NEW CARBON MATERIALS

Volume 34, Issue 2, Apr 2019

Online English edition of the Chinese language journal

Cite this article as: New Carbon Materials, 2019, 34(2):161-169 RESEARCH PAPER

The effects of graphene content on the corrosion

resistance, and electrical, thermal and mechanical
properties of graphene/copper composites
Jian Wang1,2, Li-na Guo1, Wan-ming Lin1, Jin Chen1,, Shuai Zhang1, Shao-da Chen1, Tian-tian
Zhen1, Yu-yang Zhang1
1
College of Materials Science and Engineering, Taiyuan University of Technology, Taiyuan 030024, China;
2
Taiyuan Iron and Steel (Group) Co., LTD., Taiyuan 030003, China

Abstract: Graphene reinforced copper matrix (G/Cu) composites were prepared by temperature-programmed sintering of their mixtures in
molds under pressure. The effects of graphene content on the microstructure, and electrical, thermal, mechanical and corrosion properties of the
G/Cu composites were investigated. Results show that the hardness, tensile strength, yield strength, thermal and electrical conductivities, and
corrosion resistance of the composites all reached maxima at a graphene content of 0.5 wt.%. The addition of graphene increased the thermal and
electrical conductivities, tensile and yield strengths, and hardness of the composites, but led to defect formation in the graphene due to the thermal
expansion mismatch between graphene and copper. Therefore, an optimal graphene content was needed to obtain the best improvement of these
properties. Tafel and electrochemical impedance tests using the composite as the working electrode, Pt as the counter electrode and a saturated
calomel electrode as a reference electrode showed that the composite with a graphene content of 0.5 wt% had the lowest corrosion current of
3.45×10-6 μA/cm2 and the highest charge transfer resistance of 1705 Ω·cm2.

Key Words: Graphene；Copper matrix composites；Conductivity; Corrosion resistance; Mechanical properties

1 Introduction
Graphene is regarded as a single-layered crystallite that is
a building unit of many forms of carbons. The hybridization of
carbon atoms in graphene is a sp 2 type, where there is an
equivalent π electron whose mobility is very high, leading to
largest electrical and thermal conductivities [1-3].
Copper-matrix composites are widely used in the
automotive, aerospace and electrical and electronics industries
owing to their good electrical and thermal conductivities and
easy processing properties[5]. Although fiber and particle
reinforcements are used to improve their mechanical
properties, their electrical and thermal conductivities is not
satisfying. Therefore, it is highly necessary to develop
copper-matrix composites with excellent electrical, thermal
and mechanical properties[6-9]. Graphene is considered to be an
ideal reinforcement for copper-matrix composites owing to its
high electrical and thermal conductivities, and excellent
mechanical properties[10].
In this paper, an electric field-activated pressure-assisted
synthesis (FAPAS) method was used to prepare copper matrix
graphene(G/Cu) composites, C1(pure copper), C2(0.5 wt.%
G/Cu), C3(1 wt.% G/Cu) and C4(1.5 wt.% G/Cu). The effects
of the graphene content on the microstructure, hardness,
electrical conductivity, thermal conductivity and corrosion
resistance of the G/Cu composites were investigated.
2 Experimental
2.1 Materials
The graphene used for testing was provided by Shanxi
Hengyi Tianjia Nano Material Technology Co., Ltd., which
was prepared by a mechanical exfoliation method. Copper
powder was used as the matrix material. The copper powder
and graphene were mixed in a high-speed vibrating ball mill
(QM-3B) under an argon atmosphere.
2.2 Preparation of copper matrix graphene composites
The mixture of copper powder and graphene was placed
in a graphite mold with a diameter of 20 mm, evacuated to a
pressure of 2×10-1 Pa, pre-pressed at 10 MPa, heated to 600 °C
at a heating rate of 50 °C/min, held for 5 min, pressed at 55
MPa, heated and kept at 750 °C for 15 min, and finally
sintered.
2.3 Characterization

Received date: 30 Dec 2018; Revised date: 30 Mar 2019

*Corresponding author. E-mail: chenjin2013815@126.com
Copyright©2019, Institute of Coal Chemistry, Chinese Academy of Sciences. Published by Elsevier Limited. All rights reserved.
DOI: 10.1016/S1872-5805(19)60009-0
 Jian Wang et al. / New Carbon Materials, 2019, 34(2): 161-169

