United States Patent (19) : Bourell Et Al

You might also like

Download as pdf or txt
Download as pdf or txt
You are on page 1of 15

United States Patent (19) 11) Patent Number: 4,944,817

Bourell et al. 45 Date of Patent: Jul. 31, 1990


54 MULTIPLE MATERIAL SYSTEMS FOR Machine and Tool Blue Book, "Laser-Cut-Lamina
SELECTIVE BEAM SINTERNG tions Form Complex Parts', (4/87).
Laser Focus/Electro-Optics, p. 41, (Jun. 1987).
(75) Inventors: David L. Bourell; Harris L. Marcus; Inside R&D The Weekly Report on Technical Innova
Joel W. Barlow; Joseph J. Beaman; tion, vol. 16, No. 19, (5/13/87).
Carl R. Deckard, all of Austin, Tex. Immediate Production of 3-D Objects, Hydronetics,
(73) Assignee: Board of Regents, The University of Inc.
Texas System, Austin, Tex. Lasers Carve Complex 3-D Parts (pp. 1-11).
Sample Cover Letter from Hydronetics, Inc.
21 Appl. No.: 402,694 Electrical Engineering, Times, Issue 430 (Apr. 20,
22 Filed: Sep. 5, 1989 1987).
Takei et al., (May 1980), J. Appl. Phys, 51:2903-2908.
Related U.S. Application Data Fudim, "Sculpting Parts With Light', Machine Design,
(63) Continuation-in-part of Ser. No. 920,580, Oct. 17, 1986, Mar. 6, 1986.
Pat. No. 4,863,538.
Revolutionary-Machine Makes 3-D Objects from
Drawings, Austin-American Stateman (Dec. 4, 1987).
51 Int. Cl. ........................ B27N 3/00; B32B 31/00; Deckard et al., Solid Freeform Fabrication and Selec
B23K9/00; B29C 67/00 tive Powder Sintering, Presented at NAMRACIS
52 U.S. C. ................................ 156/622; 156/272.8; (1987) pp. 636-640.
219/121.66; 219/121.8; 219/121.85; 264/58; Deckard et al., Process and Control Issues in Selective
264/113; 264/125; 425/174 Laser Sintering, Measurement and Control in Manufac
58 Field of Search ..................... 156/62.2, 89,272.8, turing (ASME, 1988) pp. 191-197.
156/278, 242, 245, 643, 345, 500, 501; Device Quickly Builds Models Of a Computer's De
219/121.6, 121.61, 121.63, 121.64, 121.65, signs, New York Times (March 16, 1988) p. 46.
121.66, 121.73, 121.8, 121.85; 264/58, 113, 125, Deckard, Part Generation by Layerwise Selective Sin
126, 127, 22; 425/174; 41.9/5, 8 tering, May 1986.
56) References Cited Leont'ev, Lazernaja Poverhnostnaja Obrabotka Metal
lov I Splavov, (1986) pp. 120-123 (partial translation
U.S. PATENT DOCUMENTS included).
2,076,952 4/1937 Kratky .................................. 75/137 Deckard, et al., Recent Advances in Selective Laser
3,848, 104 11/1974 Locke ... 219/121 L Sintering, Presented at 14th Conf. on Production Re
3,985,995 10/1976 Brandi et al. ......................... 219/76 search and Technology (U. of Mich., 1987) pp.
4,117,302 9/1978 Earle et al. ... 219/121. LM 447-451.
4,135,902 1/1979 Oehrle..................................... 65/02
4,270,675 6/1981 Wicks et al. ..... ... 222/196 Primary Examiner-William A. Powell
4,300,474 11/1981 Livsey ................................. 118/641 Attorney, Agent, or Firm-Vinson & Elkins
4,323,756 4/1982 Brown et al. ... 219/121 LF 57 ABSTRACT
4,474,861 10/1984 Ecer .................................... 428/614
4,540,867 9/1985 Ackerman ... 219/121. LW A method and apparatus for selectively sintering a layer
4,575,330 3/1986 Hull. 425/1744: of powder to produce a part comprising a plurality of
4,587,396 5/1986 Rubin ... 219/121
4,752,352 6/1988 Feygin ................................ 156/630 :
sintered layers. The apparatus includes a computer con
4,818,562 4/1989 Arcella et al. ..................... 427/53.1 trolling a laser to direct the laser energy onto the pow
4,863,538 9/1989 Deckard ............................. 156/62.2 der to produce a sintered mass. The computer either
determines or is programmed with the boundaries of the
FOREIGN PATENT DOCUMENTS desired cross-sectional regions of the part. For each
0209366 7/1986 European Pat. Off. . . cross-section, the aim of the laser beam is scanned over
2263777 7/1973 Fed. Rep. of Germany . a layer of powder and the beam is switched on to sinter
137951 10/1979 Fed. Rep. of Germany. only the powder within the boundaries of the cross-sec
2166526 7/1973 France . tion. Powder is applied and successive layers sintered
57-156959 7/1984 Japan. until a completed part is formed. Preferably, the pow
57-185536 8/1984 Japan. der comprises a plurality of materials having different
WO88/02677 4/1988 PCT . dissociation or bonding temperatures. The powder pref
1215184 7/1968 United Kingdom. erably comprises blended or coated materials.
OTHER PUBLICATIONS
Chicago Enterprise, vol. I, No. II (May 1987).
Crain's Chicago Business (1987). 20 Claims, 5 Drawing Sheets
U.S. Patent Jul.31, 1990 Sheet 1 of 5 4,944,817
U.S. Patent Jul. 31, 1990 ! Sheet 2 of 5 4,944,817
407

