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8-Bit Quad Dacpot: Dip Package (P) Soic Package (J)
8-Bit Quad Dacpot: Dip Package (P) Soic Package (J)
FEATURES APPLICATIONS
■ Output settings retained without power ■ Automated product calibration.
■ Output range includes both supply rails ■ Remote control adjustment of equipment
■ 4 independently addressable outputs ■ Offset, gain and zero adjustments in Self-
■ 1 LSB Accuracy Calibrating and Adaptive Control systems.
■ Serial µP interface ■ Tamper-proof calibrations.
DESCRIPTION
The CAT504 is a quad 8-Bit Memory DAC designed as Control of the CAT504 is accomplished with a simple 3
an electronic replacement for mechanical potentiom- wire serial interface. A Chip Select pin allows several
eters and trim pots. Intended for final calibration of CAT504s to share a common serial interface and com-
products such as camcorders, fax machines and cellular munication back to the host controller is via a single
telephones on automated high volume production lines, serial data line thanks to the CAT504’s Tri-Stated Data
it is also well suited for systems capable of self calibra- Output pin.
tion, and applications where equipment which is either
difficult to access or in a hazardous environment, re- The CAT504 operates from a single 3–5 volt power
quires periodic adjustment. supply drawing just a few milliwatts of power. When
storing data in EEPROM memory an additional 20 volt
The 4 independently programmable DAC's have an low current supply is required.
output range which includes both supply rails. Output
settings, stored in non-volatile EEPROM memory, are The CAT504 is available in the 0 to 70° C Commercial
not lost when the device is powered down and are and –40° C to + 85° C Industrial operating temperature
automatically reinstated when power is returned. Each ranges and offered in 14-pin plastic DIP and Surface
output can be dithered to test new output values without mount packages.
effecting the stored settings and stored settings can be
read back without disturbing the DAC’s output.
FUNCTIONAL DIAGRAM PIN CONFIGURATION
VPP VDD VREF H
DIP Package (P) SOIC Package (J)
3 1 14
10
DAC 4 V 4
OUT
SERIAL
DATA 6
DO
OUTPUT
REGISTER
CAT504
8 9
GND VREF L
RELIABILITY CHARACTERISTICS
Symbol Parameter Min Max Units Test Method
VZAP(1) ESD Susceptibility 2000 Volts MIL-STD-883, Test Method 3015
ILTH(1)(2) Latch-Up 100 mA JEDEC Standard 17
NOTES: 1. This parameter is tested initially and after a design or process change that affects the parameter.
2. Latch-up protection is provided for stresses up to 100mA on address and data pins from –1V to VCC + 1V.
DC ELECTRICAL CHARACTERISTICS:
VDD = 2.7V to 5.5V, VREFH = VDD, VREFL = 0V, unless otherwise specified
Logic Inputs
IIH Input Leakage Current VIN = VDD — — 10 µA
IIL Input Leakage Current VIN = 0V — — –10 µA
VIH High Level Input Voltage 2 — VDD V
VIL Low Level Input Voltage 0 — 0.8 V
References
VRH VREFH Input Voltage Range 2.7 — VDD V
VRL VREFL Input Voltage Range GND — VDD -2.7 V
ZIN VREFH–VREFL Resistance — 7k — Ω
Logic Outputs
VOH High Level Output Voltage IOH = – 40 µA VDD –0.3 — — V
VOL Low Level Output Voltage IOL = 1 mA, VDD = +5V — — 0.4 V
IOL = 0.4 mA, VDD = +3V — — 0.4 V
AC ELECTRICAL CHARACTERISTICS:
VDD = 2.7V to 5.5V, VREFH = +VDD, VREFL = 0V, unless otherwise specified
NOTES: 1. All timing measurements are defined at the point of signal crossing VDD / 2.
2. These parameters are periodically sampled and are not 100% tested.
CLK
t CSH Falling CLK edge for last data bit (DI) Min
to falling CS edge
t CSS t CLK L t CSH
A. C. TIMING DIAGRAM
CS
DI
4
t DIH
PROG
t PROG Rising PROG edge to falling PROG Min
edge
t PROG
to 1 2 3 4 5
CAT504
DEVICE OPERATION read to or from the chip, and the Data Output (DO) pin is
The CAT504 is a quad 8-bit Digital to Analog Converter active. Data loaded into the DAC control registers will
(DAC) whose outputs can be programmed to any one of remain in effect until CS goes low. Bringing CS to a logic
256 individual voltage steps. Once programmed, these low returns all DAC outputs to the settings stored in
output settings are retained in non-volatile EEPROM EEPROM memory and switches DO to its high imped-
memory and will not be lost when power is removed from ance Tri-State mode.
the chip. Upon power up the DACs return to the settings
Because CS functions like a reset the CS pin has been
stored in EEPROM memory. Each DAC can be written
equipped with a 30 ns to 90 ns filter circuit to prevent
to and read from independently without effecting the
noise spikes from causing unwanted resets and the loss
output voltage during the read or write cycle. Each
of volatile data.
output can also be temporarily adjusted without chang-
ing the stored output setting, which is useful for testing CLOCK
new output settings before storing them in memory.
