K&S Thin Die Technology

Sematech Symposium Hsinchu

October 2012
Thin Die Technology – Agenda

 Introduction

 Beneficial Machine Architecture

 Pick Process & Process Control

 Application Tools and Optimization Process

 SW Features for High End Apps

 Yield Assurance

 Conclusion / Roadmap
Die & Film Thickness Trends

Indexerfor Thin Die Handling Technology:

Key Driver

Film over Wire

Production (high end MCP)

Mother Die DAF

Qualification / Demo

Daughter Die DAF

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Successfully Processed Thin Die App’s on iStack

3 Layer Stack (MD – DD – Controller) Successful iStack Thin Die Applications

Thickness 15mm Die / 5mm DAF
20
Qualification / Production
Piston Ejector Demo
Slider Ejector Demo

15

Die Size [mm]

10

10 Layer Shingle Stack

Thickness 15mm Die / 5mm DAF

0
10 20 30 40 50 60 70 80 90 100 110
Die Thickness [µm]

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K&S Thin Die Technology Overview

 Thin Die (Needle-less) Ejector & Pick Mode

 Dedicated Vacuum Supply
 Special ‘Seal Lip’ Tool

 Multi-Step
25
 Smooth Tool Lift-off
 Expert Diagnostics
20  Step-wise Pick
Die Size [mm]

15

10

0
100 90 80 70 60 50 40 30 20 10
Die Thickness [µm]
Standard & Multi Needle
(Magnetic) Die Ejector Thin & Small Die (Needle-less)
Ejector & Pick Mode
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K&S Thin Die Pick Technology
- Machine Architecture
Equipment Architecture

Moving Bond
Vision
Fixed Transfer
Vision Key Benefits for Thin Die Handling:

 Process Performance & Flexibility 

Optimized pick & place tooling design

Indexer
 Highest Throughput 
Long pick times for high-end DAF/FOW
Fixed app‘s are „hidden“ behind bond process
Pick
Vision through parallel die handling

 Process Stability 
„Cold“ pick process while bonding @
high temperatures

Die Ejector

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Equipment Architecture = Process Flexibility

 Pick Tool – Many big holes = Strong pick

 Multi-hole tools optimized for pick yield
Separated PTP architecture
allows for optimized pick &
place processes!
 Transfer Tool – High Accuracy
 Transfer tool designed for highly accurate
handover process
 Vacuum holes location optimized to prevent
“potato chip effect” on thin die for reliable vision
Tool has “self cleaning” effect and lowest
surface energy – optimized for WBL/FOW
handling

 Place Tool – No Voids

 Tool optimized to eliminates voiding

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K&S Thin Die Technology –
Pick Process & Process Control
Thin Die Picking Method Piston Ejector

1. Tool Impact
Vacuum Level
Impact Speed 2. Initial Peeling
Pick Force Separation Distance
Separation Speed
Multi-Step Separation configurable

3. Retraction – Final Peeling

Pick Force
4. Die Pick-up
Retract Distance Smooth Tool Lift-off configurable
Retract Speed
Multi-Step Retraction configurable

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Thin Die Picking Method Slider Ejector

1. Tool Impact 2. Initial Peeling

Vacuum Level
Eject Height
Impact Speed
Eject Speed
Pick Force
Slider Speed
Slide Distance
Multi Step configurable

3. Final Peeling
Sliding Distance
Slide Speed 4. Die Pick-up
Multi Step configurable Smooth Tool Lift-off configurable

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(Thin) Die Handling Process Control

Transfer Force Repeatability at 0.8N

iStack’s Tool Impact, Force & Position Control Over 1 Hour Production at 4500 UPH
for Minimum Stress on the Die: 0.3

0.2

Deviation from 0.8N

 Tool Impact Control: 0.1

 Tool impacts at user adjustable constant velocity 0

 Tool impacts are automatically detected and -0.1

adjusted during each machine cycle -0.2 s = 0.008N, Range = ±0.03N

-0.3
 Force Control: 0 600 1200 1800 2400 3000 3600

 Force is generated by linear motors (spring-less) Time [s]

with auto calibrated current loops Pick Arm Positioning Repeatability

 Highest force repeatability through closed loop 5
4
current control 3

Position [µm]
2

 Position Control: 1
0

 Dies are positioned and handed over between -1

-2
tools within 1.5µm (sigma), implying zero shear -3
-4
stress during pick and handover -5
200sX  0.2µm, sY600
 0.4µm800
 Drifts are eliminated through “Dynamic 0 400 1000
Cycle #
Calibration” during production
Y X

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K&S Thin Die Technology –
Application Tools and Optimization
Thin Die Ejector Optimization

Die Ejector Design Optimization using Finite Element Analysis based on:
 minimizing tensile (center and neighbor) die stress near/along the die edges
 maximizing peel stress along the die edges
Peel Stress FEA –
Separation Step Center Die

Neighbor Die

Die Stress FEA –

Separation Step
Center Die

Neighbor Die

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Thin Die FEA Model Validation

Excellent agreement between FEA model and Pick Test (7.8x10.8mm Die, 25µm thin)
FEA Model: Red WBL sticks on Tape, Blue WBL peeled from Tape

