TLV271-Q1, TLV272-Q1, TLV274-Q1

FAMILY OF 550-µA/Ch 3-MHz RAIL-TO-RAIL OUTPUT

OPERATIONAL AMPLIFIERS
SGLS275A − OCTOBER 2004 − REVISED JUNE 2008

D Qualified for Automotive Applications Operational Amplifier

D Rail-To-Rail Output
D Wide Bandwidth . . . 3 MHz +
D High Slew Rate . . . 2 .4 V/µs
−
D Supply Voltage Range . . . 2.7 V to 16 V
D Supply Current . . . 550 µA/Channel
D Input Noise Voltage . . . 39 nV/√Hz
D Input Bias Current . . . 1 pA
D Specified Temperature Range
−40°C to 125°C . . . Automotive Grade
D Ultrasmall Packaging
− 5-Pin SOT-23 (TLV271)
D Ideal Upgrade for TLC27x Family
description
The TLV27x takes the minimum operating supply voltage down to 2.7 V over the extended automotive
temperature range while adding the rail-to-rail output swing feature. This makes it an ideal alternative to the
TLC27x family for applications where rail-to-rail output swings are essential. The TLV27x also provides 3-MHz
bandwidth from only 550 µA.
Like the TLC27x, the TLV27x is fully specified for 5-V and ±5-V supplies. The maximum recommended supply
voltage is 16 V, which allows the devices to be operated from a variety of rechargeable cells (±8 V supplies down
to ±1.35 V).
The CMOS inputs enable use in high-impedance sensor interfaces, with the lower voltage operation making
an attractive alternative for the TLC27x in battery-powered applications.
The 2.7-V operation makes it compatible with Li-Ion powered systems and the operating supply voltage range
of many micropower microcontrollers available today including Texas Instruments MSP430.

SELECTION OF SIGNAL AMPLIFIER PRODUCTS†

RAIL-
VIO Iq/Ch GBW SR
DEVICE VDD (V) IIB (pA) SHUTDOWN TO- SINGLES/DUALS/QUADS
(µV) (µA) (MHz) (V/µs)
RAIL
TLV27x 2.7−16 500 550 1 3 2.4 — O S/D/Q
TLC27x 3−16 1100 675 1 1.7 3.6 — — S/D/Q
TLV237x 2.7−16 500 550 1 3 2.4 Yes I/O S/D/Q
TLC227x 4−16 300 1100 1 2.2 3.6 — O D/Q
TLV246x 2.7−6 150 550 1300 6.4 1.6 Yes I/O S/D/Q
TLV247x 2.7−6 250 600 2 2.8 1.5 Yes I/O S/D/Q
TLV244x 2.7−10 300 725 1 1.8 1.4 — O D/Q
† Typical values measured at 5 V, 25°C

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date. Copyright  2008 Texas Instruments Incorporated
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1

TLV271-Q1, TLV272-Q1, TLV274-Q1
FAMILY OF 550-µA/Ch 3-MHz RAIL-TO-RAIL OUTPUT
OPERATIONAL AMPLIFIERS
SGLS275A − OCTOBER 2004 − REVISED JUNE 2008

FAMILY PACKAGE TABLE{

NUMBER OF PACKAGE TYPES} UNIVERSAL
DEVICE
CHANNELS SOIC SOT-23 TSSOP MSOP§ EVM BOARD
TLV271 1 8 5 — — See the EVM
TLV272 2 8 — — 8 Selection Guide
TLV274 4 14 — 14 — (SLOU060)
† For the most current package and ordering information, see the Package Option Addendum at
the end of this document, or see the TI web site at http://www.ti.com.
‡ Package drawings, thermal data, and symbolization are available at
http://www.ti.com/packaging.
§ Product Preview

TLV271 AVAILABLE OPTIONS

PACKAGED DEVICES
VIOMAX AT
TA SMALL OUTLINE SOT-23
25°C
(D) (DBV) SYMBOL
−40°C to 125°C 5 mV TLV271QDRQ1 TLV271QDBVRQ1 271Q

TLV272 AVAILABLE OPTIONS

PACKAGED DEVICES
VIOMAX AT
TA SMALL OUTLINE MSOP
25°C
(D) (DGK) SYMBOL
−40°C to 125°C 5 mV TLV272QDRQ1 TLV272QDGKRQ1†
† Product Preview

TLV274 AVAILABLE OPTIONS

PACKAGED DEVICES
TA VIOMAX AT 25°C SMALL OUTLINE TSSOP
(D) (PW)
−40°C to 125°C 5 mV TLV274QDRQ1 TLV274QPWRQ1

2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

 TLV271-Q1, TLV272-Q1, TLV274-Q1
FAMILY OF 550-µA/Ch 3-MHz RAIL-TO-RAIL OUTPUT
OPERATIONAL AMPLIFIERS
SGLS275A − OCTOBER 2004 − REVISED JUNE 2008

TLV27x PACKAGE PINOUTS(1)

TLV271 TLV271
DBV PACKAGE D PACKAGE
(TOP VIEW) (TOP VIEW)

