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UFI Software version 1.6.0.

2333
Whats new:
General changes:
BUGFIX: Revised Dark Mode UI support
BUGFIX: Minor bugfixes and improvements
eMMC ToolBox changes:
ADD: Special Task in Programming Tab
- Update eMMC5x Firmware
Standardized Firmware update method for eMMC 5.x
- Secure Wipe(TRIM, Sanitize)
- [moviNAND] eMMC Full Reset (Reset RPMB, ECC error, Factory Reset)
- [moviNAND] Force boot mode (erase firmware)
ADD: BOOT_SIZE entry on EMMC PARTITIONING tab (For Micron eMMC)
BUGFIX: Revised eMMC Fw routine
BUGFIX: Minor bugfixes and improvements
----------------------------------------------------
Connection status: XHCI:HUB3:HUB3[#1]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-4228
Boot version: 1.04, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 4 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0xED93DAB7
Manufacturing date: May 2019
CID: 15010033 5636434D 4202ED93 DAB756B8
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
Firmware version: 0x02
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB [Provisioned, counter: 112604]
User area: 116.48 GiB(125,069,950,976 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Secure Feature support: 0x55
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
ANDROID System Info:
platform: sdm710, cpu abi: arm64-v8a
manufacturer: Realme
board: sdm710, name: RMX1851
brand: Realme, model: RMX1851
build model list: RMX1851, RMX1851, RMX1853, RMX1855, RMX1851, RMX1851
build id: PKQ1.190101.001, version: 9 [Pie] (RMX1851EX_11_A.10)
build description: sdm710-user 9 PKQ1.190101.001 eng.root.20190408.232206 release-
keys
crypto state: encrypted?
crypto state: encrypted?
EXT_CSD backup saved to "\\%BACKUPS%\3V6CMB_ED93DAB7.ext_csd"
eMMC selected: [SAMSUNG] KM3V6001CM-B705/128GB (BGA254)
+++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
UFI software version: 1.5.0.2015
Official website:
https://www.ufi-box.com
Official support forums:
https://www.ufixers.com
https://www.martview-forum.com/forums/ufi-box-dongle.183
Official facebook page:
https://www.facebook.com/ufiboxdongle
Official youtube channel:
https://www.youtube.com/ufixers
System info:
Processor: Intel(R) Core(TM) i5 CPU 760 2.81 GHz (4 CPUs)
Installed RAM: 3.99 GiB (65 % free)
OS: Windows 10 Professional (Build 18362, Version: 1909, 64-bit)
Storage:
Disk space: 238.47 GiB (206.45 GiB available)
Disk space(firmware packages): 3.64 TiB (170.81 GiB available)
Loaded drivers:
[Microsoft] WINUSB, version: 1.1.0.0, date: 8-30-2012

Please "Identify eMMC" at first, before any other operation.


Connection status: XHCI:HUB3:HUB3[#1]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-4228
Boot version: 1.04, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0xED93DAB7
Manufacturing date: May 2019
CID: 15010033 5636434D 4202ED93 DAB756B8
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB [Provisioned, counter: 112604]
User area: 116.48 GiB(125,069,950,976 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KM3V6000CM-BXXX/128G
Connection status: XHCI:HUB3:HUB3[#1]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-4228
Boot version: 1.04, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0xED93DAB7
Manufacturing date: May 2019
CID: 15010033 5636434D 4202ED93 DAB756B8
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB [Provisioned, counter: 112604]
User area: 116.48 GiB(125,069,950,976 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KM3V6000CM-BXXX/128G
Connection status: XHCI:HUB3:HUB3[#1]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-4228
Boot version: 1.04, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0xED93DAB7
Manufacturing date: May 2019
CID: 15010033 5636434D 4202ED93 DAB756B8
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB [Provisioned, counter: 112604]
User area: 116.48 GiB(125,069,950,976 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KM3V6000CM-BXXX/128G
+++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
UFI software version: 1.4.0.1464
ldr [winscard] -> 0
Official website:
https://www.ufi-box.com
Official support forum:
https://www.ufixers.com
https://www.martview-forum.com/forums/ufi-box-dongle.183
Official facebook page:
https://www.facebook.com/ufiboxdongle
System info:
Processor: Intel(R) Core(TM) i5 CPU 760 2.81 GHz (4 CPUs)
Installed RAM: 3.99 GiB (64 % free)
OS: Windows 10 Professional (Version 10.0, Build 18362, 64-bit)
Storage:
Disk space: 238.47 GiB (206.53 GiB available)
Disk space(firmware packages): 3.64 TiB (170.81 GiB available)
Loaded drivers:
[Microsoft] WINUSB, version: 1.1.0.0, date: 8-30-2012
ldr [bxapp] -> 32

