L3 Troubleshooting Guide

S82918-A6020

LENOVO

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 Catalogue
1 How to disassemble and assemble ............................................................................................................................. 3
1.1 Teardown guidance ................................................................................................................................................ 3
1.2 Assembling guide ................................................................................................................................................ 12
2. Main board layout introduction .................................................................................................................................... 19
2.1 Main board top view ............................................................................................................................................ 19
2.2 Main board bottom view...................................................................................................................................... 20
3. Mobile phone principle and fault analysis ................................................................................................................. 21
3.1 Mobile phone principle block diagram and introduction..................................................................................... 21
3.2 Switch on the power management circuit ............................................................................................................ 22
3.3 Charge fault ......................................................................................................................................................... 27
3.4 TP malfunction .................................................................................................................................................... 28
3.5 REC malfunction ................................................................................................................................................. 30
3.6 SPK malfunction ................................................................................................................................................. 32
3.7 LCD malfunction ................................................................................................................................................. 35
3.8 Keypad malfunction ............................................................................................................................................ 38
3.9 RF malfunction .................................................................................................................................................... 40
3.10 MIC malfunction ................................................................................................................................................. 43
3.11 Camera malfunction ............................................................................................................................................ 45
3.12 VIB malfunction .................................................................................................................................................. 48
3.13 SIM Card not to identify...................................................................................................................................... 50
3.14 SD Card doesn't recognize................................................................................................................................... 52
3.15 FM /BT/WIFI malfunction .................................................................................................................................. 54
3.16 GPS malfunction ................................................................................................................................................. 58

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1 How to disassemble and assemble

1.1 Teardown guidance

1.1.1 Tools for disassembling: Screwdriver, Tweezers & Pry bar

1.1.2 Disassembling steps：

a. Separate battery cover as the following. pictures：

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b. Take out battery as the following, picture：

c. Use screwdriver to take out the 12 screws which are locking the front housing and rear housing. The
screws are marked in red circles.

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d. Separate the rear housing: Use a pry bar to pry the gap in right and top of rear housing; pry off every hook
around, then the rear housing is separated from front housing. Notice there is a snap-in in the bottom of T
card.

e. Take out antenna holder from rear housing with a pry bar to pry gap

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f. Use screwdriver to take out 2 screws and then take out antenna snap-in in sub-PCBA.

g. Use Ion air blower (60°C) to heat label for 20 seconds; use tweezers to catch one side of IMEI label
(marked by red cycle) to tear off it.
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h. Use tweezers to separate side key and A housing.
Attention: avoid damaging FPC during separating FPC side key.

i. Open the snap-in of rear-facing and front-facing cameras; take out TP-FPC and use tweezers to take out
Motor from front housing.
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 Avoid damage the cable during disassembling Motor.

j. Use hands to open the snap-in in front housing which is marked in red circle; open PCBA with 45°angle
and use tweezers to open the snap-in in PCBA and then separate PCBA and main FPC gently.
Attention: Keep purple heatsink in front housing after separated the PCBA.

k. Use screwdriver to take out 1 screw in sub-PCBA marked in red circle the following picture.

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l. Use tweezers to tear off main FPC from front housing slowly.

m. Insert tweezers in the place marked by red circle to pry receiver and take out it.

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n. Take out light sensitive rubber as the following picture.

o. Use tweezers to tear off TP-FPC & LCM-FPC as the following pictures.

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p. Use tweezers to pry loudspeaker marked in red circle in the following picture.

q. The picture is to show all components after disassembly.

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1.2 Assembling guide

a. Use antistatic tweezers to take water-proof label and paste in the place in PCBA.

b. Fix located hole and silk printed frame for FPC and solder FPC from up to down.
Attention: control the quantity of solder and do not solder empty.

c. Assemble receiver and light sensitive rubber in place marked in red circle.

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d. Take sponge for front-facing camera and heatsink to paste them in frame marked in the following
pictures.

e. Install sub-PCBA in red circle and fix the screw with screwdriver.

