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DEPARTMENT

OF
ELECTRONICS & COMMUNICATION ENGINEERING

UG - B.E. COURSE
IN
Basic Electronics
Course Code : 21EC105 - 21EC205
I / II Semester ODD & Even Semester

CLASS NOTES – Module 5


Academic Year : 2021-22
Staff Incharges for Basic Electronics Course

Sowmya P / Trupti S Tagare / Navya Holla K /


Aishwarya N / Swapnil S Ninawe / Sindhushree M /
Nirmala Y N / Pavithra G.

Dr. T.C.Manjunath, Ph.D. (IIT Bombay)


Prof. & HOD, ECE Dept., DSCE

Dayananda Sagar College of Engineering


Shavigemalleshwara Hills, Kumaraswamy Layout,
Banashankari, Bangalore-560078, Karnataka
Tel : +91 80 26662226 26661104 Extn : 2731 Fax : +90 80 2666 0789
Web - http://www.dayanandasagar.edu Email : hod-ece@dayanandasagar.edu
( An Autonomous Institute Affiliated to VTU, Approved by AICTE & ISO 9001:2008 Certified )
( Accredited by NBA, National Assessment & Accreditation Council (NAAC) & Ranked by NIRF )
BASIC ELECTRONICS

Course Code : 21EC105 / 21EC205 Credits : 03


L: P:T:S:3:0:0: 0 CIE Marks : 50
Exam Hours : 03 SEE Marks : 50
Total Hours : 40 CIE + SEE Marks : 100

COURSE OBJECTIVES: To impart knowledge on

1. Digital concepts and number systems.


2. Basics of Electronic devices.
3. Principle of OP AMP.
4. Fundamentals of communication systems.
5. Applications of electronics.

COURSE OUTCOMES : At the end of the course, the student will be able to

Understand the operation and characteristics of semiconductor devices, digital


CO1
logic for various applications.
Apply and analyze circuits for applications like transistors, amplifiers and
CO2 electronic
systems.
Perform investigation of electronic devices through experimental learning and
CO3
literature to bring out safety and environmental considerations.
CO4 Evaluate performance of electronic circuits using modern it tools.
Analyze the functioning of a communication system, and different modulation
CO5
techniques
CO6 Design and develop simple electronic projects.

Mapping of Course outcomes to Program outcomes:

PO1 PO2 PO3 PO4 PO5 PO6 PO7 PO8 PO9 PO10 PO11 PO12

CO1 3 1 2 - - - - - - - - -

CO2 3 3 3 1 1 - - - - - - -

CO3 3 2 2 2 2 1 3 - 1 - 1 -

CO4 3 2 2 1 3 - - - 1 - 1 -

CO5 3 3 1 1 - - - - - - - -

CO6 3 3 3 2 2 2 2 - 1 - 1 -
Module Course Contents Hours COs
Digital Electronics 1 : Introduction to Number Systems, Binary
Number System, Decimal Number System, Octal Number
System, Hexadecimal Number System. Conversion from one
number system to another number system, 1’s and 2’s
1 complement method and their arithmetic. 8 CO1
Digital Electronics 2 : Binary logic functions, Boolean algebra, CO3
De- Morgan’s Theorem, Logic gates, Realization of Boolean
functions using basic gates, Implementation of logic gates as
half & full adders.
Bipolar Junction Transistors: P-N Junction Diode - Working
principle and Characteristics, BJT - Construction, Operation,
Common Base, Common Emitter and Common Collector
Characteristics, Numerical examples. BJT Biasing
2 – Introduction to DC load line and Operating Point, Base Bias, 8
CO2
Voltage Divider Bias Circuit (no numericals). CO4
Field Effect Transistor (FET): Construction, Operation,
Transfer Characteristics, p-channel FET - construction,
operation and drain characteristics.
Operational Amplifiers: Introduction, Block diagram
representation of OPAMP, Schematic symbol and pin
configuration, Ideal and Practical Characteristics of OPAMP,
CO2
3 Virtual ground concept. 8 CO3
OPAMP applications: Inverting and Non-Inverting amplifiers, CO6
Voltage Follower, Summer, Differentiator, Integrator,
Numericals.
Communication Systems 1: Introduction, Elements of
Communication Systems, Concept of Modulation, Methods of
Modulation - Principles of AM, AM derivation, Modulation
Index, FM, Pulse Analog and Pulse Digital Modulation, AM /
4 CO5
FM transmitters & receivers (block diagram description only). 8
CO6
Communication Systems 2: Block diagram and Principle of
Optical Fiber Communication, Advantages and Applications of
Optical Fiber communication.
Applications of Electronics: Principle of operation of Mobile
Phone, GSM Architecture, Generations of Communications,
Anti-Lock Braking System (ABS) : Introduction and Block
Diagram, Internet of Things (IoT) : Introduction, Applications : CO1
5 8 CO4
Smart Home Automation System, IC voltage regulators,
CO6
Introduction to Microcontroller & Microprocessors & its
differences, AI & ML, Robots & Robotics, Applications of AI /
ML / Robots / Robotics
PRE-REQUISITES :

Knowledge of subjects like : Basic Engineering Mathematics, Fundamentals of Electronics


(studied @ X, XI, XII level)

NOTE :

1. Questions for CIE and SEE not to be set from self-study component.
2. Assignment Questions may or may not be from self-study component only.