(MAA A/7 zz is)


a07A77 A474
VOAA) 726 Zz

/7224,4772//
\S/6//44. 727 A 4,5a AP

421 12

42
U.S. Patent Jul.31, 1990 Sheet 5 of 5 4,944,817

ote
O (2 O2 YO -o/ 6) (3) 65) 6)
codeo-e
C62 562
/002 92.9
63) (2 - 2
-29 12
2. 2% ?o
4,944,817 2
1.
is, conventional machining methods are usually best
MULTIPLE MATERIAL SYSTEMS FOR suited for producing symmetrical parts and parts where
SELECTIVE BEAM SINTERNG only the exterior part is machined. However, where a
desired part is unusual in shape or has internal features,
BACKGROUND OF THE INVENTION 5 the machining becomes more difficult and quite often,
The present application is a continuation-in-part of the part must be divided into segments for production.
Ser. No. 06/920,580, filed Oct. 17, 1986, now Pat. No. In many cases, a particular part configuration is not
4,863,538. possible because of the limitations imposed upon the
1. Field of the Invention tool placement on the part. Thus, the size and configu
This invention relates to a method and apparatus 10 ration of the cutting tool do not permit access of the
which uses a directed energy bean to selectively sinter tool to produce the desired configuration.
a powder to produce a part. n particular, this invention There are other machining processes which are addi
relates to a computer aided laser apparatus which se tive, for example, plating, cladding, and some welding
quentially sinters a plurality of powder layers to build 15 processes are additive in that material is added to a
the desired part in a layer-by-layer fashion. The present starting substrate. In recent years, other additive-type
application is particularly directed towards a powder machining methods have been developed which use a
comprising a plurality of materials where the powder laser beam to coat or deposit material on a starting
has more than one bonding or dissociation temperature. article. Examples include U.S. Pat. Nos. 4,117,302;
2. Description of the Relevant Art 4,474,861; 4,300,474; and 4,323,756. These recent uses of
The economies associated with conventional part 20 lasers have been primarily limited to adding a coating to
production methods are generally related directly to the a previously machined article. Often such laser coating
quantity of parts to be produced and the desired mate methods have been employed to achieve certain metal
rial characteristics of the finished parts. For example, lurgic properties obtainable only by such coating meth
large scale manufacture casting and extrusion tech ods. Typically, in such laser coating methods the start
niques are often cost effective, but these production 25 ing article is rotated and the laser directed at a fixed
methods are generally unacceptable for small quan location with the coating material sprayed onto the
tities-i.e. replacement parts or prototype production. article so that the laser will melt the coating onto the
Many such conventional part production methods re article.
quire expensive part specific tooling. Even powder
metallurgy requires a die for shaping the powder, mak 30 SUMMARY OF THE INVENTION
ing powder metallurgy unattractive as a method for The problems outlined above are in large major
producing a small number of parts. solved by the method and apparatus of the present in
Where only a small number of parts are desired, con vention. The present invention includes a directed en
ventional production methods involving a subtractive ergy beam-such as a laser-and is adaptable to pro
machining method are usually used to produce the de 35 duce almost any three dimensional part. The method of
sired part. In such substractive methods, material is cut the present invention is an additive process, with the
away from a starting block of material to produce a powder being dispensed into a target area where the
more complex shape. Examples of substractive machine laser selectively sinters the powder to produce a sin
tool methods include: milling, drilling, grinding, lathe tered layer. The invention is a layer-wise process in
cutting, flame cutting, electric discharge machine, etc. which the layers are joined together until the completed
While such conventional machine tool substractive
methods are usually effective in producing the desired part is formed. The method of the present invention is
part, they are deficient in many respects. not limited to a particular type of powder, but rather is
First, such conventional machine tool substractive adaptable to plastic, metal, polymer, ceramic, wax,
methods produce a large amount of waste material for 45 semiconductor or amorphous powders, or composite
disposal. Further, such machine tool methods usually material powders.
involve a large initial expense for setting up the proper Broadly speaking, the apparatus includes a laser or
machining protocol and tools. As such, the set-up time other directed energy source which is selectable for
is not only expensive, but relies a great deal on human emitting a beam in a target area where the part is pro
judgment and expertise. These problems are, of course, 50 duced. A powder dispenser system deposits powder
exacerbated when only a small number of parts are to be into the target area. A laser control mechanism operates
produced. to move the aim of the laser beam and modulates the
Another difficulty associated with such conventional laser to selectively sinter a layer of powder dispensed
machining techniques involves tool wear which not into the target area. The control mechanism operates to
only involves the cost of replacement, but also reduces 55 selectively sinter only the powder disposed within de
machining accuracy as the tool wears. Another limit on fined boundaries to produce the desired layer of the
the accuracy and tolerance of any part produced by part. The control mechanism operates the laser to selec
conventional machining techniques is the tolerance tively sinter sequential layers of powder, producing a
limits inherent in the particular machine tool. For exam completed part comprising a plurality of layers sintered
ple, in a conventional milling machine or lathe, the lead together. The defined boundaries of each layer corre
screws and ways are manufactured to a certain toler spond to respective cross-sectional regions of the part.
ance, which limits the tolerances obtainable in manufac Preferably, the control mechanism includes a com
turing a part on the machine tool. Of course, the toler puter-e.g. a CAD/CAM system to determine the de
ances attainable are reduced with age of the machine fined boundaries for each layer. That is, given the over
tool. 65 all dimensions and configuration of the part, the con
The final difficulty associated with such conventional puter determines the defined boundaries for each layer
machine tool subtractive processes is the difficulty or and operates the laser control mechanism in accordance
impossibility of making many part configurations. That with the defined boundaries. Alternatively, the com
4,944,817
3 4.
puter can be initially programmed with the defined the boundaries of each cross-sectional region of the
boundaries of each layer. part.
In a preferred form, the laser control mechanism Additionally, another embodiment of the present
includes a mechanism for directing the laser beam in the invention includes a powder comprising a plurality of
target area and a mechanism for modulating the laser materials where the plurality of materials have more
beam on and off to selectively sinter the powder in the than one dissociation temperature. In still another em
target area. In one embodiment, the directing mecha bodiment of the present invention, the powder com
nism operates to move the aim of the laser beam in a prises a plurality of materials where the plurality of
continuous raster scan of target area. The modulating materials have more than one bonding temperature.