SEM(TESCANMIRA3 LMH/LMU) equipped with an
energy spectrometer (EDS), TEM and HRTEM(JEM-2100F)
were used to observe the micro-morphology of graphene and
the G/Cu composites and to calculate the number of layers of
graphene. A electrochemical workstation (HC1660E), a
Vickers hardness tester (MCRO-586),
microcomputer-controlled electronic universal testing
machine (DNS200) ， a thermal conductivity detector
(NETZSCH-LFA447) and a electrical conductivity detector
(FD120) were used to test the corrosion resistance, mechanical
properties, thermal conductivity and the electrical conductivity
of the G/Cu composites.
3 Results and discussion
3.1 Microstructure of the graphene nanoplates and bulk
composites
Fig. 1(a) shows a Raman spectrum of graphene. In the
Raman spectrum, the D peak is located at 1 351 cm-1 as a
defect peak, which reflects the disorder of graphene. The G
peak is located near 1 580 cm-1, which is caused by the tensile
vibration between the sp2 hybridized carbon atoms. The peak
intensity ratio of the D peak to the G peak (ID/IG=0.47) is used
to characterize the defect size of graphene [11]. The 2D peak
appears near 2 696 cm-1, and its position and intensity reflect
the stacking of graphene. The peak intensity ratio of the G
a peak to the 2D peak is related to the number of graphene
layers, the graphene IG/I2D of 3-4 layers is approximately 0.5,
and the graphene IG/I2D of 1.07 is approximately 5 layers [12-13].
Fig. 1(b) is the SEM image of as-prepared graphene. The
overall color in the figure is bright, indicating that graphene
has fewer layers. Fig.1(c) shows the TEM and HRTEM
images of graphene. TEM is used to observe the microscopic
morphology and the size of graphene, and to characterize the
number of layers of graphene. The surface of the graphene
creases shows a folded layered structure and a surface
morphology rich in wavy folds, so that the graphene surface
observed by TEM has different color region like SEM. The
HRTEM image is used to calculate the number of layers of
graphene, and the number of layers of graphene is 2 to 5
layers.

Fig. 1 (a) Raman spectrum of graphene, (b) SEM image of as-prepared graphene, (c) TEM and HRTEM images of graphene.

Fig. 2 (a) OM image of C2, (b) SEM image of C2 and (c) EDS image of C2.