SELF-STUDY COMPONENTS:

Module 1 : Digital – 9’s & 10’s Complement methods, Universal gates.


Module 2 : CMOS Circuits, Construction & working of SCR, UJT.
Module 3 : Applications of OPAMPs – Oscillators, Schmitt Trigger.
Module 4 : Satellite Communication, ISDN.
Module 5 : Cloud Computing, Electrical & Electronic Instruments, Multimeters.

TEXT BOOKS :

1. D.P. Kothari, I. J. Nagrath, “Basic Electronics”, 2nd Edn, Mc Graw Hill, 2018.
V.K. Mehta, “Fundamentals of Electronic Devices & Circuits”, S. Chand & Company,
2.
New Delhi, India.
David A. Bell, “Electronic Devices and Circuits”, Oxford University Press, 5th Edition,
3.
2008.
Dr. T.C.Manjuanth, Dr. Arunkumar G., Dr., Dr. Spoorthi Jainar, Dr. Purohit S., “Basic
4.
Electronics”, Sudha Publishers, Bengaluru, 2016.

REFERENCES BOOKS:

Robert Boylested and Louis Nashelsky, “Electronic Devices and Circuit Theory”,
1.
Pearson Education, 9th Edition, 2007.
2. Thomas Floyd, “Electronic Devices”, Prentice Hall of India, New Delhi 2009.
3. Charles H. Roth, Jr; “Fundamentals of Logic Design”, Thomson Learning, 2004.
4. George Kennedy, “Electronic Communication Systems”, TMH, 4th Edition.

On-Line Materials & Resources:

1. https://www.rfwireless-world.com
2. https://en.wikipedia.org/wiki/Anti-lock_braking_system
3. https://en.wikipedia.org/wiki/Internet_of_things
4. https://www.synergy.ac.in
5. https://drive.google.com/drive/folders/0B5FYP7g6SWwdQmtvbnh0Uy03SnM
Scheme of Evaluation of the CIE & Assessment Pattern :

Alternate Assessment Tool (AAT) : There will be one AAT in the semester which will be
valued for 10 marks.

Quiz : There will be 1 quiz of 30 questions of 1 mark each, which would be reduced to 10
Marks.

CIE : There will be 3 CIE tests in a semester conducted for 50 marks each with 10 Marks MCQs,
remaining 40 Marks descriptive (with theory & problems). Finally, each CIE will be reduced
to 30 Marks and an average of the 3 tests would be considered as the final marks (30M).

Total CIE Marks : will be evaluated to 50 (CIE-30 + AAT-10 + Quiz-10)

CIE – Continuous Internal Evaluation Theory (50 Marks)

Tests - 3 CIEs AAT Quiz-1 No.


Bloom’s Category
30 Marks 10 Marks 10 Marks
Marks (Out of 50) 30 10 10
Remember 05 -- --
Understand 05 -- --
Apply 10 -- --
Analyze 05 -- --
Evaluate 05 -- --
Create -- -- --

SEE – Semester End Examination Theory (50 Marks)

Bloom’s Category Marks Theory (50)

Remember 10

Understand 20

Apply 10

Analyze 5

Evaluate 5

Create -
DEPARTMENT
OF
ELECTRONICS & COMMUNICATION ENGINEERING

Basic Electronics

(Theory Notes)

Autonomous Course

Prepared by

Prof. Sowmya P

Module – 5 Contents

Applications of Electronics: Principle of operation of Mobile


phone, GSM architecture, Anti-Lock Braking System (ABS):
Introduction and block diagram, Internet of Things (IoT):
Introduction, Applications: Smart Home Automation system,
7805 IC voltage regulator, Introduction to microcontroller &
microprocessors, Difference between microcontroller &
microprocessor, Difference between CISC & RISC processors.

Dayananda Sagar College of Engineering


Shavige Malleshwara Hills, Kumaraswamy Layout,
Banashankari, Bangalore-560078, Karnataka
Tel : +91 80 26662226 26661104 Extn : 2731 Fax : +90 80 2666 0789
Web - http://www.dayanandasagar.eduEmail :hod-ece@dayanandasagar.edu
( An Autonomous Institute Affiliated to VTU, Approved by AICTE & ISO 9001:2008 Certified )
( Accredited by NBA, National Assessment & Accreditation Council (NAAC) with 'A' grade )
Basic Electronics Module 5

GSM mobile phone

Figure 1. GSM mobile phone block diagram

RF Part
RF part consists of RF frequency up converter and RF frequency down converter. Up converter
converts modulated baseband signal either at zero IF (Intermediate frequency) or some IF to RF
frequency (890-915 MHz). RF down converter converts RF signal (935 to 960 MHz) to
baseband signal.