OUT 1 5 VDD NC 1 8 NC
IN − 2 7 VDD
GND 2 IN + OUT
3 6
GND 4 5 NC
IN+ 3 4 IN −

TLV272 TLV274
D OR DGK PACKAGE D OR PW PACKAGE
(TOP VIEW) (TOP VIEW)

1OUT 1 8 VDD
1OUT 1 14 4OUT
1IN − 2 7 2OUT
1IN − 2 13 4IN −
1IN + 3 6 2IN −
1IN+ 3 12 4IN+
GND 4 5 2IN+
VDD 4 11 GND
2IN+ 5 10 3IN+
2IN − 6 9 3IN −
2OUT 7 8 3OUT
NC − No internal connection
(1) SOT−23 may or may not be indicated

TYPICAL PIN 1 INDICATORS

Pin 1
Printed or Pin 1 Pin 1
Pin 1
Molded Dot Stripe Bevel Edges Molded ”U” Shape

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3

TLV271-Q1, TLV272-Q1, TLV274-Q1
FAMILY OF 550-µA/Ch 3-MHz RAIL-TO-RAIL OUTPUT
OPERATIONAL AMPLIFIERS
SGLS275A − OCTOBER 2004 − REVISED JUNE 2008

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16.5 V
Differential input voltage, VID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± VDD
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.2 V to VDD + 0.2 V
Input current range, II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 10 mA
Output current range, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 100 mA
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 125°C
Maximum junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values, except differential voltages, are with respect to GND.

DISSIPATION RATING TABLE

θJC θJA TA ≤ 25°C TA = 25°C
PACKAGE
(°C/W) (°C/W) POWER RATING POWER RATING
D (8) 38.3 176 710 mW 396 mW
D (14) 26.9 122.3 1022 mW 531 mW
DBV (5) 55 324.1 385 mW 201 mW
DGK (8) 54.23 259.96 481 mW 250 mW
PW (14) 29.3 173.6 720 mW 374 mW

recommended operating conditions

MIN MAX UNIT
Single supply 2.7 16
Supply voltage
voltage, VDD V
Split supply ±1.35 ±8
Common-mode input voltage range, VICR 0 VDD−1.35 V
Operating free-air temperature, TA Q-suffix −40 125 °C

4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

 TLV271-Q1, TLV272-Q1, TLV274-Q1
FAMILY OF 550-µA/Ch 3-MHz RAIL-TO-RAIL OUTPUT
OPERATIONAL AMPLIFIERS
SGLS275A − OCTOBER 2004 − REVISED JUNE 2008

electrical characteristics at specified free-air temperature, VDD = 2.7 V, 5 V, and 15 V (unless

otherwise noted)

dc performance
PARAMETER TEST CONDITIONS TA† MIN TYP MAX UNIT
25°C 0.5 5
VIO Input offset voltage VIC = VDD/2,
/2 VO = VDD/2
/2, mV
Full range 7
RL = 10 kΩ,
kΩ RS = 50 Ω
αVIO Offset voltage drift 25°C 2 µV/°C
VIC = 0 to VDD−1.35V,
1.35V, 25°C 53 70
VDD = 2 7V
2.7
RS = 50 Ω Full range 54
VIC = 0 to VDD−1.35V,
1.35V, 25°C 58 80
CMRR Common mode rejection ratio
Common-mode VDD = 5 V dB
RS = 50 Ω Full range 57
VIC = 0 to VDD−1.35V,
1.35V, 25°C 67 85
VDD = 15 V
RS = 50 Ω Full range 66
25°C 95 106
VDD = 2
2.7
7V
Full range 76
Large signal differential voltage
Large-signal VO(PP) = VDD/2, 25°C 80 110
AVD VDD = 5 V dB
amplification RL = 10 kΩ Full range 82
25°C 77 115
VDD = 15 V
Full range 79
† Full range is − 40°C to 125°C. If not specified, full range is − 40°C to 125°C.

input characteristics
PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT
25°C 1 60
IIO Input offset current pA
VDD = 15 V, VIC = VDD/2, 125°C 1000
VO = VDD/2,, RS = 50 Ω 25°C 1 60
IIB Input bias current pA
125°C 1000
ri(d) Differential input resistance 25°C 1000 GΩ
CIC Common-mode input capacitance f = 21 kHz 25°C 8 pF

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5

TLV271-Q1, TLV272-Q1, TLV274-Q1
FAMILY OF 550-µA/Ch 3-MHz RAIL-TO-RAIL OUTPUT
OPERATIONAL AMPLIFIERS
SGLS275A − OCTOBER 2004 − REVISED JUNE 2008

electrical characteristics at specified free-air temperature, VDD = 2.7 V, 5 V, and 15 V (unless

otherwise noted)

