Electronic Costing & Technology Experts

Power electronics – MEMS & Sensors – LED & Optoelectronics – Advanced Packaging – System

TRENDS IN AUTOMOTIVE SIP SYSTEMS: REVIEW BASED

ON TEARDOWN OF ACTUAL SOLUTIONS

Advanced Packaging & System Integration Technology Symposium

Apr. 22-23, 2019
Shanghai, China

Romain Fraux
CEO – System Plus Consulting
 6 COMPANIES TO SERVE YOUR BUSINESS

Yole Group of Companies

Market, technology and strategy Manufacturing costs analysis IP analysis

consulting Teardown and reverse engineering Patent assessment
Cost simulation tools
www.yole.fr www.knowmade.fr
www.systemplus.fr

Design and characterization of

innovative optical systems Innovation and business maker Due diligence
www.bmorpho.com
www.piseo.fr www.yole.fr

Advanced Packaging & System Integration Technology Symposium, April 23, 2019 2
 OUR GLOBAL ACTIVITY
Europe office
Frankfurt

Paris

Nantes
Yole Korea Yole Inc.
HQ in Lyon
Seoul Phoenix
Vénissieux
Yole Japan
Tokyo
Nice Palo Alto

40%
Greater
China office
Hsinchu

of our business
30%
30%
of our business

of our business

Advanced Packaging & System Integration Technology Symposium, April 23, 2019 3
 BUSINESS MODEL

Reverse Costing
Teardown + Cost Analysis

Customer
Catalog
Specific

Costing Tools Training

Advanced Packaging & System Integration Technology Symposium, April 23, 2019 4
 FIELDS OF EXPERTISE

UV LED
Lamp
White/Blue
Discrete
Module
Compound (GaN, SiC)
Power RF

Pressure Sensor
Gyro/Accelero
Automotive IMU/Combo
Consumer Oscillators/Compass
Energy Environment
Medical Gas Sensor
Telecom Fingerprint
Microphone
Light/Optic
WLP
SiP
Embedded
3D Packaging/TSV Infrared
Visible

Advanced Packaging & System Integration Technology Symposium, April 23, 2019 5
 OUTLINE

❑ Introduction
❑ System in Package in Automotive
▪ Power Modules
▪ Sensors
▪ Transmission
▪ RF
▪ Computing

System in Package illustration

Source: Amkor

Advanced Packaging & System Integration Technology Symposium, April 23, 2019 6
 INTRODUCTION
❑ Advanced Packaging

Advanced Packaging & System Integration Technology Symposium, April 23, 2019 7
 INTRODUCTION
❑ Automotive Electronics

Source: Bosch
Advanced Packaging & System Integration Technology Symposium, April 23, 2019 8
 System in Package in Automotive
▪ Power Modules
▪ Sensors
▪ Transmission
▪ RF
▪ Computing
Advanced Packaging & System Integration Technology Symposium, April 23, 2019 9
 POWER MODULES
❑ Power Modules Market
▪ This Market forecast shows that the market for the Power Module devices will follow a rising trend
with an estimated 1.5 billion increase in the next five years.

Advanced Packaging & System Integration Technology Symposium, April 23, 2019 10
 POWER MODULES
❑ Molded IGBT Modules
▪ IGBTs and Diodes molded in a package.
▪ Strong presence in EV/HEV power units (VW, Toyota,

Mitsubishi TPM IGBT Module Bosch T-PM IGBT Module Toyota Prius DSC Module Infineon HybridPACK
Advanced Packaging & System Integration Technology Symposium, April 23, 2019 11 DSC Module
 POWER MODULES
❑ Molded IGBT Modules
▪ Exemple of Internal Structure
Diode

Top copper
leadframe

IGBT

Thick copper
leadframe
Mitsubishi TPM Module Opening
Emitter plate

Copper Spacer
IGBT Diode

Collector plate

Toyota Double Side Cooling Module Cross-Section

Advanced Packaging & System Integration Technology Symposium, April 23, 2019 12
 POWER MODULES
❑ ADI µModules
▪ µModules offer real SiP integration

µModule Top View, X-Ray View, Opening View & Cross-Section View
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 POWER MODULES
❑ Linear Technology µModules
▪ 40A DC/DC Regulator with:
➢ Integrated constant-frequency current mode regulator
➢ Power MOSFETs
➢ 0.18μH Stacked Inductor
➢ Protection circuitry
➢ 5V regulator and other supporting discrete components.

