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Carregador de Bateria Toshiba (High-Frequency Low Cost SMBus Chargers) IC-ON-LINE - CN - Max17435etg - 4529962
Carregador de Bateria Toshiba (High-Frequency Low Cost SMBus Chargers) IC-ON-LINE - CN - Max17435etg - 4529962
TION KIT
EVALUA LE
AVA AB
IL
High-Frequency,
Low-Cost SMBus Chargers
General Description Features
MAX17035/MAX17435/MAX17535
The MAX17035/MAX17435/MAX17535 integrated multi- S Low-Cost SMBus Charger
chemistry battery chargers IC simplify construction S High Switching Frequency (1.2MHz, 0.85MHz,
of accurate and efficient chargers. The MAX17035/ 0.5MHz)
MAX17435/MAX17535 provide SMBusK-programmable S Internal Boost Switches
charge current, charge voltage, input current limit, relearn
S SMBus-Programmable Charge Voltage, Input
voltage, and digital readback of the IINP voltage. The Current Limit, Charge Current, Relearn Voltage,
MAX17035/ MAX17435/MAX17535 utilize a charge pump and Digital IINP Readback
to control the adapter selection n-channel MOSFETs
S Single-Point Compensation
when the adapter is present. When the adapter is absent,
the charge pump is shut down and a p-channel MOSFET S Automatic Selection of System Power Source
selects the battery. Adapter n-channel MOSFETs Driven by an
Internal Dedicated Charge Pump
The MAX17035/MAX17435/MAX17535 provide up to 7A Adapter Soft-Start
of charge current to 2, 3, or 4 lithium-ion (Li+) cells in S ±0.4% Accurate Charge Voltage
series. The charge current, and input current-limit sense
amplifiers have low offset errors and can use 10mI S ±2.5% Accurate Input Current Limiting
sense resistors. The MAX17035/MAX17435/MAX17535 S ±3% Accurate Charge Current
fixed-inductor ripple architecture significantly reduces S Monitor Outputs for
component size and circuit cost. AC Adapter Current (±2% Accuracy)
The MAX17035/MAX17435/MAX17535 provide a digital Battery Discharge Current (±2% Accuracy)
AC Adapter Presence
output that indicates the presence of the adapter, an
analog output that indicates the adapter or battery S AC Adapter Overvoltage Protection
current, depending upon the presence or absence of S 11-Bit Battery Voltage Setting
the adapter, and a digital output that indicates when the S 6-Bit, Charge-Current Setting/Input Current Setting
adapter current exceeds a user-defined threshold. S Improved IINP Accuracy at Low Input Current
The MAX17035 operates with a switching frequency of
1.2MHz. The MAX17435 switches at 850kHz, and the Ordering Information
MAX17535 switches at 500kHz.
PART TEMP RANGE PIN-PACKAGE
The MAX17035/MAX17435/MAX17535 are available in MAX17035ETG+* -40NC to +85NC 24 TQFN-EP**
a small, 4mm x 4mm x 0.75mm 24-pin, lead-free QFN
MAX17435ETG+ -40NC to +85NC 24 TQFN-EP**
package. An evaluation kit is available.
MAX17535ETG+* -40NC
to +85NC 24 TQFN-EP**
Applications +Denotes a lead(Pb)-free/RoHS-compliant package.
*Future product—contact factory for availability.
Notebook Computers **EP = Exposed pad.
PDAs and Mobile Communicators Pin Configuration
2- to-4 Li+ Cell Battery-Powered Devices
TOP VIEW
CSSN
CSSP
PDSL
BATT
IINP
CC
18 17 16 15 14 13
ACIN 19 12 CSIP
ITHR 20 11 CSIN
VAA 21 10 ACOK
MAX17035
VCC 22 MAX17435 9 DH
MAX17535
GND 23 8 LX
EN 24 7 BST
1 2 3 4 5 6
SCL
SDA
DCIN
LDO
DLO
ADAPTLIM
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
High-Frequency,
Low-Cost SMBus Chargers
ABSOLUTE MAXIMUM RATINGS
MAX17035/MAX17435/MAX17535
DCIN, CSSP, BATT, CSIP to GND.......................... -0.3V to +28V LX to GND ................................................................ -6V to +28V
CSIP to CSIN, CSSP to CSSN............................... -0.3V to +0.3V CC, IINP to GND....................................... -0.3V to (VLDO + 0.3V)
VCC, SCL, SDA, VAA, EN, ACIN, ITHR, LDO Short Circuit to GND.......................................... Momentary
ADAPTLIM, ACOK to GND................................... -0.3V to +6V Continuous Power Dissipation (TA = +70NC)
PDSL to GND.......................................................... -0.3V to +37V 24-Pin, 4mm x 4mm Thin QFN
GND to PGND ...................................................... -0.3V to +0.3V (derate 20.8mW/NC above +70NC).............................1666mW
DHI to LX...................................................-0.3V to (VBST + 0.3V) Operating Temperature Range........................... -40NC to +85NC
BST to LX.................................................................. -0.3V to +6V Junction Temperature......................................................+150NC
BST to GND............................................................ -0.3V to +34V Storage Temperature Range............................. -65NC to +150NC
DLO to PGND........................................... -0.3V to (VLDO + 0.3V) Lead Temperature (soldering, 10s)..................................+300NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(Circuit of Figure 1, no load on LDO, VDCIN = VCSSP = VCSSN = 19V, VLX = 0V, VBST - VLX = 5V, VBATT = VCSIP = VCSIN = 16.8V,
TA = 0°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.)
