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cd00002963 82864 4449426
cd00002963 82864 4449426
cd00002963 82864 4449426
STS3DPF20L 20 V <0.11 Ω 3A
■ TYPICAL RDS(on) = 0.090 Ω @ 4.5 V
■ TYPICAL RDS(on) = 0.1 Ω @ 2.7 V
■ STANDARD OUTLINE FOR EASY
AUTOMATED SURFACE MOUNT ASSEMBLY
■ ULTRA LOW THRESHOLD
GATE DRIVE (2.7 V)
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DESCRIPTION
This Power MOSFET is the latest development of
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STMicroelectronis unique "Single Feature Size™"
strip-based process. The resulting transistor
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shows extremely high packing density for low on-
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resistance, rugged avalanche characteristics and
less critical alignment steps therefore a remark- INTERNAL SCHEMATIC DIAGRAM
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able manufacturing reproducibility.
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APPLICATIONS
■ BATTERY MANAGEMENT IN NOMADIC
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EQUIPMENT
■ MOBILE PHONE APPLICATIONS
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ABSOLUTE MAXIMUM RATINGS
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Symbol Parameter Value Unit
VDS Drain-source Voltage (VGS = 0) 20 V
VDGR Drain-gate Voltage (RGS = 20 kΩ) 20 V
VGS Gate- source Voltage ± 12 V
Drain Current (continuous) at TC = 25°C Single Operation 3 A
ID
Drain Current (continuous) at TC = 100°C Single Operation 1.9 A
IDM(•) Drain Current (pulsed) 12 A
Total Dissipation at TC = 25°C Dual Operation 1.6 W
Ptot
Total Dissipation at TC = 25°C Single Operation 2 W
(•) Pulse width limited by safe operating area. Note: For the P-CHANNEL MOSFET actual polarity of voltages and
current has to be reversed
June 2002 1/8
.
STS3DPF20V
THERMAL DATA
Rthj-amb (*)Thermal Resistance Junction-ambient Single Operation 62.5 °C/W
Dual Operating 78 °C/W
Tj Thermal Operating Junction-ambient -55 to150 °C
Tstg Storage Temperature -55 to 150 °C
(*) When Mounted on 0.5 in2 pad of 2 oz.copper
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ON (*)
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Symbol Parameter Test Conditions Min.
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Typ. Max. Unit
VGS(th) Gate Threshold Voltage
Static Drain-source On
VDS = VGS
VGS = 4.5 V
ID = 250 µA
ID = 1.5 A
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0.6
P 0.090 0.110
V
Ω
RDS(on)
Resistance VGS = 2.7 V
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ID = 1.5 A
t 0.100 0.135 Ω
DYNAMIC
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Symbol Parameter
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Test Conditions Min. Typ. Max. Unit
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Ciss Input Capacitance VDS = 25V, f = 1 MHz, VGS = 0 500 pF
Coss Output Capacitance 140 pF
Crss Reverse Transfer
Capacitance
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STS3DPF20V
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
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SOURCE DRAIN DIODE
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Symbol Parameter Test Conditions Min. Typ. Max. Unit
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ISD Source-drain Current 3 A
ISDM (•)
VSD (*)
Source-drain Current (pulsed)
1.2
A
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Tj = 150°C
(See test circuit, Figure 3) le 13
1.3
nC
A
(*)Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
(•)Pulse width limited by safe operating area.
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Safe Operating Area
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STS3DPF20V
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Transconductance Static Drain-source On Resistance
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Gate Charge vs Gate-source Voltage Capacitance Variations
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STS3DPF20V
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Source-drain Diode Forward Characteristics Normalized Breakdown Voltage vs Temperature
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STS3DPF20V
Fig. 1: Switching Times Test Circuits For Resistive Fig. 2: Gate Charge test Circuit
Load
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Fig. 3: Test Circuit For Diode Recovery Behaviour
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6/8
STS3DPF20V
mm inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 1.75 0.068
a1 0.1 0.25 0.003 0.009
a2 1.65 0.064
a3 0.65 0.85 0.025 0.033
b 0.35 0.48 0.013 0.018
b1 0.19 0.25 0.007 0.010
C 0.25 0.5 0.010 0.019
c1 45 (typ.)
D 4.8 5.0 0.188
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0.196
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E 5.8 6.2 0.228 0.244
e 1.27 0.050
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e3 3.81 0.150
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F
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3.8
0.4
4.0
1.27
0.14
0.015
P r 0.157
0.050
M 0.6
te 0.023
S 8 (max.)
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0016023
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STS3DPF20V
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
Oauthorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
8/8
Mouser Electronics
Authorized Distributor
STMicroelectronics:
STS3DPF20V