FQD2N100/FQU2N100

January 2009
®
QFET
FQD2N100/FQU2N100
1000V N-Channel MOSFET

General Description Features

These N-Channel enhancement mode power field effect • 1.6A, 1000V, RDS(on) = 9Ω @VGS = 10 V
transistors are produced using Fairchild’s proprietary, • Low gate charge ( typical 12 nC)
planar stripe, DMOS technology. • Low Crss ( typical 5 pF)
This advanced technology has been especially tailored to • Fast switching
minimize on-state resistance, provide superior switching • 100% avalanche tested
performance, and withstand high energy pulse in the • Improved dv/dt capability
avalanche and commutation mode. These devices are well
• RoHS Compliant
suited for electronic lamp starter and ballast.

D D
!

◀ ▲
D-PAK I-PAK G! ●
●

G S FQD Series G D S FQU Series

!
S

Absolute Maximum Ratings TC = 25°C unless otherwise noted

Symbol Parameter FQD2N100/FQU2N100 Units

VDSS Drain-Source Voltage 1000 V
ID Drain Current - Continuous (TC = 25°C) 1.6 A
- Continuous (TC = 100°C) 1.0 A
IDM Drain Current - Pulsed (Note 1) 6.4 A
VGSS Gate-Source Voltage ± 30 V
EAS Single Pulsed Avalanche Energy (Note 2) 160 mJ
IAR Avalanche Current (Note 1) 1.6 A
EAR Repetitive Avalanche Energy (Note 1) 5.0 mJ
dv/dt Peak Diode Recovery dv/dt (Note 3) 5.5 V/ns
PD Power Dissipation (TA = 25°C) * 2.5 W
Power Dissipation (TC = 25°C) 50 W
- Derate above 25°C 0.4 W/°C
TJ, TSTG Operating and Storage Temperature Range -55 to +150 °C
Maximum lead temperature for soldering purposes,
TL 300 °C
1/8" from case for 5 seconds

Thermal Characteristics
Symbol Parameter Typ Max Units
RθJC Thermal Resistance, Junction-to-Case -- 2.5 °C/W
RθJA Thermal Resistance, Junction-to-Ambient * -- 50 °C/W
RθJA Thermal Resistance, Junction-to-Ambient -- 110 °C/W
* When mounted on the minimum pad size recommended (PCB Mount)

©2009 Fairchild Semiconductor Corporation Rev. A2, January 2009

 8FQD2N100/FQU2N100
Electrical Characteristics TC = 25°C unless otherwise noted

Symbol Parameter Test Conditions Min Typ Max Units

Off Characteristics
BVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = 250 µA 1000 -- -- V
∆BVDSS Breakdown Voltage Temperature
ID = 250 µA, Referenced to 25°C -- 0.976 -- V/°C
/ ∆TJ Coefficient
IDSS VDS = 1000 V, VGS = 0 V -- -- 10 µA
Zero Gate Voltage Drain Current
VDS = 800 V, TC = 125°C -- -- 100 µA
IGSSF Gate-Body Leakage Current, Forward VGS = 30 V, VDS = 0 V -- -- 100 nA
IGSSR Gate-Body Leakage Current, Reverse VGS = -30 V, VDS = 0 V -- -- -100 nA

On Characteristics
VGS(th) Gate Threshold Voltage VDS = VGS, ID = 250 µA 3.0 -- 5.0 V
RDS(on) Static Drain-Source
VGS = 10 V, ID = 0.8 A -- 7.1 9 Ω
On-Resistance
gFS Forward Transconductance VDS = 50 V, ID = 0.8 A (Note 4) -- 1.9 -- S

Dynamic Characteristics
Ciss Input Capacitance -- 400 520 pF
VDS = 25 V, VGS = 0 V,
Coss Output Capacitance -- 40 52 pF
f = 1.0 MHz
Crss Reverse Transfer Capacitance -- 5 6.5 pF