2 _______________________________________________________________________________________
High-Frequency,
Low-Cost SMBus Chargers
ELECTRICAL CHARACTERISTICS (continued)
MAX17035/MAX17435/MAX17535
(Circuit of Figure 1, no load on LDO, VDCIN = VCSSP = VCSSN = 19V, VLX = 0V, VBST - VLX = 5V, VBATT = VCSIP = VCSIN = 16.8V,
TA = 0°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
CHARGE-CURRENT REGULATION
CSIP-to-CSIN Full-Scale
78.22 80.64 83.06 mV
Current-Sense Voltage
RS2 = 10mI, Figure 1; 7.822 8.064 8.306 A
ChargingCurrent()= 0x1f80 -3 +3 %
RS2 = 10mI, Figure 1; 3.829 3.968 4.107 A
Charge Current and Accuracy
ChargingCurrent()= 0x0f80 -3.5 +3.5 %
RS2 = 10mI, Figure 1; 64 128 192 mA
ChargingCurrent()= 0x0080 -50 +50 %
Based on ChargeCurrent() = 128mA and
Charge-Current Gain Error -2 +2 %
8.064A
INPUT CURRENT REGULATION
RS1 = 10mW, Figure 1, InputCurrent() = full 106.7 110 113.3 mV
scale -2.5 +2.5 %
62.08 64 65.92 mV
Input Current-Limit Threshold RS1 = 10mW, Figure 1, InputCurrent() = 0C80
-3 +3 %
36.86 38.4 39.94 mV
RS1 = 10mW, Figure 1, InputCurrent() = 0780
-4 +4 %
CSSP/CSSN Input-Voltage Range 8 26 V
IINP Voltage Gain 19.7 19.85 20.3 V/V
IINP Output-Voltage Range 0 4.2 V
VCSSP - VCSSN = 110mV -5 +5
IINP Accuracy VCSSP - VCSSN = 55mV -4 +4 %
VCSSP - VCSSN = 5mV -10 +10
Based on VCSSP - VCSSN = 110mV and
IINP Gain Error -1.5 +1.5 %
VCSSP - VCSSN = 55mV
Based on VCSSP - VCSSN = 110mV and
IINP Offset Error -350 +350 FV
VCSSP - VCSSN = 55mV
REFERENCE
REF Output Voltage REF IREF = 50FA 4.082 4.096 4.115 V
REF Undervoltage-Lockout
REF falling 3.1 3.9 V
Threshold
LINEAR REGULATOR
LDO Output Voltage LDO IREF = 50FA 5.25 5.4 5.6 V
LDO Load Regulation 0 < ILDO < 40mA 127 250 mV
LDO Undervoltage-Lockout
LDO falling 3.2 4.1 5.0 V
Threshold
_______________________________________________________________________________________ 3
High-Frequency,
Low-Cost SMBus Chargers
ELECTRICAL CHARACTERISTICS (continued)
MAX17035/MAX17435/MAX17535
(Circuit of Figure 1, no load on LDO, VDCIN = VCSSP = VCSSN = 19V, VLX = 0V, VBST - VLX = 5V, VBATT = VCSIP = VCSIN = 16.8V,
TA = 0°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.)
4 _______________________________________________________________________________________
High-Frequency,
Low-Cost SMBus Chargers
ELECTRICAL CHARACTERISTICS (continued)
MAX17035/MAX17435/MAX17535
(Circuit of Figure 1, no load on LDO, VDCIN = VCSSP = VCSSN = 19V, VLX = 0V, VBST - VLX = 5V, VBATT = VCSIP = VCSIN = 16.8V,
TA = 0°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
ADAPTER OVERVOLTAGE PROTECTION
ACOVP Threshold Rising 2.04 2 2.1 V
ACOVP Threshold Hysteresis 30 mV
ADAPTER OVERCURRENT PROTECTION
ACOCP Threshold With respect to VCSSP - VCSSN 144 mV
ACOCP Blanking Time 16 ms
When ACOCP comparator is high and at the
ACOCP Waiting Time 0.6 s
time the blanking time expires
PDSL SWITCH CONTROL
PDSL Turn-Off Resistance 2.5 4 kI
SMBus TIMING SPECIFICATIONS
SMBus Frequency fSMB 10 100 kHz
Bus Free Time tBUF 4.7 Fs
START Condition Hold Time
tHD:STA 4 Fs
from SCL
START Condition Setup Time
tSU:STA 4.7 Fs
from SCL
STOP Condition Setup Time
tSU:STO 4 Fs
from SCL
Holdup Time from SCL tHD:DAT 300 ns
Setup Time from SCL tSU:DAT 250 ns
SCL Low Period tLOW 4.7 Fs
SCL High Period tHIGH 4 Fs
Maximum Charging Period
Without a Charge_Voltage() or 140 175 210 s
ChargeCurrent() Command
ELECTRICAL CHARACTERISTICS
(Circuit of Figure 1, no load on LDO, VDCIN = VCSSP = VCSSN = 19V, VLX = 0V, VBST - VLX = 5V, VBATT = VCSIP = VCSIN = 16.8V,
TA = -40°C to +85°C, unless otherwise noted.) (Note 2)
_______________________________________________________________________________________ 5
High-Frequency,
Low-Cost SMBus Chargers
ELECTRICAL CHARACTERISTICS (continued)
MAX17035/MAX17435/MAX17535
(Circuit of Figure 1, no load on LDO, VDCIN = VCSSP = VCSSN = 19V, VLX = 0V, VBST - VLX = 5V, VBATT = VCSIP = VCSIN = 16.8V,
TA = -40°C to +85°C, unless otherwise noted.) (Note 2)
6 _______________________________________________________________________________________
High-Frequency,
Low-Cost SMBus Chargers
ELECTRICAL CHARACTERISTICS (continued)
MAX17035/MAX17435/MAX17535
(Circuit of Figure 1, no load on LDO, VDCIN = VCSSP = VCSSN = 19V, VLX = 0V, VBST - VLX = 5V, VBATT = VCSIP = VCSIN = 16.8V,
TA = -40°C to +85°C, unless otherwise noted.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN MAX UNITS
INPUT CURRENT REGULATION
RS1 = 10mI, Figure 1; 106.7 113.3 mV
