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2SK1056, 2SK1057, 2SK1058

Silicon N-Channel MOS FET

ADE-208-1244 (Z)
1st. Edition
Mar. 2001

Application

Low frequency power amplifier

Complementary pair with 2SJ160, 2SJ161 and 2SJ162

Features

• Good frequency characteristic


• High speed switching
• Wide area of safe operation
• Enhancement-mode
• Good complementary characteristics
• Equipped with gate protection diodes
• Suitable for audio power amplifier
2SK1056, 2SK1057, 2SK1058
Outline

TO-3P

G 1
2
3
1. Gate
2. Source
(Flange)
S
3. Drain

Absolute Maximum Ratings (Ta = 25°C)


Item Symbol Ratings Unit
Drain to source voltage 2SK1056 VDSX 120 V
2SK1057 140
2SK1058 160
Gate to source voltage VGSS ±15 V
Drain current ID 7 A
Body to drain diode reverse drain current I DR 7 A
1
Channel dissipation Pch* 100 W
Channel temperature Tch 150 °C
Storage temperature Tstg –55 to +150 °C
Note: 1. Value at TC = 25°C

2
2SK1056, 2SK1057, 2SK1058
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test conditions
Drain to source 2SK1056 V(BR)DSX 120 — — V I D = 10 mA, VGS = –10 V
breakdown voltage 2SK1057 140
2SK1058 160
Gate to source breakdown V(BR)GSS ±15 — — V I G = ±100 µA, VDS = 0
voltage
Gate to source cutoff voltage VGS(off) 0.15 — 1.45 V I D = 100 mA, VDS = 10 V
Drain to source saturation VDS(sat) — — 12 V I D = 7 A, VGD = 0 *1
voltage
Forward transfer admittance |yfs| 0.7 1.0 1.4 S I D = 3 A, VDS = 10 V *1
Input capacitance Ciss — 600 — pF VGS = –5 V, VDS = 10 V,
Output capacitance Coss — 350 — pF f = 1 MHz
Reverse transfer capacitance Crss — 10 — pF
Turn-on time t on — 180 — ns VDD = 20 V, ID = 4 A,
Turn-off time t off — 60 — ns
Note: 1. Pulse test

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2SK1056, 2SK1057, 2SK1058

Power vs. Temperature Derating Maximum Safe Operation Area


150 20
Ta = 25°C
Channel Dissipation Pch (W)

10
ID max (Continuous)
P PW

Drain Current ID (A)


PW W = = 1

D
5

C
100 10 0 m

O
=

pe
1 0 s

ra
s m 1
s sh

tio
2 1 1 ot

n
sh sh

(T C
ot ot

=
1.0

25
50

°C
)
0.5
2SK1056 2SK1057
2SK1058
0.2
0 50 100 150 5 10 20 50 100 200 500
Case Temperature TC (°C) Drain to Source Voltage VDS (V)

Typical Output Characteristics Typical Transfer Characteristics


10 1.0

VGS = 10 V TC = 25°C VDS = 10 V

5°C
8 9 0.8

–2
25
Drain Current ID (A)

Drain Current ID (A)

75
C=
T
6 7 0.6
6
4 5 0.4
4 Pch =
100 W
2 3 0.2
2
1
0
0 10 20 30 40 50 0 0.4 0.8 1.2 1.6 2.0
Drain to Source Voltage VDS (V) Gate to Source Voltage VGS (V)

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2SK1056, 2SK1057, 2SK1058

Drain to Source Saturation Drain to Source Voltage vs.


Voltage vs. Drain Current Gate to Source Voltage
10 10
°C
75
Drain to Source Saturation Voltage

VGD = 0

Drain to Source Voltage VDS (V)


°C °C
5 25 25 TC = 25°C
=– 8
TC
2
VDS (on) (V)

6
5A
1.0
4
0.5

2 2A
0.2
ID = 1 A
0.1
0.1 0.2 0.5 1.0 2 5 10 0 2 4 6 8 10
Drain Current ID (A) Gate to Source Voltage VGS (V)

Input Capacitance vs. Gate Forward Transfer Admittance


Source Voltage vs. Frequency
1000
Forward Transfer Admittance  yfs  (S)

3.0
Input Capacitance Ciss (pF)

1.0

500
0.3

0.1

200 0.03 TC = 25°C


VDS = 10 V
VDS = 10 V 0.01 ID = 2 A
f = 1 MHz
100 0.003
0 –2 –4 –6 –8 –10 10 k 30 k 100 k 300 k 1 M 3 M 10 M
Gate to Source Voltage VGS (V) Frequency f (Hz)

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2SK1056, 2SK1057, 2SK1058
Switching Time vs. Drain Current
500

Switching Time ton,toff (ns)


200 t on

100

50
t off
20

10

5
0.1 0.2 0.5 1.0 2 5 10
Drain Current ID (A)

Switching Time Test Circuit


Output

RL= 2 Ω

Input

PW = 50µs 20 V
duty ratio 50 Ω
=1%

Waveforms
90 %

Input

10 %

t on t off

10 %
Output

90 %

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2SK1056, 2SK1057, 2SK1058

Package Dimensions

As of January, 2001

5.0 ± 0.3
15.6 ± 0.3 4.8 ± 0.2 Unit: mm
φ3.2 ± 0.2 1.5

1.0
0.5

19.9 ± 0.2
14.9 ± 0.2

0.3
2.0

1.6

1.4 Max 2.0


2.8
18.0 ± 0.5

1.0 ± 0.2 0.6 ± 0.2

3.6 0.9
1.0

5.45 ± 0.5 5.45 ± 0.5


Hitachi Code TO-3P
JEDEC —
EIAJ Conforms
Mass (reference value) 5.0 g

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2SK1056, 2SK1057, 2SK1058

Cautions

1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
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contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.

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