KEC-151P-251P - Electronics Engg. Lab Micro

JSS Academy of Technical Education – NOIDA JSS Academy of Technical Education – NOIDA JSS Academy of Technical Education – NOIDA
Electronics Lab (KEC-151P/KEC-251P) Manual (ECE I/II Semester) Electronics Lab (KEC-151P/KEC-251P) Manual (ECE I/II Semester) Electronics Lab (KEC-151P/KEC-251P) Manual (ECE I/II Semester)
ELECTRONICS ENGINEERING LAB
LABORATORY MANUAL INDEX
0
Page
UNIVERSITY SYLLABUS Sl. No LIST OF EXPERIMENTS CO
No
1. Study of Active and Passive components CO1 8-9
Understanding Basic concepts associated with printed circuit board

2. CO1 10-12
design and soldering techniques.
PCB Lab:
3. a) Artwork and printing of a simple PCB CO2 13-15
b) Etching and drilling of PCB
4. Winding shop: Step-down transformer winding of less than 5 VA CO2 16-18
Soldering Shop: Soldering and disoldering of Resistor in PCB

B. Tech, Semester- I & II 5. Soldering and disoldering of ICs in PCB CO2 19-20
KEC 151P & 251P Soldering and disoldering of Capacitor in PCB
6. Setting specific AC/DC signals and perform their measurements CO3 21-24
P-N Junction diode: Characteristics of PN Junction diode - Static and

7. CO4 25-27
dynamic resistance measurement from graph.
SESSION: 2021-22, ODD/EVEN SEMESTER Applications of PN Junction diode: Half & Full wave rectifier-
8. CO4 28-31
Measurement of VRMS, VDC, and ripple factor.
Name
Roll. No. Characteristics of Zener diode: V-I characteristics of Zener diode,

9. CO4 32-33
Graphical measurement of forward and reverse resistance
Group/ Batch
10. To study and Plot Characteristics of BJT: BJT in CE configuration. CO4 34-36
11. To study Operational Amplifier as Adder and Subtractor CO4 37-38
12. Verification of Truth Table of Various Logic Gates. CO5 39-44
Implementation of the given Boolean function using logic gates in

JSS MAHAVIDHYAPEETHA 13.
both SOP and POS forms.
CO5 45-48
JSS Academy of Technical Education