Fig. 2 (a) shows the microscopic morphology of C2 under by EDS, and the second phase on the surface of C2 is
the optical microscope. From the image, it can be seen that graphene.
graphene is randomly distributed along the grain boundary of 3.2 Thermal and electrical conductivities of Cu and the
copper matrix. Fig. 2(b) shows the microtopography of C2
G/Cu composites
under SEM. There is a mismatch in thermal expansion
Fig. 3(a) shows the thermal conductivity of pure copper
coefficient between the graphene and copper matrix, and
and the copper matrix composites. The thermal conductivities
residual stress produces dislocations at the interface, as shown
of C1, C2, C3 and C4 are 381, 392, 371 and 331 W/mK,
in the blue dashed box. Fig. 2(c) shows the EDS diagram of
respectively. Compared with C1, the thermal conductivity of
C2. The material matrix and the second phase were analyzed
 Jian Wang et al. / New Carbon Materials, 2019, 34(2): 161-169
C2 is increased by 2.9%, C3 and C4 are decreased by 2.6 and
13.1%, respectively.
There are three factors that determine the thermal
conductivity of a material, firstly, the grain size and
dislocation density of the material[14], secondly, the thermal
expansion mismatch and wetting properties of the matrix
material and the filler material [15], and lastly, the defects such
as holes and holes generated during the sintering of the
material.
Graphene is dispersed uniformly in the copper matrix
with a little amount of addition, so the influence on the grain
size and thermal expansion mismatch of the material is limited.
The large size of graphene can effectively compensate the
influence of defects such as pores and holes generated in the
G/Cu composites during sintering, which is beneficial to the
movement of phonons [16] and the improvement of thermal
conductivity.
As the content of graphene increases, the grain size and
dislocation density of the composite increases, the nonlinear
thermal vibration between the lattice increases. There is a
certain coupling between the lattice waves, and there will be
collision between phonons, which reduces the mean free path
of phonons. With the dislocation density of the composites
increases, the interaction between lattice waves becomes
larger, the probability of collision between phonons is larger,
and the corresponding mean free path is smaller. The
Fig. 3 (a) Thermal conductivities of pure copper and the copper matrix composites, (b) electrical conductivities of pure copper and the
copper matrix composites.
3.3 Mechanical properties of the G/Cu composites
Fig. 4(a) shows the relative density of pure Cu and the
G/Cu composites. The relative density of pure Cu is 98%. The
relative densities of the G/Cu composites are 97% (C2), 96%
(C3) and 94% (C4), respectively. Due to the low wettability of
graphene and copper [15], the increase of graphene content
leads to the increase of the defects such as cracks and holes.
Subsequently, the relative density of the G/Cu composites
decreases [17].
Fig. 4(b) shows the Vickers Hardness of pure Cu and the
G/Cu composites. The hardness of C1, C2, C3 and C4 is
70HV, 85HV, 78HV and 72HV respectively. Compared with
C1, and the hardness of the G/Cu composite increases by
scattering caused by the collision between phonons is the main
source of thermal resistance in crystals. It is also one of the
causes for the decrease in thermal conductivity of the
composites. Due to the large thermal expansion mismatch and
low wettability between the copper matrix and graphene, the
interfacial thermal resistance of the composites is further
improved as the content of graphene increases. In sintering,
holes and other defects of the composites also play a role in
preventing heat flow diffusion and transfer, and the thermal
conductivity of C3 and C4 decreases significantly. Therefore,
the thermal conductivity of C2 with a graphene content of 0.5
wt.% is optimal.
Fig. 3(b) shows the electrical conductivities of pure
copper and the copper matrix composites. The conductivity of
C1, C2, C3 and C4 is 90%IACS, 94%IACS, 83%IACS and 76%
IACS, respectively. Compared with C1, the conductivity of
C2 is increased by 4.4%, while that of C3 and C4 are
decreased by 7.7% and 15.5%, respectively. Similar to the
thermal conductivity mechanism, the graphene content of 0.5
wt.% of C2 maintains a high conductivity. As the content of
graphene in the copper matrix increases, the dislocation
density of the composite increases, which reduces the mean
free path of electrons and increases the scattering capacity of
electrons, leading to the decline of the electrical conductivity
of the composite.
17.6%, 11.4% and 2.8% for C2, C3 and C4, respectively. The
hardness values of the G/Cu composites increase significantly,
especially for the G/Cu composite (C2) with 0.5 wt.%
graphene, which has the most significant enhancement effect
on the copper matrix. With a further increase of graphene
content, the hardness values of the G/Cu composites gradually
decrease. The hardness of the G/Cu composite with 1.5 wt.%
graphene decreases most obviously.
The reason for the hardness change of the G/Cu
composites is that the large thermal expansion mismatch
between the copper matrix and graphene, as shown in the
dashed box in Fig. 2(b) and (c). There is a high dislocation
density [18]. The transfer of the load from the copper matrix to
 Jian Wang et al. / New Carbon Materials, 2019, 34(2): 161-169

the graphene reinforcement depends mainly on the interfacial
bonding strength of the copper matrix and the graphene
reinforcement. Graphene is dispersed in the grain boundary of
copper and can effectively prevent atoms from diffusing
through the grain boundary, improving the hardness of the
G/Cu composites.
The distribution of graphene at the grain boundaries of
copper increases with increasing graphene content. The
wettability of copper and graphene is poor, and a large amount
of multilayer graphene accumulates at the grain boundaries of
copper, causing a large number of defects such as small holes,
and cracks at the grain boundaries of copper, which affects the
hardness of the G/Cu composites.

Fig.4 (a) Relative density of copper and the copper matrix composites, (b) Vicker hardness of copper and the copper matrix composites.

Fig. 5 shows the fracture morphology of pure Cu and the
G/Cu composites, and graphene is distributed in the matrix of
copper. Fig. 5(a) is the fracture topography of C1, and the
dimple-like pattern is a typical plastic fracture morphology.
As the graphene content increases, the size and depth of the
dimples change, which is a sign of the toughness deterioration
of the composites. Some graphene is exposed to the fracture
surface, which is caused by crack propagation along the
interface during the fracture process. In addition, the
dispersion of graphene in the composite material is related to
its content in the composite material. According to the
previous research, the high graphene content makes the
graphene more easily agglomerate. The bonding and load
transfer effects become weakened, resulting in a decrease in
the mechanical properties of the composites.