LTM4636 µModule
Stacked Inductor

Package Molding

LTM4636 µModule Cross-Sections

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 POWER MODULES
❑ Linear Technology µModules
▪ Triple 10A Step-Down DC/DC μModule Regulator Switching mode DC/DC converters
➢ Included in the package are the switching controllers, power FETs,
inductors, and most support components

Inductors

MOSFETs

Controller

LTM4633 µModule Top View & Opening View

Advanced Packaging & System Integration Technology Symposium, April 23, 2019 15
 POWER MODULES
❑ Infineon DrBlade – Integrated Power Stage
▪ ASE aEASI Packaging Platform (Advanced Embedded Active System Integration)
▪ Organic Substrate Process Flow Modified to Meet High Power Applications
▪ 2 Power MOSFET + 1 Driver
▪ RDL: 2+1 Layer

Infineon TDA21320 Top View, Bottom View & X-Ray View

Solder
Copper Line
Copper Line
MOSFET MOSFET
Copper HS

Copper Line

Infineon TDA21320 Cross-Section

16
Advanced Packaging & System Integration Technology Symposium, April 23, 2019
 System in Package in Automotive
▪ Power Modules
▪ Sensors
▪ Transmission
▪ RF
▪ Computing
Source: Bosch

Advanced Packaging & System Integration Technology Symposium, April 23, 2019 17
 SENSORS
❑ Around 50 MEMS Components in a Car

Source: Bosch
Advanced Packaging & System Integration Technology Symposium, April 23, 2019 18
 SENSORS
❑ Around 50 MEMS Components in a Car

Source: Bosch
Advanced Packaging & System Integration Technology Symposium, April 23, 2019 19
 SENSORS
❑ Around 50 MEMS Components in a Car

Source: Bosch
Advanced Packaging & System Integration Technology Symposium, April 23, 2019 20
 SENSORS
❑ TPMS: Tire Pressure Monitoring System
▪ Mendatory in several countries
TPMS Sensor

TPMS Integration TPMS Opening

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 SENSORS
❑ TPMS: Tire Pressure Monitoring System
▪ Freescale (NXP) TPMS

Metal lid

Package Molding

Package
Silicone
Molding
gel

Pressure Sensor

Accelerometer
ASIC

Leadframe

Freescale FXTH87 TPMS Package Views, Opening & Cross-Section

Advanced Packaging & System Integration Technology Symposium, April 23, 2019 22
 SENSORS
❑ TPMS: Tire Pressure Monitoring System
▪ Infineon TPMS

ASIC MEMS

Package molding

MEMS

ASIC
Copper leadframe

Infineon SP37 TPMS Package Views, Opening & Cross-Section

Advanced Packaging & System Integration Technology Symposium, April 23, 2019 23
 SENSORS
❑ Airbag ECU
▪ Airbag ECU uses multiple inertial sensors

Continental Airbag ECU TRW (ZF) Airbag ECU

Advanced Packaging & System Integration Technology Symposium, April 23, 2019 24
 SENSORS
❑ Airbag ECU
▪ Continental Airbag ECU
➢ 2 x Panasonic Combo Sensors (Single-Axis gyro + 2-Axis Accelerometer)
➢ 2 x NXP Accelerometer (Single + Dual-Axis Accelerometer)

