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3rd Edition, 4 March 1998

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Installation Practices Manual

Bonding and Grounding Practices

Table of Contents

Paragraph Page

2.1 INTRODUCTION .................................................................................................................................................... 2-1

2.1.1 RF Strap for Reducing RF Interference.........................................................................................................................2-1
2.2 GROUNDING AND BONDING REQUIREMENTS (ELECTROMAGNETIC PROTECTION
PRACTICES) .......................................................................................................................................................... 2-1
2.2.1 General ............................................................................................................................................................................2-1
2.2.2 Specific Requirements ....................................................................................................................................................2-2
2.2.3 Equipment Grounding and Bonding (Refer to Figure 2-1) ...........................................................................................2-2
2.2.4 Marginal Practices and Associated Problems ...............................................................................................................2-4
2.2.5 Cable Shielding (Refer to Figures 2-2 and 2-3) .............................................................................................................2-4
2.2.6 Cable and Connector Selection.......................................................................................................................................2-8
2.2.7 Cable Routing..................................................................................................................................................................2-9
2.2.8 Maintenance Considerations........................................................................................................................................2-10
2.2.9 References .....................................................................................................................................................................2-10
2.2.10 Shield Treatment of Microphone Jacks .....................................................................................................................2-10
2.2.11 Definitions of Types of Interference...........................................................................................................................2-11
2.3 CONTROL SURFACE BONDING........................................................................................................................ 2-12
2.3.1 Bonding Aluminum Surfaces .......................................................................................................................................2-12
2.3.2 Bond Testing .................................................................................................................................................................2-12
2.3.3 Honeycomb Shelf Bonding............................................................................................................................................2-13

NOTICE: This section replaces second edition dated 6 March 1992.

 List of Effective Pages *The asterisk indicates pages changed, added, or deleted by the current change.

Page No Issue

* Title ........................................... 4 Mar 98

* List of Effective Pages............... 4 Mar 98
* 2-1 thru 2-16.............................. 4 Mar 98

RETAIN THIS RECORD IN THE FRONT OF THE MANUAL. ON RECEIPT OF

Record of Revisions REVISIONS, INSERT REVISED PAGES IN THE MANUAL, AND ENTER DATE
INSERTED AND INITIALS.

REV REVISION INSERTION SB NUMBER REV REVISION INSERTION SB NUMBER

NO DATE DATE/BY INCLUDED NO DATE DATE/BY INCLUDED

1st Ed 22 Mar 90 None

2nd Ed 6 Mar 92 None

3rd Ed 4 Mar 98 None

 section II
bonding and grounding practices

2.1 INTRODUCTION

The following paragraphs describe bonding requirements as related to the installation of avionics equipment.
It includes methods for achieving acceptable metal-to-metal electrical bonding in equipment racks and other
aircraft structures to insure a low impedance bond from equipment chassis to airframe. Also discussed are
wiring practices related to termination of shields and connecting equipment ground wires and power re-
turns. Proper attention to these installation methods and requirements will help to assure acceptable HIRF,
lightning, and EMI performance of the installed equipment.

2.1.1 RF Strap for Reducing RF Interference

RF bonding or grounding requires a strap of metal instead of a wire. This strap must be bonded directly to
the airframe using silver- or tin-plated copper strap or aluminum strap or equivalent structure. The length
to width ratio of the strap should not be more than 5 to 1 (that is, 127-mm (5-in) strap should be minimum of
25.4 mm (1 in) wide).

Bonding to anodized or painted surfaces is not acceptable for good RF grounds. Surfaces to be bonded should
be sanded free of paint or anodic film and joined using screws with washers to ensure maximum surface con-
tact over as large an area as possible. Materials should be carefully selected to avoid corrosion due to dis-
similar metals. An electrically conductive substance should be used on all bare metal surfaces to retard cor-
rosion.

2.2 GROUNDING AND BONDING REQUIREMENTS (ELECTROMAGNETIC PROTECTION

PRACTICES)

The FAA has issued policy guidelines concerning the operation of flight-critical and essential systems when
exposed to the possible hazards of High Intensity Radiated electromagnetic Fields (HIRF) and the indirect
hazards of lightning. Also of concern are the increasing number of incidents of interference to aircraft radio
navigation and communication operations, resulting from EMI produced by avionics equipment and wiring.
Proper shielding and grounding techniques have proven to be extremely important in protecting equipment
against these electromagnetic hazards. The practices given in the following paragraphs are designed to
minimize HIRF, EMI, and lightning hazards.