Fig. 5 SEM images of the G/Cu composites with different graphene contents: (a) C1, (b) C2, (c) C3 and (d) C4.
 Jian Wang et al. / New Carbon Materials, 2019, 34(2): 161-169

Fig. 6(a) shows stress-strain curves of the G/Cu
composites with different graphene contents. The mechanical
properties of C1 and the G/Cu composites are compared. In
order to further analyze the relation of graphene content and
mechanical properties of the composites, Fig. 6(b) shows the
ultimate tensile strength (UTS) and fracture elongation of C1
and the G/Cu composites. The yield strength, UTS, and
fracture elongation of C1 are 73 MPa, 191 MPa and 32%
respectively. The yield strength, UTS and fracture elongation
of the G/Cu composites are C2 (122 MPa, 270 MPa, 30%), C3
(113 MPa, 240 MPa, 19%) and C4 (95 MPa, 221 MPa, 13%),
respectively. Compared with C1, the yield strength of the
G/Cu composites increases by 67%, 54% and 30%, the UTS
increases by 40%, 25%, and 15% while the fracture elongation
decreases by 6%, 40% and 59% for C2, C3 and C4,
respectively. The addition of graphene improves the
mechanical properties of copper. The main mechanism is the
change of the microstructure of the metal matrix. Firstly, the
plastic region near graphene produces high dislocation density
due to the large thermal expansion mismatch between Cu
matrix and graphene. Secondly, the size of the grains is
reduced, and the ability of the grain boundaries to resist
dislocation slip is enhanced. With the increase of graphene
content, the graphene agglomerated at the grain boundaries of
the copper matrix causes defects such as cracks and voids,
which reduces the strength and plasticity of the composites.

Fig. 6 Tensile properties of the G/Cu composites with different graphene contents. (a) stress-strain curves, (b) relationship of UTS and
fracture elongation with graphene content.

3.4 Electrochemical corrosion behavior of the G/Cu is that the migration speed of electrons is faster than the
composites reaction speed of electrodes. The addition of graphene
increases the rate at which the metal ions are transferred into
Tafel test and electrochemical impedance (EIS) test are
the solution during the anodic reaction, which is higher rate
carried out on C1, C2, C3 and C4 in an electrochemical
than the rate at which the electrons flow from the cathode into
workstation. Fig. 7(a) shows the polarization curves of pure
the external circuit. Therefore, the cathode will accumulate an
copper and the G/Cu composites.
excess of negative charge, causing the cathode potential to
The polarization curves of the G/Cu composites move to
move to the negative direction.
the negative direction as a whole compared with pure copper.
The essence of this electrochemical polarization phenomenon
Table 1 Polarization curve parameters obtained using the Tafel test for Cu and the G/Cu composites
in a 3.5 wt.% NaCl electrolyte solution.
Sample βc(V decade-1) βa(V decade-1) Ecorr(V) Icorr(μA/cm2)

C1 -0.33 0.05 -0.21 4.81×10-6

C2 -0.22 0.06 -0.24 3.45×10-6
C3 -0.21 0.06 -0.24 3.52×10-6
C4 -0.12 0.09 -0.27 4.06×10-6

Table 1 lists the polarization curve data obtained by the
Tafel test. The current densities of C1, C2, C3, and C4 are
4.81×10-6, 3.45×10-6, 3.52×10-6 and 4.06×10-6 μA/cm2,
respectively. Compared with C1, the current density of the
G/Cu composites decreases by 28.2%, 26.8% and 15.5% for
C2, C3 and C4, respectively.
The reason for the decrease of the corrosion current
density of the G/Cu composites is the polarization of the
corroded battery and the current passage leads to the reduction
of potential difference between the two stages, which results
in the reduction of the corrosion current, thereby corrosion
rate is reduced. Therefore, the addition of graphene can
 Jian Wang et al. / New Carbon Materials, 2019, 34(2): 161-169

