Tensan 4109A is a one-component epoxy adhesive designed for bonding SMD components to printed circuit boards. It cures at high temperatures and has suitable properties for high-speed SMT placement machines. The adhesive has excellent thixotropy and adhesive strength after curing. Instructions note it should be warmed before use and applied via screen printing with a thick mask.
Tensan 4109A is a one-component epoxy adhesive designed for bonding SMD components to printed circuit boards. It cures at high temperatures and has suitable properties for high-speed SMT placement machines. The adhesive has excellent thixotropy and adhesive strength after curing. Instructions note it should be warmed before use and applied via screen printing with a thick mask.
Tensan 4109A is a one-component epoxy adhesive designed for bonding SMD components to printed circuit boards. It cures at high temperatures and has suitable properties for high-speed SMT placement machines. The adhesive has excellent thixotropy and adhesive strength after curing. Instructions note it should be warmed before use and applied via screen printing with a thick mask.
Tensan 4109A is a one-component epoxy adhesive designed for bonding SMD components to printed circuit boards. It cures at high temperatures and has suitable properties for high-speed SMT placement machines. The adhesive has excellent thixotropy and adhesive strength after curing. Instructions note it should be warmed before use and applied via screen printing with a thick mask.
Tensan 4109A is a one-component epoxy Item Index adhesive, curing at high temperature. Specific Gravity It is designed for SMD components on 1.38 (g/cm3) printed circuit board bonding. 4109A has Viscosity at 5rpm 25℃ 390.000cps suitable for high-speed SMT placement Adhesive Strength machine Dispensing and stencil printing. It 38N(3.9kgf) ( 2125c) is of high adhesive strength after curing . Adhesive Strength REACH, ROHS, certified 38N(3.9kgf) (Mini-mold tr) Excellent thixotropy Adhesive Strength Good adhesive strength after curing 92N(9.4kgf) (SOP-IC 16P) Easy to mix and use Thixotropy Index 5.0 Instructions and Precautions Electric Property 1.8*10^1 (Ω.cm) Cold storage 4109A to be rewarmed before Resistance Insulation use, 30ml syringe to be 1 hour, 300ml 24 3.4*10^14 (Ω.cm) hours. Storage tank or dispensing mouth Resistance Initial Value temperature at 25℃-30℃ can help 2.1*10^32 (Ω.cm) improve the high-speed dispensing effect. Precautions: 150℃/60sec Curing Condition 130℃/90sec 1.In order to avoid contaminating unused glue, any glue can not be back into the original packaging. Applying Method Screen Printing Thick Mask 2.Glue placing in the air will absorb trace Dielectric Constant 3.8 (100KHz) moisture performance, which will influence Dielectric Loss Tangent 0.027 (100KHz) the properties of glue, so it should be Preservation Condition Refrigerated storage at 2-8℃ avoided. In the stencil printing, do not put 30ml/syringe Package Style SMT printed circuit board in the air for too 200gl/syringe long, patch curing as soon as possible, if possible, air humidity should be controlled. Other Information Packing Information The above information are correct, but does not contain all of the information and can 30ml/syringe only be used as a guide. 200g/syringe This product is ROHS, REACH, compliant. It does not contain any unknow carcinogenic, Storage and Validity mutagenic or teratogenic components. 2-8℃, cool and dry place, it can be stored For further info please visit our web: for 6 months; room temperature (25℃), it www.sztensan.com can be stored for 1 month.