2.2.1 General

The objective of any avionics installation is to provide an operational system that properly performs all func-
tions at all times. To achieve this goal requires that consideration be given to methods of interconnection and
grounding that will provide the proper distribution of signals and power while minimizing the systems sus-
ceptibility to interference from internal and external energy sources.

A prerequisite for providing equipment protection is the establishment of a a reference ground plane and the
means of providing adequate connection. Making a connection to the ground plane is grounding, and the
mechanical method of providing a low impedance union between conductors is electrical bonding. For air-
craft installations, the airframe functions as the reference ground plane. The low impedance bonding of the

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 bonding and grounding practices 523-0776007

various rack, mounts, panels, and equipment chassis provide the needed protection. In the evaluation of
bonding needs, there are two distinct and separate considerations:

a. The equipment bonding must provide a low impedance path to the airframe to ensure that signals gen-
erated and exchanged between units are referenced to a common level, and an adequate earth path is
provided to cater for short circuit conditions.
b. Provide a low impedance path suitable for radio frequency protection.

The differences in the magnitude and nature of a. and b. above dictate the type of loading path required in
each case. In paragraph a., the currents are usually DC or low frequency AC, and of a magnitude measured
in amps under fault conditions. Hence, the resistive component of the bond path impedance is the dominant
feature. It should be kept to a minimum and the path should be capable of carrying the maximum current
that can pass through the unit under fault conditions. In paragraph b., because of the high frequency of the
currents involved, the inductive component of the path impedance is the critical feature, and it should be
kept to a minimum. Consequently, while a cable of adequate current rating and suitably terminated may
provide an acceptable path for paragraph a., it's inherent inductance could render it unsuitable for radio fre-
quency bonding.

2.2.2 Specific Requirements

The following guidelines should be used as a basis for practices used for installation of all Collins avionics.
Specific requirements that must be met when installing Collins avionics systems and equipment are:

The installation requirements defined on the interconnect diagrams and other installation data provided by
Collins must be followed completely. Any deviations must be evaluated individually.

Workmanship and quality control is very important. Past installation standards and practices may not be
adequate for modern protection requirements. Dressing of shields, length of strapping wires, bonding, etc.
are critical to provide protection.

Connectors with conductive backshells and good conductivity of exterior mating surfaces to provide 360 de-
grees of shielding are now being used where possible. Connectors and hardware called out on installation
control drawings for individual equipment or approved equivalent must be used.

2.2.3 Equipment Grounding and Bonding (Refer to Figure 2-1.)

To minimize electromagnetic effects upon the avionics equipment a low impedance/low resistance plane of
reference is required. For convenience this is referred to as a ground plane, even though a connection to
earth is not necessarily involved. Such is the case for aircraft installations. The airframe functions as the
ground plane and therefore becomes the reference plane. The primary objective of a good installation is to
minimize the impedance between the primary aircraft structure and the various racks, mounts, and equip-
ment chassis.

In designing and establishing equipment bonding and grounding methods, it is necessary to consider the fre-
quency spectrum of the electromagnetic effects for which protection is required. By far the most favorable
method for bonding is to provide direct bonding between structures in such a way as to maximize contact
area and minimize contact resistance between the surfaces being bonded. RF currents seek the most direct
path to the reference plane. Forcing them away from this path by bonding in only one location or with insuf-
ficient surface area introduces impedance which can seriously degrade system performance, especially at
higher frequencies. In general, direct bonds include permanent metal-to-metal joints formed of machined
metal surfaces or with electrically conductive joints held together by fasteners. Where screws are used to se-
cure metallic surfaces, the screws should not be the only conductive path between metallic surfaces. Non-
conductive paint should be removed to expose the metallic surface where contact is made. Good bonding im-
plies attention to bonds between all structures in the path between the equipment chassis and the primary

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aircraft structure. With proper attention to direct bonding methods, individual bonds between metal struc-
tures should be well below 500 micro-ohms. An indication of a good equipment installation is a DC resis-
tance of 2.5 milliohms or less between the equipment and the primary aircraft structure. it is important to
realize that bonds within the individual structures between the equipment chassis and primary aircraft
structure need to be considerably less than 2.5 milliohms.