Department of Electronics & Communication Engineering
C-20/1, Sec -62 NOIDA
Department of Electronics & Communication Engineering 5 Department of Electronics & Communication Engineering 6 Department of Electronics & Communication Engineering 7
JSS Academy of Technical Education – NOIDA JSS Academy of Technical Education – NOIDA JSS Academy of Technical Education – NOIDA JSS Academy of Technical Education – NOIDA
Electronics Lab (KEC-151P/KEC-251P) Manual (ECE I/II Semester) Electronics Lab (KEC-151P/KEC-251P) Manual (ECE I/II Semester) Electronics Lab (KEC-151P/KEC-251P) Manual (ECE I/II Semester) Electronics Lab (KEC-151P/KEC-251P) Manual (ECE I/II Semester)
EXPERIMENT-1 EXPERIMENT-2
Following points should be taught in the Lab:
Aim: To study active and passive components. a. Discuss various types of passive & active components and their types, symbolic Aim: To understand basic concepts associated with printed circuit board design and soldering techniques.
Objectives of the experiment: representations, specific indicators that aid in measuring their values. Pre-Experiment Questions:
a. To study the specifications of the active and passive components. b. Discuss various applications of passive & active components. 1) What purpose is served by the PCB? Mention different types of PCBs.
b. Identify the given component, find its specifications and perform validation. c. Illustrate the procedure of measuring forward current gain for NPN transistor, reading its 2) What is the requirement of soldering?
Pre-Experiment Questions: data sheet, finding matched transistor for replacement. 3) What is the use of flux in soldering?
1. List out the common components that you have come across so far. d. Explain the significance of referring to the datasheets the specifications mentioned in the Equipment/Components Required: Different types of PCBs, Electric Soldering iron, Solder
2. How do you check the suitability of any component for the given circuit? datasheets of an IC. wire, Flux and sample PCB for soldering.
Components Required: Observation Table: Theory Fig.2 Double Sided PCB
Set of given components (Resistor, Capacitor, Inductor, Diode, BJT, IC) of different values In the observation table students are expected to perform measurements for different resistors, Different Types of PCBs:
Theory: capacitors. Draw symbol for PN junction diode, IC and BJT. Measure specific parameters and get b. Multilayer PCBs
PCB is a thin board made of fiberglass, composite epoxy, or other laminate material. Conductive
Active Components: Active Components are electronic components that require a Source of familiarize with the component data sheet. These PCBs further enlarges the density and complexity of PCB designs by adding extra
pathways are etched or "printed" onto board, connecting different components on the PCB, such
Energy to perform their intended functions. They have capability of generating and amplifying a Passive Components layers beyond the top & bottom layers seen in a configuration of double sided. With the
as transistors, resistors, and integrated circuits.
signal. Examples: Diode, Transistor, SCR etc. accessibility of over many layers in multilayer printed circuit board configurations, multilayer
Components Symbol Value as per Value measured using Tolerance The different types of printed circuit boards are as follows:
Passive components: Passive components are electrical components that do not require any form PCBs let designers to make very thick and highly compound designs.
Type Colour Code multimeter a. Single Sided PCB
of electrical power to operate. Examples: Resistors, Inductors, Capacitors etc. Resistor 1. This single sided printed circuit board includes just one layer of base material or substrate. One
Passive devices do not provide gain, amplification or directionality to a circuit but instead provide c. Rigid PCB
2. end of the substrate is coated with a thin layer of metal, usually copper because it is a good
attenuation as they always have a gain less than unity. Therefore, passive devices can not In addition to having different numbers of layers & sides, Printed circuit boards can also
3. electrical conductor. Components are mounted on one side of PCB (on plain surface).
generate, oscillate or amplify an electrical signal. come in changing inflexibilities. Most customers usually think of inflexible PCBs when they
Capacitor 1.
image a circuit board. Rigid printed circuit boards use a solid, rigid substrate material like
Active Components Passive Components 2.
fiberglass that remains the board from twisting. A motherboard within the tower of a computer is
3.
the best example of an inflexible PCB.
Inductor
Active Components
Component Symbol and Schematic and Important Specification Measured
Specification referring to the data sheet parameters
Diode
BJT
FET
IC
Fig.1 Single Sided PCB
Result & Conclusion: Comment on the error in the value calculated and measured using
instrument.
a. Double Sided PCB
This type of PCBs is much more popular than single-sided boards. Both sides of the Fig.3 Rigid PCB
board’s substrate include metal conductive layers, and elements attach to both sides as well. Holes
in the PCB let circuits on a single side to attach to circuits on the other side. These circuit boards d. Flex PCB
used to connect the circuits on every side using one of two techniques: through-hole & surface Generally, the substrate in a flexible board is a flexible plastic. This fundamental material
mount technology. Surface mount technology is different from through-hole technology, it does permits the board to fit into the forms that is not possible with inflexible boards. Flex boards can
Fig.1 Active and Passive Components not utilize wires. In this technology leads are soldered straight onto the board. also come in three formats, namely single sided, double-sided or multilayer formats.
Department of Electronics & Communication Engineering 8 Department of Electronics & Communication Engineering 9 Department of Electronics & Communication Engineering 10 Department of Electronics & Communication Engineering 11
e. Rigid-Flex PCB e. Remove from water and dry in an oven at 60 degrees. them. Always keep at least 2 spare 0.8mm drill bits, as they always break just when you need a
