Z168 & 169 repair manual

(Factory training)

Shanghai Communications Technology Co., Ltd. and Germany Shanghai Wind Communication Technologies Co., Ltd.
Contents ( table of Contents)
Introduction
Introduction
Introduction

1. file name: Z168 & 169 Maintenance Manual

2. Version: V1.0

Technical documents
3. Fiction: Li Qing

4. Audit:

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Transition page

Introduction
Introduction
Introduction

1. Equipment and tools you need

2. Important key components and test points

Maintenance Manual directory contents3. Board plan view

4. Repair method

5. Repair Schematics

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Transition page

Introduction
Introduction
Introduction

Chapter I: equipment and tools you need

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Transition page

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Introduction

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Transition page

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Introduction

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Introduction

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Transition page

Introduction
Introduction
Introduction

Chapter two: Important key components and test points

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 Text + picture page

Introduction
Introduction
Introduction
Power management ch
Tag: U2001

Introduction
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 Text + picture page

Introduction
Introduction
Introduction
FLASH
Tag: U4102

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 Text + picture page

Introduction
Introduction
Introduction

LCD & TP Interface

Tag: CON6101
Introduction
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 Text + picture page

Introduction
Introduction
Introduction
Front and rear camera interface
before camera Interface Tag: CON6202
Rear camera Interface Tag: CON6201

Introduction
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 Text + picture page

Introduction
Introduction
Introduction
A gravity sensor
Tag: U6303

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 Text + picture page

Introduction
Introduction
Introduction
From light pe
Tag: U6302

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 Text + picture page

Introduction
Introduction
Introduction
NFC chip (169)
Tag: U3901

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 Text + picture page

Introduction
Introduction
Introduction
SIM card interface
SIM2 Tag: CON4001 SIM1 & T A
card number: CON4002

Introduction
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 Text + picture page

Introduction
Introduction
Introduction
Interface Board Size
Tag: CON6404

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 Text + picture page

Introduction
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Introduction
Side key connector
Tag: CON6401

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 Text + picture page

Introduction
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Introduction
Speaker Amplifier PA
Tag: U6403

Introduction
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 Text + picture page

Introduction
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Introduction
Test Points

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Introduction
Introduction
Introduction
Handset Headphone & MIC &

Introduction
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Battery Interface
Tag: CON2101

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Introduction
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Introduction
Charging IC
Tag: U2101

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Introduction
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Introduction
Flash IC
After flash IC Tag: U2301
Pre-flash IC Tag: U2302

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IC screen bias
Tag: U2304

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The backlight
Tag: U2305

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RF transceiver IC
Tag: U3101

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3 / 4G RF PA
Tag: U3201

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2G RF PA
Tag: U3301

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RF diversity switch
Tag: U3401

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Introduction
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Introduction

Chapter 3: a plan view of the motherboard

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PCBA -Top Handset contacts
before Camera Connector

Pilot lamp

before flash

From light perception

Headphones on
gravity sensor

base Band chip

3 / 4G Shoot frequency PA
MT6737

26M Crystal

Speaker amplifier chip

Shoot Frequency Transceiver IC

FLASH

2G Shoot frequency PA

Battery connector

The size of the board Connector

32
PCBA-Bottom Deputy Mike
Headphones on

Shoot Frequency test socket

backlight chip screen Pressure chip

Rear Camera Connector

Partial screen

NFC chip( 169 WIFI / GPS / Bluetooth

) / FM chip

Switch / volume key Rear Flash driver chip

Shoot Frequency coaxial seat

Power management chip

Shoot Frequency test socket

32.768K Crystal

Screen/ TP Connector

Charge Power chip

SIM card 1 / T card Flash shrapnel
SIM card 2
Transition page

Introduction
Introduction
Introduction

Chapter 4: Maintenance Methods

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1. Upgrade failure failure analysis