Baseband Part
This part basically converts voice/data to be carried over GSM air interface to baseband signal.
It is ported usually on DSP (Digital Signal Processor) to meet latency and power requirements
of mobile phone. For Speech/audio, codec is used to compress and decompress the signal to
match the data rate to the frame it has to fit in. CODEC converts speech at 8 KHz sampling rate
to 13 kbps rate for full rate speech traffic channel.

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ADC and DAC


ADC (Analog to Digital Converter) and DAC (Digital to Analog Converter) is used to convert
analog speech signal to digital signal and vice versa in the mobile handset. At Transmit path,
ADC converted digital signal is given to speech coder. AGC (Automatic Gain Control) and AFC
(Automatic Frequency Control) is used in the receiver path to control gain and frequency.

Application layer
It also runs on CPU. Various applications run in GSM mobile phone. It includes audio, video
and image/graphics applications. It supports various audio formats such as MP3, MP4, WAV,
rm. JPEG image formats are usually available.

Operating system
Various operating systems are supported in mobile phone such as Symbian, java, android, RT-
Linux, Palm. It runs on CPU of different manufacturers. For time critical applications RTOS
(real-time operating system) is used.

Battery
It is the only major source of power to make/to keep mobile phone functional. There are various
types of batteries made of Nickel Cadmium (NiCd), Nickel Metal Hydride (NiMH), based on
lithium, Li- ion and so on. The major factors for designers are to reduce battery size, last for
more talk time, increase battery life. Battery comes usually with 3.6 or 3.7 voltage and 600mAh
or 960 mAh ratings. Battery Charger is usually provided with mobile phone to charge the mobile
phone battery. Battery charger is AC to DC converter.

Connectivity (WLAN, Bluetooth, USB, GPS)


To make data transfer fast enough between mobile phone and other computing devices (laptop,
desktop, tablet) or between mobile and mobile various technologies are evolved which include
WLAN, Bluetooth, and USB. GPS (global positioning system) is used for location assistance
and will enable Google map to work efficiently.

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Microphone
Microphone or mic converts air pressure variations (result of our speech) to electrical signal
to couple on the PCB for further processing.

Speaker
It converts electrical signal to audible signal (pressure vibrations) for human being to hear. This
is often coupled with audio amplifier to get required amplification of audio signal.
Camera
It is the major specifications in increasing cost of mobile phone. There are various mega pixel
cameras for mobile phones are available such as 12 mega pixel, 14 mega pixel and even 41
mega pixel available in smart phones. This has become evident because of advancement in
sensor technology. If one wants to buy low cost mobile phone, they usually go for non camera
mobile phone.
Display
There are various display devices used in mobile phone such as LCD (liquid crystal display),
TFT (Thin- film transistor) screen, OLED (organic light emitting diode), TFD (thin film
diode), touch screen of capacitive and resistive type etc.
Keypad
Earlier days keypad was simple matrix type keypad which contains numeric digits (0 to 9),
alphabets (a to z), special characters and specific function keys. These has been designed for
various applications such as accepting call, rejecting call, cursor movement (left, right, top,
down) dialing number, typing name/sms/mms and so on.

GSM Network Architecture


The GSM network architecture consists of four main parts:

 Mobile station (MS)

 Base-Station Subsystem (BSS)

 Network and Switching Subsystem (NSS)

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Basic Electronics Module 5

 Operation and Support Subsystem (OSS)

Figure 2. Simplified GSM Network Architecture Diagram

Mobile station

Mobile station (MS)/mobile equipment (ME)/cell/mobile phone is the section of a GSM cellular
network that the user sees and operates. There are number of elements in the cell phone. The two
main elements are the main hardware and the SIM.
The hardware itself contains the main elements of the mobile phone including the display, case,
battery, and the electronics used to generate the signal, and process the data receiver and to be
transmitted. It also contains a number known as the International Mobile Equipment Identity
(IMEI). This is installed in the phone at manufacture and "cannot" be changed. It is accessed by
the network during registration to check whether the equipment has been reported as stolen.

The SIM or Subscriber Identity Module contains the information that provides the identity of the
user to the network. It contains are variety of information including a number known as the
International Mobile Subscriber Identity (IMSI).

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Basic Electronics Module 5

Base Station Subsystem (BSS)


The Base Station Subsystem (BSS) section of the GSM network architecture that is
fundamentally associated with communicating with the mobiles on the network. It consists of
two elements:

 Base Transceiver Station (BTS): The BTS used in a GSM network comprises the radio
transmitter receivers, and their associated antennas that transmit and receive to directly
communicate with the mobiles. The BTS is the defining element for each cell. The BTS
communicates with the mobiles and the interface between the two is known as the Um
interface with its associated protocols.