Ejection Height Low Ejection Height Medium Ejection Height High

Thru-Tape Photos: Dark Grey WBL sticks on Tape, Light Grey WBL peeled from Tape
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Thin Die FEA Model Validation

Process Tests on Various Devices for Verification of FEA Results & Developments
 Test Device Information: Thin Die Picking Performance on 15µm Die
Die Thickness 15µm
DAF Tape Hitachi FH9011 100.00% 1800

Die Sizes 17.15mm x 9.70mm 99.00% 1600

16.90mm x 10.65mm 98.00% 1400
10.80mm x 7.80mm 97.00%
1200

Units Bonded
Pick Cycle time 350ms
96.00%

Yield
1000
95.00%
"no crack" yield
800
94.00% pick yield
bonded units 600
93.00%

92.00% 400

91.00% 200

90.00% 0
Piston 2011 Piston 2012 Slider

ejector type die picked crack yield pick yield total yield
Piston 2011 224 100.00% 99.55% 99.55%
Piston 2012 231 100.00% 100.00% 100.00%
Slider 1684 100.00% 100.00% 100.00%

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K&S Thin Die Pick Tools

Seal Lip Pick Tool maintains vacuum between tool and thin die if the die deforms:
 Strengthens grip and adds stiffness to the die
 Increases pick-up yield
 Avoids stress due to pressure difference between atmospheric pressure and ejector vacuum
 Reduces die bending

Standard Seal Lip

Pick Tool Pick Tool

FEA of tool with

vacuum, showing lip
Flexible seal to cover seal compliance
the edges of die

17
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Thin Die Technology –
SW Features for High-End App’s
SW Features for High-End App’s

Multi-Step Separation Process:

 More flexibility to parametrize the separation process
 Better control of initial peel process for applications with high “edge tackiness”
(Fast) Initial peel process for low “edge tackiness”:

Configuration of Multi-Step
Separation
Dt = 2ms
Die in front Pick tool

(Slow) Initial peel process for high “edge tackiness”:

Pick Tool / Piston Position [µm]

250

200

150

100 Dt = 40ms
50

0
Dt = 60ms
0 100 200 300 400 500 600 700 800
Time [ms]
Dt = 70ms
Separation @ 1% Speed With Multi-Step Separation

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SW Features for High-End App’s

Smooth Pick Tool Lift-off @ End of Pick Process:

 More flexibility to parametrize the pick tool lift-off motion
 Higher process reliability for extremely thin or high “edge tackiness” dies

Configuration of
Smooth Lift-off

1 Pick 2
100 tool
Pick Tool Position [µm]

80

60

40

20 3 Die lost 4
from tool
0
0 50 100 150 200 250 300 350 400
Time [ms]

Slow Setting Medium Setting Fast Setting

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SW Features for High-End App’s

K&S Mixed Signal Scope for Process Setup:

 K&S includes unique monitoring and diagnostics SW scope, tracking all
 axes position, speed & acceleration set points & actual readings,
 digital and analogue I/O’s
 Allows for detailed pick process analysis & optimization

Example:
Pick tool detects leaks between pick tool and die 
Conclusions on effectiveness of peel process
Pick Tool Pick Tool
Flow Flow
Sensor & Sensor &
Vacuum Vacuum
Supply Supply

Ejector Ejector
Vacuum Vacuum
Supply Supply

Initial peeling not started Initial peeling completed

– leakage between tool – no leakage between pick
and die during separation tool and die

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Thin Die Technology –
Yield Assurance
Yield Assurance

Crack Inspection System

Transfer Camera:
 Full Die image @ 30µm/pix
 Technically NOT possible to
make Cracks visible with full
field FOV sensor (MP limit)
Hi-Resolution Microscope:
  0.6µm/pixel  very small FOV
 Hard to tell Edge from Cracks
 Needs multi-image scanning
(time consuming = low UPH)
K&S technique:
 Full Die image at 60µm/pixel resolution
 Special illumination technique
 High resolution NOT required even for 1µm crack

1.7 / 4.4µm crack width Cracks appear as bright “Crack Detection Module”
signals on dark background Inspection after Die Pick-Up
17.1mm

320µm

Red Lines
indicate
Cracks SEM image

10.0mm 210µm  10mm

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Thin Die Technology –
Conclusion / Roadmap
Conclusion / Roadmap

Conclusion
 Production proven ‘Best in Class’ Thin Die Handling
 Demonstrated Unique Crack Detection Capability

Roadmap - Extension of Current Thin Die Technology to Advanced Packages

 Background
 TSVs will create different stress distribution in thin die.
 Thinner Die  easier Via manufacturability  smaller possible Via  (aspect ratio Via depth/)
 Pillars are not touchable. Changed Pickup Tool geometry  different stress distribution.

 We will enhance existing technology for thinnest possible TSV / Copper Pillar Die.
 Verification on suitability of existing thin die technology is started
 Reduce inner stress on TSV and Copper Pillar Dice with FEA models and validation.
 Looking for partners to validate Technology on TSV and Copper Pillar Dice in production
environment.

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Question / Answers
Company Copyright

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