mechanism turns the laser beam on and off so that the 10 As used throughout this document, bonding tempera
powder is sintered only when the aim of the laser beam ture includes but is not limited to, melting temperature,
is within the defined boundaries for the particular layer. softening temperature and bonding temperature.
Alternatively, the directing mechanism aims the laser In all preferred embodiments of the present inven
beam only within the defined boundaries for the partic tion, the plurality of materials comprise at least one first
ular layer so that the laser beam can be left on continu 15 material blended with at least one second material or at
ously to sinter the powder within the defined bound least one first material coated with at least one second
aries for the particular layer. material.
In a preferred embodiment, the directing mechanism As can be appreciated from the above general de
moves the laser beam in a repetitive raster scan of the scription, the method and apparatus of the present in
target area using a pair of mirrors driven by galvonome 20 vention solves many of the problems associated with
ters. The first mirror reflects the laser beam to the sec known part production methods. First, the present in
ond mirror which reflects the beam into the target area. vention is well suited for prototype part production or
Shifting movement of the first mirror by its galvonome replacement part production of limited quantities. Fur
ter shifts the laser beam generally in one direction in the ther, the method and apparatus hereof are capable of
target area. Similarly, shifting movement of the second 25 making parts of complex configurations unobtainable
mirror by its galvonometer shifts the laser beam in the by conventional production methods. Further, the pres
target area in a second direction. Preferably, the mirrors ent invention eliminates tool wear and machine design
are oriented relative to each other so that the first and as limiting factors on the tolerances obtainable in pro
Second directions are generally perpendicular to each ducing the part. Finally, with the apparatus of the pres
other. Such an arrangement allows for many different
30 ent invention incorporated into a CAD/CAM environ
types of scanning patterns of the laser beam in the target ment, a large number of replacement parts can be pro
area, including the raster scan pattern of the preferred grammed into the computer and can be easily produced
embodiment of the present invention. with little set-up or human intervention.
The method of part production of the present inven 35 BRIEF DESCRIPTION OF THE DRAWINGS
tion includes the steps of depositing a first portion of FIG. 1 is a schematic representation of the apparatus
powder onto a target surface, scanning the aim of a of the present invention;
directed energy beam (preferably a laser) over the tar FIG. 2 is a schematic showing a portion of the lay
get surface, and sintering a first layer of the first powder ered build up of a part produced in accordance with the
portion on the target surface. The first layer corre present invention, and illustrating the raster scan pat
sponds to a first cross-sectional region of the part. The tern of the laser beam in the target area;
powder is sintered by operating the directed energy FIG. 3 is a block diagram depicting the interface
source when the aim of the beam is within the bound hardware between the computer, laser and galvonome
aries defining the first layers. A second portion of pow ters of the present invention;
der is deposited onto the first sintered layer and the aim 45 FIG. 4 is a perspective view of an example part pro
of the laser beam scanned over the first sintered layer. A duced in accordance with the present invention;
second layer of the second powdered portion is sintered FIG. 5 is a sectional view with parts broken away and
by operating the directed energy source when the aim in phantom, of the part illustrated in FIG. 4;
of the beam is within the boundaries defining the second FIG. 6 is a flow chart of the data metering program
layer. Sintering of the second layer also joins the first 50 in accordance with the present invention;
and second layers into a cohesive mass. Successive FIG. 7 is a sectional view taken along line 7-7 of
portions of powder are deposited onto the previously FIG. 4;
sintered layers, each layer being sintered in turn. In one FIG. 8 illustrates in diagram form the correlation
embodiment, the powder is deposited continuously into between a single sweep of the laser across the layer of
the target. 55 FIG. 7 and the control signals of the present invention;
In a preferred embodiment, the laser beam is modu FIG. 9 illustrates a blend of materials in a powder;
lated on and off during the raster scan so that the pow FIG. 10 illustrates coated materials in a powder;
der is sintered when the aim of the beam is directed FIG. 11 illustrates a portion of a sintering cycle on a
within the boundaries of the particular layer. Prefera blend of materials as presently understood.
bly, the laser is controlled by a computer; the computer FIG. 12 illustrates two materials deposited prior to
may include a CAD/CAM system, where the computer sintering.
is given the overall dimensions and configuration of the DESCRIPTION OF THE PREFERRED
part to be made and the computer determines the EMBODIMENTS
boundaries of each cross-sectional region of the part.
Using the determined boundaries, the computer con 65 Turning now to the drawings, FIG. 1 broadly illus
trols the sintering of each layer corresponding to the trates the apparatus 10 in accordance with the present
cross-sectional regions of the part. In an alternative invention. Broadly speaking, the apparatus 10 includes a
embodiment, the computer is simply programmed with laser 12, powder dispenser 14, and laser control means
4,944,817 6
5
16. In more detail, the powder dispenser 14 includes a appreciated that alternative scanning methods are avail
hopper 20 for receiving the powder 22 and having an able for use as the scanning system 42, including acusto
outlet 24. The outlet 24 is oriented for dispensing the optic scanners, rotating polygon mirrors, and resonant
powder to a target area 26, which in FIG. 1 is generally mirror scanners.
defined by the confinement structure 28. Of course, Turning to FIG. 2 of the drawing, a portion of a part
many alternatives exist for dispensing the powder 22. 52 is schematically illustrated and shows four layers
The components of the laser 12 are shown somewhat 54-57. The aim of the laser beam, labeled 64 in FIG. 2,
schematically in FIG. 1 and include a laser head 30, a is directed in a raster scan pattern as at 66. As used
safety shutter 32, and a front mirror assembly 34. The herein, "aim” is used as a neutral term indicating direc
type of laser used is dependent upon many factors, and 10 tion, but does not imply the modulation state of the laser
in particular upon the type of powder 22 that is to be 12. For convenience, the axis 68 is considered the fast
sintered. In the embodiment of FIG. 1, a Nd:YAG laser scan axis, while the axis 70 is referred to as the slow scan
(Lasermetrics 9500O) was used which can operate in a axis. Axis 72 is the direction of part build-up.
continuous or pulsed mode with a hundred-watt maxi Turning to FIGS. 9 and 10, powders, comprising a
mum outlet power in the continuous mode. The laser 15 plurality of materials by which parts may be made using
beam output of the laser 12 has a wavelength of approx the present invention, are illustrated. For simplicity,
imately 1060 nm, which is near infrared. The laser 12 only two materials are shown in the illustrations. How
illustrated in FIG. 1 includes an internal pulse rate gen ever, as will be apparent to one skilled in the art, a