InputCurrent() = full scale -2.5 +2.5 %
RS1 = 10mI, Figure 1; 62.08 65.92 mV
Input Current-Limit Threshold
InputCurrent()= 0C80 -3 +3 %
RS1 = 10mI, Figure 1; 36.86 39.94 mV
InputCurrent()= 0780 -4 +4 %
CSSP/CSSN Input Voltage Range 8 26 V
IINP Voltage Gain 19.7 20.3 %
IINP Output-Voltage Range 0 4 V
VCSSP - VCSSN = 110mV -5 +5
IINP Accuracy VCSSP - VCSSN = 55mV -4 +4 %
VCSSP - VCSSN = 5mV -10 +10
Based on VCSSP - VCSSN = 100mV
IINP Gain Error -1 +1 %
and VCSSP - VCSSN = 20mV
Based on VCSSP - VCSSN = 100mV
IINP Offset Error -500 +500 FV
and VCSSP - VCSSN = 5mV
REFERENCE
REF Output Voltage REF IREF = 50FA 4.075 4.115 V
REF Undervoltage-
REF falling 3.9 V
Lockout Threshold
LINEAR REGULATOR
LDO Output Voltage LDO IREF = 50FA 5.25 5.6 V
LDO Load Regulation 0 < ILDO < 40mA 250 mV
LDO Undervoltage-Lockout
LDO falling 3.2 5.0 V
Threshold
ACOK
ACOK Sink Current VACOK = 0.4V, ACIN = 2.5V 1 mA
ACIN
ACIN Threshold 1.465 1.53 V
ACIN Threshold Hysteresis 30 50 mV
ACIN Input-Bias Current -1 +1 FA
ITHR/ADAPTLIM
ITHR Leakage Current VITHR = 0 to 5.4V 1 FA
ADAPTLIM Sink Current VITHR > VIINP 1 mA
ADAPTLIM Leakage Current VITHR < VIINP 1 FA
ITHR Threshold Calculated = VITHR - VIINP -12 +12 mV
_______________________________________________________________________________________ 7
High-Frequency,
Low-Cost SMBus Chargers
ELECTRICAL CHARACTERISTICS (continued)
MAX17035/MAX17435/MAX17535
(Circuit of Figure 1, no load on LDO, VDCIN = VCSSP = VCSSN = 19V, VLX = 0V, VBST - VLX = 5V, VBATT = VCSIP = VCSIN = 16.8V,
TA = -40°C to +85°C, unless otherwise noted.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN MAX UNITS
LOGIC LEVELS
SDA/SCL Input Low Voltage 0.8 V
SDA/SCL Input High Voltage 2.1 V
SDA/SCL Input-Bias Current -1 FA
SWITCHING REGULATOR
VDCIN = 19V, VBATT = 10V, MAX17035 29 41
DHI Off-Time K Factor VDCIN = 19V, VBATT = 10V, MAX17435 47 57 ns/V
VDCIN = 19V, VBATT = 10V, MAX 17535 80 94
Cycle-by-Cycle Current-Limit
VCSIP - VCSIN 120 130 mV
Sense Voltage
DHI Resistance High IDHI = 10mA 3 I
DHI Resistance Low IDHI = -10mA 1.6 I
DLO Resistance High IDLO = 10mA 6 I
DLO Resistance Low IDLO = -10mA 6 I
ADAPTER DETECTION
Adapter Absence Detect
VDCIN - VBATT, VDCIN falling 50 200 mV
Threshold
Adapter Detect Threshold VDCIN - VBATT, VDCIN rising 340 570 mV
CHARGE-PUMP MOSFET DRIVER
PDSL Gate-Driver VDCIN
VDCIN = 19V V
Output-Voltage High + 5.3
ADAPTER OVERVOLTAGE PROTECTION
ACOVP Threshold Rising 2.04 2.1 V
PDSL SWITCH CONTROL
PDSL Turn-Off Resistance 4 kI
SMBus TIMING SPECIFICATIONS
SMBus Frequency fSMB 10 100 kHz
Bus Free Time tBUF 4.7 Fs
START Condition Hold Time
tHD:STA 4 Fs
from SCL
START Condition Setup Time
tSU:STA 4.7 Fs
from SCL
STOP Condition Setup Time
tSU:STO 4 Fs
from SCL
8 _______________________________________________________________________________________
High-Frequency,
Low-Cost SMBus Chargers
ELECTRICAL CHARACTERISTICS (continued)
MAX17035/MAX17435/MAX17535
(Circuit of Figure 1, no load on LDO, VDCIN = VCSSP = VCSSN = 19V, VLX = 0V, VBST - VLX = 5V, VBATT = VCSIP = VCSIN = 16.8V,
TA = -40°C to +85°C, unless otherwise noted.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN MAX UNITS
Hold Time from SCL tHD:DAT 300 ns
Setup Time from SCL tSU:DAT 250 ns
SCL Low Period tLOW 4.7 Fs
SCL High Period tHIGH 4 Fs
Maximum Charging Period
Without a Charge_Voltage() or 140 210 s
ChargeCurrent() Command
Note 1: Adapter Present conditions are tested at VDCIN = 19V and VBATT = 16.8V. Adapter Absent conditions are tested at VDCIN
= 16V, VBATT = 16.8V.
Note 2: Specifications to -40°C are guaranteed by design and not production tested.
INPUT CURRENT-LIMIT ERROR INPUT CURRENT-LIMIT ERROR IINP ERROR vs. SYSTEM CURRENT
vs. INPUT CURRENT-LIMIT SETTING vs. SYSTEM CURRENT (DC SWEEP)
16 0 30
MAX17035 toc03
MAX17035 toc01
MAX17035 toc02
14 -0.5 25
INPUT CURRENT-LIMIT ERROR (%)
12 VBATT = 8.4V
-1.0
10 20
IINP ERROR (%)
8 -1.5
15
6 -2.0
10 VADAPTER = 20V
4 -2.5 VBATT = 12.6V VADAPTER = 0V, VBATT = 15V
2 5
-3.0 VBATT = 16.8V
0
-3.5 0
-2
INPUT CURRENT LIMIT = 3.584A
-4 -4.0 -5
0 2 4 6 8 0 1 2 3 4 0 20 40 60
INPUT CURRENT-LIMIT SETTING (A) SYSTEM CURRENT (A) VCSSP - VCSSN (mV)
_______________________________________________________________________________________ 9
High-Frequency,
Low-Cost SMBus Chargers
Typical Operating Characteristics (continued)
MAX17035/MAX17435/MAX17535
(Circuit of Figure 1, VIN = 19V, VCC = VDD = 5V, EN = VCC, TA = +25NC, unless otherwise specified.)