Switching Characteristics
td(on) Turn-On Delay Time VDD = 500 V, ID = 2.0 A, -- 13 35 ns
tr Turn-On Rise Time RG = 25 Ω -- 30 70 ns
td(off) Turn-Off Delay Time -- 25 60 ns
(Note 4, 5)
tf Turn-Off Fall Time -- 35 80 ns
Qg Total Gate Charge -- 12 15.5 nC
VDS = 800 V, ID = 2.0 A,
Qgs Gate-Source Charge -- 2.5 -- nC
VGS = 10 V
Qgd Gate-Drain Charge (Note 4, 5) -- 6.5 -- nC

Drain-Source Diode Characteristics and Maximum Ratings

IS Maximum Continuous Drain-Source Diode Forward Current -- -- 1.5 A
ISM Maximum Pulsed Drain-Source Diode Forward Current -- -- 6.0 A
VSD Drain-Source Diode Forward Voltage VGS = 0 V, IS = 1.6 A -- -- 1.4 V
trr Reverse Recovery Time VGS = 0 V, IS = 2.0 A, -- 520 -- ns
Qrr dIF / dt = 100 A/µs (Note 4)
Reverse Recovery Charge -- 2.3 -- µC

Notes:
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L = 120mH, IAS = 1.6A, VDD = 50V, RG = 25 Ω, Starting TJ = 25°C
3. ISD ≤ 2.0A, di/dt ≤ 300A/µs, VDD ≤ BVDSS, Starting TJ = 25°C
4. Pulse Test : Pulse width ≤ 300µs, Duty cycle ≤ 2%
5. Essentially independent of operating temperature

©2009 Fairchild Semiconductor Corporation Rev. A2, January 2009

 FQD2N100/FQU2N100
Typical Characteristics

VGS
Top : 15.0 V
10.0 V
8.0 V
7.0 V
6.5 V
0 6.0 V
10 Bottom : 5.5 V

ID , Drain Current [A]

ID, Drain Current [A]

0 150℃
10

-1 25℃
10
-55℃

※ Notes :
※ Notes : 1. VDS = 50V
1. 250µs Pulse Test 2. 250µs Pulse Test
2. TC = 25℃
-2 -1
10 10
10
-1
10
0
10
1
2 4 6 8 10
VDS, Drain-Source Voltage [V] VGS , Gate-Source Voltage [V]

Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics

20
IDR , Reverse Drain Current [A]
Drain-Source On-Resistance

15

VGS = 10V
RDS(on) , [ Ω ]

0
10
10

5 VGS = 20V
150℃ 25℃
※ Notes :
1. VGS = 0V
※ Note : TJ = 25℃
2. 250µs Pulse Test

0 -1
0 1 2 3 4 10
0.2 0.4 0.6 0.8 1.0 1.2 1.4
ID , Drain Current [A] VSD , Source-Drain Voltage [V]

Figure 3. On-Resistance Variation vs. Figure 4. Body Diode Forward Voltage

Drain Current and Gate Voltage Variation vs. Source Current and
Temperature

700 12
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
VDS = 200V
600
10
Ciss VDS = 500V
500 VDS = 1000V
VGS , Gate-Source Voltage [V]

8
Capacitance [pF]

400 Coss
6

300
※ Notes :
1. VGS = 0 V 4
200 Crss 2. f = 1 MHz

2
100
※ Note : ID = 1.6 A

0 0
-1 0 1 0 2 4 6 8 10 12 14
10 10 10
QG, Total Gate Charge [nC]
VDS, Drain-Source Voltage [V]

Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics

©2009 Fairchild Semiconductor Corporation Rev. A2, January 2009

 FQD2N100/FQU2N100
Typical Characteristics (Continued)

1.2 3.0

2.5
Drain-Source Breakdown Voltage

1.1

Drain-Source On-Resistance
BV DSS , (Normalized)

RDS(ON) , (Normalized)
2.0

1.0 1.5

1.0

0.9 ※ Notes :
1. VGS = 0 V
※ Notes :
2. ID = 250µA 0.5
1. VGS = 10 V
2. ID = 0.8 A

0.8 0.0
-100 -50 0 50 100 150 200 -100 -50 0 50 100 150 200
o o
TJ, Junction Temperature [ C] TJ, Junction Temperature [ C]