output characteristics
PARAMETER TEST CONDITIONS TA† MIN TYP MAX UNIT
25°C 2.55 2.58
VDD = 2
2.7
7V
Full range 2.48
25°C 4.9 4.93
VIC = VDD/2,
/2 IOH = −1
1 mA VDD = 5 V
Full range 4.85
25°C 14.92 14.96
VDD = 15 V
Full range 14.9
VOH High level output voltage
High-level V
25°C 1.88 2.1
VDD = 2
2.7
7V
Full range 1.42
25°C 4.58 4.68
/2 IOH = −5
VIC = VDD/2, 5 mA VDD = 5 V
Full range 4.44
25°C 14.7 14.8
VDD = 15 V
Full range 14.6
25°C 0.1 0.15
VDD = 2
2.7
7V
Full range 0.22
25°C 0.05 0.1
VIC = VDD/2,
/2 IOL = 1 mA VDD = 5 V
Full range 0.15
25°C 0.05 0.08
VDD = 15 V
Full range 0.1
VOL Low level output voltage
Low-level V
25°C 0.5 0.7
VDD = 2
2.7
7V
Full range 1.15
25°C 0.28 0.4
VIC = VDD/2,
/2 IOL = 5 mA VDD = 5 V
Full range 0.54
25°C 0.19 0.3
VDD = 15 V
Full range 0.35
Positive rail 25°C 4
VO = 0
0.5
5 V from rail
rail, VDD = 2.7
27V
Negative rail 25°C 5
Positive rail 25°C 7
IO Output current VO = 0
0.5
5 V from rail
rail, VDD = 5 V mA
Negative rail 25°C 8
Positive rail 25°C 13
VO = 0
0.5
5 V from rail
rail, VDD = 15 V
Negative rail 25°C 12
† Full range is − 40°C to 125°C. If not specified, full range is − 40°C to 125°C.
‡ Depending on package dissipation rating

6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

 TLV271-Q1, TLV272-Q1, TLV274-Q1
FAMILY OF 550-µA/Ch 3-MHz RAIL-TO-RAIL OUTPUT
OPERATIONAL AMPLIFIERS
SGLS275A − OCTOBER 2004 − REVISED JUNE 2008

electrical characteristics at specified free-air temperature, VDD = 2.7 V, 5 V, and 15 V (unless

otherwise noted) (continued)

power supply
PARAMETER TEST CONDITIONS TA† MIN TYP MAX UNIT
VDD = 2.7 V 25°C 470 560
VDD = 5 V 25°C 550 660
IDD Supply current (per channel) VO = VDD/2 µA
25°C 750 900
VDD = 15 V
Full range 1200

Supply voltage rejection ratio VDD = 2.7 V to 15 V, VIC = VDD /2, 25°C 70 80
PSRR dB
(∆VDD /∆VIO) No load Full range 65
† Full range is − 40°C to 125°C. If not specified, full range is − 40°C to 125°C.

dynamic performance
PARAMETER TEST CONDITIONS TA† MIN TYP MAX UNIT
VDD = 2.7 V 25°C 2.4
UGBW Unity gain bandwidth RL = 2 kΩ
kΩ, CL = 10 pF MHz
VDD = 5 V to 15 V 25°C 3
25°C 1.4 2.1
VDD = 2
2.7
7V V/ s
V/µs
Full range 1
VO(PP) = VDD/2, 25°C 1.4 2.4
SR Slew rate at unity gain VDD = 5 V V/ s
V/µs
CL = 50 pF, RL = 10 kΩ, Full range 1.2
25°C 1.9 2.1
VDD = 15 V V/ s
V/µs
Full range 1.4
φm Phase margin RL = 2 kΩ CL = 10 pF 25°C 65 °
Gain margin RL = 2 kΩ CL = 10 pF 25°C 18 dB
VDD = 2.7 V,
V(STEP)PP = 1 V, AV = −1, 0.1% 2.9
CL = 10 pF, RL = 2 kΩ
ts Settling time 25°C µss
VDD = 5 V, 15 V,
V(STEP)PP = 1 V, AV = −1, 0.1% 2
CL = 47 pF, RL = 2 kΩ
† Full range is − 40°C to 125°C. If not specified, full range is − 40°C to 125°C.

noise/distortion performance
PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT

VDD = 2.7 V, AV = 1 0.02%

VO(PP) = VDD/2 V, AV = 10 25°C
25 C 0.05%
RL = 2 kΩ, f = 10 kHz AV = 100 0.18%
THD + N Total harmonic distortion plus noise
VDD = 5 V, ±5 V, AV = 1 0.02%
VO(PP) = VDD/2 V, AV = 10 25°C
25 C 0.09%
RL = 2 kΩ, f = 10K AV = 100 0.5%
f = 1 kHz 39
Vn Equivalent input noise voltage 25°C nV/√Hz
f = 10 kHz 35
In Equivalent input noise current f = 1 kHz 25°C 0.6 fA /√Hz

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7

TLV271-Q1, TLV272-Q1, TLV274-Q1
FAMILY OF 550-µA/Ch 3-MHz RAIL-TO-RAIL OUTPUT
OPERATIONAL AMPLIFIERS
SGLS275A − OCTOBER 2004 − REVISED JUNE 2008