Good bonding practices in cabling require all aircraft electrical systems such as generators, ignition systems,
power supplies, etc., be bonded and grounded. LRU mounts must be bonded directly to the airframe ground.
This provides positive grounding of the mount, to which the shield grounds and chassis ground safety wire
are attached.

Figure 2-1. Typical Grounding Connections

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 bonding and grounding practices 523-0776007

2.2.4 Marginal Practices and Associated Problems

At the LRU indicator, display and/or control which are panel or console mounted, shields are terminated to
connector backshell stud and nut assemblies or a ground stud provided. If the backshell connection cannot
make a known positive low impedance ground through the case of the LRU through panel/ pedestal to air-
frame, then a connector backshell RF grounding strap connected to airframe will be necessary. This will help
to achieve a low impedance shield ground. Other methods include:

a. Use of multiple bonding straps.

b. Use of multiple ground points for each instrument.
c. Use of wider and thicker bonding straps.
d. Use of instrument panel for ground point by spot facing attach points of instruments and instrument
panel.
e. Locate ground studs on instrument panel and position to accept the backshell bonding straps of a length
to allow disconnect of connectors. Add multiple bonding straps on the instrument panel to airframe
ground points. Corrosion proof to maintain low surface resistance.

Solid flexible tinned copper with a 5 to 1 length to width ratio is highly preferred for bonding straps as it ex-
hibits the lowest impedance when compared to tinned copper braid or tinned stranded copper wire of the
same length. The strap length should be as short as possible as all straps will exhibit some inductive reac-
tance that will combine with the stray capacitance to become a parallel resonant, high impedance, circuit at
some frequency. As the strap is shorter, the frequency will be higher. When this occurs the strap no longer
provides a good bonding path.

2.2.5 Cable Shielding (Refer to Figure 2-2 and Figure 2-3)

When using shielded wire and coaxial cable the shield must be grounded at both ends. Shield drain wires
should be 7.62 cm (3.0 in) in length or less and should terminate to chassis ground or airframe ground within
3.81 cm (1.5 in) of connector entry to the LRU. In many cases the connector backshell provides a convenient
location to attach a drain wire. This would require the use of a special circuit. This practice requires ade-
quate bonding between masked connector halves and may require the use of conductive spring fingers on the
line.

Unless shown specifically in the interconnect drawing or installation data, DO NOT USE THE CONNEC-
TOR FUNCTION PINS LABELED “SHIELD” TO TERMINATE WIRING SHIELDS. Doing so could allow
the penetration of high energy interference into the internal areas of an LRU. At the LRU mount, shield
terminations are made directly to the LRU mount/airframe.

The conventional symbols for earth ground and chassis ground are both used for convenience in identifying
power grounds or returns, and chassis ground terminations. In the actual aircraft installation they would
electrically be the same. System power grounds and chassis ground wires must be no greater than the spe-
cific lengths and use extremely low impedance bonding paths and materials.

LRU jumper/logic straps should be as short as possible, but no longer than 15.24 cm (6 in). If a particular in-
stallation demands a longer length of wire, then single shielded wire should be used with shield of wire
grounded at both ends unless otherwise indicated.

Discrete control functions, discrete valids, and discrete logic lines connected to relays, switches, annunciators
and other equipment can be single wires and are not required to be twisted-pair wires. The single wires used
for discrete functions may be open-ended during some operational modes and could act as antennas. Nor-
mally, these do not require shielding if they are not directly exposed to the aircraft external environment. In
the case where a long run (over 30 feet) of unshielded wire is not in a harness with other wiring, it is advis-

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 bonding and grounding practices 523-0776007

able to shield the wire and ground the shield at both ends. When there is doubt concerning the adequacy of
protection to any LRU input, the published circuit information for the LRU should be consulted.