Rigid flex boards merge technology from both flexible and rigid circuit boards. An easy rigid-flex EXPERIMENT-3 2. Photo printing using negative: PCB really urgently. 1.0 and larger are more resilient, but one spare is always a good idea.
board comprises of a rigid circuit board those joints to a flex circuit board. These boards can be To be carried out in a room with yellow light 5. When making two identical boards, it is possible to drill them both together to save time. To
more compound if design requests demand. Aim: To understand different processes involved in PCB design 1. Collect a single side copper clad sheet which is of the size of the negative. do this, carefully drill a 0.8mm hole in the pad nearest each corner of each of the two boards,
Objective of the Experiment: 2. Clean the copper surface with pumice powder and steel wool. getting the center as accurate as possible. For larger boards, drill a hole near the center of each
RESULT & CONCLUSION: a. To understand making of artwork & printing the circuit 3. Coat the copper clad sheet with lpr e1020 a negative photo resists. side as well. Lay the boards on top of each other, and insert a 0.8mm track pin in 2 opposite
Post-Experiment Questions: b. To understand process of etching, drilling and tinning. 4. Dry the copper clad sheet in an oven at 60 degrees. corners, using the pins as pegs to line the PCBs up. Squeeze or hammer the pins into the
Pre-Experiment Questions: 5. Place the negative, non-chemical side placed over the copper surface in between 2 boards, and then insert and squeeze pins into the remaining holes. The two PCBs will now
1) Compare single- and double-sided PCBs
2) Differentiate between Give the difference between flex PCB and rigid flex PCB. 1) What is the chemical reaction of ferric chloride with water? glass plates of UV exposure unit. have been 'nailed' together accurately, and can be drilled together. Standard track pins are just
3) Mention alloys that are used in the solder wire 2) What is etching? 6. Expose the copper plate to UV light for about 6 minutes. the right length to fix the PCBs together without protruding below the bottom board.
Equipment/Components Required: 7. The copper plate is then immersed in LPR developer for duration of 120 seconds.
Copper clad sheet, marker pen, pressing machine, tracing paper, drill machine, etching machine, 8. Wash with water, the chemical which is not exposed to UV light will get removed and Tinning the Etched PCB after Drilling:
Etching machine, Drilling machine. the top layer will be visible. Procedure:
(a) Printing the artwork on the copper clad sheet: 9. A dye may be applied for better visibility. 1. Apply flux over tracks and pads.
Method 1: Using a marker Etching Process: 2. Apply a thin layer of tin over copper using a soldering iron.
Take the print of the circuit drawn with the help of express PCB, using a permanent marker and a 1. The photo printed copper clad sheet is immersed in ferric chloride (Ferric chloride is in
scale draw the circuit diagram neatly on the copper clad sheet. power or crystal form, it is mixed with water to form a homogeneous mixture). Results & Conclusion:
Method 2: Using the pressing machine 2. Depending on the chemical concentration, temperature and quality of printed copper clad Post-Experiment Questions:
Method 3: Using negative photo printing technique (take a print on the tracing sheet for this sheet the unwanted copper is removed in about 30 minutes.
method) 3. The copper clad sheet is then washed and dried. 1) What is function of pressing machine?
The task can be accomplished using two methods: First method involves following steps Chemical reactions involved: 2) What is the use of flux?
1. Preparing negative: Dark room with red light is to be used When Ferric crystals are mixed with water some free HCL produced through hydrolysis. 3) Why drilling is required?
Step-1
Prepare the following chemicals The basic etching reaction takes place in 3 stages. First the ferric ion oxidizes copper to
a. Developing solution: Take one table spoon of Piolith A and one table spoon of Piolith cuprous chloride, which is then further oxidized to cupric chloride.
B and dissolve in 250 ml of water in a Tray.
b. Fixer solution: Take 20 ml of AG FIX and dissolve in 250 ml of water.
c. Keep a Tray of water
As the cupric chloride builds up at further reaction takes place,
Step-2
a. Make sure the contact printer glass is clean.
b. Place the tracing sheet with printed side facing the light source. The etch rate quickly falls off after about 17oz/gallon (100g/l of copper has been etched.
c. Collect a lith film of size bigger than the top layer and place it over the tracing sheet. Drilling the etched PCB:
Make sure the chemical side of the lith film is over the tracing sheet covering the 1. To make holes on the PCB you need a drill, a good vertical drill stands and drill bits.
design of the circuit board. 2. When drilling, it's important to hold the PCB down firmly, as the drill bit can snatch the board
d. Expose the film i.e.; allow light to pass through for duration of 6 seconds. upwards as it breaks through, and this will usually break the bit if the board isn't held down.
Step-3 3. You need a good strong light on the board when drilling to ensure accuracy. It can be useful to
a. Put the exposed lith film in the developing solution, chemical side upwards, till the raise the working surface about 15 cm above normal desk height for more comfortable
exposed lith film turns black and the top layer appears. viewing. Dust extraction is nice, but not essential - an occasional blow does the trick! Note that
b. Stop the developing process by immersing the film in water. fiberglass dust & drill scarf is very abrasive and also irritating to the skin.
c. Put the developed film in fixer solution till the top layer pattern becomes transparent. 4. Typical hole sizes: ICs, resistors etc. 0.8mm. Larger diodes, pin headers etc., 1.0 mm, terminal
d. Stop the fixing process by immersing the film in water. blocks, trimmers etc. 1.2 to 1.5mm. Avoid hole sizes less than 0.8mm unless you really need
 Fix mandrill to winding M/C holder. EXPERIMENT-5