TYPICAL CHARACTERISTICS

Table of Graphs
FIGURE
CMRR Common-mode rejection ratio vs Frequency 1
Input bias and offset current vs Free-air temperature 2
VOL Low-level output voltage vs Low-level output current 3, 5, 7
VOH High-level output voltage vs High-level output current 4, 6, 8
VO(PP) Peak-to-peak output voltage vs Frequency 9
IDD Supply current vs Supply voltage 10
PSRR Power supply rejection ratio vs Frequency 11
AVD Differential voltage gain & phase vs Frequency 12
Gain-bandwidth product vs Free-air temperature 13
vs Supply voltage 14
SR Slew rate
vs Free-air temperature 15
φm Phase margin vs Capacitive load 16
Vn Equivalent input noise voltage vs Frequency 17
Voltage-follower large-signal pulse response 18, 19
Voltage-follower small-signal pulse response 20
Inverting large-signal response 21, 22
Inverting small-signal response 23
Crosstalk vs Frequency 24

8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

 TLV271-Q1, TLV272-Q1, TLV274-Q1
FAMILY OF 550-µA/Ch 3-MHz RAIL-TO-RAIL OUTPUT
OPERATIONAL AMPLIFIERS
SGLS275A − OCTOBER 2004 − REVISED JUNE 2008

TYPICAL CHARACTERISTICS

COMMON-MODE REJECTION RATIO INPUT BIAS AND OFFSET CURRENT LOW-LEVEL OUTPUT VOLTAGE
vs vs vs
FREQUENCY FREE-AIR TEMPERATURE LOW-LEVEL OUTPUT CURRENT
120 300 2.80

I IB I IO − Input Bias and Offset Current − pA

CMRR − Common-Mode Rejection Ratio − dB

VDD = 2.7 V

VOL − Low-Level Output Voltage − V

VDD = 2.7 V, 5 V and 10 V
250 2.40 T = 125 °C
100 VIC = VDD/2 A

VDD = 5 V, 10 V 2.00
200
80
150 1.60
60
VDD = 2.7 V 1.20
100 TA = 70 °C
40
50 0.80 TA = 25 °C

20 0.40 TA = 0 °C
0
TA = 40 °C
0 −50 0.00
10 100 1k 10 k 100 k 1M −40 −25 −10 5 20 35 50 65 80 95 110 125 0 2 4 6 8 10 12 14 16 18 20 22 24
f − Frequency − Hz TA − Free-Air Temperature − °C IOL − Low-Level Output Current − mA

Figure 1 Figure 2 Figure 3

HIGH-LEVEL OUTPUT VOLTAGE LOW-LEVEL OUTPUT VOLTAGE HIGH-LEVEL OUTPUT VOLTAGE

vs vs vs
HIGH-LEVEL OUTPUT CURRENT LOW-LEVEL OUTPUT CURRENT HIGH-LEVEL OUTPUT CURRENT
2.80 5.00 5.00
VDD = 2.7 V VDD = 5 V VCC = 5 V

V OH − High-Level Output Voltage − V

V OH − High-Level Output Voltage − V

4.50
VOL − Low-Level Output Voltage − V

4.50
2.40 TA = −40°C
TA = 125 °C
4.00 4.00
TA = 0°C
2.00 TA =−40°C 3.50 TA = 70 °C 3.50

TA = 125°C 3.00 3.00

1.60
2.50 2.50
TA = 70°C TA = 25°C
1.20 2.00 TA = 25 °C 2.00
TA = 25°C 1.50
1.50 TA = 0 °C TA = 70°C
0.80
TA = 0°C 1.00 1.00
TA = −40 °C
0.40 TA = 125°C
0.50 0.50

0.00 0.00 0.00

0 1 2 3 4 5 6 7 8 9 10 11 12 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 0 5 10 15 20 25 30 35 40 45
IOH − High-Level Output Current − mA IOL − Low-Level Output Current − mA IOH − High-Level Output Current − mA

Figure 4 Figure 5 Figure 6

LOW-LEVEL OUTPUT VOLTAGE HIGH-LEVEL OUTPUT VOLTAGE PEAK-TO-PEAK OUTPUT VOLTAGE

vs vs vs
LOW-LEVEL OUTPUT CURRENT HIGH-LEVEL OUTPUT CURRENT FREQUENCY
10 10 11
V O(PP) − Peak-to-Peak Output Voltage − V

VDD = 10 V VDD = 10 V VDD = 10 V

10
VOL − Low-Level Output Voltage − V

V OH − High-Level Output Voltage − V

TA =125°C 9
8 8 AV = −10
TA =70°C 8 RL = 2 kΩ
TA = −40°C
CL = 10 pF
7
TA =25°C 6 TA = 25°C
6
6 THD = 5%
TA =0°C
TA = 0°C 5
4 4 VDD = 5 V
TA =−40°C 4
TA = 25°C
3
2 2 TA = 70°C 2 VDD = 2.7 V
1
TA = 125°C
0 0 0
0 20 40 60 80 100 120 0 20 40 60 80 100 120 10 100 1k 10 k 100 k 1M 10 M
IOL − Low-Level Output Current − mA IOH − High-Level Output Current − mA f − Frequency − Hz

Figure 7 Figure 8 Figure 9

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9

TLV271-Q1, TLV272-Q1, TLV274-Q1
FAMILY OF 550-µA/Ch 3-MHz RAIL-TO-RAIL OUTPUT
OPERATIONAL AMPLIFIERS
SGLS275A − OCTOBER 2004 − REVISED JUNE 2008