MAX17035 toc05
MAX17035 toc06
MAX17035 toc04
7
2.5
2.0 ICHARGER = 5A
6
IINP ERROR (%)
2.0
1.5 5
1.5 ICHARGER = 3A
4
1.0
1.0
ICHARGER = 4A 3
0.5 VBATT = 16.8V 0.5
2
0 0 1
VBATT = 12.6V VBATT = 8.4V
-5.0 -0.5 0
0 1 2 3 4 3 8 13 18 2 4 6
SYSTEM CURRENT (A) INPUT CURRENT-LIMIT SETTING (A)
BATTERY VOLTAGE (V)
CHARGE VOLTAGE CHARGER VOLTAGE ERROR BATTERY REMOVAL
ACCURACY AT 3.854A vs. CHARGER CURRENT (VBATT = 3V )
MAX17035 toc09
0.20 0.3
MAX17035 toc08
MAX17035 toc07
0.2 PDSL
0.15
5V/div
CHARGER VOLTAGE ERROR (%)
0.1
VBATT
0.10 0 VBATT = 8.4V VBATT = 12.6V 5V/div
VBATT = 16.8V
-0.1 DCIN
ERROR (%)
0.05
5V/div
-0.2
0 -0.3
-0.4 IL
-0.05
1A/div
-0.5
-0.10
-0.6
-0.15 -0.7
0 5 10 15 20 0 2 4 6 100Fs/div
CHARGE VOLTAGE (V) CHARGER CURRENT (A)
4 CELL
IL 95
1A/div 3 CELL
90
VBATT 85
VBATT 5V/div 2 CELL
EFFICIENCY (%)
200mV/div 80
CC 75
1V/div 70
IL
ISYSLD
2A/div 65
1A/div
60
0A
55
50
1ms/div 20Fs/div 0 1 2 3 4 5 6
CHARGE CURRENT (A)
10
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High-Frequency,
Low-Cost SMBus Chargers
Typical Operating Characteristics (continued)
MAX17035/MAX17435/MAX17535
(Circuit of Figure 1, VIN = 19V, VCC = VDD = 5V, EN = VCC, TA = +25NC, unless otherwise specified.)
MAX17035 toc15
MAX17035 toc13
MAX17035 toc14
5.46 1.5
4.105
1.0
5.44
4.100
DEVIATION (mV)
0.5
5.42
0 SWITCHING 4.095
5.40
-0.5 4.090
5.38
-1.0
NOT SWITCHING 4.085
5.36 -1.5
4.080
5.34 -2.0
-40 -20 0 20 40 60 80 100
0 10 20 30 40 50 0 5 10 15 20 25 30
TEMPERATURE (NC)
LDO CURRENT (mA) DCIN (V)
900
800 PDSL PDSL
5V/div 5V/div
700 VADAPTER
FREQUENCY (kHz)
0
0 5 10 15 20 10ms/div 40ms/div
VBATT (V)
______________________________________________________________________________________ 11
High-Frequency,
Low-Cost SMBus Chargers
Pin Description
MAX17035/MAX17435/MAX17535
Current Sense for Positive Input. Connect a current-sense resistor from CSSP to CSSN. The voltage
across CSSP to CSSN determines the current at which the charger reduces charging current to
keep from drawing more current from the adapter than is allowed. As the system current flowing
in the resistor from CSSN to CSSP increases, the charger reduces charge current to keep the
system current at the limit value. When the system current reaches approximately 130% of the
16 CSSP
max programmed value, the PDSL pin changes state and turns off the input FET to prevent excess
current from the adapter. When the adapter overcurrent condition occurs, give a 16ms blanking
time, and then turn off the adapter switch. The adapter switch is turned on again after 0.6s. Try the
same thing one more time. After the third blanking time (16ms), the adapter MOSFETS are latched
in the off state. To release the adapter switch’s off state, adapter removal and reinsertion is needed.
12
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High-Frequency,
Low-Cost SMBus Chargers
Pin Description (continued)
MAX17035/MAX17435/MAX17535
PIN NAME FUNCTION
17 CC Voltage Regulation Loop-Compensation Point. Connect a 10nF capacitor from CC to GND.
Input Current-Monitor Output. The voltage at the IINP pin is 20 times the voltage from CSSP to
18 IINP CSSN. This voltage is present when charging is enabled to monitor the system current, and when
the battery is discharging to monitor the battery discharge current.
AC Adapter-Detect Input. ACIN is the input to a comparator with a comparison voltage of about
1.5V. The output of the comparator is ACOK. ACOK goes low when the threshold voltage is
exceeded to indicate that the AC adapter is present, and it enables the charger. When the ACIN
input is above 2.1V, the MAX17035/MAX17435/MAX17535 interpret that as an adapter overvoltage
19 ACIN
event. The charger is then disabled and the adapter MOSFETs are turned off. If the part is charging
and the ACIN voltage drops below the programmed threshold, the charger is disabled and a
ChargeCurrent() and ChargeVoltage() command have to be written over the SMBus to reenable the
charger.
Adaptive System Current-Limit Comparator Threshold. This pin connects to the inverting input of a
comparator. The noninverting input of the comparator is the IINP input, while the output is driving
20 ITHR
the ADAPTLIM open drain. When the input to ITHR is greater than IINP, the ADAPTLIM output is
high.
4.096V Internal Reference Voltage; No External Load Allowed. Bypass to analog ground using a 1FF
21 VAA
or greater ceramic capacitor.
Circuitry Supply-Voltage Input. Connect to LDO through 10I and bypass with a 0.1FF capacitor to
22 VCC
GND as close as possible to the package pin.