 Base Station Controller (BSC): The BSC forms the next stage back into the GSM
network. It controls a group of BTSs, and is often co- located with one of the BTSs in its
group. It manages the radio resources and controls items such as handover within the
group of BTSs, allocates channels and the like. It communicates with the BTSs over what
is termed the Abis interface.

Network Switching Subsystem (NSS)

The GSM system architecture contains a variety of different elements, and is often termed the
core network. It provides the main control and interfacing for the whole mobile network. The
major elements within the core network include:

 Mobile Services Switching Centre (MSC): The main element within the core network
area of the overall GSM network architecture is the Mobile switching Services Centre
(MSC). The MSC acts like a normal switching node within a PSTN or ISDN, but also
provides additional functionality to enable the requirements of a mobile user to be
supported. These include registration, authentication, call location, inter-MSC handovers
and call routing to a mobile subscriber. It also provides an interface to the PSTN so that
calls can be routed from the mobile network to a phone connected to a landline.
Interfaces to other MSCs are provided to enable calls to be made to mobiles on different
networks.

 Home Location Register (HLR): This database contains all the administrative
information about each subscriber along with their last known location. In this way, the
GSM network is able to route calls to the relevant base station for the MS. When a user
switches on their phone, the phone registers with the network and from this it is possible to
determine which BTS it communicates with so that incoming calls can be routed appropriately.
Even when the phone is not active (but switched on) it re-registers periodically to ensure that the
network (HLR) is aware of its latest position. There is one HLR per network, although it may be
distributed across various sub-centers to for operational reasons.

 Visitor Location Register (VLR): This contains selected information from the HLR that
enables the selected services for the individual subscriber to be provided. The VLR can
be implemented as a separate entity, but it is commonly realized as an integral part of the

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Basic Electronics Module 5

MSC, rather than a separate entity. In this way access is made faster and more
convenient.

 Equipment Identity Register (EIR): The EIR is the entity that decides whether a given
mobile equipment may be allowed onto the network. Each mobile equipment has a
number known as the International Mobile Equipment Identity. This number, as
mentioned above, is installed in the equipment and is checked by the network during
registration. Dependent upon the information held in the EIR, the mobile may be
allocated one of three states - allowed onto the network, barred access, or monitored in
case its problems.

 Authentication Centre (AuC): The AuC is a protected database that contains the secret
key also contained in the user's SIM card. It is used for authentication and for ciphering
on the radio channel.

 Gateway Mobile Switching Centre (GMSC): The GMSC is the point to which a ME
terminating call is initially routed, without any knowledge of the MS's location. The
GMSC is thus in charge of obtaining the MSRN (Mobile Station Roaming Number) from
the HLR based on the MSISDN (Mobile Station ISDN number, the "directory number" of
a MS) and routing the call to the correct visited MSC. The "MSC" part of the term
GMSC is misleading, since the gateway operation does not require any linking to an
MSC.

 SMS Gateway (SMS-G): The SMS-G or SMS gateway is the term that is used to
collectively describe the two Short Message Services Gateways defined in the GSM
standards. The two gateways handle messages directed in different directions. The SMS-
GMSC (Short Message Service Gateway Mobile Switching Centre) is for short messages
being sent to an ME. The SMS-IWMSC (Short Message Service Inter-Working Mobile
Switching Centre) is used for short messages originated with a mobile on that network.
The SMS-GMSC role is similar to that of the GMSC, whereas the SMS-IWMSC
provides a fixed access point to the Short Message Service Centre.

Operation and Support Subsystem (OSS)

The OSS or operation support subsystem is an element within the overall GSM network
architecture that is connected to components of the NSS and the BSC. It is used to control and
monitor the overall GSM network and it is also used to control the traffic load of the BSS. It
must be noted that as the number of BS increases with the scaling of the subscriber population
some of the maintenance tasks are transferred to the BTS, allowing savings in the cost of
ownership of the system.

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Basic Electronics Module 5

Anti-Lock Braking System

Figure 3. Block diagram of Anti-Lock Braking System.

Antilock braking system (ABS) prevents brakes from locking during braking. In normal braking
situation the driver control the brakes, however during severs braking or on slippery roadways
when driver the wheels to approach lockup, the antilock takes over here. The ABS modulates the
brake line pressure independent of the pedal force to bring the wheel speed back to the slip level
range that necessary to the optimal braking performance. The ABS does not allow full wheel lock
under braking. In simple terms, during emergency of braking, the wheel does not get locked
even if you push a full auto brake pedal and hence the skidding does not take place.

