www.osram-os.

com
Produktdatenblatt | Version 1.1
KW CELNM1.TG
 

KW CELNM1.TG
OSLON ® Compact PL
Compact light source with isolated thermal pad for
improved heat dissipation and small z-tolerance (+/-
35 µm).

Applications
——Headlamps, LED & Laser & Night Vision

Features:
——Package: Ceramic package
——Chip technology: UX:3
——Typ. Radiation: 120° (Lambertian emitter)
——Color: Cx = 0.32, Cy = 0.33 acc. to CIE 1931 (● white)
——Corrosion Robustness Class: 3A
——Qualifications: AEC-Q102 Qualified with RV-level 1
——ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)


Not for new design

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Ordering Information 
Type Luminous Flux 1) Ordering Code
IF = 1000 mA
ΦV

KW CELNM1.TG-Z6N6-ebvFfcbB46-15B3 315 ... 474 lm Q65112A9410


Not for new design

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Maximum Ratings
Parameter Symbol Values

Operating Temperature Top min. -40 °C

max. 125 °C
Storage Temperature Tstg min. -40 °C
max. 125 °C
Junction Temperature Tj max. 150 °C
Junction Temperature for short time applications* Tj max. 175 °C
Forward Current IF min. 50 mA
TS = 25 °C max. 1500 mA
Surge Current IFS max. 5000 mA
t ≤ 10 µs; D = 0.005 ; TS = 25 °C
ESD withstand voltage VESD 8 kV
acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)
Reverse current 2) IR max. 200 mA

* The median lifetime (L70/B50) for Tj = 175°C is 100h.


Not for new design

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Characteristics
IF = 1000 mA; TS = 25 °C
Parameter Symbol Values

Chromaticity Coordinate 3) Cx typ. 0.32

Cy typ. 0.33
Viewing angle at 50% IV 2φ typ. 120 °
Forward Voltage 4) VF min. 2.75 V
IF = 1000 mA typ. 3.00 V
max. 3.40 V
Reverse voltage (ESD device) VR ESD min. 45 V
Reverse voltage  2)
VR max. 1.2 V
IR = 20 mA
Real thermal resistance junction/solderpoint 5) RthJS real typ. 4.6 K / W
max. 5.6 K / W
Electrical thermal resistance junction/solderpoint 5) RthJS elec. typ. 3.3 K / W
with efficiency ηe = 28 % max. 4.0 K / W


Not for new design

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Brightness Groups 
Group Luminous Flux 1) Luminous Flux 1)
IF = 1000 mA IF = 1000 mA
min. max.
ΦV ΦV

6N 315 lm 355 lm
6NF 334 lm 377 lm
7N 355 lm 400 lm
7NF 377 lm 424 lm
8N 400 lm 450 lm
8NF 424 lm 474 lm

Forward Voltage Groups 

Group Forward Voltage 4) Forward Voltage 4)
IF = 1000 mA IF = 1000 mA
min. max.
VF VF

15 2.75 V 3.00 V
65 3.00 V 3.25 V
B3 3.25 V 3.40 V


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Chromaticity Coordinate Groups 3)

0.90 0.37

520
525
515 530
0.80
0.36
Cy 540 Cy
510

0.70 550

505
0.35
560
0.60 fcbB46
570
500
0.34
0.50
580
ebzB46
590
495
0.40
0.33
600
ebxD46
610
620
0.30 490 630
650
700
0.32
ebvF46
0.20 485

480 0.31
0.10
475

470
465
460
455
450
0.00 400
0.30
0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.29 0.30 0.31 0.32 0.33 0.34

Cx Cx

Chromaticity Coordinate Groups  3)

Group Cx Cy Group Cx Cy

ebvF46 0.3127 0.3093 ebzB46 0.3203 0.3274

0.3212 0.3175 0.3299 0.3361
0.3199 0.3325 0.3298 0.3526
0.3104 0.3234 0.3190 0.3430
ebxD46 0.3163 0.3181 fcbB46 0.3248 0.3370
0.3253
0.3246
0.3266
0.3424  0.3350
0.3355
0.3460
0.3633
0.3145 0.3330 0.3241 0.3534
Not for new design

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Group Name on Label 

Example: 6N-ebvF46-15
Brightness Color Chromaticity Forward Voltage

6N ebvF46 15


Not for new design

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Relative Spectral Emission 6)

Φrel = f (λ); IF = 1000 mA; TS = 25 °C

KW CELNM1.TG
1,0
Φrel
: Vλ
: ultra white

0,8

0,6

0,4

0,2

0,0
350 400 450 500 550 600 650 700 750 800
λ [nm]
Note: Percentage of red: >5% acc. to ECE regulation
Percentage of UV: <10-5 W/lm acc. to ECE regulation

