 21–23 V will yield the maximum percentage
the samples at each test voltage for tensile test.
elongation at the 11 m/s without tarnishing either wire.
Fig. 5 shows the annealer curve results of experiments carried out on
2.3. Mechanical testing machine 3. The minimum required elongation of 18% was achieved at
around 28 V which is much higher than that of machines 1 and 2 which
Elongation was the most important mechanical property of the wire occurred at 17 V and 18 V respectively. This could be attributed to less
to be determined as this was used to establish the annealer curves for all resistance on the annealer of machine 3 due to a higher operating wire
the machines for the different types of copper used in the medium wire drawing speed of 20 m/s compared to 9 m/s and 11 m/s for machines 1
drawing machines. For each point on the annealer curve, three samples and 2 respectively.
were used to obtain the average percentage elongation value for all three The highest percentage elongation values of 35% at 38.2 V for Cu-ETP
machines. The percentage elongations were obtained through tensile
(UTS) measurements on an Instron 3369 Tensile test machine loaded
with Bluehill software at a constant strain rate of 96 mm/min at room
temperature.

3. Results and discussions

3.1. Annealer curves

Fig. 3 shows the annealer curve results on machine 1. The minimum


required elongation of 18%, as specified by SANS 1411–1:2008 [14], was
achieved at around 18 V. 22% for the single wire and 20% for the multi
wire was achieved at 20 V, as specified by BS EN 13602:2013 [15]. The
results display an average taken from 7 wires. The highest percentage
elongation values of 29% at 25 V for Cu-ETP and 36.5% at 23 V for Cu-OF
were achieved. Cu-OF was observed to start tarnishing at 24 V and 34%
elongation while Cu-ETP tarnished earlier at 28 V at an elongation of
27%. For this machine, a common voltage range of 21–23 V will yield the
maximum percentage elongation at the optimum speed without tarn-
ishing either wire. Fig. 5. Graph of voltage vs percentage elongation for 0.66 mm Ø Cu-ETP and
Fig. 4 shows the annealer curves related to medium wire drawing Cu-OF copper run at 20 m/s on machine 3.

3
C. Banganayi et al. Results in Materials 8 (2020) 100146

Fig. 7. Maximum elongation at maximum voltage before tarnishing of wire.


Fig. 6. Applied voltage required for 18% minimum elongation of wire.
is switched from Cu-ETP to Cu-OF for the considered size reduction from
and 36.5% at 34 V for Cu-OF copper were achieved. Although higher 2.2 mm diameter to 0.66 mm and 0.53 mm. For this level of percentage
ductility is achieved at these voltages, the wires could not be used as they elongation, the required applied voltage in the annealer increases with
were tarnished due to oxidation. Cu-OF was observed to start tarnishing the wire drawing machine speed. The study also corroborated that raw
at 33 V and 33% elongation while Cu-ETP tarnished earlier at 31 V and Cu-OF is superior to Cu-ETP in terms of the maximum achievable elon-
an elongation of 29%. For machine 3, there is an even larger operating gation at the highest possible voltage in the annealer without wire
window for the adjustment of annealer voltages while still achieving the oxidation as it contains less than 10 ppm of oxygen as can be seen in the
correct elongation and colour of the wire if the present conditions of the chemical analysis provided in Annexure A. The investigation contributes
machine are to be used. For this machine, a common voltage range of to a better understanding of copper annealing post wire drawing. It also
29–32 V yielded the maximum percentage elongation at 20 m/s without provides a guideline for the optimum operation of medium wire drawing
tarnishing either wire. machines for the different types of copper used in the cable industry.
Fig. 6 provides additional insight into the relationship between the Future investigation will include the measurement of electrical wire
machine speed and the voltage required to achieve the minimum elon- properties and could possibly explore different wire sizes.
gation in the different materials.
In addition, there seems to be no difference between Cu-OF and Cu- Credit author statement
ETP regarding the required voltage to achieve the minimum percent-
age elongation of 18% irrespective of machine speed. This could arguably C Banganayi: Conceptualization, Methodology, Validation, Formal
be true for the wire sizes considered in the investigation. The phenom- analysis, Investigation, Writing - original draft, Formal analysis. K
enon could be due to a higher percentage reduction in area from 2.2 mm Nyembwe.: Writing - original draft, Writing - review & editing prepara-
to 0.53 and 0.66 mm which represents more than 80% cold work [16]. tion, Formal analysis, K Mageza: Investigation, Data curation
Fig. 7 shows the comparison of maximum elongation achieved
without tarnishing of wires between Cu-ETP and Cu-OF. It appears that Declaration of competing interest
Cu-OF can achieve a higher maximum percentage elongation without
oxidation of the wire compared to Cu-ETP for the different machine The authors declare that they have no known competing financial
speeds. This is attributed to Cu-OF having fewer impurities, such as interests or personal relationships that could have appeared to influence
Cu2O, than are present in Cu-ETP [17,18]. the work reported in this paper.