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f. Insert FPC & RF cable and close the connector.

g. Assemble PCBA in front housing; tear off release paper for FPC side key and paste the side key in front
housing; connect TP-FPC in connector and then connect RF cable in RF connector in sub-PCBA.

h. Paste rear-facing and front-facing camera and electric conductivity fabric in the place marked in red
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circle in the following picture; install Motor in slot and lock the screws with electric screwdriver. The order is
as follows.
Attention: Make sure the two screws are locked well with no floating, forgetting to lock and other
problems.

i. Paste the handset label as the follows and install MIC rubber in located place. Pay attention to the
direction of rubber.

j. Paste accessory of camera in rear housing; paste camera lens cloth in the hole of accessory; press the
lens after checked there is no dirt, dust, scratch, white dots and other problems; paste antenna after inserted
FPC antenna gold finger in housing.

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k. Paste antenna after inserted FPC antenna gold finger in housing; install loudspeaker and pay attention
to Spring’s direction.

l. Assemble rear housing into front housing.

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m. Lock 12 screws with electric screwdriver as the following picture. Check there is no forgetting to lock,
floating and other problems.

n. Take battery cover and check its appearance has no problems; install the battery cover to rear housing.
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2. Main board layout introduction

2.1 Main board top view

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2.2 Main board bottom view

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3. Mobile phone principle and fault analysis

3.1 Mobile phone principle block diagram and introduction

S82918 products is a kind of LTE FDD based on qualcomm MSM8939 platform independent research
and development,TDD LTE,WCDMA and GSMMobile phone main chip integrated ap and CP at the sam
e time,Combined withabundant peripheral interface.

Motherboard including MSM8939 EMMC + LPDDR3 PMUIC,RF transceiver,RF switch amplifier,WIFI+

GPS + BT + FM The joining together of four components,G-SENSOR 等.1600W 5 inch screen,FHD,a -
SI LCD,Support min USB connector,Support for high-speed transmission,Support the 3.5 mm headphone j
ack.

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3.2 Switch on the power management circuit

The power button

and volume buttons
welds PAD1701

 Schemetics：

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  Circuit Analysis：

When the battery connection VBAT voltage battery connector,Feedto PMU,Will the power button P
WRKEY signal to low level PMU ,Then PMUOutput voltage related work from the beginning,Clock circuit
is an oscillation signal after power supply voltage,Into the logic circuit,CPU Get the voltage and the clock
signal is executed after boot program,Software to be obtained from the ROM,Perform logical self-checkin
g reset,CPU provide Watchdog signal,PMU To keep on.

 Failure analysis process：

Concrete is divided into press the power button does not boot、The charger don't boot up,Large cur
rent don't boot up,Software problem not boot crash、Fault slow reaction and so on.

一. The machine doesn't boot maintenance analysis

1. Press the power button does not boot：

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 First take out the battery,With external dc power through fake batteries to power a mobile phone,Pres
s the power button according to the variation of current mobile phone,concrete analysis：
Current does not change,It is likely to be the power button failure,Should check the power button co
ntact are in good condition.The current will have obvious change,But there are no orders to boot, such
as on the bell,Must first rule out the possibility of software does not boot,To download the software at
a time,Will not solve the problem,Whether need to screen the main chip,PMIC,Whether such as FLASH
virtual welding and damage possible.Large current hundreds of ma,First check the components on the P
CBA like:LCD connector、
SPK、VIBSuch as welding are in good condition,For the short circuit, need to be maintained by the bad
PCBA process cannot be ruled out.
2.Insert the charger not boot：
In the presence of insert battery charger did not respond, no charge,First check the battery contacts
are in good condition,There is no problem further to observe the output current of charger（Using externa
l power supply with current instructions for charger）Size is used as the basis for judgment：If little or no
output current charger,Check the USB connector on the main board of charging pin is in good contact,
And then the charging management device can work normally,The last may be a power management chi
p internal charging circuit was burned down,Need to change the chip.
3.Boot crash, automatic shutdown：
First check whether use of external power supply current limit,
adjust to the appropriate location to test again, if you use the
battery switch on to confirm whether the battery is enough, the normal is 3.7 V can be switched on a st
able job.There is also a situation is ready to play after boot boot ringtone crashing,Usually the horn weldi
ng when the welding point and to short circuit,moreover LCD connector,MIC peripherals such as poor
welding device can also be boot crash,PowerOff,According to the bad one.If we can't rule out fault, the li
kelihood is the RF PA damage or other device, need to carry out specific analysis on PCBA repair.