 Thread the insulated Cu wire between rollers and fix the wire to the
EXPERIMENT-4 former/mandrill. Aim: Soldering and de-soldering of Resistors, IC and Capacitors in PCB
 Fix the drive roller to wire gauge scale corresponding to the wire gauge. Pre-Experiment Questions:
Aim: To make a Transformer with secondary voltage 12 V, secondary current 500 mA when 1) What is the requirement of soldering?
 Set the counter to ZERO.
primary voltage is 230 V. 2) What is the use of flux in soldering?
2. Wind 2825 turns of 43 SWG for primary winding
Pre-Experiment Questions: Equipment/Components Required- Electric Soldering iron, Solder wire, Flux and sample PCB
3. Isolate Primary Winding using insulating paper (Leatheroid paper)
1) What is a transformer? for soldering.
4. Solder the end of primary winding to the primary eyelets & Measure resistance.
2) Difference between self and mutual inductance. Fig.1 Single Phase Transformer Construction Theory:
5. Wind 152 turns of 32 SWG for secondary winding.
Equipment/Components Required: Winding machine, Copper wire, Mandrel (Wooden Block), Design Example: Soldering- Soldering is a process in which two or more metal items are joined together by
6. Cover the secondary winding with insulating paper.
wires. melting and flowing a filler metal (solder) into the joint, the filler metal having a lower melting
7. Solder the end of Secondary winding to the Secondary eyelets & Measure resistance.
Theory: Transformers are electrical devices consisting of two or more coils of wire used to Primary voltage: 230 V. Secondary voltage: 12 V, Secondary current: 500 mA point than the adjoining metal.
8. Place/Insert E & I Stamping in Former/Core.
transfer electrical energy by means of a changing magnetic field. A transformer basically is very Core area = 1.152 x = 2.821 sq.cm Soft soldering is a process used for attaching small components onto the larger PCB. These small
9. Solder red wires of length 12” and Black wires of length 6” to the primary and secondary
simple static (or stationary) electro-magnetic passive electrical device that works on the principle Selecting CRGO (Cold Rolled Grain Oriented) as the core material components usually have a low-liquefying temperature that starts to break down under the high
eyelets.
of Faraday’s law of induction by converting electrical energy from one value to another. The Turns per volt = 1/(4.44 x10-4 x 50 x 2.821 x 1.3) = 12.282 temperatures of the heat source. Hard soldering is a process that uses a solid solder to join two
10. Measure the resistance of Primary and secondary winding.
transformer does this by linking together two or more electrical circuits using a common Primary current = (12 x 0.5)/(230x 0.87) =29.98 mA different metal elements together by spreading throughout the holes of the components that
11. Apply 230 V primary voltage and measure secondary voltage.
oscillating magnetic circuit which is produced by the transformer itself. A transformer operates on Wire selected is 43 SWG become unlocked with exposure to high temperatures. As a process, hard soldering is made up of
12. Dip the Transformer in insulating varnish & Dry it.
the principals of “electromagnetic induction”, in the form of Mutual Induction. Thus, primary turns =12.282 x 230 = 2824.86 two smaller sub-processes known as silver soldering and brazing.
Mutual induction is the process by which a coil of wire magnetically induces a voltage Primary windings area = 2824.86/9337 = 0.3025 sq.cm. RESULTS & CONCLUSION: Solder wires usually have a core inside the wire containing flux. Flux is designed to
into another coil located in close proximity to it. Then we can say that transformers work in the Secondary current = 500 mA improve electrical contact and mechanical strength in solder joints. There are mainly two types of
“magnetic domain”, and transformers get their name from the fact that they “transform” one Secondary wire selected is 32 SWG Post-Experiment Questions: flux cores. Acid core and rosin core. The quality of solder used during soldering and PCB
voltage or current level into another. A single-phase voltage transformer basically consists of two Secondary turns = 1.03 (12 x 12.282) = 151.8 1) How does a transformer work? assembly decides the life and performance of any electronic machine, equipment, consumer
electrical coils of wire, one called the “Primary Winding” and another called the “Secondary Secondary winding area= 151.8/1137 = 0.1335 sq.cm. 2) What are the properties of ideal transformer? electronics, appliance or gadget. Different alloys of solder are available but the real ones are those
Winding”. For this tutorial we will define the “primary” side of the transformer as the side that Total winding area = 1.3(0.3025+0.13351) = 0.5668 sq.cm 3) List four applications of a transformer. that are eutectic. Eutectic solder is one that melts exactly at the temperature of 183 Degree
usually takes power and the “secondary” as the side that usually delivers power. In a single-phase Gross core area = 2.821/0.9 = 3.134 sq.cm. Celsius. An alloy of tin and lead in the ration 63/37 is eutectic and hence 63/37 tin-lead solder is
voltage transformer the primary is usually the side with the higher voltage. Tongue width= √3.134 = 1.7703 cm. called eutectic solder. Solders that are non-eutectic will not change from solid to liquid at 183
These two coils are not in electrical contact with each other but are instead wrapped Stack height= 3.134/1.748 =1.79 cm Degree Celsius.
together around a common closed magnetic iron circuit called the “core”. This soft iron core is Thus, the resultant data are:
not solid but made up of individual laminations connected together to help reduce the core’s Primary winding: 2824 turns of 43 SWG wire
losses. The two coil windings are electrically isolated from each other but are magnetically linked Secondary winding: 120 turns of 32 SWG wire
through the common core allowing electrical power to be transferred from one coil to the other. Stack height: 1.79 cm.
When an electric current passed through the primary winding, a magnetic field is developed Procedure:
which induces a voltage into the secondary winding as shown. 1. Set the winding machines to wind primary and secondary winding.
Two coil windings are not electrically connected but are only linked magnetically. A a. Take instructions from Instructor or refer winding instructions.
single-phase transformer can operate to either increase or decrease the voltage applied to the b. Important points to be followed:
primary winding. When a transformer is used to “increase” the voltage on its secondary winding  The winding machine should be loaded with 43 SWG wire to make primary
with respect to the primary, it is called a Step-up transformer. When it is used to “decrease” the winding. Fig-1: soldering process
voltage on the secondary winding with respect to the primary it is called a Step-down transformer.  The winding machine should be loaded with 32SWG wire to make Secondary
1. Solder Wire: These are called solder wire and are available in various combinations of
winding. alloy and in various diameters ranging from 0.2 to 1.5mm. Solder wire is basically used in
 Fix former/bobbin to a mandrill (Wooden Block) after cleaning the brass eyelet hand soldering.
with steel wool. 2. Solder Bar: Solder bars are in the form of bar is sizes of .5 to 1 kg. Solder bar is used in
wave soldering.
3. Solder Paste: These are soldering in paste form. Solder paste is used in Reflow Soldering EXPERIMENT-6
and Hot Air Soldering.
4. Solder Balls: These are solder in the form of tiny balls in sizes ranging from 18 to 30 Aim: Study of equipment for setting specific AC/DC Value of a signal and perform signal
MIL. Solder balls are used in BGA of Ball Grid Array soldering. Most of the tiny gadgets measurement using CRO.
have BGA.
Flux- The purpose of flux is to facilitate the soldering process. One of the obstacles to a Objectives of the experiment:
successful solder joint is an impurity at the site of the joint, for example, dirt, oil or oxidation. The a. Setting up desired signals using the function generator.
Time Period Measurement:
impurities can be removed by mechanical cleaning or by chemical means. The most common type b. Perform measurements using CRO
of flux used in electronics (soft soldering) was rosin-based, using the rosin from selected pine Equipment Required:
trees. It was ideal in that it was non-corrosive and non-conductive at normal temperatures but 12 V DC power supply, Function generator, 20 MHz Dual trace CRO and Digital millimeter
became mildly reactive (corrosive) at the elevated soldering temperatures. with probes, Bread board, Connecting wires.
No. of horizontal divisions (n) = 4
Theory: Following points are expected to be covered during conduct of the lab m n
Time/div setting of the time-base (t) = x ms
Procedure: To carry out process of soldering follow the following steps- a. Functionalities of various knobs from the function generator front panel. Setting
1. Prepare the iron – Start with warming up the iron thoroughly and letting it rest until it Time period (T) = n* t = 4*(x) ms
different signal values. Explain specifications and connections of DC power supply
reaches its full heat. Once it has completely heated, coat the tip thoroughly with solder, b. Specifications of DMM used in the lab.
making sure to cover the entire tip. Prepare Your Surface c. Functionalities of CRO knobs and performing measurements of specific
2. Prepare the surface-Clean the surface to eliminate dust particles prior to the soldering (use characteristics of AC/DC signals.
acetone or blast of air for cleaning)
d. Precautions and care of the equipment while handling. Fig-2 Waveform display on CRO screen
3. Place the component on the board at the desired location. Insert he leads into the holes or
bend at 45° so that the component rests on the board firmly
CRO Front Panel: Amplitude measurement
No. of vertical divisions (m) = 4.4
RESULTS & CONCLUSION: Volts/div setting of the voltage knob (v) =y volts
Voltage (peak to peak) = m*v = 4.4*(y) volts
Post-Experiment Questions:
1) Explain the function of filler metal Function Generator:
2) Give the names of alloys used in solder wire.
3) Give the advantages of soldering.
4) How component mounting is done?
Fig-1 CRO Front

