FYP Report - Zaka and Mohsin

MULTIFUNCTIONAL MEDICAL MACHINE
Supervised by:
Salman Siddiq
Co-supervisor:
Asim Maqsood
Mohsin Raza BSEES-01181001
Zaka Ullah BSEES-01173007
Department of Electronics and Electrical Systems
The University of Lahore

DEPARTMENT OF ELECTRONICS AND ELECTRICAL SYSTEMS
Remarks by Supervisor
Salman Siddiq
Remarks by Co-supervisor
Asim Maqsood
Remarks by Head, Department of Electronics & Electrical System
Dr. Syed Baqar Hussain
I
DEDICATION
We would like to dedicate this project to the most precious relations of our Parents,
Teachers and Friends.
Thank you all without you we would not be what we are today.
II
UNDERTAKING
We, hereby declare that this project neither as a whole nor as a part there of has been copied out
from any source. It is further declared that we have developed this project and the accompanied
report entirely on the basis of our personal efforts made under the sincere guidance of our
supervisors. No portion of the work presented in this report has been submitted in the support of
any other degree or qualification of this or any other University or Institute of learning, if found
only we shall stand responsible.
Signature:
Mohsin Raza
(BSEES-01181001)
Signature:
Zaka Ullah
(BSEES0117300)
III
ACKNOWLEDGEMENT
We are grateful to the ALLAH Almighty who provides all the resources of every kind to us, sothat we
make their proper use for the benefit of mankind. May Allah keep providing us with allthe resources,
and the guidance to keep helping humanity?
We would like to express our heartfelt gratitude to our supervisors Salman Siddiq and co-
supervisors Asim Maqsood who’s provided encouraging and constructive feedback thought. It is no
easy task, reviewing a thesis and we are grateful for his thoughtful and detailed comments andalso for
helping to shape and guide the direction of the work with his careful and instructive comments.
We would not have contemplated this road if not for our Parents, who instilled within us a loveof
creative pursuits, science and language, all of which finds a place in this thesis. To our parents,thank
you. Who have also been the best of friends along this journey who encouraged us to lookforward to
be more than just student?
IV
ABSTRACT
Anthropometry medical measuring system is very important in health sector in taking the
physical measurement of patients. The research focused on the need to consider a parametric
design of height and weight measuring system with the enlightenment of basic design
principle. The materials involved for the parametric design of this medical measuring system
under study are Load Cells with Strain Gauge (weight sensor), Sonar with Ultrasonic Sensors
(height sensor), Liquid Crystal Display, Medium Density Fiberboard, Rubber Mounting,
Microcontroller Arduino Board and other important accessories. The results from the design
analysis revealed that the system weight sensor platform has sheer force of 630 N, maximum
bending moment of 126 Nm. The compressive stress that could be induced during
measurement of maximum human weight is 6 kN/m2 and stress that could be induced due to
maximum bending moment is amount to 605 N/m2. The amount by which weight sensor
platform could deflect when subjected to bending moment is 0.000004 m. These values
indicate that the design is safe for operation which is far lesser than the property parameters of
the materials used for the weight sensor platform. The designed height of the system for the
measuring of the height is about 2.1 m (7 Feet), the area of the stand platform for the measuring
of the weight is about 0.2 m2. The weight sensor for the design could measure from 1kg to 200
kg with accuracy of about±0.1 kg and height measuring sensor could measure through a
scanning range of 0.4 to 2.5 m with accuracy of about ±1 mm.
V
Table of Contents
DEDICATION........................................................................................................................ II
UNDERTAKING ..................................................................................................................III
ACKNOWLEDGEMENT .................................................................................................... IV
ABSTRACT ............................................................................................................................ V
1 CHAPTER ....................................................................................................................... 1
1 INTRODUCTION .......................................................................................................... 1
1.1 Introduction: ........................................................................................................... 1
1.2 What is BMI? .......................................................................................................... 2
1.3 Objectives: ............................................................................................................... 3
1.4 Problem Statement: ................................................................................................ 3
2 CHAPTER ....................................................................................................................... 5
2 LITERATURE REVIEW ................................................................................................... 5
2.1 Abstract.................................................................................................................... 6
2.2 Introduction ............................................................................................................. 6
2.3 Materials and Method ............................................................................................ 7
2.4 Block Diagram......................................................................................................... 8
2.5 Circuit Diagram ...................................................................................................... 8
2.6 Schematic and Hardwar Diagram......................................................................... 9
2.7 Proposed System: .................................................................................................. 10
2.8 Conclusion: ............................................................................................................ 10
3 CHAPTER ..................................................................................................................... 11
3 TOOLS & TECHNIQUES ................................................................................................ 11
3.1 Related Components: ........................................................................................... 11

3.1.1 Introduction: ..................................................................................................... 11
3.1.2 Pin-outs: ............................................................................................................. 11
VI
3.2 Specifications:........................................................................................................ 12
3.3 Diode: ..................................................................................................................... 13
3.4 Realization: ............................................................................................................ 13
3.5 Specification: ......................................................................................................... 15
3.6 MOSFET................................................................................................................ 15
3.7 Realization: ............................................................................................................ 16
3.8 7805 Voltage Regulator IC: ................................................................................. 16

3.8.1 Features: ............................................................................................................ 17
3.9 Specifications:........................................................................................................ 18
3.10 16x2 LCD Display: ................................................................................................ 18
3.11 Specs:...................................................................................................................... 19
3.12 Arduino Pro-Mini: ................................................................................................ 19
3.13 Specs:...................................................................................................................... 21
3.14 Power...................................................................................................................... 22
3.15 Memory .................................................................................................................. 22
3.16 Input and Output .................................................................................................. 22
3.17 Programming ........................................................................................................ 23
3.18 Automatic (Software) Reset ................................................................................. 23
3.19 HX711 Module ...................................................................................................... 23

3.19.1 HX711 Load Cell Amplifier ............................................................................. 24
3.20 Interfacing HX711 Load Cell with Arduino....................................................... 25
3.21 Load Cell: .............................................................................................................. 26
3.22 Ett-10pt RTD Temperature Sensor: ................................................................... 26
3.23 Specification: ......................................................................................................... 26
3.24 Working Principal: ............................................................................................... 27

