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How to apply Thermal Interface Material (TIM)

The Thermal Interface Material (TIM) is used to provide efficient thermal exchange between the
processor Integrated Heat Spreader (IHS) and the fan-heatsink. Proper installation of the thermal
interface material is crucial to the success of the thermal solution. Failure to properly install the
thermal interface material could cause the processor to overheat.

Most of the thermal solutions shipped with the Boxed Intel® Desktop and Server processors have
the TIM applied to the bottom of the heatsink in a 3 bar application from the factory as shown
below.

Related Information: Intel® Desktop Boxed Processors and Sockets video

If it does not have the TIM applied, it will ship with the TIM pillow pack (E94211-001) in the box.

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 Replacement or reinstallation of the processor or heat sink requires replacement of the thermal
interface material. Application of the thermal interface material to the top of the processor is
critical in order to insure effective heat transfer from the processor to the thermal solution.
Failure to apply the thermal interface material could cause the processor to either shut down or
operate inefficiently.

Intel will be offering the thermal interface material replacement in a syringe and pillow pack for
both current and legacy Boxed Intel® Desktop and Server processors over the next few months.
After that, the syringe-based thermal interface material will be phased out in favor of the pillow
pack version.

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 This part may be ordered online here.

You also can order thermal interface material replacement kits through Intel® Customer
Support. The Intel® part number is D54816-001 for the syringe and E94211-001 or
G15816-001 for the pillow pack.
What's the difference between E94211-001 & G15816-001?
E94211-001 will be included in some box processors that have a fan/heatsink without
the pre-applied TIM. G15816-001 is stocked as an individual packet with instructions.
The TIM in both instances is the same.
You should apply all of the TIM to the center of the Integrated Heat Spreader (IHS),
which is the metal plate on the top of the processor. It will spread out when the
heatsink is installed on top of it and flow when the processor reaches its normal
operating temperature.

Below are the steps you should follow during the thermal interface material reinstallation process.

Thermal Interface Material Installation (Thermal Grease TC-1996)

Important: Ensure processor and

heatsink bonding surfaces are free
from previously applied thermal
interface material, oil, dust, and
any other debris.

Do not add new thermal grease on

top of the existing of old grease.
TIM is not reusable and previous
Thermal Interface Material should
be completely removed.

Do not place a sticker or any other

material on top of the processor
Integrated Heat Spreader (IHS).
Only Thermal Interface Material
(TIM) should be used between the

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 (TIM) should be used between the
processor IHS and the heat sink.
Using any other material will
degrade the thermal transfer
characteristics and could
potentially damage the processor
(causing the warranty to be
voided).

Never touch the thermal interface

material as any foreign substances
(such as oils from your skin, or
chemicals) can reduce the
effectiveness of the thermal
contact. Thermal grease is very
prone to smudging and must not be
touched.

STEP
1
Wipe off previously applied/used
TIM on the heatspreader with a
soft, dry cloth or tissue.

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 Be careful not to touch the gold
contacts at the bottom of the CPU.

Install the processor in the socket.

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 This part is for adding TIM on IHS
because you did not have any
Thermal Interface Material on your
STEP heatsink or you removed it and need
2 to reinstall TIM.

Remove the syringe from the

protective plastic covering.

Preparing the Syringe
Open the tip of the syringe by
twisting off cap.

STEP
3 OR

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 3 OR

Preparing the Pillow Pack
Cut the package on the dotted
black line.

Syringe Application
Inject the thermal grease from the
syringe to the center of the
Integrated Heat Spreader surface.

STEP
OR
4

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 Pillow Pack Application
Push/dispense the thermal material
from the package to the center of
the processor surface.
Note: There will be some residue
left in the package after installation.

STEP
Install the heat sink.
5

This applies to:

Intel® C eleron® Desktop Processor Intel® C ore™2 Quad Processor

Intel® C ore™ i3 Desktop Processor Intel® Pentium® 4 Processor Extreme Edition
Intel® C ore™ i5 Desktop Processor Intel® Pentium® 4 Processors
Intel® C ore™ i7 Desktop Processor Intel® Pentium® D Processor
Intel® C ore™ i7 Processor Extreme Edition Intel® Pentium® Processor Extreme Edition
Intel® C ore™2 Duo Desktop Processor Intel® Pentium® Processor for Desktop
Intel® C ore™2 Extreme Processor Intel® Xeon® Processor 3000 Sequence

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 Solution ID: C S-030329
Date C reated: 17-Mar-2009
Last Modified: 10-Oct-2011

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