Panel
Fig-3 Front Panel of function generator
EXPERIMENT-7 Diode Symbol and I-V Characteristics rd=Vf / If = (Vf2 – Vf1) / (If2 – Tf1).
Aim: To determine the characteristics of the given PN junction diode. For reverse characteristics
Objectives of the experiment: 7. Connect the circuit as in figure 2.1
a. To plot the VI characteristics and estimate static and dynamic resistance value from the
8. Vary the voltage Vr in steps of 1 V and measure the corresponding reverse current.
characteristics.
Observation table:
b. To mark the knee voltage from the characteristics.
Pre-requisite questions:
Forward Biased Condition/ Reverse Biased Condition
1. List different P type and N-type impurities used for doping Silicon. Fig: 2: Symbolic Representation
2. What happens to the depletion region across PN junction when a forward biased voltage is VD (volts) ID (mA)
applied across it?
Equipment Required:
RESULT & CONCLUSION:
S. No. Equipment Specification Quantity Static Resistance is _______________
Dynamic resistance is _____________
1 Regulated Power Supply 0-30 V
Knee Voltage is _______________
2 Voltmeter 0 – 1 V DC 1
3 Ammeter 0 – 200 mA DC 1 Post Experiment questions:
1.What is the diode equation? What is the role of reverse leakage current in the operation of PN junction?
4 Junction Diode BY 127 1
2. Can the proerties of PN junction altered if the doping profile is altered?
5 Resistor 1 KΩ 1 3. What is the significane of diode rating- Peak inverse voltage ?
Observations: Students are expected to perform following measurements
1. Minimum and maximum signal amplitude generated using function generator for sine 6 Bread Board 1
wave of 2KHz ______________ 7 Connecting Wires As per requirements
2. Minimum and maximum signal frequency generated using function generator. __
3. Different signal types generated using function generator are _________ Theory: Brief discussion on charge carrier’s movement happening across PN junction under
4. Multimeter can be used to perform following measurements ________
forward and reverse biased condition (VI- characteristics) is expected.
5. Voltage range of DC power supply__________
Circuit Diagram: Fig: 3: Forward & Reverse characteristics (V-I characteristics) of Silicon Diode
6. Measurement of signal frequency as well as magnitude using CRO (tabulate the
comparison of actual value set in the function generator and validate using CRO)
Procedure:
RESULTS & CONCLUSION For Forward Characteristics
1. Connect the circuit on the breadboard as per the given circuit diagram as in figure 2
Post -experiment Questions
2. Using the 0 – 30 V power supply vary the voltage across the diode from 0 upwards in step of 0.1
1. What are the typical specifications to be followed when a choice of BJT is to done in circuit
design? V i.e. Vf= 0.1 V, 0.2 V etc. At each value of diode voltage Vf. Note down the corresponding
2. What will be colour code or indication markings on a resistor of 47 K having 5% tolerance, diode current If. Record the knee voltage or cut in voltage also.
10M with 10% tolerance and a mica capacitor having 0.22 uF 3. Plot the graph of If Vs Vf on graph paper.
4. To determine the static resistance, select any point Q on the linear region of the forward
Fig:.1: Circuit connections for verifying characteristics of PN junction diode characteristic curve. Note the voltage and the current corresponding to this point. Then the ratio
of voltage to the current gives the static resistance at Q.
5. For the dynamic resistance mark two points on the linear region of the forward characteristic
curve. Draw the perpendicular on X & Y axis and evaluate the value of Vf & If .
6. Calculate the static resistance (Rs) and the dynamic resistance (rd) using the formula.
Rs= VQ / IQ
Department of Electronics & Communication Engineering 24 Department of Electronics & Communication Engineering 25
EXPERIMENT 8 Procedure:
Aim: Draw the wave shapes of electrical signal at the input & output points of half wave, a Full 1. Connect the circuit as given in figure and observe the AC waveform at the input and
wave and Bridge rectifiers and also find out the ripple factor. pulsating waveform across R.
Pre-requisite questions: 2. Measure the peak voltage VM with the help of CRO.
3. Calculate VDC , VAC, VRMS & ripple factor.
1. What is a rectifier circuit?
4. Draw the wave form at the output of the capacitor across the load R.
2. What are the parameters that characterize its performance?
Equipment Required: Formula:
S.No. Equipment Specification Quantity Half Wave Rectifier:
1 CRO 20MHz 1
Components Required: Fig. 5: Full Wave Bridge Rectifier circuit a. Without filter b. With Capacitive filter
S.No. Components Specification Quantity Full Wave Rectifier:
1 Diode IN 4007 4
2 Transformer Step down 1
3 Resistor 1KΩ 1
4 Capacitor 470 µF 1
5 Bread Board - 1 Fig 2: Half Wave Rectifier input-output waveforms without filter
Result & Conclusion
6 Connecting wires & CRO Probes - As many required Sl. Half Wave Full Wave Centre- Full Wave
No. Parameters
Theory: Rectification is the conversion of alternating current (AC) to direct current (DC). This Rectifier Tap Rectifier Bridge Rectifier
involves a device that only allows one-way flow of electrons. Rectifiers are categorized in two 1 DC Value (VDC )
types 2 RMS Value (VRMS)
a) Half Wave rectifier 3 Ripple Factor
b) Full wave rectifier 4 PIV
(i) Centre-Tap rectifier Post-requisite questions:
(ii) Bridge rectifier 1. Suggest a suitable circuit that can improve the DC output of the rectifier circuit?
2. What is rectifier efficiency?
Circuit Diagram: 3. Considering the design parameters compare center tapped and bridge rectifier circuits.
Fig 3: Half Wave Rectifier output waveform with Capacitive filter
Fig 6: Full Wave Rectifier input-output waveforms without filter Design Experiment: Design and implement a circuit using PN junction diode that can be used for
signal shaping. (Clipping or Clamping)
Fig 1: Half Wave Rectifier circuit (a) Without filter (b) With Capacitive filter
Fig. 4: Full Wave Centre-Tap Rectifier circuit a. Without filter b. With Capacitive filter
Fig 7: Full Wave Rectifier output waveform with Capacitive filter
2. Why the Zener diode does offers finite reverse resistance?