erator with a selectable range of about one kilohertz to plurality of materials may comprise the powder of the
forty kiloHertz, and an approximately six nanosecond 20 present invention.
pulse duration. In either the pulsed or continuous mode, FIG. 9 illustrates a blend of first material 901 and
the laser 12 can be modulated on or off to selectively second material 902. The materials are combined in a
produce a laser beam which travels generally along the blend through conventional blending processes. FIG.
path shown by the arrows in FIG. 1. 10 illustrates material 1002 coated in material 1001.
To focus the laser beam, a diverging lens 36 and 25 Material 1002 is coated using conventional coating pro
converging lens 38 are disposed along the path of travel CeSSeS.
of the laser beam as shown in FIG. 1. Using just the As will be further apparent to one skilled in the art,
converging lens 38, the location of the true focal point coated materials, as shown in FIG. 10, may be blended
is not easily controlled by varying the distance between to produce a desired mix of materials.
the converging lens 38 and the laser 12. The diverging 30 Turning to FIG. 11, a portion of a sintering cycle, as
lens 36 placed between the laser 12 and converging lens presently understood, is illustrated. FIG. 11a illustrates
38 creates a virtual focal point between the diverging a blend of materials prior to the application of energy
lens 36 and the laser 12. Varying the distance between able to produce sintering. Preferably, the materials
the converging lens 38 and the virtual vocal point, al comprising powder mass 1100 have more than one
lows control of the true focal point along the laser beam 35 bonding or dissociation temperature. FIG. 11b illus
path of travel on the side of the converging lens 38 trates powder 1100 during application of energy suffi
remote from the laser 12. In recent years there have cient to promote sintering. FIG. 11b illustrates material
been many advances in the field of optics, and it is rec 1101 having a lower bonding or dissociation tempera
ognized that many alternatives are available to effi ture than material 1102. In a preferred embodiment, the
ciently focus the laser beam at a known location. low temperature phase material 1101 melts and infil
In more detail, the laser control means 16 includes trates powder mass 1100 in the area surrounding each
computer 40 and scanning system 42. In a preferred particle of material 1101. Additional powder compo
embodiment, the computer 40 includes a microproces nents could also be added to the blend to promote infil
sor for controlling the laser 12 and a CAD/CAM sys tration. Similarly a gas phase can be used to promote
tem for generating the data. In the embodiment illus 45 infiltration and the sintering process. The gas phase may
trated in FIG. 1, a personal computer is used (Commo be either inert or active, preferably to either displace an
dore 64) whose primary attributes include an accessible undesired gas or introduce a desired gas. FIG. 11c illus
interface port and a flag line which generates a non trates a potential mechanism through which effects,
maskable interrupt. including but not limited to, capillarity effects, allow
As shown in FIG. 1, the scanning system 42 includes 50 material 1101 to infiltrate the powder mass 1100. FIG.
a prism 44 for redirecting the path of travel of the laser 11d shows the part following sintering in the present
beam. Of course, physical layout of the apparatus 10 is invention.
the primary consideration in determining whether a Because a material having a bonding or dissociation
prism 44, or a plurality of prisms 44, are needed to ma temperature higher than the temperature to be obtained
nipulate the path of travel of the laser beam. The scan 55 during the sintering process may be selected, the higher
ning system 42 also includes a pair of mirrors 46, 47 bonding or dissociation temperature material need not
driven by respective galvonometers 48, 49. The galvo sinter but may retain its original structure. In particular,
nometers 48, 49 coupled to their respective mirrors 46, for crystalline material this enables control of epitaxial
47 to selectively orientate the mirrors 46, 47. The galvo growth in the selective beam sintering process of the
nometers 46, 47 are mounted perpendicular to each present invention. For example, if the higher bonding or
other such that the mirrors 46, 47 are mounted nomi dissociation temperature material is positioned in a par
nally at a right angle to each other. A function genera ticular structure that may, preferably, result in epitaxial
tor driver 50 controls the movement of the galvonome growth from the preceding layer, only bonding or dis
ter 48 (galvonometer 49 is slaved to the movement of sociating the lower bonding or dissociation temperature
galvonometer 48) so that the aim of the laser beam 65 material enables the higher temperature material to
(represented by the arrows in FIG. 1) can be controlled retain its structure.
in the target area 26. The driver 50 is operatively cou The choice of materials selected for the powder al
pled to the computer 40 as shown in FIG. 1. It will be lows for a broad range of resulting sintered material.
4,944,817
7 8
For example, a conducting material is preferably coated of the applied beam energy represented by the arrows
with an insulating polymer material to produce a pow while elemental material 1102 absorbs less energy
der. The powder is then distributed in the target area. thereby enabling elemental material 1101 to bond or
The material is preferably sintered and the insulator dissociate prior to the bonding or dissociation of ele
may be removed later through a conventional process, mental material 1102. This absorption of energy can be
including but not limited to a chemical method, result achieved by either material or laser beam wavelength
ing in a conductive, sintered product. selection, or both, in a plurality of combinations.
By way of further illustration, extremely hard materi Turning to FIG. 12, in yet another preferred embodi
als may be produced using the present invention. For ment a material 1201 is preferably deposited on surface
example, tungsten carbide/cobalt tools which, because 10 1200 and second material 1203 is then deposited on
of their extreme hardness are difficult to form or material 1201 prior to sintering. Materials 1201 and 1203
sharpen may be produced by coating tungsten carbide preferably have different bonding or dissociation tem
material with cobalt to produce a powder or by blend peratures.
ing tungsten carbide and cobalt to produce a powder. Operation
During sintering, the cobalt preferably melts under the 15
applied energy beam causing local infiltration of the A fundamental concept of the present invention is the
tungsten carbide. The part that is manufactured is ready build up of a part in a layer-by-layer manner. That is, a
to be put into service preferably after a secondary pro part is considered a plurality of discrete cross-sectional
cess including, but not limited to, annealing. regions which cumulatively comprise the three-dimen
By way of further illustration, copper and tin may be 20 sional configuration of the part. Each discrete cross-sec
combined in a powder. Tin, having a lower melting tional region has defined two-dimensional boun
temperature than copper, will melt and infiltrate the daries-of course, each region may have unique bound
copper during sintering. aeS.
Secondary processing may also be applied to parts In the method, a first portion of powder 22 is depos
produced using the present invention. For example, 25 ited in the target area 26 and selectively sintered by the
where tin is allowed to melt and infiltrate copper during laser beam 64 to produce a first sintered layer 54 (FIG.