TYPICAL CHARACTERISTICS

SUPPLY CURRENT POWER SUPPLY REJECTION RATIO

vs vs
SUPPLY VOLTAGE FREQUENCY
1.0 120

PSRR − Power Supply Rejection Ratio − dB

AV = 1 TA = 25°C
0.9
VIC = VDD / 2
TA = 125°C
I DD − Supply Current − mA/ch

100
0.8
TA = 70°C VDD = 5 V, 10 V
0.7
80
0.6

0.5 60 VDD = 2.7 V

0.4 TA = 25°C
40
0.3 TA = 0°C
0.2 TA = −40°C 20
0.1

0.0 0
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 10 100 1k 10 k 100 k 1M
VDD − Supply Voltage − V f − Frequency − Hz

Figure 10 Figure 11

DIFFERENTIAL VOLTAGE GAIN AND PHASE GAIN BANDWIDTH PRODUCT

vs vs
FREQUENCY FREE-AIR TEMPERATURE
120 180 4.0
GBWP −Gain Bandwidth Product − MHz

100 135 3.5

AVD − Differential Voltage Gain − dB

Phase VDD = 10 V
80 90 3.0

60 45 2.5
Phase − °

VDD = 5 V
40 Gain 0 2.0 VDD = 2.7 V

20 −45 1.5

0 VDD=5 V −90 1.0

RL=2 kΩ
−20 CL=10 pF −135 0.5
TA=25°C
−40 −180 0.0
10 100 1k 10 k 100 k 1 M 10 M −40 −25 −10 5 20 35 50 65 80 95 110 125
f − Frequency − Hz TA − Free-Air Temperature − °C

Figure 12 Figure 13

SLEW RATE SLEW RATE PHASE MARGIN

vs vs vs
SUPPLY VOLTAGE FREE-AIR TEMPERATURE CAPACITIVE LOAD
3.0 3.5 100
VDD = 5 V
SR− 90
3.0 RL= 2 kΩ
2.5
SR − Slew Rate − V/ µ s

TA = 25°C
SR − Slew Rate − V/ µ s

SR− 80
2.5 AV = Open Loop
Phase Margin − °

2.0 70
Rnull = 100
2.0 60
1.5 SR+
SR+ 50
1.5
40
1.0 Rnull = 0
AV = 1 VDD = 5 V
1.0 30
RL = 10 kΩ AV = 1
CL = 50 pF RL = 10 kΩ 20 Rnull = 50
0.5
TA = 25°C 0.5 CL = 50 pF
VI = 3 V 10
0.0 0.0 0
2.5 4.5 6.5 8.5 10.5 12.5 14.5 −40 −25 −10 5 20 35 50 65 80 95 110 125
10 100 1000
VCC − Supply Voltage −V TA − Free-Air Temperature − °C CL − Capacitive Load − pF

Figure 14 Figure 15 Figure 16

10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

 TLV271-Q1, TLV272-Q1, TLV274-Q1
FAMILY OF 550-µA/Ch 3-MHz RAIL-TO-RAIL OUTPUT
OPERATIONAL AMPLIFIERS
SGLS275A − OCTOBER 2004 − REVISED JUNE 2008

TYPICAL CHARACTERISTICS

EQUIVALENT INPUT NOISE VOLTAGE

vs VOLTAGE-FOLLOWER LARGE-SIGNAL
FREQUENCY PULSE RESPONSE
Hz 100 4

V − Input Voltage − V
VDD = 2.7, 5, 10 V 3
90
TA = 25°C
V n − Equivalent Input Noise Voltage − nV/

80 2 VDD = 5 V
1 AV = 1
70 VI
RL = 2 kΩ
0
60 CL = 10 pF

V − Output Voltage − V
VI = 3 VPP

I
50 TA = 25°C
40
3
30
2
20 1
VO
10 0

O
0
10 100 1k 10 k 100 k 0 2 4 6 8 10 12 14 16 18
f − Frequency − Hz t − Time − µs

Figure 17 Figure 18

VOLTAGE-FOLLOWER LARGE-SIGNAL VOLTAGE-FOLLOWER SMALL-SIGNAL

PULSE RESPONSE V − Input Voltage − mV
PULSE RESPONSE
8
V − Input Voltage − V

0.12
6
VDD = 10 V 0.08
4 VDD = 5 V
AV = 1
0.04 AV = 1
RL = 2 kΩ
2 VI RL = 2 kΩ
VI CL = 10 pF 0.00 CL = 10 pF
VI = 6 VPP
V − Output Voltage − V

0 VI = 100 mVPP

V − Output Voltage − mV
I

TA = 25°C
I

TA = 25°C 0.12
6
0.08
4
0.04
VO 2 VO
0 0.00
O

O
0 2 4 6 8 10 12 14 16 18 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
t − Time − µs t − Time − µs

Figure 19 Figure 20

INVERTING LARGE-SIGNAL RESPONSE INVERTING LARGE-SIGNAL RESPONSE

V − Input Voltage − V

4 8
V I − Input Voltage − V

3 VI
6
2 VDD = 5 V VDD = 10 V
4
AV = 1 AV = VI = −1
1 RL = 2 kΩ
RL = 2 kΩ 2 VI
0 CL = 10 pF CL = 10 pF
V − Output Voltage − V
I