3.24.1 Speciation ........................................................................................................... 28
VII
3.25 Heat Sink: .............................................................................................................. 29
3.26 Capacitor ............................................................................................................... 30
3.27 Electrostatic Capacitor ......................................................................................... 30
3.28 Electrolytic Capacitor........................................................................................... 31
3.29 Resisters ................................................................................................................. 31
3.30 Ultrasonic Sensor .................................................................................................. 32
3.31 Pin-Outs: ................................................................................................................ 32
3.32 Features.................................................................................................................. 33
3.33 Work ...................................................................................................................... 34
4 CHAPTER ..................................................................................................................... 35
4 METHODOLOGY ............................................................................................................ 35
4.1 Description: ........................................................................................................... 35
4.2 Writing Software: ................................................................................................. 38
4.3 Steps of Writing Software: ................................................................................... 38
4.4 Features.................................................................................................................. 39
4.5 Designing Hardware ............................................................................................. 39
4.6 Implementation Steps ........................................................................................... 40
4.7 Project Deployment: ............................................................................................. 41
5 CHAPTER ..................................................................................................................... 42
5 RESULTS & FINDINGS .................................................................................................. 42
5.1 Working Principal ................................................................................................ 42
5.2 Software Results: .................................................................................................. 42
5.3 Hardware Results: ................................................................................................ 43
5.4 Conclusion ............................................................................................................. 46
5.5 Future Scope .......................................................................................................... 46
VIII
5.6 Limitation .............................................................................................................. 47
6 CHAPTER ..................................................................................................................... 48
6 BIBLIOGRAPHY .............................................................................................................. 48
6.1 Arduino UNO ........................................................................................................ 48
6.2 Arduino Pro-Mini ................................................................................................. 52
6.3 Visual Studio Code................................................................................................ 55
6.4 Visual Studio Code 2............................................................................................. 56
7 REFERENCES.............................................................................................................. 60
IX
1 CHAPTER
1 INTRODUCTION
1.1 Introduction:
Design is the creation of plans with the use of scientific principles, technical information and
imagination in the description of any machine or system to perform desired and specific
functions with maximum economy and efficiency. Design is very vital in the production of any
functional system. Anthropometry is the science that deals with the application of scientific
physical measurement methods of human beings for the development of engineering design
standards according to Aderoba cited in Udosen in which bodily measurements are the
mainstay of anthropological research. The measurement of human height and weight is very
significant to their health. Height and Weight are important indicators of human health and
also it could be a very essential indicator to people’s health. For children, it is important to
monitor that they are growing at a healthy rate and for adults it is important to monitor whether
or not their height decreases.
Studio meter is a device for measuring standing height which consists of a vertical ruler with a
sliding horizontal board which is adjusted to rest on the top of the head. Scale is a mechanical
or electronic device used to measure the weight or mass of an object and human. Body Mass
Index (BMI) is a calculated ratio of a person’s height to weight which provides general
information about a person’s body composition. Defined BMI as a measure of weight adjusted
for height, calculated as weight in kilograms divided by the square of Height in meters. The
body mass index was considered an indicator of body fatness and also a surrogate measure of
body fat because it measures excess weight rather than excess fat. Body Mass Index relies
solely on height and weight as well with access to the proper equipment routinely measured
and calculated with reasonable accuracy. Body fatness has been an important psychosocial
issue among humans for millennia. Body weight is influenced by the interaction of multiple
factors. Body Mass Index is used to estimate healthy weight of average people. People with a
BMI of 25 to 29.9 are considered overweight, and people with a BMI of 30 or above are
considered obese. Research had shown that individuals with a higher BMI are more likely to
1
experience obesity-related health problems. BMI categories are used worldwide for all adults
20 years and older. Some researchers established that BMI should serve as the initial screening
of overweight and obesity for adults including children and adolescents. BMI is a reasonable
indicator of body fat for both adults and Children. BMI does not measure body fat directly; it
should not be used as a diagnostic tool. A health care provider should integrate other factors
into a health assessment, including evaluations of diet, physical activity, family history, and
other appropriate health screenings.
1.2 What is BMI?
It was indicated that BMI should be used as a measure to track weight status in populations and
as a screening tool to identify potential weight problems in individuals. Measured height and
weight are needed because self-reported data is not sufficiently reliable to follow population
level trends or to make comparisons between populations. The BMI as given in equation 1
according to. Body Mass Index for Adults graphical data as shown in Fig. 1.
Body Mass Index (BMI) = Weight/ Height*2
Figure: 1.1 BMI Chart

2
1.3 Objectives:
To design and develop an Automated BMI calculation that will display the BMI through height
and weight measurement of a person. There are specific objectives that this project aimed to
analyze the manual calculation of BMI and automating it; to design a circuit that will combine
all the functions of the weight sensor and proximity sensors and microcontroller; to develop
software embedded in the microcontroller; and to test, implement and evaluate the proposed
design.
1.4 Problem Statement:
Foster quoted from United States Centers for Disease Control and Prevention that studies
showed that individuals who are overweight or obese run a greater risk of developing diabetes
mellitus, hypertension, coronary heart disease, stroke, arthritis, and some forms of cancer.
World Health Organization stated that about 1.6 billion adults worldwide were overweight and
400 million were obese which was considered as global obesity epidemic. This research
focused on the need to consider a parametric design of height and weight measuring system
with the enlightenment of basic design principle. The convectional height and weight
measurement equipment as shown in Fig.
Figure: 1.2 Weighing Balance Studio Meter
3
Book Overview
• Chapter 1: demonstrates the proposed idea with the problem that urged this solution.
Also the overview of the proposed idea with the scope and features elaboration.
• Chapter 2: we demonstrate the literature review and previous projects heath

