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Infineon IPD65R1K4C6 DataSheet v02 01 en
Infineon IPD65R1K4C6 DataSheet v02 01 en
MetalOxideSemiconductorFieldEffectTransistor
CoolMOS™C6650V
650VCoolMOS™C6PowerTransistor
IPD65R1K4C6
DataSheet
Rev.2.1
Final
Industrial&Multimarket
650VCoolMOS™C6PowerTransistor
IPD65R1K4C6
1Description DPAK
CoolMOS™isarevolutionarytechnologyforhighvoltagepower tab
MOSFETs,designedaccordingtothesuperjunction(SJ)principleand
pioneeredbyInfineonTechnologies.CoolMOS™C6seriescombinesthe
experienceoftheleadingSJMOSFETsupplierwithhighclassinnovation.
TheresultingdevicesprovideallbenefitsofafastswitchingSJMOSFET
whilenotsacrificingeaseofuse.Extremelylowswitchingandconduction
lossesmakeswitchingapplicationsevenmoreefficient,morecompact, 2
lighterandcooler. 1
Features
•ExtremelylowlossesduetoverylowFOMRdson*QgandEoss
Drain
•Veryhighcommutationruggedness Pin 2
•Easytouse/drive
•Pb-freeplating,Halogenfreemoldcompound
•Fully qualified according to JEDEC for Industrial Applications Gate
Pin 1
Source
Applications Pin 3
HardswitchingPWMstagesandresonantswitchingPWMstagesfore.g.
PCSilverbox,Adapter,LCD&PDPTVandLighting.
Table1KeyPerformanceParameters
Parameter Value Unit
VDS @ Tj max 700 V
RDS(on),max 1.4 Ω
Qg,typ 10.5 nC
ID,pulse 8.3 A
Eoss @ 400V 1.15 µJ
Body diode di/dt 500 A/µs
IPD65R1K4C6
TableofContents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Test Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Appendix A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
IPD65R1K4C6
2Maximumratings
atTj=25°C,unlessotherwisespecified
Table2Maximumratings
Values
Parameter Symbol Unit Note/TestCondition
Min. Typ. Max.
Continuous drain current 1) ID 3.2 A TC=25°C
2.0 TC=100°C
Pulsed drain current 2)
ID‚pulse 8.3 A TC=25°C
ID=0.6A,VDD=50V
Avalanche energy, single pulse EAS 26 mJ
(see table 10)
Avalanche energy, repetitive EAR 0.10 mJ ID=0.6A,VDD=50V
Avalanche current, repetitive IAR 0.6 A
MOSFET dv/dt ruggedness dv/dt 50 V/ns VDS=0...480V
Gate source voltage VGS -20 20 V static
-30 30 AC (f > 1 Hz)
Operating and storage temperature Tj‚Tstg -55 150 °C
Continuous diode forward current IS 2.8 A TC=25°C
Diode pulse current IS‚pulse 8.3 A TC=25°C
1)
Limited by Tj max. Maximum duty cycle D=0.75
2)
Pulse width tp limited by Tj max
3)
Identical low side and high side switch with identical RG
Final Data Sheet 4 Rev. 2.1, 2020-05-20
650VCoolMOS™C6PowerTransistor
IPD65R1K4C6
3Thermalcharacteristics
Table3ThermalcharacteristicsDPAK
Values
Parameter Symbol Unit Note/TestCondition
Min. Typ. Max.
Thermal resistance, junction - case RthJC 4.4 °C/W
Thermal resistance, junction - ambient 1)
RthJA 62 °C/W leaded
SMD version, device on PCB,
35
6cm² cooling area
Soldering temperature, wave- & 1.6 mm (0.063 in.) from case for
Tsold 260 °C
reflowsoldering allowed 10s
1)
Device on 40mm*40mm*1.5mm one layer epoxy PCB FR4 with 6cm² copper area (thickness 70µm) for drain connection.
PCB is vertical without air stream cooling.
Final Data Sheet 5 Rev. 2.1, 2020-05-20
650VCoolMOS™C6PowerTransistor
IPD65R1K4C6
4Electricalcharacteristics
atTj=25°C,unlessotherwisespecified
Table4Staticcharacteristics
Values
Parameter Symbol Unit Note/TestCondition
Min. Typ. Max.
Drain-source breakdown voltage V(BR)DSS 650 V VGS=0V,ID=1mA
Gate threshold voltage VGS(th) 2.5 3 3.5 V VDS=VGS,ID=0.1mA
Zero gate voltage drain current IDSS 1 µA VDS=650V,VGS=0V,Tj=25°C
10 VDS=650V,VGS=0V,Tj=150°C
Gate-source leakage current IGSS 100 nA VGS=20V,VDS=0V
Drain-source on-state resistance RDS(on) 1.260 1.4 Ω VGS=10V,ID=1.0A,Tj=25°C
3.280 VGS=10V,ID=1A,Tj=150°C
Gate resistance RG 6.5 Ω f=1MHz,opendrain
Table5Dynamiccharacteristics
Values
Parameter Symbol Unit Note/TestCondition
Min. Typ. Max.
