Low melting point solder paste eCO+PLUS” + Combines reliability and workability with low temperature reflow Reduces damage to components, boards, and cost by low temperature reflow "TB48-M742, a low melting point alloy (138°C), brings the following benefits associated with low temperature reflow; 1. Available with temperature sensitive materials. 2. Less heat damage to components given by double sided reflow ‘3. Reduction of running costs by saving electricity consumption. (wees Figure 1, Comparison of PCB's condition after reflow — alt oa OCLs Optimized flux and solvent formulation of TB48-M742 realzes excellent compatibility between electrical reliability and workability for low temperature reflow with sufficient SIR, printing idle time and tack time, Ena et Figure 2 Electiciy consumption /hr during reflow process: ‘ote censure) ‘SACI05 ‘r-s8.088 ‘TB48.M742 enables a saving of approx. 40% reduction in running cost by low temperature reflow. Figure 3. Volage appled SRS raion: aPC x ASR for S000 = plese IS yee @votageapoec: OCSOY Flax content) Ene cen S some B rwe-e Eproaer) e08 05-06 3 scene “ime (rau!) ‘5057.68 0485 eal 2098 ° Row KOKI COMPANY LIMITED 82-1, Sen Aeshkcho, dacs, Towyo, Japan, 120-0026 TEL +81-252461621 FAK +81-552461527 WMW:KO-K.colD