monitoring system
• Chapter 3: describes all the components used in the system with proper introduction
and with all helping material to develop a good know how with each of it.
• Chapter 4: elaborates the diagrams and designs and the whole hierarchy for designing
the proposed idea.
• Chapter 5: project testing is done here with the help of images taken while testing the
system for table use
4
2 CHAPTER
2 LITERATURE REVIEW
The Body Mass Index (BMI) equation was originally framed by Adolphe Quetelet, [1] a
Belgium mathematician and scientist, between 1830 and 1850 (Vinay, 2011; Chmela, 2006).
A dolphin was the first person to think of relating weight to height in a statistical manner [2].
The BMI tool is fairly reliable; it is one of the tools used by physicians for evaluating patients’
health status (Vinay, 2011). In 2006, Chmela discussed many of the existing techniques for
evaluating weight-related health problems and their limitations when applied to obese people.
From his recommendations, among all the methods available to monitor obesity such as
anthropometry, weight and stature, body mass index, abdominal circumference, skin folds,
bioelectric impedance analysis, body density, total body water, dual energy x-ray
absorptiometry, BMI is currently the Easiest and most informative index (Chum lea, 2006) [3].
Over the years, there has been several ways of measuring weight while measurement of human
height later received research focus so that BMI can be computed arithmetically [4]. A
technique of measuring human height using analogue type pyre electric sensors was carried
out in Japan by Shinya et al., (2005). The sensors detect the feeble far-infrared rays emitted
by the human body. They are installed in rest room ceilings and passageways to save energy.
They arranged these sensors in the shape of a lattice on the ceiling and floors. Human heights
were detected when the examinees pass through their bottom [5]. The Conventional position
and height detection techniques use image processing, Radio Frequency Identification (RFID)
they can acquire fixed accuracy, but it is difficult to use them in everyday Life (Shinya et al.,
2005). Deepak et al. (2015) designed and constructed BMI machine using PIC 18F452. The
weight sensing unit is made of load button cell which is efficient for weight measurement.
5
2.1 Abstract
Awareness of Body Mass Index (BMI) can be the guide to adjust a person’s lifestyle and
maintain a normal healthy body. This study developed a BMI assessment machine that
automatically calculates BMI value, displays the nutritional status and suggests ideal weight.
The machine is composed of a microcontroller that interconnects the other components of the
machine which includes load cell that gets the weight, an ultrasonic sensor that gets the height,
keypad as the input mechanism and Liquid Crystal Display (LCD) as the display mechanism.
The machine is very useful most especially to children in such a way that as young as their age
they are already aware of their nutritional status. In the several testing that was conducted, the
BMI machine was highly accurate in determining BMI. The suggestion of ideal weight by the
machine was comparable to the manual calculation of ideal weight. Key words: body mass
index, microcontroller, load cell, ultrasonic sensor.
2.2 Introduction
Each year Filipinos celebrate fiestas in every city and barrio in the Philippines. Gatherings are
also held by the majority of the Filipino families, but what is common during these events is
the food that is being laid on the table. Filipinos are essentially imbued with the utmost desire
for food but not aware of the food that contains high cholesterol causing a high amount of body
fats which can lead to weight-related diseases. In the 2014 Global Status Report on Non-
communicable diseases (NCDs) by the World Health Organization, out of the 16 million
premature deaths, 82% are associated with NCDs that occur in low and middle countries. In
the Philippines alone, 57% of total deaths were due to cancer, cardiovascular disease, diabetes,
and chronic respiratory disease. In which among Filipino adults, 27% are overweight and
obese, 25% have hypertension, 5% have high blood sugar and 10% have high total cholesterol
levels in the current prevalence of NCD risk factor and overweight children and adolescents
has also been on the rise in the Philippines and the rest of the world over the last decade. The
8th national nutrition survey shows that among Filipino children of age zero to five, the
prevalence of overweight has significantly increased from 1% in 1989 to 5% in 2013. On the
other hand, the prevalence of overweight Filipino children of age five to ten was 5.8% in 2003
6
and leaped to 9.1% in 2013. Awareness of BMI testing from childhood and Adulthood can help
maintain normal body weight to lessen the risk of having NCD diseases. In fact, a fellow in the
Division of Endocrinology at Cincinnati Children’s Hospital Medical Center said that BMI
level measurement predicts obesity risk.
2.3 Materials and Method
The block diagram in Figure 1 shows the interconnection of the different components of the
BMI Assessment machine that includes a microcontroller, ultrasonic sensor, keypad, load cell
with load cell amplifier and liquid crystal display. The open-source Arduino microcontroller is
a general-purpose microcontroller [5]. It is responsible for the overall operation of the machine.
The input device of the machine comprises of the keypad, ultrasonic sensor, and load cell. The
keypad acts as the input mechanism for the data that will be coming from the user. The
ultrasonic sensor serves as the height sensor while the load cell with load cell amplifier acts as
the weight sensor. After the inputs are processed by the microcontroller, it is being displayed
with a u ser-centered design [6]. in the liquid crystal display (LCD). Figure 1: Block Diagram
of the BMI Machine 2.1 Project Development The schematic diagram of the BMI machine is
presented in Figure 2. The components which serve as inputs for the machine are the load cell,
ultrasonic sensor, and keypad. The load cell is capable of converting pressure (force) into an
electrical signal [8]. This signal is read and amplified by the HX711, a load cell amplifier. The
load cell is connected to the HX711 input side while the output side of the HX711 is connected
to the Arduino. The pins 1, 2, 3, 4, 5, 6, 7, 8 of the keypad are connected to the digital pins 8,
9, 10, 11, 4, 5, 6, 7 of the Arduino, respectively. Lastly, the trigger pin (input) and echo pin
(output) of the ultrasonic sensor is connected to the digital pin 13 and pin 12 of the Arduino,
respectively. The output is shown in the 4x20 I2C Liquid Crystal Display. The SDA and SCL
pins of the LCD are connected to the SDA and SCL pins of the microcontroller. The machine
has a common VCC and ground.
7
2.4 Block Diagram
The block diagram of this project is given bellow:
Figure: 2.1 Block Diagram
2.5 Circuit Diagram
The circuit diagram of this project is given bellow:
Figure: 2.2 Schematic Diagrams
8
2.6 Schematic and Hardwar Diagram
Schematic and hardware diagram is given bellow:
Figure: 2.3 Complete Schematic Diagram
Figure: 2.4 Hardware Diagram

9
2.7 Proposed System:
Collects data from the sensing units and forward to the computer system for data processing.
Rather than in-home monitoring if the system is ON at home then we are able to monitor from
anywhere round the world through web monitoring system (i.e. with the help of IP address).
The major task of our work is to recognize the essential daily living behavior of the elderly
detection of orientation or inclination of body [7]. To detect movement or motion of any part
of body. The all sensor connected to Arduino microcontroller, the sensed data transfer to
internet through ESP8266. The cloud “Thing Speak” accept values and will generate graph as
per values received meanwhile the data also transfer to web server also. Web Portal uses here
to access data of patient through remote place.
2.8 Conclusion:
A locally made BMI machine was designed and constructed. The machine was tested and the
results obtained practically match that of ready-made scales with minimal errors. The
correlation values of the height and weight measured for various people when compared with
the commercially available measurement scales were 0.97 and 0.99 respectively. The BMI
machine can be used to determine the changes in human health status. It is an important
indicator of nutritional status; being underweight, normal, overweight, obese or highly obese
which adversely influence mortality and morbidity rate. The cost of constructing this BMI
machine was about ₦50,000 (140 USD) whereas a typical BMI Machine cost about 800 USD
in the market. The local built BMI machine holds several advantages over the commercially
available ones which are highly customized. These include local serviceability, affordability
and simplicity. It is also designed to withstand the weather conditions of the tropical climate
therefore, does not require special room conditioning for proper operation.
The performance of the constructed instrument can be improved by enclosing the entire
instrument in a customized closed chamber so as to shield the ultrasonic sensor from external
interference.
10
3 CHAPTER
3 TOOLS & TECHNIQUES
3.1 Related Components:
There are different electronics components we used in this project are listed below:
3.1.1 Introduction:
ATmega328P is one of the high performances AVR technology microcontrollers with a large
number of pins and features. It is designed by 8-bit CMOS technology and RSIC CPU which
enhance its performance and its power efficiency get improved by auto sleeps and internal
temperature sensor. This ATmega328P IC comes with internal protections and multiple
programming methods which helps the engineers to priorities this controller for different
situations. The IC allows multiple modern era communications methods for other modules and
microcontrollers itself, which is why the microcontroller ATmega328P usage has been
increasing every day.
3.1.2 Pin-outs:
There are 14 pins of ATmega328p. All pins in IC perform different functions like set reset etc
Pin diagram of ATmega328p is given below:
Figure: 3.1 Microcontroller Pin Out
11
3.2 Specifications:
The Atmel 8-bit AVR RISC-based microcontroller combines 32 KB ISP flash memory with
read-while-write capabilities, 1 KB EEPROM, 2 KB SRAM, 23 general purpose I/O lines, 32
general purpose working registers, three flexible timer/counters with compare modes, internal
and external interrupts, serial programmable USART, a byte-oriented 2-wire serial interface,
SPI serial port, 6-channel 10-bit A/D converter (8-channels in TQFP and QFN/MLF
packages), programmable watchdog timer with internal oscillator, and five software selectable
power saving modes. The device operates between 1.8-5.5 volts. The device achieves
throughput approaching 1 MIPS per MHz.
Diagram is given below:
Figure: 3.2 ATmaga328 Controllers
12
3.3 Diode:
A diode is a device that allows current to flow in one direction but not the other. This is
achieved through a built-in electric field. A diode is a device that allows current to flow in one
direction but not the other.
Figure: 3.3 Diode Family
3.4 Realization:
The operation of a diode is controlled by the diode's current-voltage (I-V) characteristics. A

diode in a circuit with the positive potential (highest) connected to the P material and the
negative potential connected to the N material is forward biased. A diode whose highest
potential is connected to the N material and the lowest potential to the P material is reverse.
13
Figure: 3.4 Diode Forward Reverse
 Forward Voltage (VF) is the voltage across the diode terminals resulting in a sharp
increase of current in the forward direction.
 Forward Current (IF) is the current when the forward voltage is applied; it flows
through the diode in the direction of lower resistance.
 Reverse Current (IR) or leakage current, is the current value when the reverse voltage is
applied. This is the current that flows when reverse bias is applied to a semiconductor
junction.
 Reverse Voltage (VR) is the maximum allowable reverse voltage that can be applied
repeatedly.
 Breakdown Voltage (VBR) is the reverse voltage at which a small increase in voltage
results in a sharp rise of reverse current.
 Junction Operating Temperature (Tj) is the range of temperatures at which a diode is