sintering, post process annealing will dissolve the tin 2). The first sintered layer 54 corresponds to a first
into the copper in the solid state creating bronze with cross-sectional region of the desired part. The laser
minimal volume change or distortion. beam selectively sinters only the deposited powder 22
By way of further illustration, metal, including but 30 within the confines of the defined boundaries.
not limited to, iron or steel, may be coated with poly(- There are, of course, alternative methods of selec
methyl methacrylate) (PMMA) polymer to form a pow tively sintering the powder 22. One method is for the
der. Sintering enables the PMMA to flow and bind the aim of the beam to be directed in a "vector' fashion
metal. Post process annealing will dissociate the that is, the beam would actually trace the outline and
PMMA and sinter the metal thus producing a final part. 35 interior of each cross-sectional region of the desired
Ceramic materials may be processed in this fashion as part. Alternatively, the aim of the beam 64 is scanned in
well. For example, a mixture of fluorophosphate glass a repetitive pattern and the laser 12 modulated. In FIG.
powders with alumina powders will result in the glass 2, a raster scan pattern 66 is used and is advantageous
Softening and infiltrating the alumina during the sinter over the vector mode primarily in its simplicity of im
ing process. In another example, aluminum silicate, plementation. Another possibility is to combine the
silica, or other ceramic powder can be coated with a vector and raster scan methods so that the desired
polymer by a variety of methods, including spray dry boundaries of the layer are traced in a vector mode and
ing and solvent coating. A surface active agent may be the interior irradiated in a raster scan mode. There are,
used to pretreat the ceramic powder prior to coating. of course, trade-offs associated with the method chosen.
This agent may be based on organosilane chemistry or 45 For example, the raster mode has a disadvantage when
other chemistries known to promote the wetability of compared to the vector mode in that arcs and lines
the ceramic by the polymer and the adhesion of ceramic which are not parallel to the axes 68, 70 of the raster
to polymer. Any polymer, either thermoplastic or ther pattern 66 of the laser beam 64 are only approximated.
moset, which can be coated on the ceramic, can be used Thus, in some cases resolution of the part can be de
as a binder. Typical materials include PMMA, polysty 50 graded when produced in the raster pattern mode.
rene, various epoxy formulations, and phenolics, However, the raster mode is advantageous over the
Any combination of materials, including but not lim vector mode in the simplicity of implementation.
ited to, metals, ceramics and polymers enables produc Turning to FIG. 1, the aim of the laser beam 64 is
tion of parts in accordance with the present invention scanned in the target area 26 in a continuous raster
wherein at least one material in the powder has a low 55 pattern. Broadly speaking, the driver 50 controls galvo
bonding or dissociation temperature relative to the nometers 48, 49 to made the raster pattern 66 (see FIG.
other materials in the powder. Shifting movement of the mirror 46 controls movement
In another preferred embodiment of the present in of the aim of the laser beam 64 in the fast scan axis 68
vention, the temperature of the powder mass may be (FIG. 2), while movement of the mirror 47 controls
increased using conventional heating means allowing movement of the aim of the laser beam 64 in the slow
the energy beam to merely supply a small increase.of Scan access 70.
energy to produce bonding or dissociation of one of the The present position of the aim of the beam 64 is fed
elemental materials of the powder. back through the driver 50 to the computer 40 (see FIG.
Materials comprising the powder may be chosen for 3). As described below, in more detail, the computer 40
each material's selective absorption of energy from a 65 possesses information relating to the desired cross-sec
laser beam (represented by the arrows in FIGS.11a and tional region of the part then being produced. That is, a
11b). In the preferred embodiment shown in FIG. 11, portion of loose powder 22 is dispensed into the target
material 1101 may be chosen to absorb the wavelength area 26 and the aim of the laser beam 64 moved in its
4,944,817
9 10
continuous raster pattern. The computer 40 modulates found more efficient for the production of high resolu
the laser 12 to selectively produce a laser beam at de tion parts.
sired intervals in the raster pattern 66. In this fashion, For each eight bit word, the least significant six bits
the directed beam of the laser 12 selectively sinters the (bits 0-5) represent the location of the next toggle poin
powder 22 in the target area 26 to produce the desired t-i.e. the next location for modulation of the laser 12.
sintered layer with the defined boundaries of the desired The next bit (bit 6) represents whether the laser is on or
cross-sectional region. This process is repeated layer off immediately before the toggle point identified in the
by-layer with the individual layers sintered together to least significant six bits. The most significant bit (MSB
produce a cohesive part-e.g. part 52 of FIG. 2. orbit 7) is used for looping and for controlling the slow
In operation, the wavelength of laser 12 may be var O scan axis 70 of the aim of the beam 64. Because the
ied to produce higher absorptivity of energy by selected Commodore 64 had limited memory, looping was
materials in the powder relative to other materials in required-it being understood that a computer 40 with
powder 22. In operation, blended, coated or other com more memory would not require looping.
binations of powders are preferably selected to produce FIG. 6 represents the flow chart for the data metering
sintered product with characteristics including but not 15 program. The data metering program is run when ever
limited to, close dimensional tolerances, structural in the flagline goes low causing a non-maskable interrupt
tegrity and required mechanical behavior. (see FIG. 3). The interrupt causes the microprocessor of
the computer 40 to retrieve a two byte interrupt vector
Interface and Software which points to the location in memory where program
The interface hardware operatively interconnects the 20 control is transferred at interrupt. As shown in FIG. 6,
computer 40 with the laser 12 and galvonometers 47, 48. the data metering program first pushes the registers
The output port of the computer 40 (see FIGS. 1 and 3) onto the stack and then loads the next byte of data into
is directly connected to the laser 12 to selectively modu the accumulator. The data word is also output to the
late the laser 12. When operated in the pulsed mode, the user port with the sixth bit used to modulate the laser 12
laser 12 is easily controlled by digital inputs to the 25 (FIG. 3).
pulsed gate input of the laser. Galvonometer 48 is As shown in FIG. 6, the most significant bit (MSB or
driven by the function generator driver 50 to drive the bit 7) of the data word in the accumulator is examined.
If the value of the most significant bit is one, that means
beam in the fast scan axis 68 independent of any control the end of the loop has not been reached; therefore the
signals from the computer 40. However, a position 30 data pointer is incremented, registers are restored from
feedback signal from the galvonometer 48 is fed to a the stack, and the data metering program is exited, re
voltage comparator 74 as shown in FIG. 3. The other turning control to the microprocessor at the location of
input to the comparator is connected to the digital-to interrupt. If the most significant bit in the accumulator