Figure 2-2. Shielding Practices Diagram (Sheet 1 of 2)

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Figure 2-2. Shielding Practices Diagram (Sheet 2)

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Figure 2-3. Shielding Treatment, Digital and Analog

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 bonding and grounding practices 523-0776007

All wiring for AC/DC signals as well as all AC primary power and AC reference power should be shielded,
twisted pair wiring with the shield grounded at the source and the load. The AC primary power return wires
are connected at the source end and to ground located at the respective circuit breaker panel or return
source. The AC primary power low side is normally not grounded at the LRU. AC primary power installa-
tions may vary between the various aircraft manufacturers and reference should be made to the aircraft
documentation. AC reference power returns should be connected at the respective circuit breaker panel or
return source.

DC primary power returns and chassis ground must be individually connected to LRU mount/airframe using
separate local termination points for safety purposes. The lengths should not exceed 15.24 cm (6 in). A single
wire may be used for DC primary power if the DC return through airframe ground to the source is less than
10 milliohms or the voltage drop between the LRU ground terminal and the primary power grounding point
to airframe does not exceed 0.5 volts during continuous operation of the LRU at a nominal primary voltage of
28 volts. Otherwise the installer may use twisted pair wire with power return connected at LRU
mount/airframe ground and also connected at the source end to the ground located at the respective circuit
breaker panel or return source. This does not negate the requirement that bonding resistance between an
LRU and the airframe be 2.5 milliohms or less.

Wire shields must be grounded at both ends unless otherwise indicated. Shields broken at bulkheads or ter-
minal strips/J boxes should be grounded at each end of their section if possible or carried through on sepa-
rate pins. (The “suppression” function, which uses coaxial cable, is an exception which requires carrying
through the shield on pins). Wires used to terminate shields to ground should be 7.62 cm (3.0 in) or less. All
shield termination wires must be connected individually to ground (do not jumper shield to shield with only
one wire to ground), unless otherwise shown.

Strapping wires added at a unit connector for programming unit internal functions should be 15.24 cm (6.0
in) or less where practical. Shield all strapping wires that are longer than 15.24 cm (6.0 in).

Use twisted-shielded-pair wire for AC panel light power. A single wire may be used for DC panel light power
if the airframe is normally used for DC power return. Twisted pair wiring should be used if the airframe is
not used for DC power return. Twisted-shielded-pair wire should be used if pulsed DC is used between units
for brightness control.

2.2.6 Cable and Connector Selection

Poorly selected connectors and installed cabling can act as both a noise transmitting and receiving antenna
or as undesired primary and secondary windings of coupling transformers, placing interference where it
should not be.

The following must be considered when selecting cable and connectors:

• SIGNAL FREQUENCIES
• AUDIO
• VIDEO
• RF VOLTAGE
• POWER LEVELS
• SUSCEPTIBILITY TO PICKUP OF NOISE
• TOLERABLE LOSS
• SIGNAL DEGRADATION

Always use the recommended connector and cable defined in the installation manual or other installation in-
structions provided by the manufacturer. All low level analog and data wiring should be shielded, due to

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 bonding and grounding practices 523-0776007

susceptibility to pickup of noise. When selecting a coax cable, too small a cable may cause excessive losses
and waveform distortion of fast rise time digital pulses. Cable selection should include the highest possible
copper coverage in the outer braid over the dielectric, to diminish transmission line leakage, and reduce sus-
ceptibility to noise pickup. Teflon type dielectric and silver plating the inner and outer conductors greatly
improves the high frequency capabilities of coax cables.

Connectors must be able to interconnect with very low DC resistance, less than 10 milliohms. Coax connector
types must be impedance matched to the system impedance.

Very low level signals (-100 dBm) require careful selection of connectors and cable. Ferro-magnetic materials
such as iron, stainless steel, cobalt and nickel, can cause the generation of intermodulation or nonlinear dis-
tortion. Even minute amounts of these materials can generate noise levels high enough to mask the low level
signal. Connector base material should be brightly plated with copper, followed by a plated gold finish for
protection and minimum contact resistance. Copper clad wire and stainless steel base materials for connec-
tors should not be used in low level signal applications.

Connector contact base material may be brass, but the spring retention material should be beryllium copper.
Brass will lose its contact pressure and the connection will become noisy or fail.

For installation design, wire and cable selection may require but not be limited to options such as twisted
pairs, shielded wire, coax, triax, twinax and foil shields.