4. Conclusions Acknowledgements

The study assessed the annealer curve characteristics of medium wire We would like to thank Aberdare Cables PTY Ltd for providing the
drawing machines for raw Cu-ETP and Cu-OF. The investigation indicates material, machines, and testing equipment for the experiment. We also
that no adjustment of operational parameters of wire drawing machines would like to thank Mr Henni Scholtz and Mr Zak Du Preez for their
is required to achieve a minimum stipulated elongation when input wire technical input and leadership guidance during the investigations.

Appendix A. CheMICAL compositions of tested materials

Chemical composition of 8 mm Cu-OF and 7.9 mm Cu-ETP rods used in the experiments.

CHEMICAL ANALYSIS

Sample Number 8 mm Cu-OF 7.9 mm Cu-ETP

Cu BAL BAL
Sn (ppm) <5 <5
Pb <5 <5
Fe 5 11
Al <5 7
Mn <5 <5
Ni <5 <5
(continued on next column)

4
C. Banganayi et al. Results in Materials 8 (2020) 100146

(continued )
CHEMICAL ANALYSIS

Sample Number 8 mm Cu-OF 7.9 mm Cu-ETP

Sb <5 <5
As <5 <5
P <5 <5
Si <5 <5
Cd <5 <5
Zn <5 <5
Bi <5 <5
Te <5 <5
Ag 6 15
Se <5 <5
S 10 8
Mg <5 <5
Cr <5 <5
Co <5 <5
Oxygen <10 <200
Be <5 <5
Zr <5 <5
COND % IACS n/a n/a
Recovery n/a n/a

References [9] Q.D. Grearson, A Guide to Copper Wire Drawing, 1980, pp. 59–62.
[10] S.H. Avner, “Introduction to Physical Metallurgy.” International Student Edition,
Publisher McGraw-Hill, 1988.
[1] M. Nairn, Graphite crucible furnace technology as a basis of highest quality copper
[11] S. Cochrane, G. Yeoman, Cu-OF or Cu-ETP?: Some General Comparisons of Small
redraw rod, Wire J. Int. 36 (2003) 68–73.
Diameter Copper Wire Rod Products, 2006, pp. 1–17.
[2] Copper Development Association Inc, Microstructure of copper alloys [Online]
[12] D. Clark, K. Costin, D. Hutton, R. McConeghy, A. Scheidemantle, and R. Smellie;
Available at: https://www.copper.org/resources/properties/microstructure
SSC spool piece design , Suppercollider 3 pp 202-210 Edited by John Nonte.
/coppers.html, , 2017. (Accessed 7 September 2017).
[13] R. Kratz, P. Wyder, Principles of Pulsed Magnetic Design Engineering Materials,
[3] J. C Hogg, Copper Wire Production, ” Publisher International Wire & Machinery
Springer-Verlag Berlin Heidelberg, 2002, pp. 27–28.
Association, 1990, pp. 3–11.
[14] South African National Standards, Materials of insulated electric cables and flexible
[4] W H Bowyer, The effects of impurities on the properties of OFP copper specified for
cords: Part1 Conductors 2 (2008) 3–21.
the copper iron canister SKI 1999, Report 99:44 pg 1-16.
[15] BS EN 13602, Copper and Copper Alloys. Drawn, Round Copper Wire for the
[5] National Bureau of Standards Circular No, [5] Publication No. 28 of the
Manufacture of Electrical Conductors, 2013, pp. 1–26.
International Electrotechnical Commission, "International Standard of Resistance
[16] Troostwijk Auctions, 1988 Niehoff MM315 twin copper wire drawing line [Online]
for Copper (March 1914) Is Included in Appendix V of This Document, 1914, p. 31.
Available at: https://www.troostwijkauctions.com/uk/twin-copper-wire-drawing
[6] S. Smart Jr., The effects of impurities in copper, in: A. Butts (Ed.), Copper,
-line/03-24774-33798-4436305/, , 2017. (Accessed 7 September 2017).
Rheinhold Publishing Corp NY, 1954, p. 410.
[17] H. Pops, J Holloman, “Effects of oxygen concentration on the recrystallization
[7] S. Jakania, M.H. Mathona, Ph Gerbera, b M. Benyoucefb, C.H. de Noviona,
behaviour of copper wire, Wire J. Int. (1994).
T. Baudin, Influence of oxygen content on the static recrystallization of ETP copper,
[18] Hitachi Cables, Oxygen free copper (OFC) CAT.NO CE 100A 1-10 wusatowska AM
Mater. Sci. Forum 467–470 (2004) 471–476.
S., miura H., T sakai (2002), nucleation and microtexture development under
[8] F.K. Huybrechts, P. Schamp, The effects of impurities on the recrystallization
dynamic recrystallization of copper, Mater. Sci. Eng. A323 (2006) 177–186.
behaviour of tough pitch hot rolled copper rod, Wire J. Int. (1996) 40–49.

You might also like