designed to operate.
14
3.5 Specification:
Note that as the reverse bias voltage (VR) increases the capacitance decreases. The quality CT is
the capacitance of the device when there is no applied voltage. The relation between the reverse
bias voltage and the capacitance is given by the following formula
Where:
Cj = Junction Capacitance
CT = Terminal Capacitance
VR = Reverse Bias Voltage
3.6 MOSFET
MOSFET stands for metal-oxide-semiconductor field-effect transistor. It is a field-effect

transistor with a MOS structure. Typically, the MOSFET is a three-terminal device with gate
(G), drain (D) and source (S) terminals. Current conduction between drain (D) and source (S)
is controlled by a voltage applied to the gate (G) terminal. MOSFETs compare favorably with
bipolar transistors in terms of relatively high-speed and low-loss operation. There are P type
and N type by channel polarity, and there is enhancement type with normally off (gate voltage
0 V off) and depletion type with normally on (deactivated with gate voltage 0 V) by control
method. Enhancement type is popular.
Figure: 3.5 MOSFET
15
3.7 Realization:
The P- channel MOSFET has a P- Channel region located in between the source and drain
terminals. It is a four-terminal device having the terminals as gate, drain, source, and body.
The drain and source are heavily doped p+ region and the body or substrate is of n-type. The
flow of current is in the direction of positively charged hole.
Figure: 3.6 MOSFET
3.8 7805 Voltage Regulator IC:
Voltage regulators are very common in electronic circuits. They provide a constant output
voltage for a varied input voltage. In our case the 7805 IC is an iconic regulator IC that finds
its application in most of the projects. The name 7805 signifies two meaning, “78” means that
it is a positive voltage regulator and “05” means that it provides 5V as output. So our 7805 will
provide a +5V output voltage.
The output current of this IC can go up to 1.5A. But, the IC suffers from heavy heat loss hence
a Heat sink is recommended for projects that consume more current. For example, if the input
voltage is 12V and you are consuming 1A, then (12-5) * 1 = 7W. This 7 Watts will be dissipated
as heat.
16
Figure: 3.7 Voltage Regulator Pin Out
3.8.1 Features:
 5V Positive Voltage Regulator
 Minimum Input Voltage is 7V
 Maximum Input Voltage is 25V
 Operating current(IQ) is 5mA
 Internal Thermal Overload and Short circuit current limiting protection is available.
 Junction Temperature maximum 125 degree Celsius
 Available in TO-220 and KTE package
17
3.9 Specifications:
 Constant +5V output regulator to power microcontrollers and sensors in most of the projects
 Adjustable Output Regulator
 Current Limiter for certain applications
 Regulated Dual Supply
 Output Polarity-Reversal-Protection Circuit
Figure: 3.8 Voltage Regulator Pin Out
3.10 16x2 LCD Display:
LCD is an electronic display module that uses liquid crystal to produce a visible image. The
16×2 LCD display is a very basic module commonly used in DIYs and circuits. The 16×2
translates o a display 16 characters per line in 2 such lines. In this LCD each character is
displayed in a 5×7-pixel matrix.
Figure: 3.9 LCD Pin Out
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3.11 Specs:
• Operating Voltage is 4.7V to 5.3V.
• Current consumption is 1mA without backlight.
• Alphanumeric LCD display module, meaning can display alphabets and numbers.
• Consists of two rows and each row can print 16 characters.
• Each character is built by a 5×8-pixel box.
• Can work on both 8-bit and 4-bit mode.
LCD Connection Diagram:
Figure: 3.10 LCD Circuit Diagram
3.12 Arduino Pro-Mini:
The Arduino Pro Mini is a microcontroller board based on the ATmega328.

It has 14 digital input/output pins (of which 6 can be used as PWM outputs), 6 analog inputs,
an on-board resonator, a reset button, and holes for mounting pin headers. A six pin header can
be connected to an FTDI cable or Spark fun breakout board to provide USB power and
19
communication to the board. The Arduino Pro Mini is intended for semi-permanent installation
in objects or exhibitions. The board comes without pre-mounted headers, Allowing the use of
various types of connectors or direct soldering of wires. The pin layout is compatible with the
Arduino Mini. There are two version of the Pro Mini. One runs at 3.3V and 8 MHz, the other
at 5V and 16 MHz Arduino Pro Mini pin outs is given bellow:
Figure: 3.11 Arduino Pro-Mini
Pin out details of microcontroller is given bellow in the table:
Table: 3.1 AT Mega Controller Pins
PINS SUPPLY
Microcontroller ATmega328 *
Board Power Supply 3.35 -12 V (3.3V model) or 5 - 12 V (5V model)
Circuit Operating Voltage 3.3V or 5V (depending on model)
Digital I/O Pins 14
20
PWM Pins 6
UART 1
SPI 1
I2C 1
Analog Input Pins 6
External Interrupts 2
DC Current per I/O Pin 40 mA
Flash Memory 32KB of which 2 KB used by boot loader *
SRAM 2 KB *
EEPROM 1 KB *
 (*) Older boards were equipped with AT mega 168 with this specs:
- Flash memory: 16 KB
- SRAM: 1 KB
- EEPROM: 512 bytes
3.13 Specs:
The following specs describe microcontrollers function:
21
3.14 Power
The Arduino Pro Mini can be powered with an FTDI cable or breakout board connected to its
six pin header, or with a regulated 3.3V or 5V supply (depending on the model) on the Vcc
pin. There is a voltage regulator on board so it can accept voltage up to 12VDC. If you're
supplying unregulated power to the board, be sure to connect to the "RAW" pin on not VCC.
The power pins are as follows:
RAW For supplying a raw voltage to the board.