23 GND Analog Ground
Enable/Disable Charger Operation. This disables the charger and associated circuitry when EN
24 EN goes low and is in addition to the ACOK charger enable. If the adapter is absent and EN is pulled
up to a voltage higher than 2.4V, the battery-discharge current monitor on IINP is enabled.
— EP Exposed Pad. Connect backside exposed pad to power ground.
______________________________________________________________________________________ 13
High-Frequency,
Low-Cost SMBus Chargers
MAX17035/MAX17435/MAX17535
Q1B
RS1
10mI SYSTEM LOAD
ADAPTER N3 Q1A
R9 C6
R17 10nF R18
R9 103kI R4
10I 1kI
2MI 150kI
CIN
N4
C10
1FF DCIN PDSL CSSP CSSN
BST
C4 C IN = 2 x 4.7FF
GND 0.1FF C OUT = 4.7FF
ACIN DHI N1 L1 = 2FH
R10
10kI LX
DLO N2 L1
ACOK ACOK
PGND PAD
R5
10kI
LDO
MAX17035
LDO RS2
C1 CSIP 10mI
1FF
CSIN
R16
VAA BATT
10I
C3 CC COUT
1FF C5
GND 0.01FF BATTERY
LDO
14
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High-Frequency,
Low-Cost SMBus Chargers
MAX17035/MAX17435/MAX17535
IINP PGND LDO BST DHI LX LDO DLO PGND
DCIN ADAPTER
5.4V PRESENT
REGULATOR
HIGH-SIDE LOW-SIDE
CSIN DRIVER DRIVER
CSSP
CURRENT-
A = 20V/V SENSE
AMPLIFIER BATTERY
CSSN GMS EN
ACOVP DC-DC
IN_SET CHARGE CONVERTER
VOLTAGE()
DCIN
+200mV
4.096V
VAA
REFERENCE MAX17035 AC_EN ZCMP
BDIV
BATT
LVC AND CAP
GMV SWITCH LOGIC ADAPTLIM
CHG_EN
IINP
The MAX17035/MAX17435/MAX17535 control input and clamps the other control loops to within 0.3V above
current (CCS control loop), charge current (CCI control the control point. Clamping the other two control loops
loop), or charge voltage (CCV control loop), depending close to the lowest control loop ensures fast transition
on the operating condition. The three control loops, with minimal overshoot when switching between different
CCV, CCI, and CCS, are brought together internally at control loops (see the Compensation section). The
the lowest voltage clamp (LVC) amplifier. The output of CCI loop is internally compensated and the CCV and
the LVC amplifier is the feedback control signal for the CCS loops share a common compensation network at
DC-DC controller. The minimum voltage at the CCV, CC. The dominant control loop (CCV, CCS) drives the
CCI, or CCS appears at the output of the LVC amplifier compensation network.
______________________________________________________________________________________ 15
High-Frequency,
Low-Cost SMBus Chargers
Table 1. EN Pin Function
MAX17035/MAX17435/MAX17535
16
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High-Frequency,
Low-Cost SMBus Chargers
Figures 4 and 5 show the timing diagrams for signals on sampled on the rising edge of SCL. Nine clock cycles are
MAX17035/MAX17435/MAX17535
the SMBus interface. The address byte, command byte, required to transfer each byte in or out of the MAX17035/
and data bytes are transmitted between the START and MAX17435/MAX17535 because either the master or the
STOP conditions. The SDA state is allowed to change slave acknowledges the receipt of the correct byte during
only while SCL is low, except for the START and STOP the ninth clock. The MAX17035/MAX17435/MAX17535
conditions. Data is transmitted in 8-bit bytes and is support the charger commands as described in Table 4.
a) Write-Word Format
SLAVE COMMAND LOW DATA HIGH DATA
S W ACK ACK ACK ACK P
ADDRESS BYTE BYTE BYTE
7 bits 1b 1b 8 bits 1b 8 bits 1b 8 bits 1b
MSB LSB 0 0 MSB LSB 0 MSB LSB 0 MSB LSB 0
PRESET TO Relearn () = 0x3D D7 D0 D15 D8
0b0001001 ChargingCurrent() = 0x14
ChargerVoltage() = 0x15
b) Read-Word Format
SLAVE COMMAND SLAVE LOW DATA HIGH DATA
S W ACK ACK S R ACK ACK NACK P
ADDRESS BYTE ADDRESS BYTE BYTE
7 bits 1b 1b 8 bits 1b 7 bits 1b 1b 8 bits 1b 8 bits 1b
MSB LSB 0 0 MSB LSB 0 MSB LSB 1 0 MSB LSB 0 MSB LSB 1
PRESET TO INP_Voltage () = 0x3E PRESET TO D7 D0 D15 D8
0b0001001 0b0001001
LEGEND:
S = START CONDITION OR REPEATED START CONDITION P = STOP CONDITION
ACK = ACKNOWLEDGE (LOGIC-LOW) NACK = NOT ACKNOWLEDGE (LOGIC-HIGH)
W = WRITE BIT (LOGIC-LOW) R = READ BIT (LOGIC-HIGH)
MASTER TO SLAVE
SLAVE TO MASTER
A B C D E F G H I J K L M
tLOW tHIGH
SMBCLK
SMBDATA
A = START CONDITION F = ACKNOWLEDGE BIT CLOCKED INTO MASTER J = ACKNOWLEDGE CLOCKED INTO MASTER
B = MSB OF ADDRESS CLOCKED INTO SLAVE G = MSB OF DATA CLOCKED INTO SLAVE K = ACKNOWLEDGE CLOCK PULSE
C = LSB OF ADDRESS CLOCKED INTO SLAVE H = LSB OF DATA CLOCKED INTO SLAVE L = STOP CONDITION, DATA EXECUTED BY SLAVE
D = R/W BIT CLOCKED INTO SLAVE I = SLAVE PULLS SMBDATA LINE LOW M = NEW START CONDITION
E = SLAVE PULLS SMBDATA LINE LOW
______________________________________________________________________________________ 17
High-Frequency,
Low-Cost SMBus Chargers
MAX17035/MAX17435/MAX17535
A B C D E F G H I J K
tLOW tHIGH
SMBCLK
SMBDATA
A = START CONDITION E = SLAVE PULLS SMBDATA LINE LOW I = ACKNOWLEDGE CLOCK PULSE
B = MSB OF ADDRESS CLOCKED INTO SLAVE F = ACKNOWLEDGE BIT CLOCKED INTO MASTER J = STOP CONDITION
C = LSB OF ADDRESS CLOCKED INTO SLAVE G = MSB OF DATA CLOCKED INTO MASTER K = NEW START CONDITION
D = R/W BIT CLOCKED INTO SLAVE H = LSB OF DATA CLOCKED INTO MASTER
18
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Table 4. ChargeVoltage() (0x15)
MAX17035/MAX17435/MAX17535
BIT BIT NAME DESCRIPTION
0 — Not used. Normally a 1mV weight.