3. What decides the magnitude of the breakdown voltage of a Zener diode?
EXPERIMENT-9
EXPERIMENT-10
Circuit Diagram: Procedure:
Aim: To determine the V-I characteristics for Zener diode in forward and reverse biasing mode and Aim: To study and Plot Characteristics of BJT in CE configuration.
measure the forward and reverse resistance graphically. Pre-Experiment Questions: Input Characteristics
Pre-Experiment Questions: 1. Explain the working of transistor in CE configuration? 1. Connect the circuit as shown in the circuit diagram. (Fig 1)
1. How Zener diode is different from the ordinary PN junction diode? 2. Differentiate among CB. CC and CE configuration of transistor? 2. Keep output voltage VCE = 2V by varying VCC.
2. How doping concentration and Depletion region width influences the breakdown phenomena? 3. Why CE configuration is most widely used for voltage amplification? 3. Varying VBB gradually, note down base current IB and base-emitter voltage VBE.
3. Differentiate between avalanche and Zener breakdown. Component Requirements: 4. Step size is not fixed because of nonlinear curve. Initially vary V BB in steps of 0.1V. Once the
Equipment Requirements: current starts increasing vary V BB in steps of 1V up to 12V.
S. No. Name Specification Quantity
S.No. Component Name Specification Quantity 5. Repeat above procedure (step 3) for VCE = 6V.
1 Regulated Power supply Variable (Dual) 1 1 Regulated Power Supply 0-30 V 2
2 Voltmeter 0-20V 1 Figure 2.1 Forward Biasing Figure 2.2 Reverse Biasing 2 Ammeters 0 – 200 mA DC 1 Output Characteristics:
3 Ammeter 0-20mA 1 Procedure: 3 Ammeters 0 – 200 µA DC 1
1. Connect the circuit as shown in the circuit diagram. (Fig 1)
4, Zener Diode 5.1 or 8.2V 1 1. The forward bias characteristics of Zener diode are same as that of normal PN junction diode. 4 Voltmeter 0 – 20 V DC 2
For the input characteristics, connect the circuit as per the Figure 2.1 and for reverse 2. Keep base current IB = 0 A by varying VBB.
5, Resistor 1K 1
Bread Board - 1 characteristic connect the circuit as per the Figure 2.2. S.No. Name Specification Quantity 3. Varying VCC gradually in steps of 1V up to 16V and note down collector current IC and
6.
Connecting wires & CRO 2. Vary the input voltage in the steps of 1V and measure the readings of voltmeter and the 1 Transistor BC107 (NPN) 1 Collector-Emitter Voltage (VCE).
7. Single strand as required 4. Repeat above procedure (step 3) for IB = 20µA, 40µA.
Probes ammeter in the circuit. 2 Resistors 100 K, 1K 1 each
Observation Table: 3 Bread Board - 1
Theory: Discussion on the reverse characteristics and Zener breakdown is expected 4 Connecting Wires - as many To Plot Graph:
Forward Characteristics
. required
Input 1. Plot the input characteristics by taking VBE on X-axis and IB on Y-axis at a constant VCE as a
S. No Voltmeter Reading (V) Ammeter Reading (mA) constant parameter.
Voltage
Theory: The circuit diagram shows basic transistor circuit of an amplifier in the CE mode. The
1 0.1V 2. Plot the output characteristics by taking VCE on X-axis and taking IC on Y-axis taking IB as a
supply voltage VBB forward biases the emitter to base junction & VCC reverse biases the collector to
2 … constant parameter.
10V base junction.
15V Thus, the transistor operates in the active region.
Reverse Characteristics Circuit Diagram:
Input
S. No Voltmeter Reading (V) Ammeter Reading (mA)
Voltage
1 1V
2 …
15V
20V
Result and Conclusions:

Identify the values of knee voltage and the Zener breakdown voltage. Observe the rapid increase in
current while the voltage across the Zener diode remains constant in reverse bias.
Plot the graph across Zener current and Zener voltage. Calculate the forward and reverse resistance. Fig. 2: CE configuration input and output characteristics
Fig 1 VI Characteristics and symbolic representation
Post Experiment Questions:
1. State the applications of Zener diode. Fig 1 Circuit diagram -CE configuration
Post-Experiment questions:
If Rf = R1 = R2 = R = 1 KΩ, then
1. List the applications of adder and subtractor circuits.
V0 = V2 - V1 2. Design and implement an adder circuit to get an output voltage as
Observation Table:
EXPERIMENT-11
Input Characteristics
VBB (Volts) VCE = 2V VCE = 6V
Aim: To study Operational Amplifier as Adder and Subtractor
VBE (Volts) IB (µA) VBE (Volts) IB (µA)
Pre-requisite questions
1. What is virtual ground?
2. What is integrator?
3. What is the gain of ideal op-amp?
4. What is the basic building block of an op-amp?
5. The feedback component in an op-amp integrator is ----?
Output Characteristics Components required:

VCC (Volts) IB = 0 µA IB = 20 µA IB = 40 µA Sl.No. Equipment Specification Quan
VCE (Volts) IC (mA) VCE (Volts) IC (mA) VCE (Volts) IC (mA) 1 Regulated Power Supply 0-30V tity1 Fig 2 Operational amplifier application as subtractor
2 Function Generator 1Hz to 2 MHz 1
3 Voltmeter 0 - 30 V DC 1 Theory: Discussion on operational amplifier applications as voltage adder and subtractor is
4 Semiconductor Trainer Kit 1 expected along with derivation of expression for its output voltage
5 –1 Op-Amp 741 1 Observations Table:
6 Resistor 1KΩ 4 Adder:
7 Connecting S. No. DC voltage at input V1 DC voltage at input V2 DC voltage at Output VO
Wires (V) (V) (V)
Formula: Circuit Diagram:
Adder Circuit:
From input characteristic, the input resistance rin is given by:
From output characteristic, the input resistance ro is given by:

If R1 = R2 = Rf = 1 KΩ, then
Subtractor:
Result & Conclusion: V0 = - (V1 + V2)
Post Experiment Questions: S. No. DC voltage at input DC voltage at input DC voltage at Output
V1 (V) V2 (V) VO (V)
1. What is the major application of CC configuration?
2. What are the four different modes of operation based on biasing?
3. What are modes in which transistor is used as a switch?
Design Problem: Graphical measurement of h- parameters from input and output characteristics of Result & Conclusion: comment on the theory and practical values of output voltages obtained.
BJT in CB configuration. Perform comparison between the CB and CE configuration. Fig .1 Operational amplifier working as a input signal adder
Subtractor Circuit:
EXPERIMENT-12
3. NOT gate – 7404 IC Pin configuration
Aim: To study and verify the truth table of logic gates
Pre-Experiment questions:
1. What are basic logical operations?
2. What is truth table?
3. What do you understand by TTL?
Equipment/Components required:
Sl.No. Equipment Specification Quantity
1 Digital trainer kit - 1 No.
2 IC 7400, IC 7402, IC 7404, TTL/CMOS 1 each
IC 7408, IC 7432, IC 7486
3 Patch chords & single strand connecting As
wires required
Theory: Basic description of basic logic gates along with the truth table is expected.
Procedure:
1. Check the IC’s for their working using universal IC tester.
2. Insert the appropriate IC into the bread board of trainer kit.
3. Make connections as shown in the circuit diagram.
4. Provide the input data via the input switches and observe the output on output LEDs.
5. Also measure voltage output using multimeter.
4. NOR gate- 7402 IC Pin configuration
Truth Table (NOR Gate) Observation Table
Input Input Output Input Output Using Using

