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Porta Lógica XOR
Porta Lógica XOR
May 2012
MM74HC86
Quad 2-Input Exclusive OR Gate
Description
Features
The MM74HC86 exclusive OR gate utilizes advanced
Typical Propagation Delay: 9ns silicon-gate CMOS technology to achieve operating
Wide Operating Voltage Range: 2–6V speeds similar to equivalent LS-TTL gates, while
maintaining the low power consumption and high noise
Low Input Current: 1mA Maximum immunity characteristic of standard CMOS integrated
Low Quiescent Current: 20mA Max. (74 Series) circuits. These gates are fully buffered and have a
fanout of 10 LS-TTL loads. The 74HC logic family is
Output Drive Capability: 10 LS-TTL Loads functionally as well as pin-out compatible with the
standard 74LS logic family. All inputs are protected from
damage due to static discharge by internal diode clamps
to VCC and ground.
Ordering Information
Operating
Part Number Package Packing Method
Temperature Range
MM74HC86M 14-Lead, Small Outline Integrated Circuit Tube
MM74HC86MX (SOIC), JEDEC MS-012, 0.150" Narrow Tape & Reel
-40 to +85°C
MM74HC86MTC 14-Lead, Thin Shrink Small Outline Package Tube
MM74HC86MTCX (TSSOP), JEDEC MO-153, 4.4mm Wide Tape & Reel
Note:
2. Pb-Free package per JEDEC J-STD-020B.
Note:
5. For a power supply of 5V ±10%, the worst-case output voltages (VOH and VOL) occur for HC at 4.5V. Thus, the
4.5V values should be used when designing with this supply. Worst-case VIH and VIL occur at VCC = 5.5V and
4.5V, respectively. (The VIH values at 5V and 5.5V are 3.5V and 3.85V, respectively.) The worst-case leakage
current (IIN, ICC, and IOZ) occurs for CMOS at the higher voltage, so the 6.0V values should be used.
6.0 10 20 26 30
2.0 30 75 95 110
CL = 50pF,
Maximum Output Rise and tR = tF = 6ns
tTLH, tTHL 4.5 8 15 19 22 ns
Fall Time
6.0 7 13 16 19
Power Dissipation
CPD 25 pF
Capacitance (per Gate)(6)
Note:
2
6. CPD determines the no-load dynamic power consumption, PD = CPD VCC f + ICC VCC, and the no load dynamic
current consumption, IS = CPD VCC f + ICC.
8.75
8.50 A 0.65
7.62
14 8
B
5.60
6.00 4.00
3.80
0.90
SEATING PLANE
0.50
(1.04)
DETAIL A
SCALE: 20:1
Figure 2. 14-Lead, Small-Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
1.65
0.45 6.10
Figure 3. 14-Lead, Thin-Shrink Small-Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.