Professional Documents
Culture Documents
Housings & Headers
Housings & Headers
TI
R
900
2
HOUSINGS & HEADERS
CE
ISO
Y
T
Q I
UAL
PLUG-IN HOUSINGS
Enhance the appearance and give a professional look to your products using these molded housings. Ideally suited for packaging
relays, logic packages, networks and miniature circuitry. Durable, lightweight covers withstand vibrations and rough usage.
HEADERS: Molded of G.P. black phenolic. Fits standard sockets. PINS: Brass, Nickel Plated.
MATERIAL CHARACTERISTICS:
• Variety of molded materials • Good chemical resistance.
POLYSTYRENE: For general purpose use where high impact strength is not required and temperature would not exceed 170º F.
LEXAN: 3 Times the impact strength of Polystyrene. Excellent electrical properties. Use wherever temperatures of 280º F exist
Housing with
Octal Header Housing Fig.
& 4 Screws Only No. Type Material Color
CAT. NO. CAT. NO.
660 670 1 Mini Lexan Clear
661 671 1 Mini Lexan White
662 672 1 Mini Polystyrene Clear MINI
641 1 Mini Polystyrene Opaque Black SMALL
675
FIG. 3 FIG. 4
FIG. 1 FIG. 2
FIG. 3
31-07 20th Road • Astoria, New York 11105-2017 • (718) 956-8900 • FAX (718) 956-9040
102 e-mail: kec@keyelco.com • WebSite: keyelco.com