The CAT504’s clock controls both data flow in and out of
DIGITAL INTERFACE the IC and EEPROM memory cell programming. Serial
data is shifted into the DI pin and out of the DO pin on the
The CAT504 employs a standard 3 wire serial control
clock’s rising edge. While it is not necessary for the clock
interface consisting of Clock (CLK), Chip Select (CS)
to be running between data transfers, the clock must be
and Data In (DI) inputs. For all operations, address and
operating in order to write to EEPROM memory, even
data are shifted in LSB first. In addition, all digital data
though the data being saved may already be resident in
must be preceded by a logic “1” as a start bit. The DAC
the DAC control register.
address and data are clocked into the DI pin on the
clock’s rising edge. When sending multiple blocks of No clock is necessary upon system power-up. The
information a minimum of two clock cycles is required CAT504’s internal power-on reset circuitry loads data
between the last block sent and the next start bit. from EEPROM to the DACs without using the external
clock.
Multiple devices may share a common input data line by
selectively activating the CS control of the desired IC. As data transfers are edge triggered clean clock transi-
Data Outputs (DO) can also share a common line tions are necessary to avoid falsely clocking data into the
because the DO pin is Tri-Stated and returns to a high control registers. Standard CMOS and TTL logic fami-
impedance when not in use. lies work well in this regard and it is recommended that
any mechanical switches used for breadboarding or
CHIP SELECT
device evaluation purposes be debounced by a flip-flop
Chip Select (CS) enables and disables the CAT504’s or other suitable debouncing circuit.
read and write operations. When CS is high data may be
CS CS
DI 1 A0 A1 D0 D1 D2 D3 D4 D5 D6 D7 DI 1 A0 A1
DO D0 D1 D2 D3 D4 D5 D6 D7 DO D0 D1 D2 D3 D4 D5 D6 D7
PROG PROG
when testing for a new output setting and allows for user NEW DAC DATA
APPLICATION CIRCUITS
+5V +5V
Ri RF
+15V +15V
VDD VREF H VDD VREF H
– VOUT – VOUT
CONTROL CONTROL
& DATA
CAT504
OPT 504 + OP 07 & DATA
CAT504
OPT 504 + OP 07
-15V -15V
GND VREF L GND VREF L
RF
VOUT = (1 + –––) V DAC
VOUT = VDAC RI
RC V OFFSET
COARSE ADJUST +
DAC GND VREF L
+V
– Ro VOFFSET
-VREF +
GND VREF L
–
-V
Coarse-Fine Offset Control by Averaging DAC Outputs Coarse-Fine Offset Control by Averaging DAC Outputs
for Single Power Supply Systems for Dual Power Supply Systems
28 - 32V
V+
I > 2 mA 15K
10 µF
1N5231B
VREF = 5.000V
VDD VREF H
VDD VREF H 5.1V
10K
CONTROL CONTROL
& DATA OPT 504
CAT504 LT 1029
& DATA
CAT504
OPT 504 + MPT3055EL
1.0 µF
+
LM 339
– 10K
VDD VREF H +5V WINDOW 1 V
+ REF
CAT504
OPT 504 –
VPP WINDOW 1
DAC 1 +
– 10K VOUT 1
+5V WINDOW 2
+
WINDOW 2
CS –
VOUT 2
DAC 2 +
DI
– 10K
+5V WINDOW 3 WINDOW 3
+
DO –
VOUT 3
DAC 3 +
PROG WINDOW 4
– 10K
+5V WINDOW 4 VOUT 4
+
CLK – WINDOW 5
DAC 4 +
GND
– 10K
+5V WINDOW 5
+ WINDOW STRUCTURE
GND VREF L –
1.0 µF
DAC 1 –
VREF H
CS WINDOW 1
VOUT 2
DAC 2 +
DI VOUT 1
– 10K
+5V WINDOW 2
+ WINDOW 2
DO –
VOUT 4
DAC 3 VOUT 3
PROG
WINDOW 3
CLK
GND
DAC 4 +
– 10K
WINDOW STRUCTURE
+5V WINDOW 3
+
GND VREF L –
2.2K
DAC + 1 mA steps
2N7000
+5V –
DAC + 5 µA steps
2N7000
–
10K 10K
–
TIP 30
+
-15V
+15V
51K
+
TIP 29
–
10K 10K
+5V
VDD VREF H
CONTROL –
& DATA CAT504
OPT 504 BS170P
1 mA steps
+
–
GND VREF L
BS170P
+ 5 µA steps
LM385-2.5
1N914 10K
1.0 µF +12V
74C14 .005 µF
13
1N914 VCC
0.1 µF
0.01 µF
2.5 µF 4
TREB CAP
0.47 µF
2 8
INPUT 1 IN 1 BASS CAP
0.39 µF
20V
IN5250B 3 1 19 10
Vpp VDD VZ OUTPUT 1 OUT 1
CAT504
OPT 504 1.0 µF LM1040
14
VREFH 9
4 LOUDNESS
CHIP SELECT. CS
47K
7 13 14
PROGRAM PROG VOUT 1 VOLUME
5 12 47K 11 1 47 µF
DATA IN DI VOUT 2 BALANCE
6 47K 7 10 µF
11 5
DATA OUT DO VOUT 3 TREBLE BYPASS
2 10 47K 16 18 10 µF
CLOCK CLK VOUT 4 BASS
0.22 0.22 0.22 0.22
µF µF µF µF
9
VREFL
15
8 OUTPUT 2 OUT 2
GND
0.47 µF 0.39 µF
23 17
INPUT 2 IN 2 BASS CAP
3 21
STEREO TREB CAP
0.1 µF 24 0.01 µF
22 ENHANCE GND
12
4.7K GND
ORDERING INFORMATION
Temperature Range
Blank = Commercial (0˚C to +70˚C)
I = Industrial (-40˚C to +85˚C)
Notes:
(1) The device used in the above example is a CAT504JI-TE13 (SOIC, Industrial Temperature, Tape & Reel)