VCC The regulated 3.3 or 5 volt supply.
GND Ground pins.
3.15 Memory
The ATmega328 has 32 kB of flash memory for storing code (of which 0.5kB is used for the
boot loader). It has 2 kB of SRAM and 1kBs of EEPROM (which can be read and written with
the EEPROM.
3.16 Input and Output
Each of the 14 digital pins on the Pro Mini can be used as an input or output, using pin
Mode, digital Write, and digital Read functions. They operate at 3.3 or 5 volts (depending on
the model). Each pin can provide or receive a maximum of 40 mA and has an internal pull-up
resistor (disconnected by default) of 20-50 K ohms. In addition, some pins have specialized
functions:
Serial: 0 (RX) and 1 (TX). Used to receive (RX) and transmit (TX) TTL serial data. These
pins are connected to the TX-0 and RX-1 pins of the six pin header.
22
3.17 Programming
The Arduino Pro Mini can be programmed with the Arduino software download. For details,
see the reference and tutorials. The ATmega328 on the Arduino Pro Mini comes preponed with
a boot loader that allows you to upload new code to it without the use of an external hardware
programmer. It communicates using the original STK500 protocol reference Files. You can
also bypass the boot loader and program the ATmega328 with an external programmer;
see these instructions for details.
3.18 Automatic (Software) Reset
Rather than requiring a physical press of the reset button before an upload, the Arduino Pro
Mini is designed in a way that allows it to be reset by software running on a connected
computer. One of the pins on the six-pin header is connected to the reset line of the ATmega328
via a 100 NF capacitor. This pin connects to one of the hardware flow control lines of the USB-
to-serial convertor connected to the header: RTS when using an FTDI cable, DTR when using
the Spark fun breakout board. When this line is asserted (taken low), the reset line drops long
enough to reset the chip. The Arduino software uses this capability to allow you to upload code
by simply pressing the upload button in the Arduino environment. This means that the boot
loader can have a shorter timeout, as the lowering of the reset line can be well-coordinated with
the start of the upload.
3.19 HX711 Module
In this project we will be “interfacing HX711 Load cell amplifier with Arduino” and 16*2 LCD
for designing Weighing Machine using Arduino Load Cell & HX711 Module. This is a
simple “Arduino Weight Measurement project”. The electronic weighing machine uses a load
cell to measure the weight produced by the load, here most load cells are following the method
of a strain gauge, which converts the pressure (force) into an electrical signal, and these load
cells have four strain gauges that are hooked up in a Wheatstone bridge formation.
23
Diagram of HX711 module is given bellow:
Figure: 3.12 15x711 Amplifier
3.19.1 HX711 Load Cell Amplifier
The Load Cell Amplifier is a small breakout board for the HX711 IC that allows you to easily
read load cells to measure weight. By connecting the amplifier to your microcontroller you will
be able to read the changes in the resistance of the load cell, and with some calibration, you’ll
be able to get very accurate weight measurements.
The HX711 uses a two-wire interface (Clock and Data) for communication. Any
microcontroller’s GPIO pins should work, and numerous libraries have been written, making
it easy to read data from the HX711. Check the hookup guide below for more information.
Load cells use a four-wire Wheatstone bridge configuration to connect to the HX711. These
are commonly colored RED, BLK, WHT, GRN, and YLW. Each color corresponds to the
conventional color coding of load cells:
Red(Excitation+orVCC)
Black(Excitation-orGND)
White(Amplifier+,Signal+orOutput+)
Green(A-,S-orO-)
Yellow (Shield)
24
Load Cell and HX711 Connection is given bellow:
Figure: 3.13 Load Cell with HX711
3.20 Interfacing HX711 Load Cell with Arduino
Assemble the circuit as shown in the figure for “Interfacing HX711 & Load Cell with Arduino
“.
Figure: 3.14 Arduino with Load Cell and LCD

25
3.21 Load Cell:
A load cell is a transducer that is used to create an electrical signal whose magnitude is directly
proportional to the force being measured. It is basically a device that measures strain and then
converts force into electric energy which serves as a measurement for scientists and workers.
The strain measurement by load cells helps in maintaining the integrity of the unit under
pressure and protects people and equipment nearby.
Figure: 3.15 Load Cell
3.22 Ett-10pt RTD Temperature Sensor:
A temperature sensor is a device that is designed to measure the degree of hotness or coolness
in an object. The working of a temperature meter depends upon the voltage across the diode.
The temperature change is directly proportional to the diode’s resistance. The cooler the
temperature, lesser will be the resistance, and vice-versa. The resistance across the diode is
measured and converted into readable units of temperature (Fahrenheit, Celsius, Centigrade,
etc.) and, displayed in numeric form over readout units. In geotechnical monitoring field, these
temperature sensors are used to measure the internal temperature of structures like bridges,
dams, buildings, power plants, etc.
3.23 Specification:
The ETT-10PT RTD can be used in similar applications as the ETT-10TH. The probe has excellent
stability and accuracy that makes it well suited for long-term installations where high accuracy and
reliability is required. It consists of a ceramic resistance element (Pt 100) with DIN IEC 751
26
(formerly DIN 43760) European curve calibration. The resistance element is housed in a closed
end robust stainless steel tube that protects the element against moisture
3.24 Working Principal:
The basic principle of working of the temperature sensors is the voltage across the diode
terminals. If the voltage increases, the temperature also rises, followed by a voltage drop
between the transistor terminals of base and emitter in a diode. Besides this, has a
vibrating wire temperature sensor that works on the principle of stress change due to
temperature change. The vibrating wire temperature meter is designed on the principle
that dissimilar metals have a different linear coefficient of expansion with temperature
variation. It primarily consists of a magnetic, high tensile strength stretched wire, the
two ends of which are fixed to any dissimilar metal in a manner that any change in
temperature directly affects the tension in the wire
The dissimilar metal, in the case of the temperature meter, is aluminum (Aluminum has
a larger coefficient of thermal expansion than steel.) As the Temperature signal is
converted into frequency; the same read-out unit which is used for other vibrating wire
sensors can also be used for monitoring temperature also.
f = 1/2 [σg/ρ] / 2l Hz
Where:
σ = tension of the wire
g = acceleration due to gravity
ρ = density of the wire
l = length of wire.
LCD temperature sensor is given bellow:
27
Figure: 3.16 LCD Temperature Sensors
3.24.1 Speciation
Specifications of Model ETT-10PT RTD Probe:
Table: 3.2 Specifications of Model ETT-10PT RTD Probe
Model ETT-10PT RTD Readings
Sensor type Pt 100
Range -20o to 80o C
Accuracy ± (0.3 + 0.005*t)o C
Calibration DIN IEC 751
Curve (European) 0.00385 Ohms/Ohm/oC
28
Dimension (Φ x L) 8 x 135 mm
Cable 3 core shielded
3.25 Heat Sink:
A heat sink is a component that increases the heat flow away from a hot device. It
accomplishes this task by increasing the device's working surface area and the amount
of low-temperature fluid that moves across its enlarged surface area. Based on each
device's configuration, we find a multitude of heat sink aesthetics, design, and ultimate
capabilities. You can see a straight fin heat sink in the image at the top of this article
and a flared fin heat sink in the image below. Each heat sink is valuable in applications
that may have varying. Figure of heat sink is given bellow:
Figure: 3.17 Heats Sank
29
3.26 Capacitor
Device for storing electrical energy, consisting of two conductors in close proximity and
insulated from each other. A simple example of such a storage device is the parallel-plate
capacitor. If positive charges with total charge +Q are deposited on one of the conductors and
an equal amount of negative charge −Q is deposited on the second conductor, the capacitor is
said to have a charge Q. (See also electricity: Principle of the capacitor. The different types of
capacitors are following.
1. Electrolytic Capacitor
2. Mica Capacitor
3. Paper Capacitor
4. Film Capacitor
5. Non-Polarized Capacitor
3.27 Electrostatic Capacitor
Generally, the electrolyte capacitors are used when the large capacitor values are required. The
thin metal film layer is used for one electrode and for the second electrode (cathode) a semi-
liquid electrolyte solution which is in jelly or paste is used. The dielectric plate is a thin layer
of oxide, it is developed electrochemically in production with the thickness of the film and it
is less than the ten microns.
Figure: 3.18 Electrochemically Capacitor