二. PCBA not boot maintenance analysis

The use of external power supply,Good is the output current and output voltage display,And have a
current protection,In case of sho rt circuit,Automatically broken output current,Cell phone will not have a
greater damage,Adjustment of the power supply voltage of 4.0 V,It is advisable to output can supply curr
ent of 2.0 A.Add electric boot to PCBA, pay attention to the connector pin close to the battery positive e
lectrode connected to 10 k of the resistance to simulate the battery in place, otherwise unable to boot
1. Current is too small around 10 ma, mainly common clock does not work,Check the master clock Y
201,The main chip U401,PMIC U402,Flash memory（U1501）,And peripheral devices with and without wel
ding, tin, the power supply is normal.Check whether the clock output amplitude is emphatically whether n
ormal, whether the waveform distortion, frequency stability etc.Also, check the clock input and output amp
litude is normal,Whether the waveform distortion, frequency stability, etc,If abnormal, should check the rel
evant circuit of RTC, whether to have virtual welding, whether the backup battery charge it with electricit
y, peripheral resistance is normal, etc.
2. Current basic normal 30 ma, common software, download a program to test.If current stays around
30 ma or higher than 30 ma instead of change, a number of virtual welding is likely to be baseband c
hip loose or damaged

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 3. Current hundreds of ma phenomenon, cause the current protection, the key inspection with VBAT
connecting device,Check the power supply (VBAT) separately with the multimeter to ground and VCHAR
GE for whether there is a short circuit phenomenon,If you have short circuit phenomenon, please first ch
eck whether related ESD protection devices breakdown, and then to some related to the VBAT network
devices for damage or short circuit phenomenon, principle is easy to difficult, after first to exclude some
parts easy to judge.

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 Power on failed , and use outside power
supply to supply PCBA, and observe the
change of current

If the value of current is on

If the value of current is on The current is normal, and the high side, about
the low side, about 10mA its value is about 20mA. several hundred mA

Check the signal of Check all of components

26MHz main clock crystal
whether is normal
No
Check some voltages ,for example, VDD
Change the 26MHz crystal
Ok or solder it again ，same
to CPU
which are correlative with
VBAT, and change those
broken components.
CORE,VDDIO,VDD_MEM，VRF
No
Change the CPU or
solder it again.

Ok

Check the signal of Check the CPU and Flash Change the CPU and
subordinate crystal whether they are soldered No Flash or solder them
32.768Khz whether is empty or broken. again.
normal
Ok

No According to the
download failed , repair
Download software again No the handset when it
can’t download
Solder the subordinate software
crystal or CPU, if the
handset is not normal still,
change the crystal or CPU Ok

Ok End

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3.3 Charge fault

 Schematic circuit diagram：

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  Circuit Analysis：

This module U301 to manage charging, charging U301.Through VBAT on CON301 interface SNS battery
detection signal to U402 into the charging status.Signal BATSNSP,BATSNSN Control the charging status.

 Failure analysis process：

unable to charge

Replace the charging

The charging cable is OK? NO
charging cable

YES

Check for 5 v voltage charging IO IO mouth rewelding or

NO
mouth, DP, DM signal connectivity replaced

YES

Check whether U301 welding and Welding or replace U301

NO
ontology again

YES

Welding or replace U301

PMU To the welding NO
again

YES

End

3.4 TP malfunction

 Schematic circuit diagram：

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 Circuit Analysis：

Power supply for touch screen,Touch screen, touch screen surface formed by a coupling electric capacity,

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 TP I2C SDA, TP I2C SCL control signal and U401 (CPU) of communication between data processing.

 Failure analysis process：

TP FAIL

Check whether
the touch screen NO Replacement TP
is good

OK

Welding or replace
Check the touch
NO the touch screen
screen connector
connector

OK

Heavy welding or
Check CPU NO
replacement CPU

OK

End

3.5 REC malfunction

 Schematic circuit diagram：

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 Circuit Analysis：

Receiver circuit output is the direct power supply chip circuit, external 32 ohms the receiver.

 Failure analysis process：

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Person who calling to you
can’t hear your voice ,
MIC no any voice

Check the contact of

Check the working current No receiver with PCBA
whether is normal
whether is well
Ok

Check those components

of receiver circuit whether Solder the bad components
No
is broken or soldered or change them
empty

Ok

Check the connectivity Check CPU , solder it

No
among each signal again or change it .