VI = 3 VPP 0 TA = 25°C
V O − Output Voltage − V

TA = 25°C
6
3
VO
4
2

1 2

0 0
O

VO

0 2 4 6 8 10 12 14 16 0 2 4 6 8 10 12 14 16
t − Time − µs t − Time − µs

Figure 21 Figure 22

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 11

TLV271-Q1, TLV272-Q1, TLV274-Q1
FAMILY OF 550-µA/Ch 3-MHz RAIL-TO-RAIL OUTPUT
OPERATIONAL AMPLIFIERS
SGLS275A − OCTOBER 2004 − REVISED JUNE 2008

TYPICAL CHARACTERISTICS

CROSSTALK
vs
INVERTING SMALL-SIGNAL RESPONSE FREQUENCY
0
V I − Input Voltage − V

VDD = 2.7, 5, & 15 V

−20 VI = 1 VDD/2
0.10
AV = 1
−40 RL = 2 kΩ
0.05 VDD = 5 V
TA = 25°C
AV = VI = −1 VI

Crosstalk − dB
RL = 2 kΩ −60
0.00
CL = 10 pF

V O − Output Voltage − V
VI = 100 mVpp −80
0.10
TA = 25°C
VO
0.05 −100
Crosstalk

0.00 −120

−140
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 10 100 1k 10 k 100 k
t − Time − µs f − Frequency − Hz

Figure 23 Figure 24

APPLICATION INFORMATION

driving a capacitive load

When the amplifier is configured in this manner, capacitive loading directly on the output decreases the device’s
phase margin leading to high frequency ringing or oscillations. Therefore, for capacitive loads of greater than
10 pF, it is recommended that a resistor be placed in series (RNULL) with the output of the amplifier, as shown
in Figure 25. A minimum value of 20 Ω should work well for most applications.
RF

RG
Input − RNULL
Output
+
CLOAD
VDD/2

Figure 25. Driving a Capacitive Load

12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

 TLV271-Q1, TLV272-Q1, TLV274-Q1
FAMILY OF 550-µA/Ch 3-MHz RAIL-TO-RAIL OUTPUT
OPERATIONAL AMPLIFIERS
SGLS275A − OCTOBER 2004 − REVISED JUNE 2008

APPLICATION INFORMATION

offset voltage
The output offset voltage (VOO) is the sum of the input offset voltage (VIO) and both input bias currents (IIB) times
the corresponding gains. The following schematic and formula can be used to calculate the output offset
voltage:
RF

IIB−
RG

RS
VI
+ −
+
VO V
OO
+V
IO ǒ ǒ ǓǓ
1)
R
R
F
G
"I
IB)
R
S ǒ ǒ ǓǓ
1)
R
R
F
G
"I
IB–
R
F

IIB+

Figure 26. Output Offset Voltage Model

general configurations
When receiving low-level signals, limiting the bandwidth of the incoming signals into the system is often
required. The simplest way to accomplish this is to place an RC filter at the noninverting terminal of the amplifier
(see Figure 27).
RG RF

VDD/2
V
V
O +
I
ǒ 1)
R
R
F
G
Ǔǒ 1
1 ) sR1C1
Ǔ
−
VO f + 1
VI + –3dB 2pR1C1
R1
C1

Figure 27. Single-Pole Low-Pass Filter

If even more attenuation is needed, a multiple pole filter is required. The Sallen-Key filter can be used for this
task. For the best results, the amplifier should have a bandwidth that is 8 to 10 times the filter frequency
bandwidth. Failure to do this can result in phase shift of the amplifier.
C1
R1 = R2 = R
C1 = C2 = C
Q = Peaking Factor
(Butterworth Q = 0.707)
VI +
R1 R2 _ f + 1
–3dB 2pRC
C2
RF
RG =
1
RG
RF
( 2−
Q )
VDD/2

Figure 28. 2-Pole Low-Pass Sallen-Key Filter

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 13

TLV271-Q1, TLV272-Q1, TLV274-Q1
FAMILY OF 550-µA/Ch 3-MHz RAIL-TO-RAIL OUTPUT
OPERATIONAL AMPLIFIERS
SGLS275A − OCTOBER 2004 − REVISED JUNE 2008