All single-ended low level analog or data circuits should be interconnected using shielded wire or cable to
protect against magnetic (inductive) and electric (capacitive) stray fields. Many units use balanced circuitry
for the data and low level inputs and require twisted shielded pair wiring. Triaxial cable in place of coaxial
cable may be used for antenna to LRU antenna port interconnection where better protection of the antenna
input is required. Wires and cables that provide higher than normal attenuation, such as the Raychem Elec-
troloss filter line, are available but an analysis of the installation should be made as to the level of protection
required before using the higher attenuation cable. Any installed spare wires or unused open-ended cable
may be left open for convenience. One method that is employed to reduce overall susceptibility of a cable
bundle to high energy, particularly lightning, is to add a wire into the cable that is grounded at both ends.
This provides a low impedance path for the interference, thereby reducing the level induced on adjacent con-
ductors.

The use of shielded wire with the shield grounded at both ends is used to raise the lightning damage immu-
nity of LRU input; the shielding acting as a layer of protection to electric and magnetic fields for the signal
conductor. Engineering normally designates which circuits require this protection and ensures that this is
shown on the interconnect drawing.

2.2.7 Cable Routing

From an RF viewpoint an all metal airplane is a loss wave guide, containing wire bundles routed in various
different locations which connect to electrical circuits and electronic equipment. The fuselage provides a
limited degree of protection (20-25 dB) as a shield. Additional protection can be achieved by routing ca-
ble/wire bundles as close as possible to the aircraft skin thereby producing a transmission line effect.

Where shielded wires are routed between different sections of the aircraft, such as from equipment rack to
the cockpit panel, the shields should be grounded to the airframe at multiple locations if at all possible. This
enhances the effectiveness of the shield by both confining and distributing the shield currents and reducing
the electrical potential along the shield, particularly in the case of lightning effects.

Protection methods against interference generated within the aircraft, referred to as electromagnetic com-
patibility (EMC), and against interference generated external to the aircraft must be evaluated as a whole.
For example, the greater the number of wires in a bundle and the tighter the grouping of the wires, the bet-

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 bonding and grounding practices 523-0776007

ter the protection against external radiation sources and against lightning effects. Conversely, to prevent
cross-talk and the induction of switching transients into low level circuits, wires are loosely bundled. In addi-
tion, the power, signal and high current drive interconnect wires may also be separated from each other. The
lower the system signal voltage, the greater is the susceptibility to outside interference. This is why low level
signal lines are spaced separately from high current and high voltage cables. To minimize the coupling be-
tween cables, physical separation is the best solution. Typical wire bundle separation might require group-
ings such as system 1 power, system 1 digital I/O, system 1 analog I/O and system 1 RF. Ideally these system
1 wire bundles would be on the left side of the aircraft along with associated electronics and all system 2 wire
bundles and electronics would be located on the right side of the aircraft. Requirements will vary with indi-
vidual installations and may need more or less separation. In general, all of the wires used to form the inter-
connection harness for each side of the Collins avionics systems. including the primary power line, can be
grouped together. This improves the immunity to external interference sources.

Do not bend coaxial cable tighter than manufacturer's recommendations as cable discontinuities may result.
Care must be taken to route cables for critical functions separately from cables for redundant systems, e.g.,
attitude interconnect wires #1 and #2 systems must be separated.

2.2.8 Maintenance Considerations

The certification authorities have indicated that those measures to protect the avionics system against the
effects of HIRF and lightning will eventually be subject to maintenance requirements. However, specific
items to be inspected or measured have as yet to be agreed upon. Until such time as specific maintenance
items are addressed by regulation, maintenance of Collins avionics systems installations which are installed
in accordance with these guidelines and which are operating correctly, will be “On Condition” maintenance.
Therefore, there will not be additional maintenance required except for normal visual inspections for damage
during routine aircraft inspections.

2.2.9 References

The following official documents should be referred to for additional or expanded information:

a. FAA Advisory Circular 43.13-1A, Chapter 11, Electrical Systems (refer to appendix).
b. FAA Advisory Circular 20-1309, System Design and Analysis
c. FAA Advisory Circular 20-136, Protection of Aircraft Electrical/Electronics Systems Against the Indirect
Effects of Lightning.