Rise No response level

Yes

Yes

Check the download tool set if there are problems Again Set up

no

Yes

an examination USB connector Welding functions for problems weight Welding or replacement

no

more Change the motherboard

2. can not boot failure analysis

Unable to start

Yes

Yes

Re liter Whether the software level OK Re liter level

no
Yes

Battery Problems more change

no
Yes

Switch Whether the key issue more change

no

more Change the motherboard

3. Abnormal failure analysis

Display Huaping / Black, no display

Yes

Yes
LCD FPC Assembly problems Again Assembly

no

Yes
LCD FPC damage more change

no

Yes
LCD bad more change

no

more Change the motherboard

37
4. Failure Analysis ringtones

no Ringtones / Ringtones Miscellaneous

Yes

Yes
Speaker assembly problems Again Assembly

no

Yes
Speaker Problems more change

no

Yes
SUB Small plates connection FPC problem weight Group or replace

no

Yes
SUB Small plates problem more change

no

more Change the motherboard

38
5. No echo Fault Analysis

No reply

Yes

Not hear other side: Yes

Handset bad; bad earpiece weight Group or replace

no

Yes
The other party can not hear:
weight Welding or replacement
Motherboard and small plates connection FPC Failure; platelet poor

no

more Change the motherboard

39
6. Camera Trouble analysis

You can not take pictures / photograph blur

Yes

Yes
Camera assembly problems weight group

no

Yes
Camera Issues more change

No

Yes

Camera connector is soldered problem weight Welding or replacement

No

more Change the motherboard

Trouble analysis 7.T card

Can not Recognition T card

Yes

Yes
T Deck Deformation or damage shrapnel more change

no

Yes
T Deck Welding problems weight Welding or replacement

no

more Change the motherboard

41
8. SIM does not know Fault Analysis

Do not knowledge SIM

Yes

Yes
SIM Deck Whether shrapnel deformation more change

no

Yes
SIM Deck Welding problems weight Welding or replacement

no

more Change the motherboard

42
 9. Charging Fault Analysis

Can not charge Electricity/ Charge Electric alarm

Yes

Yes
USB If the connector is soldered in question weight Welding or replacement

no

Yes
Battery Problems weight Welding or replacement

no

more Change the motherboard

43
10. Vibration Failure Analysis

Vibration-free move/ Vibration Moving Miscellaneous

Yes

Yes
SUB Small plates connection FPC problem weight Group or replace

no

Yes
Vibration Welding actuator for problems Again welding

no

Yes
Vibration Actuator itself is the problem more change

no

Yes
Vibration Actuator 2 More PAD It Between the resistance is normal Again Welding power chip or replacement

no

more Change the motherboard

44
11. Failure Analysis bad touch

No counter-touch function or Should slow

Yes

Yes

Touch FPC Is there damage more change

no

Yes
Whether there is a touch screen problem more change

no

more Change the motherboard

45
13. No Signal Fault Analysis

No signal / low power

Yes

Yes

Check coaxial connection between the motherboard and the small plate is normal Again Assembly

no

Yes
PCBA with SUB PCBA On fire The connector frequency welding is problematic weight Welding or replacement

no

more Changing the motherboard or a small board

46
14. GPS / WiFi Failure Analysis

GPS / WiFi did not work

Yes

Yes
Part of the non-functional Setting related functions

no

Yes
day Line contact is good shrapnel Again Assembly

no

Yes
GPS / WIFI day Line problem more change

no

more Change the motherboard

47
15. The headset Analysis

No function headphone

Yes

Yes
headset Line if there are problems more change

no

Yes
Headphone jack Welding for problems weight Welding or replacement

no

more Change the motherboard

48
16. The virtual keys failure analysis

press Key non-functional

Yes

Yes
CTP FPC Assembly problems Again Assembly

No
Yes

CTP bad more change

No

more Change the motherboard

49
Button 17. Fault Analysis

press Key non-functional

Yes

Yes
FPC Poor installation re-install

no

no

press key FPC Component issues more Renewed FPC

no

more Change the motherboard

50
Transition page

Introduction
Introduction
Introduction

Chapter V: Repair Schematics

principle Map Tag Map

Shanghai
Shanghai and Daytona
Shanghai
Communications - Technology
Communications
Shanghai Co.,
Technology
Communications
Technology Co., Ltd. andLtd.
Co.,
Technology Shanghai
Ltd. and Germany
Co.,
Germany Ltd.
And internal
and Wind
Shanghai
ShanghaiGermanyCommunication
Wind
Wind Communication
Communication
Shanghai
data communication is
Technologies
Technologies
Wind Communication Co., Ltd.
Technologies
strictly prohibited rumored
Technologies
Germany
Co.,
Co.,
Co., Ltd.
Ltd.
Ltd.
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Shanghai Communications Technology Co., Ltd. and Germany Shanghai Wind Communication Technologies Co., Ltd.