1 — Not used. Normally a 2mV weight.
2 — Not used. Normally a 4mV weight.
3 — Not used. Normally an 8mV weight.
0 = Adds 0mV of charger voltage compliance, 4095mV min.
4 Charge Voltage, DACV 0
1 = Adds 16mV of charger voltage compliance.
0 = Adds 0mV of charger voltage compliance, 4095mV min.
5 Charge Voltage, DACV 1
1 = Adds 32mV of charger voltage compliance.
0 = Adds 0mV of charger voltage compliance, 4095mV min.
6 Charge Voltage, DACV 2
1 = Adds 64mV of charger voltage compliance.
0 = Adds 0mV of charger voltage compliance, 4095mV min.
7 Charge Voltage, DACV 3
1 = Adds 128mV of charger voltage compliance.
0 = Adds 0mV of charger voltage compliance, 4095mV min.
8 Charge Voltage, DACV 4
1 = Adds 256mV of charger voltage compliance.
0 = Adds 0mV of charger voltage compliance, 4095mV min.
9 Charge Voltage, DACV 5
1 = Adds 512mV of charger voltage compliance.
0 = Adds 0mA of charger voltage compliance, 4095mV min.
10 Charge Voltage, DACV 6
1 = Adds 1024mV of charger voltage compliance.
0 = Adds 0mV of charger voltage compliance, 4095mV min.
11 Charge Voltage, DACV 7
1 = Adds 2048mV of charger voltage compliance.
0 = Adds 0mV of charger voltage compliance.
12 Charge Voltage, DACV 8
1 = Adds 4096mV of charger voltage compliance.
0 = Adds 0mV of charger voltage compliance.
13 Charge Voltage, DACV 9
1 = Adds 8192mV of charger voltage compliance.
0 = Adds 0mV of charger voltage compliance.
14 Charge Voltage, DACV 10
1 = Adds 16384mV of charger voltage compliance, 19200mV max.
15 — Not used. Normally a 32768mV weight.
______________________________________________________________________________________ 19
High-Frequency,
Low-Cost SMBus Chargers
Table 5. ChargeCurrent() (0x14) (10mI Sense Resistor, RS2) (continued)
MAX17035/MAX17435/MAX17535
Setting Input-Current Limit The total input current can be estimated as follows:
System current normally fluctuates as portions of the IINPUT = I SYSTEM + I CHARGER +
system are powered up or put to sleep. By using the input-
current-limit circuit, the output-current requirement of the [(I CHARGE × VBATTERY ) (VIN × η)]
AC wall adapter can be lowered, reducing system cost.
where E is the efficiency of the DC-DC converter (typically
The total input current is the sum of the system supply 85% to 95%).
current, the charge current flowing into the battery, and
the current required by the charger. When the input To set the input current limit, issue the SMBus command
current exceeds the input current limit set with the InputCurrent() using the 16-bit data format listed in
InputCurrent() command, the MAX17035/MAX17435/ Table 6. The InputCurrent() command uses the write-
MAX17535 reduce the charge current to provide priority word protocol (see Figure 3). The command code for
to system load current. As the system supply current InputCurrent() is 0x3F (0b00111111). When RS1 = 10mI,
increases, the charge current is reduced as needed the MAX17035/MAX17435/MAX17535 provide an input
to maintain the total input current at the input current current-limit range of 256mA to 11.004A with 256mA
limit. The MAX17035/MAX17435/MAX17535 decrease resolution. If a resistor RS other than 10mI is used, the
the charge current to zero, if necessary, to reduce the input current limit is scaled by a factor of 10mI/RS1.
input current to the input current limit. Thereafter, if the InputCurrent() settings from 1mA to 128mA result in a
system current continues to increase, there is nothing the current limit of 128mA. Upon reset, the input current limit
MAX17035/MAX17435/MAX17535 can do to maintain the is 128mA.
input current at the input current limit. If the system current Setting Relearn Voltage
continues to increase the total input current can increase To set the relearn voltage issue, the SMBus command
until the ACOCP threshold (which is 1.3 x maximum RelearnVoltage() uses the 16-bit data format listed in
DAC setting) is reached and the MAX17035/MAX17435/ Table 7. The RelearnVoltage() command uses the
MAX17535 drive PDSL low to remove the input voltage. write-word and read-word protocols (see Figure 3).
The MAX17035/MAX17435/MAX17535 wait 0.6s and The command code for RelearnVoltage() is 0x3D
then try to charge again; after a 16ms blanking period if (0b00111101). The MAX17035/MAX17435/MAX17535
the current is again over the ACOCP threshold, it again provide a charge-voltage range of 4.095V to 19.200V
opens up the input voltage. It goes through this cycle with 16mV resolution. When the relearn function is
three times; after three times, the MAX17035/MAX17435/ enabled by setting bit 0 to 1, the PDSL pin switches off
MAX17535 wait for the adapter voltage to be removed the input-voltage FET and switches on the battery FET,
and reinserted before it reconnects the input voltage. enabling discharging of the battery. The battery voltage
is monitored until the battery voltage reaches the relearn
voltage and thus a known low state of charge. The PDSL
state is then reset to allow charging and bit 0 is set to zero.