Please "Identify eMMC" at first, before any other operation.


----------------------------------------------------
UFI Software version 1.4.0.1464
Whats new:
!!! WARNING: Do not rename "BRAND" and "MODEL" list to be different as at support
site, certain features might not working properly !!!
General changes:
Introducing UFIBox firmware version 1.13
Latest firmware for supported models (Nokia, Meizu, Xiaomi, Oppo, Vivo and others)
was uploaded to support servers
Remapped [USB] Device Manager toolbox menu
Revised upgrade firmware routine for boxed with new hardware version
eMMC ToolBox changes:
ADD: Improved reading system information for Android with Project Treble and
Android A/B system
BUGFIX: Handing extracted OFP files
WARNING: Extracted OFP firmwares is still encrypted and can only
be used from within the UFI Software(including eMMC ToolBox)
Always use self extracted firmware image from OFP file, never use
firmware extracts downloaded from internet that are known to have been extracted
using UFI software
Using this fimware with other tools may result in bricked
devices !!!
BUGFIX: Minor bugfixes and improvements
----------------------------------------------------
Connection status: XHCI:HUB3:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-4228
Boot version: 1.04, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0xED93DAB7
Manufacturing date: May 2019
CID: 15010033 5636434D 4202ED93 DAB756B8
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: sdm710, cpu abi: arm64-v8a
manufacturer: Realme
board: sdm710, name: RMX1851
brand: Realme, model: RMX1851
build model list: RMX1851, RMX1853, RMX1855
build id: PKQ1.190101.001, version: 9 Pie (RMX1851EX_11_A.10)
build description: sdm710-user 9 PKQ1.190101.001 eng.root.20190408.232206 release-
keys
crypto state: encrypted?
crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KM3V6000CM-BXXX/128G
Connection status: XHCI:HUB3:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-4228
Boot version: 1.04, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0xED93DAB7
Manufacturing date: May 2019
CID: 15010033 5636434D 4202ED93 DAB756B8
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)
Factory Reset...
Creating filesystem with parameters:
Size: 268435456
Block size: 4096
Blocks per group: 32768
Inodes per group: 8192
Inode size: 256
Journal blocks: 1024
Label:
Blocks: 65536
Block groups: 2
Reserved block group size: 15
Created filesystem with 13/16384 inodes and 2091/65536 blocks
Writing cache... Done.
Creating filesystem with parameters:
Size: 116133834752
Block size: 4096
Blocks per group: 32768
Inodes per group: 8192
Inode size: 256
Journal blocks: 32768
Label:
Blocks: 28352987
Block groups: 866
Reserved block group size: 1024
Created filesystem with 11/7094272 inodes and 493375/28352987 blocks
Writing userdata... Unknown chunk type 0x0000 at 0x00E160C4
Wrote 30273510 blocks, expected to write 28352987 blocks
Done.
Done.
Connection status: XHCI:HUB3:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-4228
Boot version: 1.04, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0xED93DAB7
Manufacturing date: May 2019
CID: 15010033 5636434D 4202ED93 DAB756B8
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KM3V6000CM-BXXX/128G
Connection status: XHCI:HUB3:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-4228
Boot version: 1.04, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0xED93DAB7
Manufacturing date: May 2019
CID: 15010033 5636434D 4202ED93 DAB756B8
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KM3V6000CM-BXXX/128G
Connection status: XHCI:HUB3:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-4228
Boot version: 1.04, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0xED93DAB7
Manufacturing date: May 2019
CID: 15010033 5636434D 4202ED93 DAB756B8
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: sdm710, cpu abi: arm64-v8a
manufacturer: Realme
board: sdm710, name: RMX1851
brand: Realme, model: RMX1851
build model list: RMX1851, RMX1853, RMX1855
build id: PKQ1.190101.001, version: 9 Pie (RMX1851EX_11_A.10)