Radiation Characteristics 6)

Irel = f (ϕ); TS = 25 °C
KW CELNM1.TG

ϕ [°]
-10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90°
-20° 1,0
Irel


-30°

-40° 0,8

-50°
0,6
-60°

0,4
-70°

-80° 0,2

-90° 0,0
Not for new design

-100°

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Forward current 6), 7) Relative Luminous Flux 6), 7)

IF = f(VF); TS = 25 °C Φv/Φv(1000 mA) = f(IF); TS = 25 °C

KW CELNM1.TG KW CELNM1.TG
3000 ΦV 2,5
IF [mA]
ΦV(1000mA)

2500
2,0

2000
1,5

1500
1,0

1000

0,5

500

0,0
50

50

00

00

00

00

00
50
2,6 2,8 3,0 3,2 3,4

10

15

20

25

30
VF [V] IF [mA]

Chromaticity Coordinate Shift 6)

ΔCx, ΔCy = f(IF); TS = 25 °C

KW CELNM1.TG
0,03
∆Cx
∆Cy : ∆ Cx
: ∆ Cy


0,02

0,01

0,00

-0,01

-0,02
Not for new design

-0,03
50

00

00

00

00

00
50

10

15

20

25

30

IF [mA]

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Forward Voltage 6) Relative Luminous Flux 6)

ΔVF = VF - VF(25 °C) = f(Tj); IF = 1000 mA Φv/Φv(25 °C) = f(Tj); IF = 1000 mA

KW CELNM1.TG KW CELNM1.TG
0,3 Φv 1,2
∆VF [V]
Φv(25°C)

0,2 1,0

0,1 0,8

0,0 0,6

-0,1 0,4

-0,2 0,2

-0,3 0,0
-40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140
Tj [°C] Tj [°C]

Chromaticity Coordinate Shift 6)

ΔCx, ΔCy = f(Tj); IF = 1000 mA

KW CELNM1.TG
0,03
∆Cx
∆Cy : ∆ Cx
: ∆ Cy


0,02

0,01

0,00

-0,01

-0,02
Not for new design

-0,03
-40 -20 0 20 40 60 80 100 120 140
Tj [°C]

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Max. Permissible Forward Current

IF = f(T)

KW CELNM1.TG
1600
IF [mA]
1500
1400
1300
1200
1100
1000
900
800 : Ts
700
600
500
400
300
200
100
0
0 20 40 60 80 100 120
T [°C]

Permissible Pulse Handling Capability Permissible F. Handling Capability

IF = f(tp); D: Duty cycle IF=f(D) f: Frequency
KW CELNM1.TG KW CELNM1.TG

TS = 0°C ... 125°C TS = 0°C ... 125°C

IF [A] IF [A]
: f = 60Hz


3,5 3
: f = 120Hz
: f = 240Hz
: f = 400Hz
: f = 800Hz
: f = 1000Hz
3,0
: D = 1.0
: D = 0.5 2
: D = 0.2
: D = 0.1
2,5 : D = 0.05
: D = 0.02
: D = 0.01
: D = 0.005
1
2,0
Not for new design

1,5
0
10 -6 10-5 10 -4 10 -3 0,01 0,1 1 10 0 10 20 30 40 50 60 70 80 90 100

Pulse time [s] Duty Cycle [%]

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Dimensional Drawing 8)

Further Information:
Approximate Weight: 7.8 mg

Corrosion test: Class: 3A

Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC
60068-2-43)
ESD advice: The device is protected by ESD device which is connected in parallel to the
Chip.


Not for new design

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Electrical Internal Circuit

Recommended Solder Pad 8)


Not for new design

For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suit-
able for ultra sonic cleaning. To ensure a high solder joint reliability and to minimize the risk of solder joint cracks, the custom-
er is responsible to evaluate the combination of PCB board and solder paste material for his application.