30
3.28 Electrolytic Capacitor
This insulating layer is very thin, it is possible to make capacitors with a large value of
capacitance for a physical size, which is in small and the distance between the two plates is
very small. The types of capacitors in the majority of electrolytic are polarized, which is DC
voltage is applied to the capacitor terminal and they must be correct polarity.
Figure 3.19 Non-Polarized Capacitor
The plastic foil capacitor is non-polarized by nature and the electrolytic capacitors are generally
two capacitors in the series, which are in the back to back hence the result is in the non-
polarized with half capacitance. The non-polarized capacitor requires the AC applications in
the series or in parallel with the signal or power supply.
3.29 Resisters
In electricity, property of an electric circuit or part of a circuit that transforms electric energy
into heat energy in opposing electric current. Resistance involves collisions of the current-
carrying charged particles with fixed particles that make up the structure of the conductors.
Resistance is often considered as localized in such devices as lamps, heaters, and resistors, in
which it predominates, although it is characteristic of every part of a circuit, including
connecting wires and electric transmission lines.
31
Figure: 3.20 Resistors
3.30 Ultrasonic Sensor
The HC-SR04 ultrasonic sensor uses sonar to determine the distance to an object. This sensor
reads from 2cm to 400cm (0.8inch to 157inch) with an Accuracy of 0.3cm (0.1inches), which
is good for most hobbyist projects. In addition, this particular module comes with ultrasonic
transmitter and receiver modules.
3.31 Pin-Outs:
Here’s the pin out of the HC-SR04 Ultrasonic Sensor
Figure 3.21 Ultrasonic Sensor
32
Table 3.3 Ultrasonic Sensor Pin Outs
Ultrasonic Sensor Pin Readings
VCC Powers the sensor (5V)
Trig Trigger Input Pin
Echo Echo Output Pin
GND Common GND
3.32 Features
Here’s a list of some of the HC-SR04 ultrasonic sensor features and specs—for more
information, you should consult the sensor’s datasheet:
 Power Supply: +5V DC
 Quiescent Current: <2mA
 Working Current: 15mA
 Effectual Angle: <15°
 Ranging Distance: 2cm – 400 cm/1″ – 13ft
 Resolution: 0.3 cm
 Measuring Angle: 30 degree
 Trigger Input Pulse width: 10uS TTL pulse
33
3.33 Work
The ultrasonic sensor uses sonar to determine the distance to an object. Here’s what happens:
1. The ultrasound transmitter (trig pin) emits a high-frequency sound (40 kHz).
2. The sound travels through the air. If it finds an object, it bounces back to the module.
3. The ultrasound receiver (echo pin) receives the reflected sound (echo)
4. speed of sound in the air at 20ºC (68ºF) = 343m/s
The time between the transmission and reception of the signal allows us to calculate the
distance to an object. This is possible because we know the sound’s velocity in the air. Here’s
The formula:
distance to an object = ((speed of sound in the air) *time)/2
34
4 CHAPTER
4 METHODOLOGY
4.1 Description:
The interconnection of the different components of the BMI Assessment machine that includes
a microcontroller, ultrasonic sensor, load cell with load cell amplifier and liquid crystal display.
The open-source Arduino microcontroller is a general-purpose microcontroller. It is
responsible for the overall operation of the machine. The input device of the machine comprises
of the, ultrasonic sensor, and load cell. The input mechanism for the data that will be coming
from the user. The ultrasonic sensor serves as the height sensor while the load cell with load
cell amplifier acts as the weight sensor. After the inputs are processed by the microcontroller,
it is being displayed with a user-centered design in the liquid crystal display (LCD).
Figure: 4.1 System Ladder Diagram
35
Base plane of the project:
Figure: 4.2 Machine Base Plane
Block diagram is given bellow:
Figure: 4.3 Block Diagram

36
Follow chart of project is given bellow:
Figure: 4.3 Flow Chart
37
4.2 Writing Software:
The proponents used the waterfall development method in developing the software part by
which the analysts proceed sequentially from one phase to the next. The advantage of this
method is that the system requirements were first identified before the programming begins
and the changes in the requirements were minimized as the project proceeds. The phase by
which the proponents conducted a research to have an idea on what design to choose for the
proposal was in the planning phase. The proponents identified the problem that will be solved
by the design. Then, the proponents constructed the title suited for the design description. The
analysis phase was done after the planning. In the analysis phase the proponents should
determine the users and the function of the system. The proponents analyzed the problem
finding out that people want to enhance the way of measuring their BMI by automating it. Next,
requirements were gathered to know the functions needed in building the design project. They
also gathered information on what programming language to use in doing the system. After
gathering the information needed, the proponents proposed the design to the Adviser as well
as to the panel. When the proposed design was approved by the panel, the proponents did the
next phase which was the Design phase. This phase decided how the system will operate and
what to use in terms of software development. In the Design Phase, the proponents chose a
design strategy to work out with the team and come up with the deadline of the design project.
This phase includes the development of the software as well as the coding of program.
4.3 Steps of Writing Software:
• Declaration of each pin with the names for specified functions.
• Declaration of all variables needed to perform the functions.
• Declaration of different functions needed to perform the tasks.
• Declaration of the libraries needed for the functions.
• Initialization of all input and output pins of controller.
• Initialization of libraries.
38
• Output pins initialization with logic conditions.
• Writing the main function to call the sub functions.
• Writing the main tasks to perform.
• Writing the sub function to be called.
• Select Bought rate 9600
4.4 Features
• It’s so simple and creative project and product for new user
• It has 100% accuracy
• It can be used for caves worker health care system
• We can make good and healthy atmosphere for labor by using this system
4.5 Designing Hardware
After uploading the software 1st was implemented to the hardware to test its functions if it will
work or not to the hardware. The last phase was the Implementation phase where, the
installation of the design was completed. After installation, the proponents did the testing to
check the accuracy and functionality of the design. For the reliability of the design, the
proponents chose five users to evaluate the design. By this waterfall designer got the output
“Automated BMI Calculation” with working and tested functionalities.
It represents the initialization of the software which will determine who will be the user. The
registered account could add BMI. Admin system has the capability to display, open, update
and delete all the BMI of the patients being examined by the system. We have try to make
batter thing and batter idea for our self. First of all, we study previous research and future work
ideas, then we start our work. we make a design on Proteus software we have another option
for instead of Proteus is Frittering, Thinker cad, p-type. But we select Proteus because it’s so
simple for user and we can make custom library easily.
39
4.6 Implementation Steps
In our project we try to design our project as a product. And we try to make a project as product
and it have musty beauty and its cost must be low we have use round shape glass of mirror .to
make a measuring of weight. The weight scale is given in below figure; we have used a doted
PCB to join the component. Here we have also display the doted PCB and show in figure
below. We have used wire for cross component joining .it is back side of PCB board. We have
done neat and clean soldering. The back side of PCB shown in blow.
Figure: 4.4 Weight Scale Hardware
In other picture we have also show the front of PCB and display the all component complete
hardware circuit diagram of our project with Arduino Uno. And DC power supply circuit also
show in front side of PCB in figure given blow:
40
Figure: 4.5 PCB Soldering
4.7 Project Deployment:
The schematic diagram of the BMI machine is presented in Figure 2. The components which
serve as inputs for the machine are the load cell, ultrasonic sensor, and keypad. The load cell
is capable of converting pressure (force) into an electrical signal. This signal is read and
amplified by the HX711, a load cell amplifier. The load cell is connected to the HX711 input
side while the output side of the HX711 is connected to the Arduino. The pins 1, 2, 3, 4, 5, 6,
7, 8 of the keypad are connected to the digital pins 8, 9, 10, 11, 4, 5, 6, 7 of the Arduino,
respectively. Lastly, the trigger pin (input) and echo pin (output) of the ultrasonic sensor is
connected to the digital pin 13 and pin 12 of the Arduino, respectively. The output is shown in
the 4x20 I2C Liquid Crystal Display. The SDA and SCL pins of the LCD are connected to the
SDA and SCL pins of the microcontroller. The machine has a common VCC and ground.
41
5 CHAPTER
5 RESULTS & FINDINGS
5.1 Working Principal
When the BMI machine is powered on, in the absence of human standing on the weighing unit,
the MCU initializes, then detects zero human height (because H-h = 0) and zero mass. As soon
as a man whose BMI is to be measured stands in the L-shaped wooden stand shown in figure
5, the ultrasonic sensor generates a shorter pulse because the ultrasound now travels a shorter
distance as it hits human head and is reflected to the receiver. The pulse is sent to the Arduino
micron roller which converts the processed time t (period) into distance h using equation (1).
The human height is determined by subtracting h from the sensor’s height H. Also, the load
cell amplifier senses an Appreciable output voltage which is sent to the MCU via the HX711
PGA. The signal received from the PGA is also used to compute human mass while equation
(2) Evaluates the BMI value. The C++ code embedded in the MCU is responsible for all the
numerical computations and operations of the system.
5.2 Software Results:
The proponents used the waterfall development method in developing the software part by
which the analysts proceed sequentially from one phase to the next. The advantage of this
method is that the system requirements were first identified before the programming begins
and the changes in the requirements were minimized as the project proceeds. The phase by
which the proponents conducted a research to have an idea on what design to choose for the
proposal was in the planning phase. The proponents identified the problem that will be solved
by the design. Then, the proponents constructed the title suited for the design description.
The analysis phase was done after the planning.
42
5.3 Hardware Results:
Complication all software and programming process we implement it on our hardware that we
already complete it during when we working on software. It works 100% accuracy. We have
implemented many test on hardware .it works correctly and no little bit error in project. Hare
below we how different figures, and test on different atmosphere and different conditions. Its
work correctly in the process of complication of project we have implementation of many test
in our project .and every test we have gain in every test some time we failed and some time
and we success we try again and again and at least we succeed and our project work 100%
accurate. And provide accurate reading and results that we want to gain. Here are showing the
hardware result that we measure a person. And we also check another meter. it’s accurate
reading of Temperature, Weight, and Height. the result is shown in figure. The both circuit are
together.
Figure: 5.1 Hardware out Put
43
In other test we just put the weight on the scale. I have checked my weight in this image. It
measured 100% accurate value. I have measured my weight another scale. its provide right
value
FIGURE: 5.2 Application Test Results 2
FIGURE: 5.3 Application Test Results 3