Input capacitance Ciss 225 pF VGS=0V,VDS=100V,f=1MHz
Output capacitance Coss 18 pF
Effective output capacitance, energy
Co(er) 10 pF VGS=0V,VDS=0...480V
related 1)
Effective output capacitance, time related ID=constant,VGS=0V,
Co(tr) 42 pF
2) VDS=0...480V
Turn-on delay time td(on) 7.7 ns VDD=400V,VGS=13V,ID=1.5A,
RG=10.2Ω
Rise time tr 5.9 ns
(see table 9)
Turn-off delay time td(off) 33 ns
Fall time tf 18.2 ns
Table6Gatechargecharacteristics
Values
Parameter Symbol Unit Note/TestCondition
Min. Typ. Max.
Gate to source charge Qgs 1.3 nC VDD=480V,ID=1.5A,
VGS=0to10V
Gate to drain charge Qgd 5.8 nC
Gate charge total Qg 10.5 nC
Gate plateau voltage Vplateau 5.4 V
1)
Co(er) is a fixed capacitance that gives the same stored energy as Coss while VDS is rising from 0 to 80% V(BR)DSS
2)
Co(tr) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% V(BR)DSS
Final Data Sheet 6 Rev. 2.1, 2020-05-20
650VCoolMOS™C6PowerTransistor
IPD65R1K4C6
Table7Reversediodecharacteristics
Values
Parameter Symbol Unit Note/TestCondition
Min. Typ. Max.
Diode forward voltage VSD 0.9 V VGS=0V,IF=1.5A,Tj=25°C
Reverse recovery time trr 200 ns VR=400V,IF=1.5A,
diF/dt=100A/µs
Reverse recovery charge Qrr 0.9 µC
(see table 8)
Peak reverse recovery current Irrm 8 A
IPD65R1K4C6
5Electricalcharacteristicsdiagrams
Diagram1:Powerdissipation Diagram2:Max.transientthermalimpedance
30 101
25 0.5
0.2
20 100
0.1
ZthJC[K/W]
0.05
Ptot[W]
15
0.02
10 10-1 0.01
single pulse
0 10-2
0 40 80 120 160 10-5 10-4 10-3 10-2 10-1
TC[°C] tp[s]
Ptot=f(TC) ZthJC=f(tP);parameter:D=tp/T
Diagram3:Safeoperatingarea Diagram4:Safeoperatingarea
2
10 102
1 µs
101 101 1 µs
10 µs
10 µs
100 µs
ID[A]
ID[A]
1 ms
1 ms
10 ms
10 ms
10-1 10-1
DC
DC
10-2 10-2
100 101 102 103 100 101 102 103
VDS[V] VDS[V]
ID=f(VDS);VGS>7V;TC=25°C;D=0;parameter:tp ID=f(VDS);VGS>7V;TC=80°C;D=0;parameter:tp
IPD65R1K4C6
Diagram5:Typ.outputcharacteristics Diagram6:Typ.outputcharacteristics
12 7
20 V
20 V 6 10 V
10
10 V 8V
5
8
8V 7V
4
ID[A]
ID[A]
6
7V
3 6V
4
5.5 V
2
6V
5V
2 5.5 V
1 4.5 V
5V
4.5 V
0 0
0 5 10 15 20 0 5 10 15 20
VDS[V] VDS[V]
ID=f(VDS);Tj=25°C;parameter:VGS ID=f(VDS);Tj=125°C;parameter:VGS
Diagram7:Typ.drain-sourceon-stateresistance Diagram8:Drain-sourceon-stateresistance
8 4
3
6
5
RDS(on)[Ω]
RDS(on)[Ω]
5 V 5.5V 6V 6.5 V 7V
2 98% typ
10 V
4
3
1
1 0
0 1 2 3 4 5 6 -60 -20 20 60 100 140 180
ID[A] Tj[°C]
RDS(on)=f(ID);Tj=125°C;parameter:VGS RDS(on)=f(Tj);ID=1.0A;VGS=10V
IPD65R1K4C6
Diagram9:Typ.transfercharacteristics Diagram10:Typ.gatecharge
10 10
9
25 °C
8 8
120 V 480 V
7
6 6
VGS[V]
ID[A]
150 °C
5
4 4
2 2
0 0
0 2 4 6 8 10 0 5 10 15
VGS[V] Qgate[nC]
ID=f(VGS);VDS=20V;parameter:Tj VGS=f(Qgate);ID=1.5Apulsed;parameter:VDD
Diagram11:Avalancheenergy Diagram12:Drain-sourcebreakdownvoltage
30 750
725
25
700
20
675
EAS[mJ]
VBR(DSS)[V]
15 650
625
10
600
5
575
0 550
0 50 100 150 200 -60 -20 20 60 100 140 180
Tj[°C] Tj[°C]
EAS=f(Tj);ID=0.6A;VDD=50V VBR(DSS)=f(Tj);ID=1.0mA
IPD65R1K4C6
Diagram13:Typ.capacitances Diagram14:Typ.Cossstoredenergy
104 2.00
1.80
1.60
103
1.40
Ciss
1.20
Eoss[µJ]
C[pF]
102 1.00
0.80
Coss
0.60
101
0.40
Crss 0.20
100 0.00
0 100 200 300 400 500 600 0 100 200 300 400 500 600
VDS[V] VDS[V]