Electronic Control Unit (ECU):


1. A micro computer that functions as the ``brain'' of the ABS system.
2. The ECU receives wheel performance data from each wheel sensor.
3. When the wheels try to lock, the ECU delivers commands to the hydraulic valves to
control brake pressure.

Hydraulic control unit or modulation valve unit


1. It receives operating signals from the ECU to apply or release the brakes under ABS
conditions.
2. Hydraulic control unit controls the brake pressure in each wheel cylinder based on the inputs
from the system sensor. This in result controls the wheel speed.

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Basic Electronics Module 5

Break application unit


Whenever hard braking situation occur, the system sense the change in the rotation of the speed
sensor and decide whether to hold or release pressure to a brake circuit.

Wheel sensor unit


1. It monitors the rotational speed of the wheel and transmits this data to the ABS control
module.
2. If a wheel-speed sensor signals a lock up - the ECU sends a current to the hydraulic unit. This
stops the braking pressure at that wheel from rising, and keeps it constant. It allows wheel
velocity to increase and slip to decrease.

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Basic Electronics Module 5

Internet of Things or IoT

BUILDING BLOCKS of IoT


Basic building blocks of IoT system include –sensors, processors, gateways, applications. Each
of these nodes has to have their own characteristics in order to form a useful IoT system.

Figure 4: Basic building blocks of the IoT

Sensors:
These form the front end of the IoT devices. These are the so called “Things” of the system.
Their main purpose is to collect data from its surrounding (sensors) or give out data to its
surrounding (actuators).
These have to be uniquely identifiable devices with a unique IP address so that they can be easily
identifiable over a large network.
These have to be active in nature which means that they should be able to collect real time data.
These can either work on their own (autonomous in nature) or can be made to work by the user
depending on their needs (user controlled).

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Basic Electronics Module 5

Examples of sensors are: gas sensor, water quality sensor, moisture sensor etc.
Processors:
Processors are the brain of the IoT system. Their main function is to process the data captured by
the sensors and process them so as to extract the valuable data from the enormous amount of raw
data collected. In a word, we can say that it gives intelligence to the data.
Processors mostly work on real-time basis and can be easily controlled by applications. These
are also responsible for securing the data – that is performing encryption and decryption of data.
Embedded hardware devices, microcontroller etc are the ones that process the data because they
have processors attached to it.
Gateways:
Gateways are responsible for routing the processed data and send it to proper locations for its
(data) proper utilization.
In other words, we can say that gateway helps in to and fro communication of the data. It
provides network connectivity to the data. Network connectivity is essential for any IoT system
to communicate.
LAN, WAN, PAN etc are examples of network gateways.
Applications:
Applications form another end of an IoT system. Applications are essential for proper utilization
of all the data collected.
Examples of applications are: home automation apps, security systems, industrial control hub
etc.

HOW IoT WORKS


First, it acquires information with respect to basic resources (names, addresses and so on) and
related attributes of objects by means of automatic identification and perception technologies
such as RFID, wireless sensor and satellite positioning, in other words the sensors, RFID tags
and all other uniquely identifiable objects or "things" acquire real- time information (data) with
the virtue of a central hub like smart phones.

Second, by virtue of many kinds of communications technologies, it integrates object-related


information into the information network and realizes the intelligent indexing and integration of
the information related to masses of objects by resorting to fundamental resource services
(similar to the resolution, addressing and discovery of the internet).

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Basic Electronics Module 5

Finally, utilizing intelligent computing technologies such as cloud computing, fuzzy recognition,
data mining and semantic analysis, it analyzes and processes the information related to masses of
objects so as to eventually realize intelligent decision and control in the physical world.

IoT ARCHITECTURE
There are four major layers.

Figure 5. IoT Architecture

Sensor, Connectivity and Network Layer

 This layer consists of RFID tags, sensors (which are essential part of an IoT system and
are responsible for collecting raw data). These form the essential “things” of an IoT
system.
 Sensors, RFID tags are wireless devices and form the Wireless Sensor Networks (WSN).
 Sensors are active in nature which means that real-time information is to be collected and
processed.
 This layer also has the network connectivity (like WAN, PAN etc.) which is responsible
for communicating the raw data to the next layer which is the Gateway and Network
Layer.

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Basic Electronics Module 5

Gateway and Network Layer


 Gateways are responsible for routing the data coming from the Sensor, Connectivity
and Network layer and pass it to the next layer which is the Management Service
Layer.
 This layer requires having a large storage capacity for storing the enormous amount of
data collected by the sensors, RFID tags etc. Also, this layer needs to have a consistently
trusted performance in terms of public, private and hybrid networks.

Management Service Layer


 This layer is used for managing the IoT services. Management Service layer is
responsible for Securing Analysis of IoT devices, Analysis of Information, Device
Management.
 Data management is required to extract the necessary information from the enormous
amount of raw data collected by the sensor devices to yield a valuable result of all the
data collected. This action is performed in this layer.

