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CH 09
CH 09
CH 09
1
Dislocation Motion
Dislocation motion & plastic deformation
• Metals - plastic deformation occurs by slip – an edge
dislocation (extra half-plane of atoms) slides over
adjacent plane half-planes of atoms.
Edge dislocation
Screw dislocation
4
Dislocations & Materials Classes
• Metals: Disl. motion easier.
+ + + + + + + +
-non-directional bonding + + + + + + + +
-close-packed directions + + + + + + + +
for slip. electron cloud ion cores
• Covalent Ceramics
(Si, diamond): Motion hard
-directional (angular) bonding
7
Stress and Dislocation Motion
• Resolved shear stress, tR
– results from applied tensile stresses
Applied tensile Resolved shear Relation between
stress: s = F/A stress: tR =Fs /A s s and tR
tR = s cos l cos f
Shmid factor
8
Critical Resolved Shear Stress
Slip will occur first in slip systems oriented close to this angle
(φ = λ = 45o) with respect to the applied stress
Critical Resolved Shear Stress
• Condition for dislocation motion: tR > tCRSS
• Ease of dislocation motion depends typically
on crystallographic orientation
10-4 GPa to 10-2 GPa
tR = s cos l cos f
s s s
tR = 0 tR = s/2 tR = 0
l = 90° l = 45° f = 90°
f = 45°
t maximum at l = f = 45º 10
Single Crystal Slip
Adapted from
Fig. , Callister
& Rethwisch
9e.
s = 45 MPa
So the applied stress of 45 MPa will not cause the
crystal to yield
12
Ex: Deformation of single crystal
What stress is necessary (i.e., what is the
yield stress, sy)?
s ³ s y = 50.5 MPa
13
Question
14
Slip Motion in Polycrystals
• Polycrystals stronger than s
single crystals – grain
boundaries are barriers
to dislocation motion
Adapted from Fig. 7
• Slip planes & directions Callister &
Rethwisch 9e.
(l, f) change from one (Fig. is courtesy of
C. Brady, National
grain to another Bureau of
Standards [now the
• tR will vary from one National Institute of
Standards and
grain to another Technology,
Gaithersburg, MD].)
16
Question
17
=1/2.0x10-3
18
Four Strategies for Strengthening:
2: Form Solid Solutions
A C
B D
19
Lattice Strains Around Dislocations
22
Ex: Solid Solution
Strengthening in Copper
• Tensile strength & yield strength increase with wt% Ni.
Tensile strength (MPa)
180
200 60
0 10 20 30 40 50 0 10 20 30 40 50
wt.% Ni, (Concentration C) wt.%Ni, (Concentration C)
23
Four Strategies for Strengthening:
3: Precipitation Strengthening
• Hard precipitates are difficult to shear.
Ex: Ceramics in metals (SiC in Iron or Aluminum).
precipitate
Large shear stress needed
Side View to move dislocation toward
precipitate and shear it.
1
• Result: s y ~
S
https://www.youtube.com/watch?v=ofoRSFZn_MQ
24
Application:
Precipitation Strengthening
• Internal wing structure on Boeing 767
Adapted Callister &
Rethwisch . (courtesy of
G.H. Narayanan and A.G.
Miller, Boeing Commercial
Airplane Company.)
1.5mm
25
Four Strategies for Strengthening:
4: Cold Work (Strain Hardening)
• Deformation at room temperature (for most metals)
• Common forming operations reduce the cross-sectional
area:
-Forging force -Rolling
roll
die Ad
A o blank Ad Ao
Adapted from Fig.
11.8, Callister & roll
Rethwisch 8e.
-Drawing force -Extrusion
Ao
die Ad container die holder
Ao tensile force
force ram billet extrusion Ad
die container die
Ao - Ad
%CW = x 100
Ao 26
Question
27
28
29
Dislocation Structures Change
During Cold Working
• Dislocation structure in Ti after cold working.
• Dislocations entangle
with one another
during cold work.