build description: sdm710-user 9 PKQ1.190101.001 eng.root.20190408.232206 release-
keys
Internal storage: 108.16 GiB
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KM3V6000CM-BXXX/128G
Connection status: XHCI:HUB3:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-4228
Boot version: 1.04, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0xED93DAB7
Manufacturing date: May 2019
CID: 15010033 5636434D 4202ED93 DAB756B8
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: sdm710, cpu abi: arm64-v8a
manufacturer: Realme
board: sdm710, name:
brand: , model:
build id: PKQ1.190101.001, version: 9 Pie ()
build description: sdm710-user 9 PKQ1.190101.001 eng.root.20190408.232206 release-
keys
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KM3V6000CM-BXXX/128G
Connection status: XHCI:HUB3:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-4228
Boot version: 1.04, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0xED93DAB7
Manufacturing date: May 2019
CID: 15010033 5636434D 4202ED93 DAB756B8
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: sdm710, cpu abi: arm64-v8a
manufacturer: Realme
board: sdm710, name: RMX1851
brand: Realme, model: RMX1851
build model list: RMX1851, RMX1853, RMX1855
build id: PKQ1.190101.001, version: 9 Pie (RMX1851EX_11_A.10)
build description: sdm710-user 9 PKQ1.190101.001 eng.root.20190408.232206 release-
keys
Internal storage: 108.16 GiB
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KM3V6000CM-BXXX/128G
Connection status: XHCI:HUB3:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-4228
Boot version: 1.04, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0xED93DAB7
Manufacturing date: May 2019
CID: 15010033 5636434D 4202ED93 DAB756B8
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KM3V6000CM-BXXX/128G
Connection status: XHCI:HUB3:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-4228
Boot version: 1.04, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0xED93DAB7
Manufacturing date: May 2019
CID: 15010033 5636434D 4202ED93 DAB756B8
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: sdm710, cpu abi: arm64-v8a
manufacturer: Realme
board: sdm710, name: RMX1851
brand: Realme, model: RMX1851
build model list: RMX1851, RMX1853, RMX1855
build id: PKQ1.190101.001, version: 9 Pie (RMX1851EX_11_A.10)
build description: sdm710-user 9 PKQ1.190101.001 eng.root.20190408.232206 release-
keys
Internal storage: 108.16 GiB
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KM3V6000CM-BXXX/128G
Connection status: XHCI:HUB3:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-4228
Boot version: 1.04, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0xED93DAB7
Manufacturing date: May 2019
CID: 15010033 5636434D 4202ED93 DAB756B8
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KM3V6000CM-BXXX/128G
Connection status: XHCI:HUB3:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-4228
Boot version: 1.04, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0xED93DAB7
Manufacturing date: May 2019
CID: 15010033 5636434D 4202ED93 DAB756B8
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KM3V6000CM-BXXX/128G
Connection status: XHCI:HUB3:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-4228
Boot version: 1.04, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0xED93DAB7
Manufacturing date: May 2019
CID: 15010033 5636434D 4202ED93 DAB756B8
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KM3V6000CM-BXXX/128G
+++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
UFI software version: 1.3.0.1155
ldr [winscard] -> 112
Official website:
https://www.ufi-box.com
Official support forum:
https://www.ufixers.com
System info:
Processor: Intel(R) Core(TM) i5 CPU 760 2.81 GHz (4 CPUs)
Installed RAM: 3.99 GiB (64 % free)
OS: Windows 10 Professional (Version 10.0, Build 18362, 64-bit)
Storage:
Disk space: 238.47 GiB (206.43 GiB available)
Disk space(firmware packages): 3.64 TiB (170.81 GiB available)
Loaded drivers:
[Microsoft] WINUSB, version: 1.1.0.0, date: 8-30-2012
ldr [bxsdk32] -> 48

Please "Identify eMMC" at first, before any other operation.