Application Layer
Application layer forms the topmost layer of IoT architecture which are responsible for effective
utilization of the data collected.
Various IoT applications include Home Automation, E-health, and E-Government etc.

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Basic Electronics Module 5

Smart Home automation


Smart Home automation refers to handling and controlling home appliances by using micro-
controller or computer technology.

Figure 6. Block Diagram of Smart Home Automation

The home automation using Internet of Things connects devices and control remotely through
internet. The system not only monitors the sensor data, like temperature, gas, light, motion
sensors, but also actuates a process according to the requirement, for example switching on the
light when it gets dark. It also stores the sensor parameters in the cloud (Gmail) in a timely
manner. This will help the user to analyze the condition of various parameters in the home
anytime anywhere.
The model consists of number of relays to connect various devices. Initially all the devices are
connected to the internet through Wi-Fi. When the connection is established in on web page we
provide virtual switches to operate the connected devices. If particular device exceeds the
threshold set point then server will give notification to the user on web page and that device will
automatically turned off.

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Basic Electronics Module 5

Passive Infrared Sensor (PIR) is an electronic device which is designed to detect this IR
wavelength when a human being is in its proximity. PIR motion sensors are installed at the
entrances of a building. This signal which detects the presence of human beings becomes the
input trigger for the micro-controller.
Raspberry Pi: The main processing and controlling unit of the system. It has four USB ports,
allowing the connection of different peripherals to it such as keyboard, mouse, memory stick or
Wi-Fi dongle that allows its connection to wireless internet.
The home automation system has the capability to monitor and control the following:
 Temperature and humidity
 Motion detection
 Fire and smoke detection
 Light/Fan on/off

ADVANTAGES
(a) Adds Safety Through Appliance and Lighting Control
(b) Secures Home Through web control Increases Convenience through Temperature Adjustment
(c) Save time
(d) Save money and increase convenience

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Basic Electronics Module 5

7805 IC Voltage Regulator


All voltage sources cannot able to give fixed output due to fluctuations in the circuit. For getting
constant and steady output, the voltage regulators are implemented. The integrated circuits which
are used for the regulation of voltage are termed as voltage regulator ICs. Here, we can discuss
about IC 7805.
The voltage regulator IC 7805 is actually a member of 78xx series of voltage regulator ICs. It is
a fixed linear voltage regulator. The xx present in 78xx represents the value of the fixed output
voltage that the particular IC provides. For 7805 IC, it is +5V DC regulated power supply. This
regulator IC also adds a provision for a heat sink. The input voltage to this voltage regulator can
be up to 35V, and this IC can give a constant 5V for any value of input less than or equal to 35V
which is the threshold limit.

Figure 7. Pin diagram of 7805

PIN 1-INPUT The function of this pin is to give the input voltage. It should be in the range of 7V
to 35V. We apply an unregulated voltage to this pin for regulation. For 7.2V input, the PIN
achieves a maximum efficiency.
PIN 2-GROUND We connect the ground to this pin. For output and input, this pin is equally
neutral (0V).
PIN 3-OUTPUT This pin is used to take the regulated output. It will be

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Basic Electronics Module 5

Circuit Diagram
The following image shows the circuit diagram of producing a regulated 5V from AC Mains
supply.

Figure 8. Circuit Diagram of an application using 7805 IC


Components Required

 230V-12V Step Down Transformer


 Bridge Rectifier (or 4 PN Diodes – 1N4007)
 1A Fuse
 1000μF Capacitor
 7805 Voltage Regulator IC
 0.22μF Capacitor
 0.1μF Capacitor
 1N4007 Diode

Working

 The AC power supply from mains first gets converted into and unregulated DC and then
into a constant regulated DC with the help of this circuit. The circuit is made up of
transformer, bridge rectifier made up from diodes, linear voltage regulator 7805 and
capacitors.

 If you observe, the working of the circuit can be divided into two parts. In the first part,
the AC Mains is converted into unregulated DC and in the second part, this unregulated DC
is converted into regulated 5V DC. So, let us start discussing the working with this in
mind.

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Basic Electronics Module 5

 Initially, a 230V to 12V Step down transformer is taken and its primary is connected to
mains supply. The secondary of the transformer is connected to Bridge rectifier (either a
dedicated IC or a combination of 4 1N4007 Diodes can be used).

 A 1A fuse is placed between the transformer and the bridge rectifier. This will limit the
current drawn by the circuit to 1A. The rectified DC from the bridge rectifier is
smoothened out with the help of 1000μF Capacitor.

 So, the output across the 1000μF Capacitor is unregulated 12V DC. This is given as an
input to the 7805 Voltage Regulator IC. 7805 IC then converts this to a regulated 5V DC
and the output can be obtained at its output terminals.

