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Cm300du 12nfh e
Cm300du 12nfh e
CM300DU-12NFH
HIGH POWER SWITCHING USE
CM300DU-12NFH
APPLICATION
High frequency switching use (30kHz to 60kHz).
Gradient amplifier, Induction heating, power supply, etc.
TC measured point
108
(7.5) 93 ±0.25 (7.5)
14 14 14
C2E1 E2 C1E2 G2
E2 G2
G1 E1
48 ±0.25
(8.25)
15
62
CM
G1 E1
17.5 6
CIRCUIT DIAGRAM
(18)
8.85
(7)
C2E1 E2 C1
25 25 21.5 2.5
3-M6 NUTS
25.7
4-φ6. 5 MOUNTING HOLES
4 0.5 0.5
18 7 18 7 18 2.8 0.5 0.5
7.5
8.5
29 +1.0
–0.5
LABEL
22
Feb. 2009
MITSUBISHI IGBT MODULES
CM300DU-12NFH
HIGH POWER SWITCHING USE
Limits
Symbol Parameter Test conditions Unit
Min. Typ. Max.
ICES Collector cutoff current VCE = VCES, VGE = 0V — — 1 mA
Feb. 2009
2
MITSUBISHI IGBT MODULES
CM300DU-12NFH
HIGH POWER SWITCHING USE
PERFORMANCE CURVES
COLLECTOR-EMITTER SATURATION
OUTPUT CHARACTERISTICS VOLTAGE CHARACTERISTICS
(TYPICAL) (TYPICAL)
600 3
11 10 Tj = 25°C
15 9
500 2.5
COLLECTOR-EMITTER
VGE =
20V
400 8.5 2
8
300 1.5
200 7.5 1
Tj = 25°C 7
4.5
5
EMITTER CURRENT IE (A)
4
COLLECTOR-EMITTER
3
3.5
2
3
IC = 600A
2.5 102
IC = 300A 7
2
5
1.5 IC = 120A
3
1
2 Tj = 25°C
0.5
Tj = 125°C
0 101
6 8 10 12 14 16 18 20 0 0.5 1 1.5 2 2.5 3
CAPACITANCE–VCE HALF-BRIDGE
CHARACTERISTICS SWITCHING CHARACTERISTICS
(TYPICAL) (TYPICAL)
102 103
7
CAPACITANCE Cies, Coes, Cres (nF)
5 7
Cies
3 5 td(off)
SWITCHING TIME (ns)
2 td(on)
3
101 2
7
5 tf
3 102 tr
2 Coes 7
Conditions:
100 5
VCC = 300V
7 Cres
5 3 VGE = ±15V
3 RG = 4.2Ω
2
2 Tj = 125°C
VGE = 0V Inductive load
10–1 –1 101 1
10 2 3 5 7 100 2 3 5 7 101 2 3 5 7 102 10 2 3 5 7 102 2 3 5 7 103
Feb. 2009
3
MITSUBISHI IGBT MODULES
CM300DU-12NFH
HIGH POWER SWITCHING USE
TRANSIENT THERMAL
REVERSE RECOVERY CHARACTERISTICS IMPEDANCE CHARACTERISTICS
OF FREE-WHEEL DIODE (IGBT part )
(TYPICAL)
10–3 2 3 5 710–2 2 3 5 710–1 2 3 5 7 100 2 3 5 7 101
REVERSE RECOVERY CURRENT lrr (A)
103 100
REVERSE RECOVERY TIME trr (ns)
7 7
NORMALIZED TRANSIENT
5
3 TC = 25°C
2
3
2 10–1 10–1
7 7
Irr 5 5
102 trr 3 3
7 2 2
5
Conditions:
VCC = 300V 10–2 10–2
7 7
3 VGE = ±15V 5 5
2
RG = 4.2Ω 3 3
Tj = 25°C 2
Per unit base = 2
Inductive load Rth(j–c) = 0.16K/W
101 1 10–3 10–3
10 2 3 5 7 102 2 3 5 7 103 10–5 2 3 5 710–4 2 3 5 7 10–3
TRANSIENT THERMAL
IMPEDANCE CHARACTERISTICS GATE CHARGE
(FWDi part) CHARACTERISTICS
10–3 2 3 5 710–2 2 3 5 710–1 2 3 5 7 100 2 3 5 7 101 (TYPICAL)
100 20
7 IC = 300A
GATE-EMITTER VOLTAGE VGE (V)
THERMAL IMPEDANCE Zth (j–c)
5 Single Pulse
NORMALIZED TRANSIENT
3 TC = 25°C 16
2 VCC = 200V
10–1 10–1
7 7 VCC = 300V
12
5 5
3 3
2 2
8
10–2 10–2
7 7
5 5
4
3 3
2
Per unit base = 2
Rth(j–c) = 0.24K/W
10–3 10–3 0
10–5 2 3 5 710–4 2 3 5 7 10–3 0 500 1000 1500 2000 2500
Feb. 2009
4
Important Notice
The information contained in this datasheet shall in no event be regarded as a guarantee of conditions or
characteristics. This product has to be used within its specified maximum ratings, and is subject to customer’s
compliance with any applicable legal requirement, norms and standards.
Except as otherwise explicitly approved by Mitsubishi Electric Corporation in a written document signed by
authorized representatives of Mitsubishi Electric Corporation, our products may not be used in any
applications where a failure of the product or any consequences of the use thereof can reasonably be
expected to result in personal injury.
In usage of power semiconductor, there is always the possibility that trouble may occur with them by the
reliability lifetime such as Power Cycle, Thermal Cycle or others, or when used under special circumstances
(e.g. condensation, high humidity, dusty, salty, highlands, environment with lots of organic matter / corrosive
gas / explosive gas, or situations which terminals of semiconductor products receive strong mechanical
stress). Therefore, please pay sufficient attention to such circumstances. Further, depending on the technical
requirements, our semiconductor products may contain environmental regulation substances, etc. If there is
necessity of detailed confirmation, please contact our nearest sales branch or distributor.
The contents or data contained in this datasheet are exclusively intended for technically trained staff.
Customer's technical departments should take responsibility to evaluate the suitability of Mitsubishi Electric
Corporation product for the intended application and the completeness of the product data with respect to
such application. In the customer's research and development, please evaluate it not only with a single
semiconductor product but also in the entire system, and judge whether it's applicable. As required, pay close
attention to the safety design by installing appropriate fuse or circuit breaker between a power supply and
semiconductor products to prevent secondary damage. Please also pay attention to the application note and
the related technical information.
Keep safety first in your circuit designs!
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more
reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may
lead to personal injury, fire or property damage. Remember to give due consideration to safety when making
your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use
of non-flammable material or (iii) prevention against any malfunction or mishap.