Accelerometer
Accelerometer
Gyroscope
ASIC
ASIC

Panasonic Combo Sensors NXP Single & Dual-Axis Accelerometers

Advanced Packaging & System Integration Technology Symposium, April 23, 2019 25
 SENSORS
❑ Airbag ECU
▪ TRW (ZF) Airbag ECU
➢ 1 x Panasonic Gyroscopes (Single-Axis)
➢ 2 x NXP Accelerometer (Single + Dual-Axis Accelerometer)

Accelerometer ASIC

Gyroscope ASIC

NXP Single-Axis Accelerometer Panasonic Single-Axis Gyro NXP Dual-Axis Accelerometer

Advanced Packaging & System Integration Technology Symposium, April 23, 2019 26
 System in Package in Automotive
▪ Power Modules
▪ Sensors
▪ Transmission
▪ RF
▪ Computing
Advanced Packaging & System Integration Technology Symposium, April 23, 2019 27
 TRANSMISSION CONTROL UNIT
❑ Transmission Control Unit (TCU)
▪ Standard ECU

Bosch TCU (Source: Bosch)

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 TRANSMISSION CONTROL UNIT
❑ Continental TCU
▪ Double Clutch Transmission (DCT)
▪ Bare-Die High-Density Interconnect (BD-HDI) substrate technology
▪ 13 ICs, 10+ MOSFETs, Diodes, Passives ICs

MOSFETS

Continental Advanced TCU

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 System in Package in Automotive
▪ Power Modules
▪ Sensors
▪ Transmission
▪ RF
▪ Computing
Advanced Packaging & System Integration Technology Symposium, April 23, 2019 30
 RF
❑ GPS IC
▪ Multi-die integration

Ublox GPS Chip

Advanced Packaging & System Integration Technology Symposium, April 23, 2019 31
 RF
❑ Vehicle Central Infotainment Unit
▪ Network Access Device Module (NAD)
▪ 2G, 3G, 4G LTE, GNSS

xxxxx

Advanced Packaging & System Integration Technology Symposium, April 23, 2019 32
 RF
❑ Vehicle Central Infotainment Unit
▪ Network Access Device Module (NAD)
▪ 2G, 3G, 4G LTE, GNSS

Cross section of Electronic Board (10 layers)

Wistron NeWeb Corp. NAD Module
Advanced Packaging & System Integration Technology Symposium, April 23, 2019 33
 System in Package in Automotive
▪ Power Modules
▪ Sensors
▪ Transmission
▪ RF
▪ Computing
Advanced Packaging & System Integration Technology Symposium, April 23, 2019 34
 COMPUTING
❑ Single-Chip Module

Single-Chip Module Introduction (Source: NXP)

Advanced Packaging & System Integration Technology Symposium, April 23, 2019 35
 COMPUTING
❑ nepes Roadmap

Nepes Roadmap (Source: Nepes)

Advanced Packaging & System Integration Technology Symposium, April 23, 2019 36
 COMPUTING
❑ nepes System in Fan-Out WLP
▪ System-in-Package at wafer-level
▪ LPDDR2 Package-on-Package Configuration Via Frame (Through
Package Via)
▪ Embedded Flash Discrete passives
Flash Memory
components
▪ Embedded PMIC (SPI NOR )

SiP (AP + Flash + PMIC)

DRAM Package i.MX6Q or iMX6D
Application
Processor

PMIC

Source : Nepes

Flash AP

Package Cross-Section
©2017 by System Plus Consulting

Advanced Packaging & System Integration Technology Symposium, April 23, 2019 37
 COMPUTING
❑ nepes System in Fan-Out WLP
▪ Chip first type Fan-Out
▪ 4 Redistribution Layers (RDLs)
▪ Via Frame (Through Package Via) formed from a PCB panel for the
redistribution of the memory but also to increase the strength of the
package Redistribution Layers
©2017 by System Plus Consulting

Package Molding

SMD Capacitor
Application Processor

4-Layer RDL

Solder Ball

Package Cross-Section – Bumps & RDLs

©2017 by System Plus Consulting
Advanced Packaging & System Integration Technology Symposium, April 23, 2019 38
 THANK YOU!

And many more !

www.systemplus.fr

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