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Reflow Soldering Profile

Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
OHA04525
300
˚C
T 250
240 ˚C Tp 245 ˚C
217 ˚C tP
200
tL

150
tS

100

50
25 ˚C
0
0 50 100 150 200 250 s 300
t

Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit

Minimum Recommendation Maximum
Ramp-up rate to preheat*) 2 3 K/s
25 °C to 150 °C
Time tS tS 60 100 120 s
TSmin to TSmax
Ramp-up rate to peak*) 2 3 K/s


TSmax to TP
Liquidus temperature TL 217 °C
Time above liquidus temperature tL 80 100 s
Peak temperature TP 245 260 °C
Time within 5 °C of the specified peak tP 10 20 30 s
temperature TP - 5 K
Ramp-down rate* 3 6 K/s
TP to 100 °C
Time 480 s
25 °C to TP
Not for new design

All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

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Taping 8)


Not for new design

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Tape and Reel 9)

Reel Dimensions
A W Nmin W1 W2 max Pieces per PU

180 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 4000


Not for new design

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Barcode-Product-Label (BPL)

Dry Packing Process and Materials 8)

Moisture-sensitive label or print

N s E RS
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Barcode label
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Humidity indicator
Barcode label
Do not eat.
Avoid metal contact.
Discard if circles overrun.
bag opening.
Please check the HIC immidiately after

check dot WET

Comparator

bake units
examine units, if necessary 15%
If wet,

bake units
examine units, if necessary 10%
If wet,

change desiccant
parts still adequately dry. 5%
If wet,

MIL-I-8835
Humidity Indicator

Desiccant
AM
OSR
Not for new design

OHA00539
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.

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Type Designation System

Emission color: Technology Concept

M: Silicone encapsulation
W: white (molding)
W2: 2 chips white Platform: Ceramic
W3: 3 chips white
W4: 4 chips white
Y: yellow
UW: ultra white
CY: color on demand yellow

K: Automotive Package Type

and Industry C: Toplooker Product
Product Ceramic package version
L: Light w/o reflector
emitting
diode (CERAMOS, OSLON (ceramic),
OSLON Compact

K W C E L N M 1 . T G
Lead / Package Properties
TOPlooker: Sidelooker:
E: 1608 E: 5515
F: 2828 H: 3006
Converted Colors
PCB: Leadframe: T: greenish cold white
H: 3432 F: 2828 F: Full conversion (color
depending on color description)
Ceramic packages:


C: intermediate cold white
D: 1612
H: YE4
E: 1915
F: 2531
G: 3631
Binning Information:
H: 4731
Converted colors
G: ECE binning:IEC 62707
E: OSLON Compact AlN based for
(ebxD46 System)
Automotive (Project Mini PowerLED)
Y: Conversion, Yellow
Encapsulant Type / Lens Properties 5F5G
L: No lens (Lambertian)
U: OSLON Compact with CLC layer
ceramic

Chip Technology:
M: Medium performance
N: Standard power class
Not for new design

High performance (>= 500µm)

P: power performance (>= 500µm)

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Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this
data sheet fall into the class moderate risk (exposure time 0.25 s). Under real circumstances (for exposure
time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye ex-
ists from these devices. As a matter of principle, however, it should be mentioned that intense light sources
have a high secondary exposure potential due to their blinding effect. When looking at bright light sources
(e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoy-
ance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal filled materials. Metal filled
materials can be affected by environments that contain traces of aggressive substances. Therefore, we
recommend that customers avoid device exposure to aggressive substances during storage, production,
and use.
For further application related information please visit www.osram-os.com/appnotes


Not for new design

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Disclaimer
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version on the OSRAM OS website.

Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of
transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we
shall have to invoice you for any costs incurred.

Product and functional safety devices/applications or medical devices/applications

OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
OSRAM OS products are not qualified at module and system level for such application.

In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi-
nate the customer-specific request between OSRAM OS and buyer and/or customer.


Not for new design

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Glossary
1)
Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal
reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of
k = 3).
2)
Reverse Operation: This product is intended to be operated applying a forward current within the
specified range. Applying any continuous reverse bias or forward bias below the voltage range of light
emission shall be avoided because it may cause migration which can change the electro-optical char-
acteristics or damage the LED.
3)
Chromaticity coordinate groups: Chromaticity coordinates are measured during a current pulse of
typically 25 ms, with an internal reproducibility of ±0.005 and an expanded uncertainty of ±0.01 (acc. to
GUM with a coverage factor of k = 3).
4)
Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an
internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage
factor of k = 3).
5)
Thermal Resistance: Rth max is based on statistic values (6σ).
6)
Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only reflect statistical figures.
These do not necessarily correspond to the actual parameters of each single product, which could dif-
fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.
because of technical improvements, these typ. data will be changed without any further notice.
7)
Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ-
ences between single devices within one packing unit.
8)
Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and
dimensions are specified in mm.
9)
Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.


Not for new design

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Revision History
Version Date Change

1.6 2019-06-28 Further Information

Recommended Solder Pad
1.7 2019-09-24 Features
Ordering Information
1.8 2020-09-15 Schematic Transportation Box
Dimensions of Transportation Box
Notes
Glossary
1.9 2021-02-26 Not for new design


Not for new design

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Not for new design

Published by OSRAM Opto Semiconductors GmbH

Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.

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