Ok

End

3.6 SPK malfunction

 Schematic circuit diagram：

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33
  Circuit Analysis：

Horn circuit adopts double horn, output power supply chip circuit by the CDC HPH L, CDC HPH R two
signals, to the two audio amplifiers for audio amplifier, the output audio source

 Failure analysis process：

No ring tone when power on

or play media

Check the working current Check speaker whether

No
whether normal exist short circuit

Ok

Check speaker No Change speaker

Ok

Check the components of speaker Solder those broken

circuit , check audio PA whether No components again or
exist short circuit change them

Ok

Check the two output signals Solder CPU again or

No
SPK+ and SPK- of CPU , change it

End

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3.7 LCD malfunction

 Schematic circuit diagram：

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 Circuit Analysis：

LCD digital interface for MIPI interface, LCD digital interface by the baseband chip, LCD controller

module to drive with EMI suppression filter (middle), LCD power supply provided by the power chip, the

interface voltage is provided by the power supply chip. LCD backlit by external backlit chip to drive.

 Failure analysis process：

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LCD display screen dark ,
screen blurred, screen
blank

check the soldering status Solder EMI component

No
of EMI component again

Ok

Check the soldering status

No Solder LCD FPC again
of LCD FPC

Ok

Check the soldering status Change LCD or solder

No
between LCD with PCBA again

Ok

Solder again or change

Check the connectivity of these CPU and
No
all signals components of LCD
display
Ok

Check the VDDIO that is

No Solder or change CPU
voltage of LCD

Ok

End

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3.8 Keypad malfunction

 Schematic circuit diagram：

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  Circuit Analysis：

Button with a Shared the power button, volume up and down keys, three physical buttons.The remaining
three for the virtual keys.Refer the power button until the startup circuit.

 Failure analysis process：

Key functions trouble after

power on

Whether correlative
Several keys failed All keys functions failed No components have short
circuit or not

Check these circuits of

keys pin with CPU

Check these keys circuit state each other ,

whether short circuit or not
No Clear keys, change dome
No

Solder CPU again or

Ok change it

Ok

Check the circuit of every Solder CPU again or

No
key with CPU change it
Clear keys pin and dome

End

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3.9 RF malfunction

 Schematic circuit diagram：

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41
  Circuit Analysis：

S82918 intermediate frequency U2701 USES WTR4905, PA(U2901) SKY77643,DuplexingU3002

SKY77916,Filters, antenna circuit composition and so on. Sending and receiving circuit is made if

signalU2701, PA U2901,DuplexingU3002,An antenna J300

 Failure analysis process：

Insert SIM card after startup

search less than network
effectively

Check the antenna contact with

Antenna, clean PCBA antenna
PCBA antenna feed contacts are N
feed point
in good condition
Y

Article signals show that Article no signal display,

the main check the Y View the presence of the signal N check the RF transceiver
emission pathway circuit system

Check to see if each

Check the matching circuit device matching
device in the transmission circuit
circuit is bad

Check U2901 rf power Replace or bad welding

N Y
amplifier is normal device again

Balun whether normal

Y operation

Check the transceiver chip U2701 Y

(WTR4905), whether the CPU
virtual welding damage Y
Receive access to normal
Y reference to launch access
check parts
Replace or welding
transceiver chip U2701 again
(WTR4905), CPU

Y End

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3.10 MIC malfunction

 Schematic circuit diagram：

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  Circuit Analysis：

Send word circuit connect a microphone, normal work, power supply chip provides a bias voltage for the
microphone, the microphone started to pick up, signal MIC1_P_C, MIC_M_C a coupling capacitance into the chip
power supply.

 Failure analysis process：

Person who calling to you

can’t hear your voice ,
MIC no any voice

Check the working current Check MIC whether solder

No
whether is normal empty

Ok

Check the soldering status between Change MIC or solder it

MIC and PCBA whether is well No
again

Ok

Check the connection Check CPU， change it

No
among all signals or solder it again

Ok

Check the input of MICBIAS Check CPU， change it

whether is high level No
or solder it again

Ok

Check the components of Solder these bad

MIC circuit whether solder No components or change
empty or be broken them

End

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3.11 Camera malfunction

 Schematic circuit diagram：

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  Circuit Analysis：

Front CAM Through platoon insert interface and CPU chip connection, Rear CAM Through parallel bus
and BB chip connection, Rear CAM 和 Front CAM share 2.8V of AVDD,1.8V of DOVDD, Front CAM DVDD
1.2V,Rear CAM DVDD 1.2V. Meanwhile Front CAM Support af, auto-focusing AF_VCC 2.8V

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 Failure analysis process：

Camera
malfunction

Test the cameras

Replace the
are in good NO
camera
condition

OK

Heavy welding
Check the
NO or replace the
camera connector
camera

OK

Check whether Heavy welding

the camera power NO or replacement
supply is good PMIC

OK

Heavy welding
Check whether
NO or replacement
the CPU is good
CPU

End

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3.12 VIB malfunction

 Schematic circuit diagram：

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  Circuit Analysis：

Welding type vibration motor and welding on small boards on the phone, working voltage 2.5 V, current
around 60 ma. Directly by the power supply for motor control chip.