20
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Table 6. InputCurrent() (0x3F) (10mI Sense Resistor, RS1)
MAX17035/MAX17435/MAX17535
BIT BIT NAME DESCRIPTION
0 — Not used. Normally a 2mA weight.
1 — Not used. Normally a 4mA weight.
2 — Not used. Normally an 8mA weight.
3 — Not used. Normally a 16mA weight.
4 — Not used. Normally a 32mA weight.
5 — Not used. Normally a 64mA weight.
6 — Not used. Normally a 128mA weight.
0 = Adds 0mA of input current compliance.
7 Input Current, DACS 0
1 = Adds 256mA of input current compliance.
0 = Adds 0mA of input current compliance.
8 Input Current, DACS 1
1 = Adds 512mA of input current compliance.
0 = Adds 0mA of input current compliance.
9 Input Current, DACS 2
1 = Adds 1024mA of input current compliance.
0 = Adds 0mA of input current compliance.
10 Input Current, DACS 3
1 = Adds 2048mA of input current compliance.
0 = Adds 0mA of input current compliance.
11 Input Current, DACS 4
1 = Adds 4096mA of input current compliance.
0 = Adds 0mA of input current compliance.
12 Input Current, DACS 5
1 = Adds 8192mA of input current compliance, 11004mA max.
13 — Not used. Normally a 16384mA weight.
14 — Not used. Normally a 32768mA weight.
15 — Not used. Normally a 65536mA weight.
______________________________________________________________________________________ 21
High-Frequency,
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MAX17035/MAX17435/MAX17535
22
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Table 8. IINPVoltage() (0x3E) (continued)
MAX17035/MAX17435/MAX17535
BIT BIT NAME DESCRIPTION
0 = Adds 0mV of IINP voltage.
11 IINP Voltage, DACV 6
1 = Adds 819.2V of IINP voltage to a maximum of 2.20V.
0 = Adds 0mV of IINP voltage.
12 IINP Voltage, DACV 7
1 = Adds 1.6384V of IINP voltage to a maximum of 2.20V.
13 — Not used. Normally a 8192mV weight.
14 — Not used. Normally a 16384mV weight.
15 — Not used. Normally a 32768mV weight.
______________________________________________________________________________________ 23
High-Frequency,
Low-Cost SMBus Chargers
must be high, MAX must be low, and OVP must be low for Compensation
MAX17035/MAX17435/MAX17535
the controller to initiate a new cycle. If the peak inductor The CCI loop is internally compensated. The CCV and
current exceeds IMAX comparator threshold or the output the CCS share the external compensation capacitor.
voltage exceeds the OVP threshold, then the on-time is The control loop, which is dominant, uses the external
terminated. The cycle-by-cycle current limit effectively compensation cap and the one that is not used uses an
protects against overcurrent and short-circuit faults. internal compensation capacitor.
If during the off-time the inductor current goes to zero,
CCV Loop Compensation
the ZCMP comparator output pulls high, turning off the
The simplified schematic in Figure 6 is sufficient to
low-side MOSFET. Both the high- and low-side MOSFETs
describe the operation of the MAX17035/MAX17435/
are turned off until another cycle is ready to begin.
MAX17535 when the voltage loop (CCV) is in control.
The MAX17035/MAX17435/MAX17535 enter into the
The required compensation network is a pole-zero pair
discontinuous conduction mode (see the Discontinuous
formed with CCV and RCV, which is an internal 1.7kI. The
Conduction section).
pole is necessary to roll off the voltage loop’s response
The on-time is calculated according to the following at low frequency; CCV = 330pF is sufficient for most
equation: applications.
L × IRIPPLE
t ON =
VCSSN - VBATT
where: BATT
GMOUT
V ×t
IRIPPLE = BATT OFF RESR RL
L
COUT
There is a 0.3Fs minimum off-time when the (VDCIN - CCV
VBATT) differential becomes too small. If VBATT R 0.88 GMV
x VDCIN, then the threshold for minimum off-time is
RCV ROGMV
reached and the off-time is fixed at 0.27Fs. The switching
frequency in this mode varies according to the equation: CCV
REF
1
f=
L × IRIPPLE
+ t OFF
VCSSN - VBATT
Figure 6. CCV Loop Diagram
Discontinuous Conduction
The MAX17035/MAX17435/MAX17535 can also operate MOSFET Drivers
in discontinuous conduction mode to ensure that the The DHI and DLO outputs are optimized for driving
inductor current is always positive. The MAX17035/ moderate-sized power MOSFETs. The MOSFET drive
MAX17435/MAX17535 enter discontinuous conduction capability is the same for both the low-side and high-
mode when the output of the LVC control point falls below sides switches. This is consistent with the variable duty
150mV. For RS2 = 10mI, this corresponds to 375mA: factor that occurs in the notebook computer environment
where the battery voltage changes over a wide range.
150mV There must be a low-resistance, low-inductance path
IDIS = 1 × = 375mA from the DLO driver to the MOSFET gate to prevent shoot-
2 20 × RS2
through. Otherwise, the sense circuitry in the MAX17035/
where charge current for RS2 = 10mI. MAX17435/MAX17535 interprets the MOSFET gate as
In discontinuous mode, a new cycle is not started until off while there is still charge left on the gate. Use very
the LVC voltage rises above 150mV. Discontinuous short, wide traces measuring 10 squares to 20 squares
mode operation can occur during conditioning charge of or less (1.25mm to 2.5mm wide if the MOSFET is 25mm
overdischarged battery packs, when the charge current from the device). Unlike the DLO output, the DHI output
has been reduced sufficiently by the CCS control loop, uses a 50ns (typ) delay time to prevent the low-side
or when the charger is in constant-voltage mode with a MOSFET from turning on until DHI is fully off. The same
nearly full battery pack. considerations should be used for routing the DHI signal
to the high-side MOSFET.