APPLICATION INFORMATION

circuit layout considerations

To achieve the levels of high performance of the TLV27x, follow proper printed-circuit board design techniques.
A general set of guidelines is given in the following.
D Ground planes—It is highly recommended that a ground plane be used on the board to provide all
components with a low inductive ground connection. However, in the areas of the amplifier inputs and
output, the ground plane can be removed to minimize the stray capacitance.
D Proper power supply decoupling—Use a 6.8-µF tantalum capacitor in parallel with a 0.1-µF ceramic
capacitor on each supply terminal. It may be possible to share the tantalum among several amplifiers
depending on the application, but a 0.1-µF ceramic capacitor should always be used on the supply terminal
of every amplifier. In addition, the 0.1-µF capacitor should be placed as close as possible to the supply
terminal. As this distance increases, the inductance in the connecting trace makes the capacitor less
effective. The designer should strive for distances of less than 0.1 inches between the device power
terminals and the ceramic capacitors.
D Sockets—Sockets can be used but are not recommended. The additional lead inductance in the socket pins
will often lead to stability problems. Surface-mount packages soldered directly to the printed-circuit board
is the best implementation.
D Short trace runs/compact part placements—Optimum high performance is achieved when stray series
inductance has been minimized. To realize this, the circuit layout should be made as compact as possible,
thereby minimizing the length of all trace runs. Particular attention should be paid to the inverting input of
the amplifier. Its length should be kept as short as possible. This helps to minimize stray capacitance at the
input of the amplifier.
D Surface-mount passive components—Using surface-mount passive components is recommended for high
performance amplifier circuits for several reasons. First, because of the extremely low lead inductance of
surface-mount components, the problem with stray series inductance is greatly reduced. Second, the small
size of surface-mount components naturally leads to a more compact layout thereby minimizing both stray
inductance and capacitance. If leaded components are used, it is recommended that the lead lengths be
kept as short as possible.

14 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

 TLV271-Q1, TLV272-Q1, TLV274-Q1
FAMILY OF 550-µA/Ch 3-MHz RAIL-TO-RAIL OUTPUT
OPERATIONAL AMPLIFIERS
SGLS275A − OCTOBER 2004 − REVISED JUNE 2008

APPLICATION INFORMATION
general power dissipation considerations
For a given θJA, the maximum power dissipation is shown in Figure 29 and is calculated by the following formula:

P
D
+ ǒT
q
–T
MAX A
JA
Ǔ
Where:
PD = Maximum power dissipation of TLV27x IC (watts)
TMAX = Absolute maximum junction temperature (150°C)
TA = Free-ambient air temperature (°C)
θJA = θJC + θCA
θJC = Thermal coefficient from junction to case
θCA = Thermal coefficient from case to ambient air (°C/W)

MAXIMUM POWER DISSIPATION

vs
FREE-AIR TEMPERATURE
2
PDIP Package TJ = 150°C
Low-K Test PCB
1.75
θJA = 104°C/W
Maximum Power Dissipation − W

1.5 MSOP Package

Low-K Test PCB
SOIC Package θJA = 260°C/W
1.25 Low-K Test PCB
θJA = 176°C/W
1

0.75

0.5

0.25 SOT-23 Package

Low-K Test PCB
θJA = 324°C/W
0
−55 −40 −25 −10 5 20 35 50 65 80 95 110 125
TA − Free-Air Temperature − °C

NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB.

Figure 29. Maximum Power Dissipation vs Free-Air Temperature

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 15

TLV271-Q1, TLV272-Q1, TLV274-Q1
FAMILY OF 550-µA/Ch 3-MHz RAIL-TO-RAIL OUTPUT
OPERATIONAL AMPLIFIERS
SGLS275A − OCTOBER 2004 − REVISED JUNE 2008

APPLICATION INFORMATION
macromodel information
Macromodel information provided was derived using Microsim Parts Release 9.1, the model generation
software used with Microsim PSpice . The Boyle macromodel (see Note 2) and subcircuit in Figure 30 are
generated using TLV27x typical electrical and operating characteristics at TA = 25°C. Using this information,
output simulations of the following key parameters can be generated to a tolerance of 20% (in most cases):
D Maximum positive output voltage swing D Unity-gain frequency
D Maximum negative output voltage swing D Common-mode rejection ratio
D Slew rate D Phase margin
D Quiescent power dissipation D DC output resistance
D Input bias current D AC output resistance
D Open-loop voltage amplification D Short-circuit output current limit
NOTE 2: G. R. Boyle, B. M. Cohn, D. O. Pederson, and J. E. Solomon, “Macromodeling of Integrated Circuit Operational Amplifiers,” IEEE Journal
of Solid-State Circuits, SC-9, 353 (1974).
3 99
VDD
+
rd1 rd2 rss css egnd fb ro2
rp
c1 −
7
11 12 +
1 c2 vlim
IN+ + 9 r2 6
−
vc
D D + 8
−
2 vb ga
G G
IN− 53 − gcm ioff ro1
S S
OUT
dp dlp dln 5
10 91 90 92

iss dc + + −
vlp hlim vln
GND − − +
4 − + 54
ve de
*DEVICE=amp_tlv27x_highVdd,OP AMP,NJF,INT ga 6 0 11 12 16.272E−6
* amp_tlv_27x_highVdd operational amplifier ”macromodel” gcm 0 6 10 99 6.8698E−9
* subcircuit updated using Model Editor release 9.1 on 05/15/00 iss 10 4 dc 1.3371E−6
* at 14:40 Model Editor is an OrCAD product. hlim 90 0 vlim 1K
* j1 11 2 10 jx1
* connections: non-inverting input J2 12 1 10 jx2
* | inverting input r2 6 9 100.00E3
* | | positive power supply rd1 3 11 61.456E3
* | | | negative power supply rd2 3 12 61.456E3
* | | | | output ro1 8 5 10
* | | | | | ro2 7 99 10
.subckt amp_tlv27x_highVdd 1 2 3 4 5 rp 3 4 150.51E3
* rss 10 99 149.58E6
c1 11 12 457.48E−15 vb 9 0 dc 0
c2 6 7 5.0000E−12 vc 3 53 dc .78905
css 10 99 1.1431E−12 ve 54 4 dc .78905
dc 5 53 dy vlim 7 8 dc 0
de 54 5 dy vlp 91 0 dc 14.200
dlp 90 91 dx vln 0 92 dc 14.200
dln 92 90 dx .model dx D(Is=800.00E−18)
dp 4 3 dx .model dy D(Is=800.00E−18 Rs=1m Cjo=10p)
egnd 99 0 poly(2) (3,0) (4,0) 0 .5 .5 .model jx1 NJF(Is=500.00E−15 Beta=198.03E−6 Vto=−1)
fb 7 99 poly(5) vb vc ve vlp vln 0 .model jx2 NJF(Is=500.00E−15 Beta=198.03E−6 Vto=−1)
176.02E6 −1E3 1E3 180E6 .ends
−180E6
Figure 30. Boyle Macromodel and Subcircuit
PSpice and Parts are trademarks of MicroSim Corporation.