• Dislocation motion
becomes more difficult.
https://www.youtube.com/watch?v=BV1cxwxnhPs 30
Dislocation Density Increases
During Cold Working
total dislocation length
Dislocation density =
unit volume
– Carefully grown single crystals
ca. 103 mm-2
– Deforming sample increases density
109-1010 mm-2
– Heat treatment reduces density
105-106 mm-2
31
Lattice Strain Interactions
Between Dislocations
Adapted from
Callister & Rethwisch
9e.
32
Impact of Cold Work
As cold work is increased
• Yield strength (sy) increases.
• Tensile strength (TS) increases.
• Ductility (%EL or %AR) decreases.
33
Example
A - Ad
%CW = o x 100
Ao
34
Mechanical Property Alterations
Due to Cold Working (Example)
pDo2 pDd2
-
Copper %CW = 4 4 x 100
Cold pDo2
Work
4
Do2 - Dd2
= x 100
Do = 15.2 mm Dd = 12.2 mm Do2
60
700 800
ductility (%EL)
40
500 600
300 MPa Cu
300 Cu 400 340 MPa 20
Cu 7%
100 200 00
0 20 40 60 0 20 40 60 20 40 60
% Cold Work % Cold Work % Cold Work
600 60
tensile strength 1. Recovery
ductility (%EL)
50 2. Recrystallization
500
40 3. Grain Growth
400 30
Adapted from Fig. 7.22, Callister & Rethwisch
ductility 20 8e. (Fig. 7.22 is adapted from G. Sachs and
300 K.R. van Horn, Practical Metallurgy, Applied
Metallurgy, and the Industrial Processing of
Ferrous and Nonferrous Metals and Alloys,
American Society for Metals, 1940, p. 139.)
37
Three Stages During Heat Treatment:
1. Recovery
Reduction of dislocation density by annihilation.
• Scenario 1 extra half-plane
of atoms Dislocations
Results from annihilate
diffusion atoms
and form
diffuse
a perfect
to regions
atomic
of tension
plane
extra half-plane
of atoms
• Scenario 2
3. “Climbed” disl. can now tR
move on new slip plane
2. grey atoms leave by
4. opposite dislocations
vacancy diffusion
meet and annihilate
allowing disl. to “climb”
1. dislocation blocked; Obstacle dislocation
can’t move to the right
38
Three Stages During Heat Treatment:
2. Recrystallization
• New grains are formed that:
-- have low dislocation densities
-- are small in size
-- consume and replace parent cold-worked grains
0.6 mm 0.6 mm
Adapted from
Fig. 7.21(a),(b),
Callister &
Rethwisch 8e.
(Fig. 7.21(a),(b)
are courtesy of
J.E. Burke,
General Electric
Company.)
0.6 mm 0.6 mm
Adapted from
Fig. (c),(d),
Callister &
Rethwisch 9e.
(Fig. 1(c),(d) are
courtesy of J.E.
Burke, General
Electric
Company.)
After 4 After 8
seconds seconds
40
Three Stages During Heat Treatment:
3. Grain Growth
• At longer times, average grain size increases
-- Small grains shrink (and ultimately disappear)
-- Large grains continue to grow
0.6 mm 0.6 mm
Adapted from
Fig. (d),(e),
Callister &
Rethwisch 8e.
(Fig. (d),(e) are
courtesy of J.E.
Burke, General
Electric
Company.)
d n - don = Kt
42
Question
d n - don = Kt
43
44
TR = recrystallization
temperature
TR
º
45
Recrystallization Temperature
TR = recrystallization temperature = temperature
at which recrystallization just reaches
completion in 1 h
0.3Tm < TR < 0.6Tm
For a specific metal/alloy, TR depends on:
• %CW -- TR decreases with increasing %CW
• Purity of metal -- TR decreases with
increasing purity
47
Summary
48
Questions for Practice
49
Question 2
50
Question 2 continued
51
Question 3
52