effectively improve the corrosion resistance of the copper
matrix composites.
With the increase of graphene, the surface defects of the
G/Cu composites increase, and the potential difference
between the two grades of the corrosion cell increases,
resulting in current density increase of C3 and C4, but
compared with C1, the G/Cu composites all have the better
corrosion resistance performance.
Fig. 7(b) shows the Nyquist plots. In the high-frequency
region, the capacitive loop of pure Cu and the G/Cu
composites appears due to the film capacitance and film
resistance of the copper-containing oxide on the electrode
surface. The AC impedance spectra show a “diffusion tail” at
the low frequency, which is caused by Warburg impedance.
The Warburg impedance at the low frequency indicates that
the corrosion process on the electrode surface is
diffusion-controlled in the electrochemical reactions. The
diffusion impedance is represented by a straight line with a
slope of 45°, reflecting the fact that the corrosion process is
controlled by the diffusion of copper ions within the oxide
film.
Fig. 7(c) shows the Bode plots. Pure Cu and the G/Cu
composites have the highest impedance at low frequencies,
and C2 has a highest impedance among the four samples. A
high impedance indicates a high resistance to electrochemical
reactions at the electrode surface. The greater the corrosion
resistance of the electrode surface, the better the passivation
effect of the material at low frequencies.
Fig. 7(d) shows an equivalent circuit(EEC) model used to
fit the EIS experimental data for analyzing the electrochemical
properties of the materials. Table 2 lists the EIS data of the
pure copper and the G/Cu composites using an equivalent
circuit model, where Rs is the solution resistance, Cdl is the
double layer electric capacitance, Rt is the charge transfer
resistance, and W is the Warburg impedance.

Fig. 7 Copper and the G/Cu composites, (a) Tafel curves, (b) Nyquist plots, (c) Bode plots and (d) the Equivalent electrical circuits model.

Table 2 EIS parameters obtained using EEC for Cu and the G/Cu composites in a 3.5wt.% NaCl electrolyte solution.

Sample Rs(Ω·cm2) Cdl(F·cm2) Rt(Ω·cm2) W S*s^(1/2)/cm2

-4
C1 4.17 1.14×10 1619 1.815×10-3
-5
C2 3.518 9.487×10 1705 1.474×10-3
-4
C3 3.611 2.085×10 1406 1.87×10-3
C4 4.005 2.904×10-4 1008 1.938×10-3