-------------
UFI Software version 1.3.0.1155
Whats new:
!!! WARNING: Do not rename "BRAND" and "MODEL" list to be different as at support
site, certain features might not working properly !!!
General changes:
Software version numbering changed
ADD: Extract support for RAR5 file format
ADD: System information for Android A/B system is now readed correctly
ADD: Improved reading system information for Android Oreo and Project Treble
system
eMMC ToolBox changes:
ADD: Auto list PIT file inside tar.md5 archive on factory image tab
BUGFIX: Minor bugfixes and improvements
-------------
Connection status: XHCI:HUB3:HUB3:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-4228
Boot version: 1.04, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0xED93DAB7
Manufacturing date: May 2019
CID: 15010033 5636434D 4202ED93 DAB756B8
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KM3V6000CM-BXXX/128G
Connection status: XHCI:HUB3:HUB3:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-4228
Boot version: 1.04, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0xED93DAB7
Manufacturing date: May 2019
CID: 15010033 5636434D 4202ED93 DAB756B8
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KM3V6000CM-BXXX/128G
Connection status: XHCI:HUB3:HUB3:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-4228
Boot version: 1.04, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0xED93DAB7
Manufacturing date: May 2019
CID: 15010033 5636434D 4202ED93 DAB756B8
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KM3V6000CM-BXXX/128G
+++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
UFI software version: 1.3.0.1155
ldr [winscard] -> 224
Official website:
https://www.ufi-box.com
Official support forum:
https://www.ufixers.com
System info:
Processor: Intel(R) Core(TM) i5 CPU 760 2.81 GHz (4 CPUs)
Installed RAM: 3.99 GiB (67 % free)
OS: Windows 10 Professional (Version 10.0, Build 18362, 64-bit)
Storage:
Disk space: 238.47 GiB (206.41 GiB available)
Disk space(firmware packages): 3.64 TiB (170.81 GiB available)
Loaded drivers:
[Microsoft] WINUSB, version: 1.1.0.0, date: 8-30-2012
ldr [bxsdk32] -> 0

Please "Identify eMMC" at first, before any other operation.


-------------
UFI Software version 1.3.0.1155
Whats new:
!!! WARNING: Do not rename "BRAND" and "MODEL" list to be different as at support
site, certain features might not working properly !!!
General changes:
Software version numbering changed
ADD: Extract support for RAR5 file format
ADD: System information for Android A/B system is now readed correctly
ADD: Improved reading system information for Android Oreo and Project Treble
system
eMMC ToolBox changes:
ADD: Auto list PIT file inside tar.md5 archive on factory image tab
BUGFIX: Minor bugfixes and improvements
-------------
Connection status: XHCI:HUB3:HUB3:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-4228
Boot version: 1.04, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0xED93DAB7
Manufacturing date: May 2019
CID: 15010033 5636434D 4202ED93 DAB756B8
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KM3V6000CM-BXXX/128G
Connection status: XHCI:HUB3:HUB3:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-4228
Boot version: 1.04, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0xED93DAB7
Manufacturing date: May 2019
CID: 15010033 5636434D 4202ED93 DAB756B8
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KM3V6000CM-BXXX/128G
+++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
UFI software version: 1.6.0.2333
Official website:
https://www.ufi-box.com
Official support forums:
https://www.ufixers.com
https://www.martview-forum.com/forums/ufi-box-dongle.183
Official facebook page:
https://www.facebook.com/ufiboxdongle
System info:
Processor: Intel(R) Core(TM) i5 CPU 760 2.81 GHz (4 CPUs)
Installed RAM: 3.99 GiB (65 % free)
OS: Windows 10 Professional (Build 18362.329, 19H1(May 2019 Update), 64-bit)
Storage:
Disk space: 238.47 GiB (206.29 GiB available)
Disk space(firmware packages): 3.64 TiB (170.81 GiB available)
Loaded drivers:
[Microsoft] WINUSB, version: 1.1.0.0, date: 8-30-2012

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