2.2.10 Shield Treatment of Microphone Jacks

Figure 2-4 illustrates a common microphone jack installation with potential interference problems, along
with a recommended installation that eliminates the problems. Although the problem installation is pro-
tected from capacitive noise, it is open to both magnetic and common impedance problems. The airframe
serves as the common impedance ground return for the MIC AUDIO LOW along with many other aircraft
appliances. The MIC AUDIO HI makes a loop with the airframe. The loop's area depends upon the routing of
the MIC cable. It may be large and is capable of developing noise currents from magnetic fields. A compro-
mise is to allow the shield to be used as a conductor for the MIC AUDIO LOW. This reduces the loop area, al-
though not as well as a twisted pair. Also the capacitively coupled noise returning to ground along the shield
will share the common impedance of the shield with the MIC AUDIO LOW. The recommended installation
diagrammed in Figure 2-4 eliminates both magnetic and common impedance problems.

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 BUSINESS AND REGIONAL SYSTEMS
INSTALLATION PRACTICES MANUAL

Installation Practices Manual

INSTALLATION MANUAL (523-0775254, 3RD EDITION, DATED MAR 4/98)

TEMPORARY REVISION NO. 01

Insert facing page 2-10.

Subject: Change to Advisory Circular AC 43.13-1A.

Advisory Circular AC 43.13-1A has been revised and is now labeled AC 43.13-1B, dated 9/8/98.

In paragraph 2.2.9.a should read as follows:

a. FAA Advisory Circular 43.13-1B Chapter 11, Aircraft Electrical Systems (refer to
appendix).

Temporary Revision 1 Page 2

523-0775254-01311A May 26/00
 bonding and grounding practices 523-0776007

Figure 2-4. Microphone Jack Shield Treatment

2.2.11 Definitions of Types of Interference

The following paragraphs contain definitions of typical interference problems encountered in avionics in-
stallations. The possible solutions to the interference problem are included in the definition.

a. Conductive Interference is interference traveling on a conductor. Power supply leads commonly sup-
ply the conductive path for this interference. Selective filtering of either the noise source or receiver, or
filtering both ends, is the common remedy. An avionics master switch can help ensure that the avionics
are isolated from power supply voltage spikes of greater than one hundred volts produced by some
starter motors.
b. Common Impedance Interference takes place between circuits that share a common impedance.
Some examples of common impedance are: Shared power supplies, power leads, ground leads, common
ground returns through chassis, airframes, mounting racks and ground lugs, and the shield of a wire
when the shield carries part of the signal and the shield is connected to ground at both ends. Bonding
and grounding become more critical in higher frequency circuits, due to increased inductive resistance.
The worst case situation for common impedance interference is a high-current noise source sharing a
common impedance with a low-voltage noise sensitive circuit.
c. Stray Capacitive Pickup Interference is a voltage transfer between two or more circuits due to stray
capacitive coupling. The worst case condition for capacitive pickup is a high-voltage, high-frequency
noise source with high mutual capacitance (wire in close proximity with no or improper shielding) to a
high-impedance, low-level, noise sensitive circuit. For a shield to be effective against capacitively coupled
noise, the shield must be held at ground potential along its length.
d. Magnetic Field Interference is the unwanted noise signal induced in a circuit while it is in the pres-
ence of a varying magnetic field. The worst case for magnetic field interference is a high-current, high-
frequency, large-loop area noise source with its loop in close proximity and lying parallel to a noise sensi-
tive circuit of large-loop area. The most effective and yet often least expensive magnetic noise source re-
duction technique is to reduce the source loop area. This is easily accomplished through the use of paired
conductors, twisted pairs, and coaxial cables. Loop-area reduction is equally effective when applied to the
noise sensitive circuit. Allowing the airframe to return a portion of the ground return current may in-
crease noise by reducing or eliminating loop-area reduction techniques. Physical separation of noise
source and noise sensitive circuits and providing for the circuits to cross at right angles also reduce mag-
netic field interference coupling. Conventional shielding (non MU metal) will not provide magnetic field
protection.

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 bonding and grounding practices 523-0776007

2.3 CONTROL SURFACE BONDING

A braided electrical jumper strap is normally used to bond a control surface to the aircraft surface. Adding or
repairing bonding jumpers or static discharge wicks to an aircraft control surface is critical to the safety of
flight.

