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Induction Cure of Adhesives For Composite Repair Applications
Induction Cure of Adhesives For Composite Repair Applications
James M. Sands
jsands@arl.army.mil 410-306-0878
and
Eric D. Wetzel
ewetzel@arl.army.mil 410-306-0851
• Sub-microwave frequencies
• Pose few risks to human exposure
– Typical amplitudes: 50 - 500 Oe
• Field generated by passing high induction susceptor
coil material
frequency current through water-cooled
copper tubing (induction coil)
– Spatial dispersion of field can be controlled through coil design
Coils
Hand held
induction coil
tube A tube B
adhesive with
magnetic filler
Induction Processing of Adhesives
• Requires incorporation of susceptor material in adhesive
– Adherend preferably a non-susceptor material
non-susceptor induction field
(adherend) susceptor
(adhesive)
( paramagnetic )
Temperature
Density
Temperature Time
(material property measurement) (particle heating in AC magnetic field)
Temperature Control Using
Curie Limit
400 1.0
• Curie temperature determined temperature
by composition of magnetic PSU proc.
window
material 300 0.75
Temperature (°C)
• Choose magnetic material with power
Power Level
Tc = processing temperature
(example, T = 354°C) 200 0.5
• Incorporate filler into adhesive
Composition: 25% Ni in Polysulphone
• Demonstrate constant heating
Curie Temperature of Ni = 354 °C
temperature with power 100 Magnetic Field Frequency = 6.5 MHz 0.25
variation
• Demonstrate induction
adhesive processing in large- 0 0
0 100 200 300
scale structural applications Time (s)
Temperature (°C)
• Heating tests performed at x = 0.25
250
f = 6.28 MHz, Ha = 10 kA/m
x = 0.50
200
• No power regulation used!
150
Temperature (°C)
±65°C
120 ±5°C
• Synthetic particle susceptors
(Zn2Y) demonstrate ideal heating 100
behavior
• Ideal for operator independent 80
performance
60
40
20
0 50 100 150 200 250 300
Time (s)
Dilution Effect on Curie Temperature
• Dilution effect is
200
significant
• Cure rate and cure 180
temperature are poorly
controlled 160
140 FP160, 5%
Temperature (°C)
FP160, 10%
120 FP160, 20%
• Rapidly reach dwell Zn2Y, 5%
temperature Zn2Y, 10%
100 Zn2Y, 20%
• Minimal thermal
gradient in bondline 80
60
40
Induction heating behavior of various
volume fractions of magnetic powders
dispersed in alumina powder, in 14 MHz 20
field at amplitude of 500 W 0 50 100 150 200 250 300
Time (s)
Induction Cured Adhesive
Performance
30
15 minute
Induction cure
25
Lap Shear Strength (MPa)
20
15
90 minute
oven cure
10
Under-
5 cured
0
Oven, 500 W, 500 W, 1 kW, 1 kW, 1.5 kW,
Oven, filled
unfilled 15 min 30 min 5 min 15 min 3 min
Avg (MPa) 25.392 21.132 20.863 22.103 13.375 23.451 6.9547
• No time-dependence on
adhesive toughness
• Performance is not SUCCESSFUL DEMONSTRATION
sensitive to rapid cure
Importance of Induction Control
adhesive
bondline