analog convertor 76 which is indicative of the least is zero, the data word is the last word in the loop. If the
significant six bits (bits 0-5) of the user port of the com 35 data word is the last word in the loop, the next bit in
puter 40. As shown in FIG. 3, the output of the voltage memory is a loop counter and the following two bytes
comparator 74 is connected to the flag line on the user are a vector pointing to the top of the loop. As can be
port of the computer 40. When the voltage comparator seen from FIG. 6, if the most significant bit equals zero
determines that the feedback signal from the galvonom (end of the loop) the loop counter (next bit) is decre
eter 48 crosses the signal from the digital-to-analog mented and analyzed. If the loop counter is still greater
convertor 76, the flag line goes low causing a nonmask than zero, the data pointer assumes the value from the
able interrupt. As discussed below, the nonmaskable next two memory bytes after the loop counter, registers
interrupt causes the next byte of data to put out on the are pulled from the stack and program control returns
user port of a computer 40. to the location of interrupt. On the other hand, if loop
Finally, as shown in FIG. 3, the galvonometer 49 45 counter is zero, the data pointer is incremented by three
driving the aim of the laser beam 64 in the slow scan axis and the loop counter is reset to ten before exiting the
70, is controlled by a second digital to analog convertor program. It can be appreciated that the need for such
78. The digital-to-analog convertor 78 is driven by a looping is absolved if the memory size of the computer
counter 79 which increments with each sweep of the 40 is adequate.
aim of the beam 64 in the fast scan axis 68. The eight 50 EXAMPLE
byte counter is designed to overflow after 256 scans in
the fast scan axis 68 to start a new cycle or raster scan In FIGS. 4 and 5, an example part 52 is illustrated. As
pattern 66. can be seen from the drawing, the example part 52
. Preferably, the control information (i.e. defined assumes an unusual shape in that it is not symmetrical
boundaries of the cross-sectional regions) data for each 55 and would be difficult to fabricate using conventional
raster pattern 66 would be determined by a CAD sys machining methods. For reference purposes, the part 52
tem given the overall dimensions and configuration of includes an outer base structure 80 having an interior
the part to be produced. Whether programmed or de cavity 82 and a pillar 84 disposed within the cavity 82
rived, the control information data for each raster pat (see FIG. 4). FIG. 5 shows the part 52 within the con
tern 66 is stored in the computer memory as a series of 60 finement structure 28 defining the target area 26 illus
eight bit words. The data format represents a pattern of trated in FIG. 1. As shown in FIG. 5, some of the pow
"on' and "off" regions of the laser 12, versus distance der 22 is loose, while the remainder of the powder is
along the raster pattern 66 traveled by the aim of the selectively sintered to comprise the structure of the part
beam 64. The data is stored in a "toggle-point' format 52. FIG. 5 is shown in vertical section with parts broken
where the data represents the distance along each raster 65 away and outlined in phantom to show the sintered
scan pattern 66 where the laser is modulated (i.e. turned cohesive portions of the part 52.
from on to off or from off to on). Although a "bit map' FIG. 7 shows a horizontal cross-sectional region,
format might be used, the toggle point format has been taken along line 7-7 of FIG. 4. FIG. 7 represents a
11
4,944,817
12
discrete layer 86 associated with the cross-sectional tion. Even the complex and expensive dies associated
region of the part being produced. As such, the sintered with powder metallurgy and conventional casting tech
layer 86 of FIG. 7 is a product of a single raster pattern niques are avoided.
66 as illustrated in FIG. 2. While large quantity production runs and certain part
For reference purposes, a sweep line through the material characteristics might be most advantageously
sintered layer 86 has been labeled "L.' FIG. 8 illustrates made using conventional fabrication techniques, the
the software and hardware interface operation during method and apparatus 10 of the present invention is
the sweep L. The top graph shows the position offeed useful in many contexts. In particular, prototype models
back signal from the fast axis galvo 48 and the output and casting patterns are easily and inexpensively pro
signal of the first digital to analog convertor 76 (com 10 duced. For example, casting patterns are easily made for
pare FIG. 3). The voltage comparator 74 generates an use in sand casting, lost wax casting, or other forming
output signal to the flag line of the computer 40 every techniques. Further, where desired quantities are very
time the feedback signal and first D/A output signal small, such as with obsolete replacement parts, produc
COSS tion of such replacement parts using the apparatus 10 of
In the top graph of FIG. 8, these points are labeled T 15 the present invention has many advantages. Finally, the
to represent toggle points. As can be seen from the use of the apparatus 10 may be useful where size of
bottom graph of FIG. 8, the flag line generates a non production facilities is a major constraint, such as on
maskable interrupt corresponding to each toggle point ship or in outerspace.
T. The sixth bit of each data word is analyzed and the Further modification and alternative embodiments of
current state of the laser 12 will reflect the value. The the apparatus of this invention will be apparent to those
penultimate graph of FIG. 8 shows the laser modulation skilled in the art in view of this description. Accord
signal for the sweep line L of FIG. 7. The second graph ingly this description is to be construed as illustrative
of FIG. 8 shows that a high-going edge in the most only and is for the purpose of teaching those skilled in
significant bit will be encountered at the end of each the art the manner of carrying out the invention. It is to
sweep of the aim of the laser beam 64 in the fast scan 25 be understood that the forms of the invention herein
axis 68. As shown in FIGS. 3 and 6, the counter 79 shown and described are to be taken as the presently
increments on a high going edge, and outputs a signal to preferred embodiments. Various changes may be made
the second digital-analog convertor 78 to drive the slow in the shape, size and arrangement of parts. For exam
axis galvonometer 49. ple, elements or materials may be substituted for those
As can be seen from the example illustrated in the 30 illustrated and described herein, parts may be reversed,
drawing, parts of complex shape can be produced with and certain features of the invention may be utilized
relative ease. Those skilled in the art will appreciate that independently of the use of other features, all as would
the part 52 illustrated in FIG. 4 would be difficult to be apparent to one skilled in the art after having the
produce using conventional machining methods. In benefit of this description of the invention.
particular, machine tool access would make the fabrica 35 We claim:
tion of cavity 82 and pillar 84 difficult, if not impossible, 1. An apparatus for producing a part comprising:
to produce if the part 52 were of a relatively small size. beam means for selectively emitting a directed energy
In addition to avoiding the access problem, it will be beam;
appreciated that the production accuracy is not depen structure for providing a target area for producing
dent upon machine tool wear and the accuracy of me the part;
chanical components found in conventional machine powder comprising a plurality of materials, said plu