The work must be inspected and signed off by a certified mechanic. In determining the best location for the
bonding jumper, consider the movement of the control surface to be bonded. Clean off any nonconductive ma-
terial such as zinc chromate, paint, grease, oil, etc from the bonding areas. Connect bonding jumper to the
control surface. Connect the opposite end to the aircraft surface.

Refer to Figure 2-1 for a view of a typical grounding stud installation. Check the movement of the control
surface. The jumper must not restrict the movement of the control surface.

2.3.1 Bonding Aluminum Surfaces

The first step in preparing two surfaces for bonding is to clean the surfaces. All nonconductive elements such
as zinc chromate, paint, grease, oil, etc must be removed from the bonding surfaces. The area should be
brushed clean or sanded with very fine sandpaper. This should remove any aluminum oxide from the sur-
face. Use caution not to remove excessive amounts of aluminum. Wipe off the cleaned surfaces with a clean
cloth and 1,1,1 Trichloroethane. The bare aluminum may be treated with Alodine 1200S, CPN 005-1157-010
(please note: the quantity for Alodine 1200S under CPN 005-1157-010 is one gallon) or Iridite 14-9 or other
conductive material. After applying Alodine, allow time for all the surfaces to dry (1 hour max).

Warning

When using flammable materials for cleaning purposes, observe all fire precautions. The materi-
als should be used outside or in a ventilated booth provided with explosion-proof electrical
equipment and exhaust fan having sparkproof blades.

The mating surfaces must be smooth and contoured so that the mating surface area is in actual contact. Af-
ter completion of the bonding, refinish the area from which the protective coating has been removed with its
original finish or other suitable protective finish within 24 hours. In no case shall full refinishing be delayed
more than seven days after removal of the finish.

2.3.2 Bond Testing

The following test methods are very useful in assuring adequate electrical bonding between surfaces. Indi-
vidual bonds should have a resistance of less than 0.75 milliohms, and should normally measure 0.25 mil-
liohms or less. The simplest method is to employ a Biddle (milliohm) meter device and measure for bond re-
sistance as shown in Figure 2-5. If a Biddle meter on the line is unavailable, a voltage drop test may be
performed as follows:

a. Securely (bolt) connect Z and Y as indicated in Figure 2-6.

b. The contact resistance at Z and Y will not be included in the millivolt measurement circuit if the leads P
and Q are not connected across the connections at Z and Y.
c. Adjust the power supply for the required 10 amps.
d. Connect the millivoltmeter across the bond and read the voltage drop.
e. The millivolt reading should be nominally less than 2.5 millivolts; anything greater than 7.5 millivolts is
a poor bond. (7.5 millivolts at 10 amps means the bond has 0.75 milliohm of resistance).

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 BUSINESS AND REGIONAL SYSTEMS
INSTALLATION PRACTICES MANUAL

Installation Practices Manual

INSTALLATION MANUAL (523-0775254, 3RD EDITION, DATED MAR 4/98)

TEMPORARY REVISION NO. 01

Insert facing page 2-13.

Subject: Change to Advisory Circular AC 43.13-1A.

In the last sentence on the page, Advisory Circular AC 43.13-1A has been revised and is now
labeled AC 43.13-1B, dated 9/8/98.

Temporary Revision 1 Page 3

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2.3.3 Honeycomb Shelf Bonding

Honeycomb bonding requires consideration of the two shelf surfaces. The top and bottom surfaces are con-
nected to the honeycomb core by nonconductive adhesive. To obtain a bond between the top and bottom sur-
faces, a bonding rivet or strap is required. A bolt and strap can also be used.

Refer to Figure 2-7 for a diagram on bonding a honeycomb shelf. It is recommended that the shelf be bonded
in two or more places at opposite ends of the shelf. Follow the bonding instructions in paragraph 2.1 for alu-
minum shelf. Additional information on bonding is available in FAA AC 43.13-1A located in the appendix
section of this manual.

Revised 4 March 1998 2-13

 bonding and grounding practices 523-0776007

Figure 2-5. Preferred Bond Testing Diagram

Revised 4 March 1998 2-14

 bonding and grounding practices 523-0776007

Figure 2-6. Alternate Bond Testing Diagram

Revised 4 March 1998 2-15

 bonding and grounding practices 523-0776007

Figure 2-7. Bonding Practices for Honeycomb Shelves

Revised 4 March 1998 2-16