Datacon 2200 evo?'s Bes Innovative Solution for Innovative Products The Datacon 2200 ever die bender for Multi Module Attach assembles all kines of technologies on a tried-and-tested platform, ‘enhanced with key features for higher bonding accuracy and lower cost of ownership. Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through @ new image processing unit, and improved cleanroom capabilities. Datacon 2200 evo goes PLUS! ase Roc Enhancements Features = PLUS Accuracy Multi-Chip Capability = PLUS Productivity + Flexibility for Customizing PLUS Flexibility = Open Platform Architecture ‘8 WEEKS: LEAD TIME hy TOOL-TO-TOOL / rearoma, A ‘ACCURACY T2T FLEXIBILITY MULTI-CHIP www.besi.comMutti-Chip Accuracy + Fully automatic cyele for MultiChip = New high-speed image processing unit production Ful alignment & Bae mark search Up t0 7 Pick & Pace teats optionally 4), » Pre-defined fiducial geometry & S eject tools customized teaching Pressure/time (Musashi), Auger, Jetter type dispensers available + Epoxy stamping option Filled and unfilled epaxy, wide viscosity range eon eet (roy Deer _ Sry Curing co Pick & Place Head Sens Die Attach, Flip Chip and Multi-Chip in ene machine Die pick fom: wafer, waffle pack, Gel-Pok®, feeder Die place to: substrate, boat, carrie, PCB, teadtreme, wafer Hot and cold processes supported epoxy, soldering, thermo-compression, eutectic Performance Footprint Chip Trays XIY placement accuracy: 7 pm@ $s + LxDxH: 1160 mmx1225mm x 17/50 mm —_- Waffle pack /Gel-Pak® 2" x2" and 4" x4" Theta placement accuracy: +0.10° @ 3s Statistics + JEDEC tray on request Bond Heads Uptime > $8% Substrates and Carriers Standard bond head 0° -360° rotation - Yield > 99.95% Substrate working range Heated bond head (optional) Wafer +18" 8°825 mm x200 mm) «Die size Die attach: 0.17 mm-50mm + Die thickness: 0.05 mm - 7mm + Wafer size:2°- 12" (50 mm - 300 mm)