MAULANA AZAD NATIONAL INSTITUTE OF

TECHNOLOGY
BHOPAL

Department of Electronics & Communication Engineering

Synopsis Report of Internship

Designing & Development of Automated solution for

EMIR validation of Design IPs

Name of the Student: Piyush Soni

Scholar No.: 212114103

Course: MTech

Branch: Digital Communication

Semester: 3rd

Name of the Supervisor: Dr. Vijayshree Chaurasia

Company of Internship: ST Microelectronics (Noida)

Table of Contents:
1. Introduction
a. Electromigration
b. IR drop

2. Objectives of EMIR Validation in IPs

3. Significance of Automation in EMIR Calculations in IPs
 Introduction

Electromigration:
When current is passing through a conductor, the electrons move from one end
to the other end. They transfer some of their momentum to the metal atoms
causing a gradual displacement of the metal atoms away from their initial
crystal lattice positions.
Electromigration occurs when the current density is high enough to cause the
drift of metal ions in the direction of the electron flow. Transport happens due
to the momentum transfer from collisions between conducting electrons and
diffusing metal atoms. The net force exerted on a single metal ion in a
conductor has two opposing contributions which are Direct Force and Wind
Force.

Forces acting on metal ion:

Fnet = Fwind +Fdirect

Effect of Electromigration:
Effect on Non-uniform Electromigration:
A Void is created if the flux leaving the region is more than the flux entering.
The depletion of matter ultimately creates a void.

A Hillock or a Whisker is created when the atomic flux entering a region is

more than the atomic flux leaving it. The matter gets accumulated in the region.
Damage due to EM - Metal Contacts:
Electromigration causes damage to the metal contacts between the aluminum
layer and source/drain. EM creates accumulation and depletion of the aluminum
at the point of contact.

Damage due to EM – Vias:

VIA (Vertical Interconnect Access) is an electrical contact to connect two
stacked metal layers in a physical electronic circuit. Due to increased current
density, EM causes depletion of the Via and creates voids.
Joule’s Heating Effect:

IR – Drop:
IR-drop refers to the amount of decrease (increase) in the power (ground) rail
voltage due to the resistance of the devices between the rail and a node of
interest in the circuit under test. During the initial design phase of the circuit, it
is a general practice to define maximum per-rail static voltage drop tolerable.

There are two ways to characterize the IR-drop in a design:

• Static – Presently working
• Dynamic – work in future
EMIR Flow:
▪ Schematic
▪ Simulation
▪ Characterization
▪ Layout
▪ LVS
▪ Parasitic
Extraction
▪ EMIR Analysis

Objectives of EMIR Calculations in Ips:

EMIR calculations are done to ensure that the life
EMIR Analysis using different Tools:

▪ CustomSimRA - Synopsys
▪ Totem – Ansys
▪ Voltus-Fi – Cadence
Significance of Automation in EMIR Calculations in IPs

QA Machine:
As automakers start adding more and more Advanced Driver
Assistance Systems (ADAS) features, the complexity of software
code and SoCs deployed inside vehicles has been skyrocketing.

This trend puts automotive tech suppliers - chip companies and

software vendors - under tremendous pressure to prove the
functional safety of their products. They must test and verify safe
operation of their electronic devices and codes.

The ISO 26262 functional safety standard not only provides detailed
processes for component suppliers to follow, but also asks for
documented proof that they followed the standard and that the
software tools they used for development are also compliant.
Thank You