Figure 7. Breakdown Voltage Variation Figure 8. On-Resistance Variation

vs. Temperature vs. Temperature

1.8
Operation in This Area
1 is Limited by R DS(on)
10
1.5

10 µs
100 µs
1.2
ID, Drain Current [A]

ID, Drain Current [A]

0
1 ms
10
10 ms
0.9
DC

0.6
-1
10
※ Notes :
o
1. TC = 25 C 0.3
o
2. TJ = 150 C
3. Single Pulse
-2
10 0.0
10
0 1
10
2
10 10
3
25 50 75 100 125 150

VDS, Drain-Source Voltage [V] TC, Case Temperature [℃]

Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current
vs. Case Temperature
( t) , T h e r m a l R e s p o n s e

D = 0 .5
0
10

0 .2
※ N o te s :
0 .1 1 . Z θ J C ( t) = 2 .5 ℃ /W M a x .
2 . D u ty F a c to r , D = t 1 /t 2
0 .0 5 3 . T J M - T C = P D M * Z θ J C ( t)
-1
10 0 .0 2
0 .0 1 PDM
JC

s i n g le p u ls e
t1
θ

t2
Z

-2
10
-5 -4 -3 -2 -1 0 1
10 10 10 10 10 10 10

t 1 , S q u a r e W a v e P u ls e D u r a t io n [ s e c ]

Figure 11. Transient Thermal Response Curve

©2009 Fairchild Semiconductor Corporation Rev. A2, January 2009

 FQD2N100/FQU2N100
Gate Charge Test Circuit & Waveform

VGS
Same Type
50KΩ
as DUT Qg
12V 200nF
300nF 10V
VDS
VGS Qgs Qgd

DUT
3mA

Charge

Resistive Switching Test Circuit & Waveforms

RL VDS
VDS 90%

VGS VDD
RG

10%
VGS
10V DUT
td(on) tr td(off)
tf
t on t off

Unclamped Inductive Switching Test Circuit & Waveforms

L BVDSS
1
VDS EAS = ---- L IAS2 --------------------
2 BVDSS - VDD
BVDSS
ID
IAS
RG
VDD ID (t)

10V DUT VDD VDS (t)

tp
tp Time

©2009 Fairchild Semiconductor Corporation Rev. A2, January 2009

 FQD2N100/FQU2N100
Peak Diode Recovery dv/dt Test Circuit & Waveforms

DUT +

VDS

I SD
L

Driver
RG
Same Type
as DUT VDD

VGS • dv/dt controlled by RG

• ISD controlled by pulse period

Gate Pulse Width

VGS D = --------------------------
Gate Pulse Period 10V
( Driver )

IFM , Body Diode Forward Current

I SD
( DUT ) di/dt

IRM

Body Diode Reverse Current

VDS
( DUT ) Body Diode Recovery dv/dt

VSD VDD

Body Diode
Forward Voltage Drop

©2009 Fairchild Semiconductor Corporation Rev. A2, January 2009

 FQD2N100/FQU2N100
Mechanical Dimensions

TO-252 (DPAK) (FS PKG Code 36)

1:1
Scale 1:1 on letter size paper
Dimensions shown below are in:
millimeters

Part Weight per unit (gram): 0.33

©2009 Fairchild Semiconductor Corporation Rev. A2, January 2009

 FQD2N100/FQU2N100
Mechanical Dimensions

I - PAK

Dimensions in Millimeters

©2009 Fairchild Semiconductor Corporation Rev. A2, January 2009

 FQD2N100/FQU2N100
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Datasheet Identification
Advance Information
Product Status Definition
Datasheet contains the design specifications for product development. Specifications
Formative / In Design
may change in any manner without notice.

Datasheet contains preliminary data; supplementary data will be published at a later

Preliminary First Production date. Fairchild Semiconductor reserves the right to make changes at any time without
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Semiconductor. The datasheet is for reference information only.
Rev. I37

©2009 Fairchild Semiconductor Corporation Rev. A2. January 2009