 Failure analysis process：

LCD display screen dark ,

screen blurred, screen
blank

check the soldering status Solder EMI component

No
of EMI component again

Ok

Check the soldering status

No Solder LCD FPC again
of LCD FPC

Ok

Check the soldering status Change LCD or solder

No
between LCD with PCBA again

Ok

Solder again or change

Check the connectivity of these CPU and
No
all signals components of LCD
display
Ok

Check the VDDIO that is

No Solder or change CPU
voltage of LCD

Ok

End

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3.13 SIM Card not to identify

 Schematic circuit diagram：

 Circuit Analysis：

SIM Circuit by the data signal（UIM1_DATA,UIM2_DATA）,clock signal（UIM1CLK,UIM2_CLK）,reset signal

（UIM1_RESET,UIM2_RESET）,power supply（VREG_L14_UIM1,VREG_L15_UIM2）build-up. Power supply
controlled by U402,Data communication is controlled by U401.

 Failure analysis process：

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 Does not
recognize
不能识别SIM卡 the
SIM card

Heavy welding or
Check the SIM holder
NO replacement SIM gets
connector
stuck

OK

Find out whether the

Check SIM working SIM signal link device
NO
current has a short circuit, and
troubleshooting

OK

Check VSIM Heavy welding or

NO
The voltage is normal replacement PMIC

OK
Find a SIM signal device
Check if SIM card
is available on the link or
peripheral circuit NO
bad welding, and
work normally
troubleshooting

End

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3.14 SD Card doesn't recognize

 Schematic circuit diagram：

 Circuit Analysis：

SD card circuit consists of four wires（SDC2_SDCARD_D0----D3）,SDC2_SDCARD_CLK

and SDC2_SDCARD_CMD build-up, Cable directly to the CPU communication signal processing, voltage is
provided by the PMIC.

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  Failure analysis process：

Does not
recognize
不能识别SIM卡 the
SD card

Check SD holder connector

PIN feet is normal, SD card Rewelding SD booth or
NO
welding are in good replaced
condition

OK

Find out whether the SD

Check SD working signal link device has a
NO
current is normal short circuit, and
troubleshooting

OK

Check whether the

Heavy welding or
VSD voltage is NO
replacement PMIC
normal

OK
Find the SD signal
Check the SD card device is available on the
NO
outside power link or bad welding, and
troubleshooting

End

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3.15 FM /BT/WIFI malfunction

 Schematic circuit diagram：

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55
  Circuit Analysis：

BT/WIFI/FM Triad chip WCN3620, The above three functions from a single chip, So abnormal three
functions, The first screening WCN3620 work is normal.

 Failure analysis process：

FM FAIL

FM No signal No sound Check the

or the signal NO
headphones headset seat
is bad

Check the FM
antenna link
Detect whether
devices are in good Reinsert the
insert headsets NO
condition, and headset
in the interface
troubleshooting
OK
OK
Heavy welding Check FM ANT Heavy welding
or replacement device welding are NO or replace the
U4901 in good condition bad device

End

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 BT/WIFI
malfunction

BT/WIFI Not BT/WIFI throw

open out of gear

Check whether
Heavy welding Reassembly
the BT/WIFI
or replacement NO BT/WIFI
antenna is
U4901 antenna
installed
OK

Check the BT/WIFI Heavy welding

antenna link on or replace the
NO
the devices are in bad device
good condition

End

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3.16 GPS malfunction

 Schematic circuit diagram：

 Circuit Analysis：

PMIC power supply to put chip transceiver chip U2701 demodulation signal to low noise amplification
signal, the GPS antenna output

 Failure analysis process：

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 GPS
malfunction

GPS
GPS Not open
disconnection

Heavy welding Check whether

Reassemble the
or replacement the GPS antenna NO
GPS antenna
U2701 is installed

OK

Check if the GPS Heavy welding

antenna device on NO or replace the
the link is good bad device

End

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