tools. That is, the accuracy and tolerances of the parts rality of materials having more than one dissocia
produced by the method and apparatus of the present tion temperature;
invention are primarily a function of the quality of the means for dispensing said powder; and
electronics, the optics, and the implementing software. 45 control means for moving the aim of the beam and for
Of course, heat transfer and material considerations do modulating the beam means to selectively sinter
affect the tolerances obtainable. within defined boundaries a layer of powder dis
Those skilled in the art will appreciate that conven pensed in said target area,
tional machining techniques require considerable the control means being operable to effect selective
human intervention and judgment. For example, a con 50 sintering of sequential layers of powder within
ventional machining process, such as milling, would respective defined boundaries to produce a part
require creativity to make such decisions as tool selec comprising a plurality of layers sintered to
tion, part segmenting, sequence of cuts, etc. Such deci gether
sions would even be more important when producing a 2. An apparatus for producing a part comprising:
control tape for a tape control milling machine. On the 55 beam means for selectively emitting a directed energy
other hand, the apparatus of the present invention only beam;
requires the data relating to each cross-sectional region structure for providing a target area for producing
of the part being produced. While such data can be the part;
simply programmed into the computer 40, preferably, powder comprising a plurality of materials, said plu
the computer 40 includes a CAD/CAM system. That is, rality of materials having more than one bonding
the CAD/CAM portion of the computer 40 is given the temperature;
overall dimensions and configurations of the desired means for dispensing said powder; and
part to be produced and the computer 40 determines the control means for moving the aim of the beam and for
boundaries for each discrete cross-sectional region of modulating the beam means to selectively sinter
the part. Thus, a vast inventory of part information can 65 within defined boundaries a layer of powder dis
be stored and fed to the computer 40 on a selectable pensed in said target area,
basis. The apparatus 10 produces a selected part without the control means being operable to effect selective
set-up time, part specific tooling, or human interven sintering of sequential layers of powder within
4,944,817 14
13
respective defined boundaries to produce a part sintering a second layer of the second powder portion
comprising a plurality of layers sintered to corresponding to a second cross-sectional region of
gether. the part by operating the beam when the aim of the
3. The apparatus of claim 1 wherein said plurality of beam is within boundaries defined by said second
materials comprises at least one first material blended 5 cross-sectional region, including the substep of
with at least one second material. joining the first and second layers during the sinter
4. The apparatus of claim 2 wherein said plurality of ing of the second layer; and
materials comprises at least one first material blended depositing successive portions of powder onto the
with at least one second material. previous sintered layers and sintering each suc
5. The apparatus of claim 1 wherein said plurality of 10 cessive portion to produce successive sintered
materials comprises at least one first material coated layers joined to a previous sintered layer and a
with at least one second material. part comprising a plurality of sintered layers.
6. The apparatus of claim 2 wherein said plurality of 9. The method of claim 7 wherein said plurality of
materials comprises at least one first material coated 15 materials comprises at least one first material blended
with at least one second material. with at least one second material.
7. A method of producing a part comprising the steps 10. The method of claim 7 wherein said plurality of
of: materials comprises at least one first material coated
depositing a first portion of powder onto a target with at least one second material.
surface, said first portion of powder comprising a 11. The method of claim 8 wherein said plurality of
plurality of materials, said plurality of materials 20 materials comprises at least one first material blended
having more than one bonding temperature; with at least one second material.
scanning the aim of a directed energy beam over the 12. The method of claim 8 wherein said plurality of
target surface; materials comprises at least one first material coated
sintering a first layer of the first powder portion cor 25
with at least one second material.
responding to a first cross-sectional region of the 13. An apparatus for producing a part comprising:
part by operating the beam when the aim of the beam means for selectively emitting a directed energy
beam is within boundaries defined by said first beam;
cross-sectional region; structure for providing a target area and a gaseous
depositing a second portion of powder onto the first environment promoting sintering for producing
sintered layer, said second portion of powder com the part;
prising a plurality of materials, said plurality of powder comprising a plurality of materials, said plu
materials having more than one bonding tempera rality of materials having more than one dissocia
ture; tion temperature;
scanning the aim of a directed energy beam over the 35 means for dispensing said powder; and
first sintered layer; control means for moving the aim of the beam and for
sintering a second layer of the second powder portion modulating the beam means to selectively sinter
corresponding to a second cross-sectional region of within defined boundaries a layer of powder dis
the part by operating the beam when the aim of the pensed in said target area,
beam is within boundaries defined by said second 40 the control means being operable to effect selective
cross-sectional region, including the substep of sintering of sequential layers of powder within
joining the first and second layers during the sinter respective defined boundaries to produce a part
ing of the second layer; and comprising a plurality of layers sintered to
depositing successive portions of powder onto the gether.
previous sintered layers and sintering each suc 45 14. An apparatus for producing a part comprising:
cessive portion to produce successive sintered beam means for selectively emitting a directed energy
layers joined to a previous sintered layer and a beam;
part comprising a plurality of sintered layers. structure for providing a target area and a gaseous
8. A method of producing a part comprising the steps environment promoting sintering for producing
of: 50 the part;
depositing a first portion of powder onto a target powder comprising a plurality of materials, said plu
surface, said first portion of powder comprising a rality of materials having more than one bonding
plurality of materials, said plurality of materials temperature;
having more than one dissociation temperature; means for dispensing said powder; and
scanning the aim of a directed energy beam over the 55 control means for moving the aim of the beam and for
target surface; f modulating the beam means to selectively sinter
sintering a first layer of the first powder portion cor within defined boundaries a layer of powder dis
responding to a first cross-sectional region of the pensed in said target area,
part by operating the beam when the aim of the the control means being operable to effect selective
beam is within boundaries defined by said first sintering of sequential layers of powder within
cross-sectional region; respective defined boundaries to produce a part
depositing a second portion of powder onto the first comprising a plurality of layers sintered to
