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PULSE ECHO SYSTEMS
A system that sends out pulses of ultrasonic energy then listens out for the returning
echoes is @ pulse echo system. ‘The probes used can be in the single or double crystal
format. The single crystal probe transmits pulses of energy, typically at 8 rate of
‘anything between 150 to 1000Hz, in between pulses the circuitry switches to receive
‘mode to listen for any retuming echoes. The double crystal probe has separate
‘transmit and receive crystals, the transmitter stil sends out pulses, (atthe same rates 25,
above) but rests in between, whilst the receiver is in "listening" mode permanently.
See the "Introduction to the basic concept” section of the notes for further information
‘and the "Propagation of sound” section for details on pulse repetition frequencies
‘The advantages of the pulse echo system are that defect positions can be located with
accuracy and access to only one side of the test material is necessary.
‘The disadvantage is thatthe sound has to travel through the material twice (there and
back) so there is more attenuation.
‘THROUGH TRANSMISSION TESTING
‘Mainly used in automated systems, in this technique there are two probes, one either
side of the fest material, one transmitting pulses of energy the other receiving the
‘energy. The received energy signal is set to a pre-determined level on the CRT and the
presence of a defect is indicated by a reduction in amplitude or loss of this signal. In
‘automated systems the signal may be set to teach or exceed a negative gate on the
CRT. This means that a portion of the screen in the area of the signal will bave an
alarm sound if the signal does not reach the pre-set amplitude. This may be coupled 10
fn automatic marking system, such as a paint sprayer, that marks the material when the
signal falls short. The marked areas then being inspected later manually in more detail
‘The advantages of this technique are based on the fact that the sound only has to travel
cone way through the material, ie. Materials with higher attenuative properties can be
tested, thicker materials can be tested and higher frequency probes can be used,
‘The disadvantages are; there is no indication of defect depth, there must be access 10
both sides ofthe material to place the probes, the probes must be correctly aligned and
‘change in coupling conditions (causing a loss of signal amplitude) could be mistaken,
fora defect.
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