(A) ( B) Y = (A +B)’ A B Voltmeter LED
0 0 1
0 1 0
1 0 0
1 1 0
Fig.1: Logic Symbols with their truth table
Result & Conclusion: EXPERIMENT-13 For a function of four variables: f(w, x, y, z)
Aim: Implementation of the given Boolean Function using Logic Gates in both SOP and POS
Post-Experiment questions:
forms
1. Why NAND & NOR gates are called universal gates?
Pre-Experiment questions: Realization of Boolean expression:
2. What are the logic low and High levels of TTL IC’s and CMOS IC’s?
1. Name the standard forms of Boolean function?
3. Compare TTL logic family with CMOS family?
2. Define min term & max term?
4. Which logic family is fastest and which has low power dissipation?
3. What is K-map? What is it’s use?
Components required:
Design Experiments:
1. Realize the EX – OR gate using minimum number of basic logic gates. Sl.No. Component /Equipment Specification Quantity
2. Realize the EX – NOR gate using minimum number of basic logic gates. 1 Digital trainer kit 1 No
Truth Table Observation Table IC 7400, IC 7408, IC 7432,
2 CMOS 1 each
IC 7406, IC 7402
Input Input Output Input Output Using Using 3 Patch chords 10 Nos
(A) ( B) Y=(A.B)’ A B Voltmeter LED 4 Connecting wires Single stranded 10 Nos
0 0 1
Theory:
0 1 1 Canonical Forms (Normal Forms): Any Boolean function can be written in disjunctive normal After simplifying using K-Map method we get Y =A B + C D
1 0 1 form (sum of min-terms) or conjunctive normal form (product of max-terms).A Boolean function
1 1 0 can be represented by a Karnaugh map in which each cell corresponds to a min-term. The cells are
arranged in such a way that any two immediately adjacent cells correspond to two min-terms of
6. Exclusive OR gate- Pin configuration of 7486 distance. There is more than one way to construct a map with this property.
Karnaugh Maps:
For a function of two variables, say, f(x, y),
Realization using Basic gates: Sum of Product:

For a function of three variables, say, f(x, y, z) Realization using NAND gates Realization using NOR gates
Truth Table Observation Table

Input Input Output Input Output Using Using
(A) ( B) Y=(AB’ + A’B) A B Voltmeter LED
0 0 0
0 1 1
1 0 1
1 1 0
JSS Academy of Technical Education – NOIDA JSS Academy of Technical Education – NOIDA
Electronics Lab (KEC-151P/KEC-251P) Manual (ECE I/II Semester) Electronics Lab (KEC-151P/KEC-251P) Manual (ECE I/II Semester)
Truth Table
Procedure:
Inputs Output 1. Check the components for their working.
A B C D Y 2. Insert the appropriate IC into the Bread board.
0 0 0 0 0 3. Make connections as shown in the circuit diagram.
0 0 0 1 0 4. Provide the input data via the input switches and observe the output.
0 0 1 0 1
5. Verify the Truth Table
0 0 1 1 0
0 1 0 0 0
0 1 0 1 0 Result & Conclusion:
0 1 1 0 1
0 1 1 1 0 Post-experiment questions:
1 0 0 0 1 1. What are the different methods to obtain minimal expression?
1 0 0 1 1
1 0 1 0 1 2. State the difference between SOP and POS.
1 0 1 1 1 3. What is meant by canonical representation?
1 1 0 0 0 4. Define multi output logic circuit?
1 1 0 1 0
1 1 1 0 1
1 1 1 1 0 Design experiment:
1. Realize EX-OR using a) NAND gates b) NOR gates.
2. Realize EX-NOR using a) NAND gates b) NOR gates.
Inputs Output
A B C D Y
0 0 0 0 1
0 0 0 1 1
0 0 1 0 0
0 0 1 1 0
0 1 0 0 1
0 1 0 1 1
0 1 1 0 0
0 1 1 1 0
1 0 0 0 0
1 0 0 1 0
1 0 1 0 0
1 0 1 1 0
1 1 0 0 0
1 1 0 1 1
1 1 1 0 0
1 1 1 1 1
For the given Truth Table, realize a logical circuit using basic gates and NAND gate

KEC-151P-251P - Electronics Engg. Lab Micro

Uploaded by

Document Information

Original Description:

Original Title

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

KEC-151P-251P - Electronics Engg. Lab Micro

Uploaded by

Copyright:

Available Formats

JSS Academy of Technical Education – NOIDA JSS Academy of Technical Education – NOIDA JSS Academy of Technical Education – NOIDA

1. Study of Active and Passive components CO1 8-9

Understanding Basic concepts associated with printed circuit board

4. Winding shop: Step-down transformer winding of less than 5 VA CO2 16-18

Soldering Shop: Soldering and disoldering of Resistor in PCB

P-N Junction diode: Characteristics of PN Junction diode - Static and

Roll. No. Characteristics of Zener diode: V-I characteristics of Zener diode,

11. To study Operational Amplifier as Adder and Subtractor CO4 37-38

12. Verification of Truth Table of Various Logic Gates. CO5 39-44

Implementation of the given Boolean function using logic gates in

JSS Academy of Technical Education

 Fix mandrill to winding M/C holder. EXPERIMENT-5

Fig-1 CRO Front

Fig-3 Front Panel of function generator

Fig 7: Full Wave Rectifier output waveform with Capacitive filter

2. Why the Zener diode does offers finite reverse resistance?

Result and Conclusions:

Output Characteristics Components required:

From output characteristic, the input resistance ro is given by:

Truth Table (NOR Gate) Observation Table

Input Input Output Input Output Using Using

Result & Conclusion: EXPERIMENT-13 For a function of four variables: f(w, x, y, z)

Realization using Basic gates: Sum of Product:

Truth Table Observation Table

You might also like