C=f(VDS);VGS=0V;f=1MHz Eoss=f(VDS)
Diagram15:Forwardcharacteristicsofreversediode
101
125 °C 25 °C
IF[A]
100
10-1
0.0 0.5 1.0 1.5 2.0
VSD[V]
IF=f(VSD);parameter:Tj
IPD65R1K4C6
6TestCircuits
Table8Diodecharacteristics
Test circuit for diode characteristics Diode recovery waveform
V ,I
Rg1 VDS( peak)
VDS
VDS
VDS IF
trr
tF tS
Rg 2 dIF / dt
IF t
QF QS 10 %Irrm
IF dIrr / dt trr =tF +tS
Irrm Qrr = QF + QS
Rg1 = Rg 2
Table9Switchingtimes
Switching times test circuit for inductive load Switching times waveform
VDS
90%
VDS
VGS 10%
VGS
td(on) tr td(off) tf
ton toff
Table10Unclampedinductiveload
Unclamped inductive load test circuit Unclamped inductive waveform
V(BR)DS
ID VDS VD
VDS VDS
ID
IPD65R1K4C6
7PackageOutlines
MILLIMETERS
DIMENSION
MIN. MAX.
DOCUMENT NO.
A 2.16 2.41
Z8B00003328
A1 0.00 0.15
b 0.64 0.89 REVISION
b2 0.65 1.15 07
b3 4,95 5.50 SCALE:
c 0.46 0.61
10:1
c2 0.40 0.98
D 5.97 6.22 0 1 2mm
D1 5.02 5.84
E 6.35 6.73
E1 4.32 5.50 EUROPEAN PROJECTION
e 2.29
e1 4.57
N 3
H 9.40 10.48
L 1.18 1.78
L3 0.89 1.27 ISSUE DATE
L4 0.51 1.02 01.04.2020
Figure1OutlinePG-TO252,dimensionsinmm
IPD65R1K4C6
8AppendixA
Table11RelatedLinks
• IFXC6ProductBrief:www.infineon.com
• IFXC6Portfolio:www.infineon.com
• IFXCoolMOSWebpage:www.infineon.com
• IFXDesignTools:www.infineon.com
RevisionHistory
IPD65R1K4C6
Revision:2020-05-26,Rev.2.1
Previous Revision
Revision Date Subjects (major changes since last revision)
2.0 2013-07-26 Release of final version
2.1 2020-05-26 Update of the package outlines
Trademarks
Allreferencedproductorservicenamesandtrademarksarethepropertyoftheirrespectiveowners.
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improvethequalityofthisdocument.Pleasesendyourproposal(includingareferencetothisdocument)to:
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Publishedby
InfineonTechnologiesAG
81726München,Germany
©2020InfineonTechnologiesAG
AllRightsReserved.
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Thedatacontainedinthisdocumentisexclusivelyintendedfortechnicallytrainedstaff.Itistheresponsibilityofcustomer’s
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informationgiveninthisdocumentwithrespecttosuchapplication.
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Forfurtherinformationontechnology,deliverytermsandconditionsandpricespleasecontactyournearestInfineon
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Warnings
Duetotechnicalrequirements,componentsmaycontaindangeroussubstances.Forinformationonthetypesinquestion,
pleasecontactthenearestInfineonTechnologiesOffice.
TheInfineonTechnologiescomponentdescribedinthisDataSheetmaybeusedinlife-supportdevicesorsystemsand/or
automotive,aviationandaerospaceapplicationsorsystemsonlywiththeexpresswrittenapprovalofInfineonTechnologies,ifa
failureofsuchcomponentscanreasonablybeexpectedtocausethefailureofthatlife-support,automotive,aviationand
aerospacedeviceorsystemortoaffectthesafetyoreffectivenessofthatdeviceorsystem.Lifesupportdevicesorsystemsare
intendedtobeimplantedinthehumanbodyortosupportand/ormaintainandsustainand/orprotecthumanlife.Iftheyfail,itis
reasonabletoassumethatthehealthoftheuserorotherpersonsmaybeendangered.
15 Rev.2.1,2020-05-26