Professional Documents
Culture Documents
LC08A
LC08A
VCC
NC
1B
1A
4B
(DB), and Thin Shrink Small-Outline (PW)
Packages, Ceramic Chip Carriers (FK) and 3 2 1 20 19
Flat (W) Packages, and DIPs (J) 1Y 4 18 4A
NC 5 17 NC
description 2A 6 16 4Y
NC 7 15 NC
The SN54LVC08A quadruple 2-input positive-
2B 8 14 3B
AND gate is designed for 2.7-V to 3.6-V VCC 9 10 11 12 13
operation and the SN74LVC08A quadruple
2Y
3Y
3A
NC
GND
2-input positive-AND gate is designed for 1.65-V
to 3.6-V VCC operation.
NC – No internal connection
The ’LVC08A devices perform the Boolean
function Y A • B or Y+ A B in positive + )
logic.
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of these devices as translators
in a mixed 3.3-V/5-V system environment.
The SN54LVC08A is characterized for operation over the full military temperature range of –55°C to 125°C. The
SN74LVC08A is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
(each gate)
INPUTS OUTPUT
A B Y
H H H
L X L
X L L
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
logic symbol†
1
1A & 3
2 1Y
1B
4
2A 6
5 2Y
2B
9
3A 8
10 3Y
3B
12
4A 11
13 4Y
4B
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Pin numbers shown are for the D, DB, J, PW, and W packages.
A
Y
B
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 6.5 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 6.5 V
Output voltage range, VO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
Continuous output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA
Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127°C/W
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The value of VCC is provided in the recommended operating conditions table.
3. The package thermal impedance is calculated in accordance with JESD 51.
LOAD CIRCUIT
tw
VCC
VCC Input VCC/2 VCC/2
Timing
VCC/2 0V
Input
0V
VOLTAGE WAVEFORMS
PULSE DURATION
tsu th
VCC Output
Data VCC
VCC/2 VCC/2 Control
Input VCC/2 VCC/2
0V (low-level
enabling) 0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
tPZL tPLZ
Output VCC
VCC Waveform 1
Input VCC/2 VCC/2 S1 at 2 × VCC VCC/2 VOL + 0.15 V
0V (see Note B) VOL
2 × VCC
500 Ω S1 Open
From Output TEST S1
Under Test GND
tpd Open
CL = 30 pF
500 Ω tPLZ/tPZL 2 × VCC
(see Note A) tPHZ/tPZH GND
LOAD CIRCUIT
tw
VCC
VCC Input VCC/2 VCC/2
Timing
VCC/2 0V
Input
0V
VOLTAGE WAVEFORMS
PULSE DURATION
tsu th
VCC Output
Data VCC
VCC/2 VCC/2 Control
Input VCC/2 VCC/2
0V (low-level
enabling) 0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
tPZL tPLZ
Output VCC
VCC Waveform 1
Input VCC/2 VCC/2 S1 at 2 × VCC VCC/2 VOL + 0.15 V
0V (see Note B) VOL
LOAD CIRCUIT tw
2.7 V
Input 1.5 V 1.5 V
2.7 V
Timing
1.5 V 0V
Input
0V
VOLTAGE WAVEFORMS
PULSE DURATION
tsu th
2.7 V
Data
1.5 V 1.5 V Output 2.7 V
Input
0V Control 1.5 V 1.5 V
(low-level
VOLTAGE WAVEFORMS
enabling) 0V
SETUP AND HOLD TIMES
tPZL
tPLZ
Output 3V
2.7 V
Input Waveform 1 1.5 V
1.5 V 1.5 V VOL + 0.3 V
S1 at 6 V VOL
0V
(see Note B) tPHZ
tPLH
tPHL tPZH
Output
VOH
VOH Waveform 2 VOH – 0.3 V
Output S1 at GND 1.5 V
1.5 V 1.5 V
(see Note B) 0V
VOL
VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES ENABLE AND DISABLE TIMES
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.