DEPARTMENT OF ELECTRONICS AND COMMUNICATION ENGINEERING

3D INTEGRATED CIRCUITS

NAME OF THE STUDENT: K.JHANSI NAME OF THE GUIDE: N.ALEKYA

ROLL NUMBER: 18AK1A0431 DESGINATION: ASSISTANT PROFESSOR

3D IC is a concept that can significantly :-

 Improve interconnect performance.

 Increase transistor packing density.

 Reduce chip area

 Power dissipation.

 In 3D design structure the entire chip ‘Si’ is

divided by number of layers of oxide and metal,
to form transistors.
1. Monolithic:-

Electronic components and their connections (wiring) are built in layers on a single
semiconductor wafer, which is then diced into 3D ICs. There is only one substrate, hence no
need for aligning, thinning, bonding, or through-silicon vias.
2. Wafer on wafer:-
Electronic components are built on two or more semiconductor wafers, which are then aligned,
bonded, and diced into 3D ICs.

3. Die on wafer:-
Electronic components are built on two semiconductor wafers. One
wafer is diced aligned and bonded onto die sites of the second wafer.

4.Die on die:-
Electronic components are built on multiple dice, which are then
aligned and bonded. One advantage of die-on-die is that each
Fig: Die on Wafer
component die can be tested first, so that one bad die does not ruin
an entire stack
 3D integration can reduce the wiring, thereby reducing the capacitances, power
dissipation and chip area improves performance.
 Digital and analog circuits can be formed with better noise performance..
 It more cost effective then 2D integration.
3D IC can perform both time and energy characteristics.

 With shorter interconnects in 3D ICs, both switching energy and cycle time are expected
to be reduced
 Thermal Issues in 3D-circuits.

 Reliability Issues
• Many companies like MIT (USA), IBM are doing research on 3D IC technology and
they are going to introduce cheaper chips for certain applications, like memory used in
digital cameras, cell phones, handheld gaming devices etc.
• The original cost will be 10 times lesser than the current one
 3D ICs will be the first of a new generation of dense, inexpensive chips having less
delay and interconnection losses that will replace the conventional storage and
recording media.