24
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The high-side driver (DHI) swings from LX to 5V above LX Generally, a small high-side MOSFET is desired to
MAX17035/MAX17435/MAX17535
(BST) and has a typical impedance of 1.5I sourcing and reduce switching losses at high input voltages. However,
0.8I sinking. The low-side driver (DLO) swings from DLOV the RDS(ON) required to stay within package power-
to ground and has a typical impedance of 3I sinking and dissipation limits often limits how small the MOSFET can
3I sourcing. This helps prevent DLO from being pulled be. The optimum occurs when the switching (AC) losses
up when the high-side switch turns on due to capacitive equal the conduction (RDS(ON)) losses. Switching losses
coupling from the drain to the gate of the low-side MOSFET. in the high-side MOSFET can become an insidious
This places some restrictions on the MOSFETs that can be heat problem when maximum AC adapter voltages are
used. Using a low-side MOSFET with smaller gate-to-drain applied, due to the squared term in the CV2 f switching-
capacitance can prevent these problems. loss equation. If the high-side MOSFET that was chosen
for adequate RDS(ON) at low supply voltages becomes
Design Procedure extraordinarily hot when subjected to VIN(MAX), then
choose a MOSFET with lower losses. Calculating the
MOSFET Selection power dissipation in M1 due to switching losses is
Choose the n-channel MOSFETs according to the maxi- difficult since it must allow for difficult quantifying factors
mum required charge current. Low-current applications that influence the turn-on and turn-off times. These
usually require less attention. The high-side MOSFET factors include the internal gate resistance, gate charge,
(N1) must be able to dissipate the resistive losses plus threshold voltage, source inductance, and PCB layout
the switching losses at both VDCI;MIN) and VDCIN(MAX). characteristics. The following switching-loss calculation
Calculate both these sums. provides only a very rough estimate and is no substitute
Ideally, the losses at VDCIN(MIN) should be roughly equal for breadboard evaluation, preferably including a
to losses at VDCIN(MAX) with lower losses in between. If verification using a thermocouple mounted on N1:
the losses at VDCIN(MIN) are significantly higher than the
losses at VDCIN(MAX), consider increasing the size of M1. VDCIN(MAX) 2 × C RSS × fSW × ILOAD
PD(HS_Switching) =
Conversely, if the losses at VDCIN(MAX) are significantly 2 × IGATE
higher than the losses at VIN(MIN), consider reducing the
size of M1. If DCIN does not vary over a wide range, the where CRSS is the reverse transfer capacitance of N1
minimum power dissipation occurs where the resistive and IGATE is the peak gate-drive source/sink current
losses equal the switching losses. Choose a low-side (3.3A sourcing and 5A sinking).
MOSFET that has the lowest possible on-resistance For the low-side MOSFET (N2), the worst-case power
(RDS(ON)), comes in a moderate-sized package (i.e., one dissipation always occurs at maximum input voltage:
or two 8-pin SO, DPAK, or D2 PAK), and is reasonably 2
priced. Make sure that the DLO gate driver can supply V I
PD(Low - Side) = 1- BATT LOAD × R DS(ON)
sufficient current to support the gate charge and the VDCIN 2
current injected into the parasitic gate-to-drain capacitor
caused by the high-side MOSFET turning on; otherwise, Inductor Selection
cross-conduction problems can occur. Select devices The charge current, ripple, and operating frequency
that have short turn-off times, and make sure that: (off-time) determine the inductor characteristics. For
N2(tDOFF(MAX)) - N1(tDON(MIN)) < 40ns, and optimum efficiency, choose the inductance according to
N1(tDOFF(MAX)) - N2(tDON(MIN)) < 40ns the following equation:
Failure to do so could result in efficiency-reducing shoot- L = VBATT O tOFF/(0.3 x ICHG)
through currents. This sets the ripple current to 1/3 the charge current and
results in a good balance between inductor size and
MOSFET Power Dissipation
efficiency. Higher inductor values decrease the ripple
Worst-case conduction losses occur at the duty factor
current. Smaller inductor values require high saturation
extremes. For the high-side MOSFET, the worst-case
current capabilities and degrade efficiency.
power dissipation (PD) due to resistance occurs at the
minimum supply voltage: Inductor L1 must have a saturation current rating of at
least the maximum charge current plus 1/2 the ripple
2
V I current (DIL):
PD(High - Side) = BATT LOAD × R DS(ON)
VDCIN 2 ISAT = ICHG + (1/2) DIL
______________________________________________________________________________________ 25
High-Frequency,
Low-Cost SMBus Chargers
The ripple current is determined by: Applications Information
MAX17035/MAX17435/MAX17535
26
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Ideally, surface-mount power components are flush ground island need not be very large. When placed on
MAX17035/MAX17435/MAX17535
against one another with their ground terminals almost an inner layer, a sizable ground island can help simplify
touching. These high-current grounds are then con- the layout because the low current connections can be
nected to each other with a wide, filled zone of top-layer made through vias. The ground pad on the backside
copper, so they do not go through vias. The resulting of the package should also be connected to this quiet
top-layer subground plane is connected to the normal ground island.
inner-layer ground plane at the paddle. Other high- Keep the gate drive traces (DHI and DLO) as short as
current paths should also be minimized, but focusing possible (L < 20mm), and route them away from the
primarily on short ground and current-sense connections current-sense lines and REF. These traces should also
eliminates about 90% of all PCB layout problems. be relatively wide (W > 1.25mm).
Place the IC and signal components. Keep the main Place ceramic bypass capacitors close to the IC. The
switching node (LX node) away from sensitive analog bulk capacitors can be placed further away. Place the
components (current-sense traces and REF capacitor). current-sense input filter capacitors under the part,
Important: The IC must be no further than 10mm from connected directly to the GND pin.
the current-sense resistors. Quiet connections to REF, Use a single-point star ground placed directly below the
CCV, CCI, ACIN, and DCIN should be returned to a part at the PGND pin. Connect the power ground (ground
separate ground (GND) island. The appropriate traces plane) and the quiet ground island at this location.
are marked on the schematic with the () ground symbol.
There is very little current flowing in these traces, so the Refer to the MAX17035 EV kit layout for a layout example.
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Maxim reserves the right to change the circuitry and specifications without notice at any time.
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