16 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

 PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

TLV271QDBVRQ1 ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 271Q

TLV271QDRG4Q1 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 T271Q1

TLV271QDRQ1 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 T271Q1

TLV272QDRG4Q1 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 T272Q1

TLV272QDRQ1 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 T272Q1

TLV274QDRG4Q1 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 TLV274Q1

TLV274QDRQ1 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 TLV274Q1

TLV274QPWRG4Q1 ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 TLV274Q

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF TLV271-Q1, TLV272-Q1, TLV274-Q1 :

• Catalog: TLV271, TLV272, TLV274

NOTE: Qualified Version Definitions:

• Catalog - TI's standard catalog product

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 16-Feb-2022

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TLV271QDBVRQ1 SOT-23 DBV 5 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
TLV274QPWRG4Q1 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 16-Feb-2022

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLV271QDBVRQ1 SOT-23 DBV 5 3000 182.0 182.0 20.0
TLV274QPWRG4Q1 TSSOP PW 14 2000 367.0 367.0 35.0

Pack Materials-Page 2
 PACKAGE OUTLINE
DBV0005A SCALE 4.000
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR

C
3.0
2.6 0.1 C
1.75 1.45
B A
1.45 0.90
PIN 1
INDEX AREA

1 5

2X 0.95
3.05
2.75
1.9 1.9
2

4
3
0.5
5X
0.3
0.15
0.2 C A B (1.1) TYP
0.00

0.25
GAGE PLANE 0.22
TYP
0.08

8
TYP 0.6
0 TYP SEATING PLANE
0.3

4214839/F 06/2021

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.25 mm per side.

www.ti.com
 EXAMPLE BOARD LAYOUT
DBV0005A SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR

PKG
5X (1.1)
1
5
5X (0.6)

SYMM
(1.9)
2
2X (0.95)

3 4

(R0.05) TYP (2.6)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:15X

SOLDER MASK
SOLDER MASK METAL METAL UNDER OPENING
OPENING SOLDER MASK

EXPOSED METAL EXPOSED METAL

0.07 MAX 0.07 MIN

ARROUND ARROUND

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED)

SOLDER MASK DETAILS

4214839/F 06/2021

NOTES: (continued)

5. Publication IPC-7351 may have alternate designs.

6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
DBV0005A SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR

PKG
5X (1.1)
1
5
5X (0.6)

SYMM
2 (1.9)
2X(0.95)

3 4

(R0.05) TYP
(2.6)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE:15X

4214839/F 06/2021

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.

www.ti.com
 PACKAGE OUTLINE
D0008A SCALE 2.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A PIN 1 ID AREA
6X .050
[1.27]
8
1

.189-.197 2X
[4.81-5.00] .150
NOTE 3 [3.81]

4X (0 -15 )

4
5
8X .012-.020
B .150-.157 [0.31-0.51]
.069 MAX
[3.81-3.98] .010 [0.25] C A B [1.75]
NOTE 4

.005-.010 TYP
[0.13-0.25]

4X (0 -15 )

SEE DETAIL A
.010
[0.25]

.004-.010
0 -8 [0.11-0.25]
.016-.050
[0.41-1.27] DETAIL A
(.041) TYPICAL
[1.04]

4214825/C 02/2019

NOTES:

1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.

www.ti.com
 EXAMPLE BOARD LAYOUT
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

8X (.061 )
[1.55]
SYMM SEE
DETAILS
1
8

8X (.024)
[0.6] SYMM

(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:8X

SOLDER MASK SOLDER MASK

METAL METAL UNDER
OPENING OPENING SOLDER MASK

EXPOSED
METAL EXPOSED
METAL
.0028 MAX .0028 MIN
[0.07] [0.07]
ALL AROUND ALL AROUND

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED

SOLDER MASK DETAILS

4214825/C 02/2019

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

8X (.061 )
[1.55] SYMM

1
8

8X (.024)
[0.6] SYMM

(R.002 ) TYP
5 [0.05]
4
6X (.050 )
[1.27]
(.213)
[5.4]

SOLDER PASTE EXAMPLE

BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X

4214825/C 02/2019

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.

www.ti.com
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