Solutions for Fundamentals of Modern Manufacturing, 3/e (published by Wiley) © MPGroover 2007

36 ELECTRONICS ASSEMBLY AND PACKAGING

Review Questions
36.1 What are the functions of a well-designed electronics package?
Answer. The principal functions are (1) power distribution and signal interconnection, (2) structural
support, (3) environmental protection, (4) heat dissipation, (5) minimum delays in signal
transmission.
36.2 Identify the levels of packaging hierarchy in electronics.
Answer. The levels are (0) chip intraconnections, (1) IC chip to IC package, (2) IC component to
PCB, (3) PCB to rack or chassis, and (4) wiring and cabling inside a cabinet.
36.3 What is the difference between a track and a land on a printed circuit board?
Answer. A track is a copper-conducting path on a PCB, while a land is a small copper area for
electrically attaching components.
36.4 Define what a printed circuit board (PCB) is.
Answer. A PCB is a laminated flat panel of insulating material to which electronic components are
attached and electrically interconnected.
36.5 Name the three principal types of printed circuit board?
Answer. The three types are (1) single-sided board, (2) double-sided board, and (3) multilayer
board.
36.6 What is a via hole in a printed circuit board?
Answer. A via hole is a hole in the printed circuit board whose sides are plated with copper to serve
as a conducting path from one side of a PCB to the other or between intermediate layers in a
multilayer board.
36.7 What are the two basic resist coating methods used for printed circuit boards?
Answer. The two methods are (1) screening, such as silk screening, and (2) photolithography.
36.8 What is etching used for in PCB fabrication?
Answer. Etching is used to remove copper cladding on the PCB surface to define the tracks and
lands of the circuit.
36.9 What is continuity testing, and when is it performed in the PCB fabrication sequence?
Answer. Continuity testing is an electrical test in which contact probes are brought into contact
with track and land areas to insure the existence of electrical conduction paths. Continuity tests are
generally used (1) after the bare board has been fabricated and (2) again after the board has been
populated with components.
36.10 What are the two main categories of printed circuit board assemblies, as distinguished by the
method of attaching components to the board?
Answer. The two categories are (1) pin-in-hole technology, also known as through-hole
technology, and (2) surface mount technology.
36.11 What are some of the reasons and defects that make rework an integral step in the PCB fabrication
sequence?

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Solutions for Fundamentals of Modern Manufacturing, 3/e (published by Wiley) © MPGroover 2007

Answer. Rework is required to correct the following types of defects: (1) replace defective
components, (2) insert missing components, (3) repair faulty solder joints, and (4) repair of copper
film that has lifted from the substrate surface.
36.12 Identify some of the advantages of surface mount technology over conventional through-hole
technology.
Answer. Advantages of SMT include (1) smaller components, (2) higher packing densities, (3)
components can be mounted on both sides of the board, (4) smaller PCBs are possible for the same
function, (5) reduced number of holes drilled in the board, and (6) certain undesirable electrical
effects are reduced, such as spurious surface capacitances and inductances.
36.13 Identify some of the limitations and disadvantages of surface mount technology?
Answer. Limitations and disadvantages of SMT include (1) components are more difficult for
humans to handle, (2) SMT components are generally more expensive than THT components, (3)
inspection, testing, and rework are more difficult, and (4) certain types of components are not
available in SMT.
36.14 What are the two methods of component placement and soldering in surface mount technology?
Answer. The two methods are (1) adhesive bonding and wave soldering and (2) solder paste and
reflow soldering.
36.15 What is a solder paste?
Answer. A solder paste is a suspension of solder powders in a flux binder. The flux binder includes
an adhesive that attaches the SMT components to the board surface. The solder constitutes about
85% of the total volume of the paste.
36.16 Identify the two basic methods of making electrical connections.
Answer. The two methods are: (1) soldering, and (2) pressure connections.
36.17 Define crimping in the context of electrical connections?
Answer. Crimping involves the mechanical forming of a terminal barrel to form a permanent
connection with the stripped end of a conductor wire.
36.18 What is press-fit technology in electrical connections?
Answer. A press-fit technology in the context of electrical connections is an interference fit
between a terminal pin and the plated hole into which it is inserted.
36.19 What is a terminal block?
Answer. A terminal block consists of a series of evenly spaced receptacles that allow connection of
individual wires or terminals.
36.20 What is a pin connector?
Answer. A pin connector is a connector with multiple pins or blades that are inserted into the holes
of a mating receptacle to establish electrical contact.
Multiple Choice Quiz
There is a total of 14 correct answers in the following multiple-choice questions (some questions have
multiple answers that are correct). To attain a perfect score on the quiz, all correct answers must be given.
Each correct answer is worth 1 point. Each omitted answer or wrong answer reduces the score by 1 point,
and each additional answer beyond the correct number of answers reduces the score by 1 point. Percentage
score on the quiz is based on the total number of correct answers.

Excerpts from this work may be reproduced by instructors for distribution on a not-for-profit basis for testing or instructional purposes only to
students enrolled in courses for which the textbook has been adopted. Any other reproduction or translation of this work beyond that permitted
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Solutions for Fundamentals of Modern Manufacturing, 3/e (published by Wiley) © MPGroover 2007

36.1 The second level of packaging refers to which one of the following: (a) component to printed circuit
board, (b) IC chip to package, (c) intraconnections on the IC chip, or (d) wiring and cabling
connections?
Answer. (a).
36.2 Surface mount technology is included within which one of the following levels of packaging: (a)
zeroth, (b) first, (c) second, (d) third, or (e) fourth?
Answer. (c).
36.3 Card-on-board (COB) packaging refers to which one of the following levels in the electronics
packaging hierarchy: (a) zeroth, (b) first, (c) second, (d) third, or (e) fourth?
Answer. (d).
36.4 Which of the following polymeric materials is commonly used as an ingredient in the insulation
layer of a printed circuit board (two correct answers): (a) copper, (b) E-glass, (c) epoxy, (d)
phenolic, (e) polyethylene, and (f) polypropylene?
Answer. (c) and (d).
36.5 Typical thickness of the copper layer in a printed circuit board is which one of the following: (a)
0.100 inch, (b) 0.010 inch, (c) 0.001 inch, or (d) 0.0001 inch?
Answer. (c).
36.6 Photolithography is widely used in PCB fabrication. Which of the following is the most common
resist type used in the processing of PCBs: (a) negative resists or (b) positive resists?
Answer. (a).
36.7 Which of the following plating processes has the higher deposition rate in PCB fabrication: (a)
electroless plating or (b) electroplating?
Answer. (b).
36.8 In addition to copper, which one of the following is another common metal plated onto a PCB: (a)
aluminum, (b) gold, (c) nickel, or (d) tin?
Answer. (b).
36.9 Which of the following are the soldering processes used to attach components to printed circuit
boards in through-hole technology (two best answers): (a) hand soldering, (b) infrared soldering, (c)
reflow soldering, (d) torch soldering, and (e) wave soldering?
Answer. (a) and (e).
36.10 In general, which of the following technologies results in greater problems during rework: (a)
surface mount technology, or (b) through-hole technology?
Answer. (a).
36.11 Which of the following electrical connection methods produce a separable connection (two correct
answers): (a) crimping of terminals, (b) press fitting, (c) soldering, (d) terminal blocks, and (e)
sockets?
Answer. (d) and (e).

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students enrolled in courses for which the textbook has been adopted. Any other reproduction or translation of this work beyond that permitted
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