As shown in Table 2, the charge transfer resistances Rt of resistance of C2 is 5.3% higher than while the transfer
pure Cu and the G/Cu composites are 1 619, 1 705, 1 406 and resistances of C3 and C4, respectively 13.1% and 37.7%
1 008 Ω·cm2 for C1, C2, C3 and C4, respectively. The transfer lower than that of C1.
 Jian Wang et al. / New Carbon Materials, 2019, 34(2): 161-169
The reason for the increase in the transfer resistance of
C2 is that the addition of graphene decreases the Warburg
impedance of C2, that is, the ability of copper ions to diffuse
within the oxide film decreases, which effectively increases
the charge transfer resistance (Rt). Meanwhile, the double
layer capacitance(Cdl) decrease indicates that C1 has more
active sites on the surface than C2, so the chloride ions are
more likely to react on the surface of C1. With the increase of
graphene content, the charge transfer resistance and Warburg
Fig. 8 SEM images of electrochemical corroded pure Cu and the G/Cu composites with
different graphene contents：(a) C1, (b) C2, (c) C3 and (d) C4.
Fig. 8 is the SEM images of electrochemical corroded
pure Cu and the G/Cu composites. As shown in the figure,
after immersion in a 3.5 wt.% NaCl solution, a large amount
of granular corrosion products are produced on the surface of
the samples. Compared with C1, the corrosion product on the
surface of C2 is more uniform and compact. With the increase
of graphene content, a large amount of agglomerated graphene
forms, which leads to uneven corrosion of the surface of the
samples and reduces the corrosion resistance of the
composites to a certain degree. Therefore, adding 0.5 wt.%
graphene can effectively improve the corrosion resistance of
copper.
4 Conclusions
Copper powder and graphene were sintered to prepare
three G/Cu composites with graphene contents of 0.5 wt.%,
1 wt.% and 1.5 wt.%. The influence of graphene contents on
the microstructure and properties of the G/Cu composites was
investigated. When 0.5 wt.% graphene was added, and the
graphene dispersed in the grain boundaries of copper matrix
impedance of C3 and C4 decrease obviously. The main reason
is that the increase of graphene content results in the thermal
expansion mismatch between graphene and copper and the
increase of surface defects, which greatly improves the
diffusion ability of copper ions in the oxide film, leading to a
significant decrease in the charge transfer resistance and an
increase in the corrosion rate. In short, the G/Cu with 0.5 wt.%
graphene has the best corrosion resistance.
produced a highest dislocation density, which prevented
dislocation movement in grain boundaries and enhanced the
hardness of the G/Cu composite. The small amount of
graphene added has a limited effect on the crystallite size of
the copper matrix, and the flake-shaped graphene can
effectively compensate for the defects produced, which
obviously improves the electrical and thermal conductivities
of the composites. Graphene addition reduces the potential
difference between the two poles of the corrosion cell, slows
down the corrosion rate, reduces the diffusion rate of copper
ions in the oxide film, increases the resistance of the
composite, and improves the corrosion resistance of the G/Cu
composites. With a further increase of graphene content, the
surface defects, dislocation density, grain size, and thermal
expansion mismatch between copper and graphene result in a
significant decrease in the thermal conductivity, electrical
conductivity, hardness, and corrosion resistance of the
composites. In summary, the addition of 0.5 wt.% graphene
can effectively improve the hardness, thermal conductivity,
 Jian Wang et al. / New Carbon Materials, 2019, 34(2): 161-169
electrical conductivity, and corrosion resistance of the G/Cu
composite.
References:
[1] Geim A K, Novoselov K S. The rise of graphene[J]. Nature
Materials, 2007, 6: 183-191.
[2] Lee C, Wei X, Kysar J W, et al. Measurement of the elastic
properties and intrinsic strength of monolayer graphene[J].
Science, 2008, 321: 385-388.
[3] Balandin A A, Ghosh S, Bao W Z, et al. Superior thermal
conductivity of single-layer graphene[J]. Nano Letter, 2008, 8:
902-907.
[4] Lee C, Hone J. Measurement of the elastic properties and
intrinsic strength of monolayer graphene [J]. Science, 2012,
5887: 358-338.
[5] Guo X H, Song K X, Liang S H, et al. Effect of the thermal
expansion characteristics of reinforcements on the electrical
wear performance of copper matrix composite[J]. Tribology
Transactions, 2014, 57( 2): 283-291．
[6] Leon C A, Rodriguez-Ortiz G, Nanko M, et al. Pulsed electric
current sintering of Cu matrix composites reinforced with plain
and coated alumina powders[J]. Powder Technology, 2014,
252(1): 1-7.
[7] Azem S, Nechiche M, Taibi K. Development of copper matrix
composite reinforced with FeAl particles produced by
combustion synthesis[J]. Powder Technology, 2011, 208(2):
515-520.
[8] Li J, Wang X, Qiao Y, et al. High thermal conductivity through
interfacial layer optimization in diamond particles dispersed
Zr-alloyed Cu matrix composites[J]. Scripta Materialia, 2015,
109: 72-75.
[9] Rajkovic V, Bozic D, Stasic J, et al. Processing, characterization
and properties of copper-matrix composites strengthened by low
amount of alumina particles[J]. Powder Technology, 2014, 268:
392-400.
[10] Novoselov K S, Geim A K, Morozov S V, et al. Electric field in
atomically thin carbon films[J]. Science, 2004, 306(5696):
666-669．
[11] Ferrari A C, Meyer J C, Scardaci V, et al. Raman spectrum of
graphene and graphene layers[J]. Physical Review Letters, 2006,
97(18): 187401.
[12] Gupta A, Chen G, Joshi P, et al. Eklund, Raman scattering from
high-frequency phonons in supported n-graphene layer films[J].
Nano Letters, 2006, 6(12): 2667-2673.
[13] Ferrari A C, Meyer J C, Scardaci V, et al. Raman spectrum of
graphene and graphene layers[J]. Physical Review Letters, 2006,
97(18): 187401.
[14] Goli P, Ning H, Li X, et al. Thermal properties of
graphene-copper-graphene heterogeneous films[J]. Nano Letters,
2014, 14(3): 1497-1503.
[15] Nan C W, Birringer R, Clarke D R, et al. Effective thermal
conductivity of particulate composites with interfacial thermal
resistance[J]. Journal of Applied Physics, 1998, 81(10):
6692-6699.
[16] Gao X, Yue H Y, Guo E, et al. Mechanical properties and
thermal conductivity of graphene reinforced copper matrix
composites[J]. Powder Technology, 2016, 301: 601-607.
[17] Chen F Y, Ying J M, Wang Y F, et al. Effects of graphene
content on the microstructure and properties of copper matrix
Composites[J]. Carbon, 2016, 96: 836-842.
[18] Wei J N, Li Z B, Han F S. Thermal mismatch dislocations in
macroscopic graphite particle-reinforced metal matrix
composites studied by internal friction[J]. Physica Status Solidi,
2015, 191(1): 125-136.