sintered layer, said second portion of powder com gether.
prising a plurality of materials, said plurality of 15. A method of producing a part comprising the
materials having more than one dissociation tem- 65 steps of:
perature; depositing a first portion of powder onto a target
scanning the aim of a directed energy beam over the surface in a gaseous environment promoting sinter
first sintered layer; ing, said first portion of powder comprising a plu
4,944,817
15 16
rality of materials, said plurality of materials hav structure for providing a target area for producing
ing more than one bonding temperature; the part;
scanning the aim of a directed energy beam over the a plurality of powders, said plurality of powders hav
target surface; ing more than one dissociation temperature;
sintering a first layer of the first powder portion cor- 5 means for dispensing each powder of said plurality of
responding to a first cross-sectional region of the powders; and
part by operating the beam when the aim of the control means for moving the aim of the beam and for
beam is within boundaries defined by said first modulating the beam means to selectively sinter
cross-sectional region; within defined boundaries a layer of said powders
depositing a second portion of powder onto the first 10 dispensed in said target area,
sintered layer in a gaseous environment promoting the control means being operable to effect selective
sintering, said second portion of powder compris sintering of sequential layers of powder within
ing a plurality of materials, said plurality of materi respective defined boundaries to produce a part
als having more than one bonding temperature; comprising a plurality of layers sintered to
scanning the aim of a directed energy beam over the 15 gether.
first sintered layer; 18. An apparatus for producing a part comprising:
sintering a second layer of the second powder portion beam means for selectively emitting a directed energy
corresponding to a second cross-sectional region of beam;
the part by operating the beam when the aim of the structure for providing a target area for producing
beam is within boundaries defined by said second 20 the part;
cross-sectional region, including the substep of a plurality of powders, said plurality of powders hav
joining the first and second layers during the sinter ing more than one bonding temperature;
ing of the second layer; and means for dispensing each powder of said plurality of
depositing successive portions of powder onto the powders; and
previous sintered layers in a gaseous environ- 25 control means for moving the aim of the beam and for
ment promoting sintering and sintering each modulating the beam means to selectively sinter
successive portion to produce successive sin within defined boundaries a layer of said powders
tered layers joined to a previous sintered layer dispensed in said target area,
and a part comprising a plurality of sintered the control means being operable to effect selective
layers. 30 sintering of sequential layers of powder within
16. A method of producing a part comprising the respective defined boundaries to produce a part
steps of: comprising a plurality of layers sintered to
depositing a first portion of powder onto a target gether.
surface in a gaseous environment promoting sinter 19. A method of producing a part comprising the
ing, said first portion of powder comprising a plu-35 steps of:
rality of materials, said plurality of materials hav individually depositing each powder of a first plural
ing more than one dissociation temperature; ity of powders onto a target surface, said first pow
Scanning the aim of a directed energy beam over the ders comprising a plurality of materials, said plural
target surface; ity of materials having more than one bonding
sintering a first layer of the first powder portion cor- 40 temperature;
responding to a first cross-sectional region of the scanning the aim of a directed energy beam over the
part by operating the beam when the aim of the target surface;
beam is within boundaries defined by said first sintering a layer of the first powders corresponding to
cross-sectional region; a first cross-sectional region of the part by operat
depositing a second portion of powder onto the first 45 ing the beam when the aim of the beam is within
sintered layer in a gaseous environment promoting boundaries defined by said first cross sectional
sintering, said second portion of powder compris region; r
ing a plurality of materials, said plurality of materi individually depositing each powder of a second
als having more than one dissociation temperature; plurality of powders onto the first sintered layer,
scanning the aim of a directed energy beam over the 50 said second powders comprising a plurality of ma
first sintered layer; terials, said plurality of materials having more than
sintering a second layer of the second powder portion one bonding temperature;
corresponding to a second cross-sectional region of scanning the aim of a directed energy beam over the
the part by operating the beam when the aim of the first sintered layer;
beam is within boundaries defined by said second 55 sintering a layer of the second powders correspond
cross-sectional region, including the substep of ing to a second cross-sectional region of the part by
joining the first and second layers during the sinter operating the beam when the aim of the beam is
ing of the second layer; and within boundaries defined by said second cross-sec
depositing successive portions of powder onto the tional region, including the substep of
previous sintered layers in a gaseous environ- 60 joining the first and second layers during the sinter
ment promoting sintering and sintering each ing of the second layer; and
successive portion to produce successive sin depositing successive layers of powders onto the
tered layers joined to a previous sintered layer previous sintered layers and sintering each suc
and a part comprising a plurality of sintered cessive portion to produce successive sintered
layers. 65 layers joined to a previous sintered layer and a
17. An apparatus for producing a part comprising: part comprising a plurality of sintered layers.
beam means for selectively emitting a directed energy 20. A method of producing a part comprising the
beam; steps of:
4,944,817 18
17
individually depositing each powder of a first plural terials, said plurality of materials having more than
ity of powders onto a target surface, said first pow one dissociation temperature;
ders comprising a plurality of materials, said plural scanning the aim of a directed energy beam over the
first sintered layer;
ity of materials having more than one dissociation 5 sintering a layer of the second powders correspond
temperature; ing to a second cross-sectional region of the part by
scanning the aim of a directed energy beam over the operating the beam when the aim of the beam is
target surface; within boundaries defined by said second cross-sec
sintering a layer of the first powders corresponding to tional region, including the substep of
a first cross-sectional region of the part by operat 10 joining the first and second layers during the sinter
ing the beam when the aim of the beam is within ing of the second layer; and
depositing successive layers of powders onto the
boundaries defined by said first cross-sectional previous sintered layers and sintering each suc
region; cessive portion to produce successive sintered
individually depositing each powder of a second 15 layers joined to a previous sintered layer and a
plurality of powders onto the first sintered layer, part comprising a plurality of sintered layers.
said second powders comprising a plurality of ma se k k

20

25

30

35

45

50

55

65

You might also like