44
In this figure the dashboard displays weight. And display value also display in 16X2 LCD in
the second test we implement another place and other person. According the second test the
values are shown normal. the upper figure the second test shown. The condition is normal we
do another test in other place and other person, there are given values according the next test
shown in upper figure.
Table: 5.1 Result Readings
Measurements Readings
Height 173cm 0r 5 ft.7 in
Weight 73.8kg
TEMP 350C
HR 107 b/m
BP 89
BMI 22.4
SP02 96%
45
5.4 Conclusion
The design of the weight and height measuring system for medical anthropometry has been
completed and the aim was immensely achieved. The results from the design analysis revealed
that the system weight sensor platform has sheer force of 630 N, maximum bending moment
of 126 Nm. The compressive stress that could be induced during measurement of maximum
human weight is 6 kN/m2 and stress that could be induced due to maximum bending moment
is amount to 605 N/m2.
The amount by which weight sensor platform could deflect when subjected to bending moment
is 0.000004 m. These values indicating that the design is safe for operation which is far lesser
than the property parameters of the materials used for the weight sensor platform. The range
of measurement of weight sensor is 1 kg to 200 kg with accuracy of about ±0.1 kg and that of
ultrasonic distance sensor is 0.4 m to 2.5 m with accuracy of about±1 mm, resolution of±0.3
mm. The time for the ultrasonic sensor to response to measure the height is less than 160
microsecond (MS) during on and off respectively.
5.5 Future Scope
Evaluation of BMI machine market share for regional and country level segments
Strategic recommendation for new entrants
Competitive landscaping of major general trends
46
5.6 Limitation
The designed project has the ability to display the height and weight of a person and their
weight classifications together with the target weight if he/she is obese or underweight. The
design is programmed to calculate the person’s height and divide it by the ratio to his/her
weight that determined body fat. The device can be set according to the gender of the person
that will enter. The device calculates the number of persons that entered into the proponent’s
system with the list of person showing underweight, normal, overweight and obese for survey
purposes. This system helps the attending nurse, physician or doctor to lessen their job and to
monitor patient’s health. The proponents build the hardware suitable for children of any weight
and height. Proponents ensure safety of any person that will enter through the device. On the
other hand, there are some limits that the system is not capable of which include not suitable
for person weighing 90kg and above; this can only accommodate one person at a time; this not
suitable for people with dwarfism and people with disability and this is not suitable for people
with mannerism movement.
47
6 CHAPTER
6 BIBLIOGRAPHY
6.1 Arduino UNO
#include <MAX30100_PulseOximeter.h>
#include <Wire.h>
#include <LiquidCrystal.h>
Liquid Crystal LCD (2, 3, 4, 5, 6, 7);
#define REPORTING_PERIOD_MS 3000
PulseOximeter pox;
Uint32_t tsLastReport = 0;
Void onBeatDetected () {
Serial.println ("Beat!");
#define tempPin A0 // the output pin of LM35
Int temp=0;
Int spO2=0;
Int bpm=0;
Byte thermometer symbol [8] = {
B00100,
B01010,
48
B01010,
B01110,
B01110,
B11111,
B11111,
B01110};
Byte heart [8] = {
0b00000,
0b01010,
0b11111,
0b11111,
0b11111,
0b01110,
0b00100,
0b00000
};
Void setup () {
Pin Mode (tempPin, INPUT);
Serial. Begin (9600);
49
Serial. Print ("Ready! \n");
lcd. create Char (1, thermometer symbol);
lcd. create Char (2, heart);
Lcd. Begin (16, 2); // Configure LCD numero columns y files
lcd. set Cursor (0, 0);
Lcd. Print (" Welcome to ");
Lcd. Print (" ");
Delay (2000);
Lcd. Clear ();
Serial. Print ("Initializing pulse oximeter...”);
Delay (1000);
If (! pox. Begin ()) {Serial.println ("FAILED");
For (; ;);
} else {
Serial.println ("SUCCESS");
pox. setIRLedCurrent (MAX30100_LED_CURR_7_6MA);
50
pox. setOnBeatDetectedCallback (onBeatDetected);
Void loop () {
Temp=analog Read (tempPin);
Temp=temp*4.887; // convert raw data into millivolts
Temp=temp/10.0;
// Make sure to call update as fast as possible
Pox. Update ();
If (Millis () - tsLastReport > REPORTING_PERIOD_MS) {
Lcd. Clear ();
Bpm = pox. get Heartrate ();
spO2= pox. getSpO2 ();
Lcd. Write (2);
Lcd. Print ("HR:");
Lcd. Print (bpm*1.2, 0);
Lcd. Print ("BPM:");
Lcd. Print (bpm);
51
Lcd. Write (1);
Lcd. Print ("T:");
Lcd. Print (temp, 1);
Lcd. Write (223);
Lcd. Print ("C");
Lcd. Print ("spO2:");
Lcd. Print (spO2);
Lcd. Print ("%");
TsLastReport = Millis ();
}}
6.2 Arduino Pro-Mini
#include "HX711.h"
#include <LiquidCrystal.h>
Liquid Crystal LCD (2, 3, 4, 5, 6, 7);
#define echo pin 10 // echo pin
#define trig pin 11 // Trigger pin
Int pul;
Int over Val;
52
Long g_weight;
Int data;
Float dist.;
Long duration;
Cost int buzzer = 13;
Float BMI = 0;
Float Weight;
Void setup () {
Pin Mode (buzzer, OUTPUT);
Pin Mode (trig pin, OUTPUT);
Pin Mode (echo pin, INPUT);
Init_Hx711 ();
Serial. Begin (9600);
Serial. Print ("Ready! \n");
Get_Maopi ();
Lcd. Begin (16, 2); // Configure LCD numero columns y files
Lcd. Print (" Welcome to ");
53
Lcd. Print (" ");
Delay (2000);
Lcd. Clear ();
Data = Get Weight ();}
Void loop () {
Dist. = data ();
Dist. = map (dist., 0, 190, 190, 0);
If (dist.<0) {dist.=0;}
g_weight = Get Weight ();
g_weight = g_weight-data;
Weight = g_weight/48.9;
If (Weight>200) {Weight=0;}
Lcd. Print ("Weight:");
Lcd. Print (Weight, 1);
Lcd. Print ("kg “);
Lcd. Print ("H:");
Lcd. Print (dist., 0);
Lcd. Print ("cm “);
54
Dist. = dist./99.9;
Dist. = dist.*1.9;
BMI = Weight / dist.;
Lcd. Print ("BMI:");
Lcd. Print (BMI);
Lcd. Print (" ");
Delay (1000);
Long data () {
Digital Write (trig pin, LOW);
Delay Microseconds (2);
Digital Write (trig pin, HIGH);
Duration=pulse in (echo pin, HIGH);
Return duration / 29 / 2;
6.3 Visual Studio Code
#index __HX711__H__
#define __HX711__H__
55
#include <Arduino.h>
#define HX711_SCK 8
#define HX711_DT 9
Extern void Init_Hx711 ();
Extern unsigned long HX711_Read (void);
Extern unsigned int Get Weight ();
Extern void Get_Maopi ();
#end if
6.4 Visual Studio Code 2
#include "hx711.h"
Long HX711_Buffer = 0;
Long Weight_Maopi = 0, Weight_Shiwu = 0;
//****************************************************
//****************************************************
Void Init_Hx711 ()
Pin Mode (HX711_SCK, OUTPUT);
56
Pin Mode (HX711_DT, INPUT);
//****************************************************
//****************************************************
Void Get_Maopi ()
HX711_Buffer = HX711_Read ();
Weight_Maopi = HX711_Buffer/100;
//****************************************************
//****************************************************
Unsigned int Get Weight ()
HX711_Buffer = HX711_Read ();
HX711_Buffer = HX711_Buffer/100;
Weight_Shiwu = HX711_Buffer;
Weight_Shiwu = Weight_Shiwu - Weight_Maopi;
Weight_Shiwu = (unsigned int) ((float)Weight_Shiwu/4.11);
57
Return Weight_Shiwu;
//****************************************************
//****************************************************
Unsigned long HX711_Read (void)
Unsigned long count;
Unsigned char i;
Bolo Flag = 0;
Digital Write (HX711_DT, HIGH);
Digital Write (HX711_SCK, LOW);
Count=0;
While (digital Read (HX711_DT));
For (I=0; I<24; I++)
Digital Write (HX711_SCK, HIGH);
58
Count=count<<1;
If (digital Read (HX711_DT))
Count++;
Digital Write (HX711_SCK, HIGH);
Count ^= 0x800000;
Delay Microseconds (1); return (count);
59
7 REFERENCES
[1] Bhandari, V.B. (2010). Design of Machine Elements, Third Edition, Tata McGraw Hill
Education Private Limited, West Patel Nagar, New Delhi110 008, India. pp. 1-6. ISBN-13:
978-0-07-068179-8, ISBN-10: 0-07-068179-1.
[2] Aderoba, A. A. (2011). Paradox of Human Anatomy in Engineering Design, Workshop on