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Basic Electronics Module 5

Micro Processors
 A microprocessor is a sequential digital circuit which provides the flexibility to perform
different tasks upon execution of corresponding instruction sequence.
 Each microprocessor has a fixed set of instructions which are coded in binary.
 It has a circuitry to read instructions from memory and execute the instructions to perform
particular task.

Figure 9. Block diagram of a Microprocessor.

The block diagram includes three major logic devices.


1. ALU
2. Several Registers: Accumulator, Status register, Instruction register, Program counter and
general purpose registers.
3. Control unit.

Program Counter: The program counter gives the address of memory location from where the next
instruction is to be fetched.

Instruction Register: Instruction read from memory is loaded into the instruction register. It is then
sent to the instruction decoder. The instruction decoder decodes the instruction and gives decoded
signals as an input to the control unit.

Arithmetic Logic Unit (ALU): The ALU performs arithmetic and logic operations such as add,
subtract, AND, OR, exclusive-OR, complement, shift right, shift left and so on.
Accumulator (A-register): It gives data for the ALU and after performing the operation; the
resulting data word is sent to the register A and stored there. This special register, where the result is
accumulated is commonly known as accumulator.

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Status register: The status register is used to store the results of certain condition such as result is
zero, negative, etc., when certain operations are performed during execution of the program. The
status register is also referred to as the flag register.

Control Unit: The control unit is responsible for working of all other parts of the microprocessor
together. It maintains the synchronization in operation of different parts in the microprocessor. The
control unit receives the signal from instruction decoder and generates the control signals necessary
to carry out the instruction execution.

Bus: A microprocessor communicates with memory and I/O devices with a common communication
path called bus. There are three types of buses: address bus, data bus and control bus.

Micro Controller

Figure 10. Block diagram of a Microcontroller.

Central processing unit (CPU):


• The 8051 Central processing unit consists of 8-bit Arithmetic & Logic Unit (ALU), Registers:
A, B, PSW, SP, 16 bit program counter & “Data Pointer Registers” (DPTR).
• The ALU can perform arithmetic functions on 8-bit data i.e. addition, subtraction,
multiplication & division.
• Similarly, the logic unit perform logical operations such as AND, OR, NOT etc.

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A register (Accumulator):
• Accumulator is a 8 bit register & is widely used for arithmetic and data transfer operations.
• The arithmetic operations are addition, subtraction, multiplication, division & Boolean bit
manipulating etc.
• The data transfer operation is between the 8051 microcontroller and any external memory.

B-register:
• The B-register is always used with the A-register to store 8-bit result of multiplication &
division operations
• It is used as temporary register where data may be stored.

BUS:
Bus is a collection of wires which work as a communication channel or medium for transfer of
data. The 8051 has two types of buses:
1) Address Bus (16-bits) and
2) Data Bus (8-bits)

Program Counter (PC):


• PC is a16-bit register which holds the address of the next instruction to be executed.
• The PC is automatically incremented after every instruction byte is fetched.
• PC is the only register that does not have an internal address.
• DPTR is very useful for string operations and look up table operations.

Input-Output ports (I/O Ports):


• The 8051 has four I/O ports i.e. PORT 1, PORT 2, PORT 3 and PORT 4 and each port has 8
I/O pins.
• The 8051 has total 32 I/O pins and each pin can be configured as either input or output pin.

Times & Counters:


• 8051 has two 16-bit registers:
i) Timer/Counter T0 and
ii) Timer/Counter T1
• Each register can be used either for Timer or counter operation and can be divided into two 8-
bit registers called Timer Low (TL) and Timer High (TH).
• Timers & Counters can be used
i) Timers as a time delay generator.
ii) Counters as an event counter.

Program status (PSW) or Flag register:

Figure 11. Program Status Word.

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Carry Flag (CY):


After performing arithmetic & logic operation if there is a carryout from the MSB (D7 i.e., 7th-bit)
then CY = 1, otherwise CY = 0.
Auxiliary carry Flag (AC): After performing arithmetic & logic operation if a carry is generated
from D3 to D4 bit then AC = 1, otherwise AC = 0.
F0: Available for the user for general purposes.
RS 1 & RS 0: Register Bank selector is shown in the table below.

Figure 12. Register Bank Selector

Overflow Flag (OV):


OV flag is set to 1 if either of the following two conditions occurs:
1) There is a carry from D6 to D7, but no carry out of D7 (CY = 0)
2) There is a carry out from D7 bit (CY = 1) but no carry from D6 to D7 bit.

Parity Flag (P):


Parity flag indicates the number of 1’s present in the accumulator.
i) If the number of 1’s in the accumulator is odd then P = 1
ii) If the number of 1’s in the accumulator is even then P = 0.

STACK (8-bit):
• The stack is a section of RAM used by the CPU to store information temporarily. This
information could be data or an address.
• The register used to access the stack is called the SP (stack pointer) register. The stack pointer
in the 8051 is only 8 bits wide.
• The storing of a CPU register in the stack is called a PUSH, and retrieving the contents off the
stack back into a CPU register is called a POP.