Advanced Manufacturing Technology, Engineering Materials Development Institute (EMDI),
Akure, Nigeria.
[3] Udosen, U. J. (1998). Work Systems Design and Measurements, Essex Classic Nigerian
Company, Uyo, Nigeria.
[4] Encyclopedia Britannica (2013). Anthropometry. Encyclopedia Britannica Article,

Encyclopedia Britannica Ultimate Reference Suite, USA.
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FYP Report - Zaka and Mohsin

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MULTIFUNCTIONAL MEDICAL MACHINE

Mohsin Raza BSEES-01181001

Zaka Ullah BSEES-01173007

Department of Electronics and Electrical Systems

The University of Lahore

Remarks by Head, Department of Electronics & Electrical System

Dr. Syed Baqar Hussain

1.1 Introduction: ........................................................................................................... 1

1.2 What is BMI? .......................................................................................................... 2

1.3 Objectives: ............................................................................................................... 3

1.4 Problem Statement: ................................................................................................ 3

2 LITERATURE REVIEW ................................................................................................... 5

2.2 Introduction ............................................................................................................. 6

2.3 Materials and Method ............................................................................................ 7

2.4 Block Diagram......................................................................................................... 8

2.5 Circuit Diagram ...................................................................................................... 8

2.6 Schematic and Hardwar Diagram......................................................................... 9

2.7 Proposed System: .................................................................................................. 10

2.8 Conclusion: ............................................................................................................ 10

3 TOOLS & TECHNIQUES ................................................................................................ 11

3.1 Related Components: ........................................................................................... 11

3.3 Diode: ..................................................................................................................... 13

3.4 Realization: ............................................................................................................ 13

3.5 Specification: ......................................................................................................... 15

3.7 Realization: ............................................................................................................ 16

3.8 7805 Voltage Regulator IC: ................................................................................. 16

3.10 16x2 LCD Display: ................................................................................................ 18

3.12 Arduino Pro-Mini: ................................................................................................ 19

3.15 Memory .................................................................................................................. 22

3.16 Input and Output .................................................................................................. 22

3.17 Programming ........................................................................................................ 23

3.18 Automatic (Software) Reset ................................................................................. 23

3.19 HX711 Module ...................................................................................................... 23

3.20 Interfacing HX711 Load Cell with Arduino....................................................... 25

3.21 Load Cell: .............................................................................................................. 26

3.22 Ett-10pt RTD Temperature Sensor: ................................................................... 26

3.23 Specification: ......................................................................................................... 26

3.24 Working Principal: ............................................................................................... 27

3.25 Heat Sink: .............................................................................................................. 29

3.26 Capacitor ............................................................................................................... 30

3.27 Electrostatic Capacitor ......................................................................................... 30

3.28 Electrolytic Capacitor........................................................................................... 31

3.29 Resisters ................................................................................................................. 31

3.30 Ultrasonic Sensor .................................................................................................. 32

3.31 Pin-Outs: ................................................................................................................ 32

3.33 Work ...................................................................................................................... 34

4.1 Description: ........................................................................................................... 35

4.2 Writing Software: ................................................................................................. 38

4.3 Steps of Writing Software: ................................................................................... 38

4.5 Designing Hardware ............................................................................................. 39

4.6 Implementation Steps ........................................................................................... 40

4.7 Project Deployment: ............................................................................................. 41

5 RESULTS & FINDINGS .................................................................................................. 42

5.1 Working Principal ................................................................................................ 42

5.2 Software Results: .................................................................................................. 42

5.3 Hardware Results: ................................................................................................ 43

5.4 Conclusion ............................................................................................................. 46

5.5 Future Scope .......................................................................................................... 46

5.6 Limitation .............................................................................................................. 47

6.1 Arduino UNO ........................................................................................................ 48

6.2 Arduino Pro-Mini ................................................................................................. 52

6.3 Visual Studio Code................................................................................................ 55