Data pointer (DPTR):


DPTR is a 16-bit register, which holds a 16-bit address.

DPTR can be split into 2 parts:


1) DPH→ Data pointer high byte having internal address 83h
2) DPL → Data pointer Low byte having internal address 82h.

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Figure 12. DPTR

Memory Organization:
The 8051 microcontroller’s memory is divided into
1) Internal RAM – 128 bytes: Used for temporarily storing and keeping intermediate results
and variables.
2) ROM – 4K bytes: Used for permanent saving program being executed

Special Function Registers (SFR):


The operations of 8051 are done by a group of specific internal registers, each called a special
function Register (SFR).

Interrupts:
The 8051 Microcontroller has 6 interrupts:
RESET, INT0, INT1, Timer0 (TF0), Timer1 (TF1), Serial Port (TI/RI).

Comparison between Microprocessor and Microcontroller:

Sl. Microprocessor Microcontroller


No.
1. Microprocessor contains ALU, Microcontroller contains
control unit (clock and timing microprocessor, memory (ROM and
circuit), different register and RAM), I/O interfacing circuit and
interrupt circuit. peripheral devices such as A/D
converter, serial I/O, timer, etc.
2. It has many instructions to move data It has one or two instructions to move
between memory and CPU. data between memory and CPU.
3. It has one or two bit handling It has many bit handling instructions.
instructions.
4. Access times for memory and I/O Less access time for built-in memory
devices are more. and I/O devices.
5. Microprocessor based system Microcontroller based system requires
requires more hardware. less hardware reducing PCB size and
increasing the reliability.
6. Microprocessor based system is more Less flexible in design point of view.
flexible in design point of view.
7. It has single memory map for data It has separate memory map for data and

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and code. code.


8. Less number of pins are multi- More number of pins are multi-
functioned. functioned.

Risc and Cisc Processors/Controllers:


RISC stands for Reduced Instruction Set Computing. As the name implies, all RISC
processors/controllers possess lesser number of instructions, typically in the range of 30 to 40.
Example for RISC processor – Atmel AVR microcontroller, its instruction set contains only 32
instructions.

CISC stands for Complex Instruction Set Computing. The instruction set here is complex
and the instructions are high in number. Example for CISC processor – original version of 8051
microcontroller (e.g. AT89C51). Its instruction set contains 255 instructions.

Remember, it is not the number of instructions that determines whether a processor/controller


is CISC or RISC. There are other factors like pipelining features, instruction set type, etc. for
determining the RISC/CISC criteria.

From a programmers point of view RISC processors are comfortable since s/he needs to learn
only a few instructions, whereas for a CISC processor s/he needs to learn more number of instructions
and should understand the context of usage of each instruction.

A few differences between RISC and CISC processors are listed below:

Sl. RISC CISC


No.
1. Lesser number of instructions. Greater number of instructions.
2. Instruction pipelining and increased Generally no instruction pipelining
execution speed. feature.
3. Orthogonal instruction set (Allows Non- orthogonal instruction set (All
each instruction to operate on any instructions are not allowed to operate
register and use any addressing on any register and use any addressing
mode) mode. It is instruction-specific).
4. Operations are performed on registers Operations are performed on registers or
only, the only memory operations memory depending on the instruction.
are load and store.
5. A large number of registers are Limited number of general purpose
available. registers.
6. Programmer needs to write more Instructions are like macros in C
code to execute a task since the language. A programmer can achieve
instructions are simpler ones. the desired functionality with a single
instruction which in turn provides the

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effect of using simpler single


instructions in RISC.
7. Single, fixed length instructions Variable length instructions
8. Less silicon usage and pin count More silicon usage since more
additional decoder logic is required to
implement the complex instruction
decoding.
9. With Harvard Architecture Can be Harvard or Von-Neumann
Architecture

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Vision & Mission of the Institute

Vision:
 To impart quality technical education with a focus on Research and Innovation emphasizing
on Development of Sustainable and Inclusive Technology for the benefit of society.

Mission:
 To provide an environment that enhances creativity and Innovation in pursuit of Excellence.
 To nurture teamwork in order to transform individuals as responsible leaders and
entrepreneurs.
 To train the students to the changing technical scenario and make them to understand the
importance of sustainable and inclusive technologies.

Vision & Mission of the Department

Vision :
 To achieve continuous improvement in quality technical education for global competence with
focus on industry, societal needs, research and professional success.

Mission:
 Offering quality education in Electronics and Communication Engineering with effective
teaching learning process in multidisciplinary environment.
 Training the students to take-up projects in emerging technologies and work with team spirit.
 To imbibe professional ethics, development of skills and research culture for better placement
opportunities.

Program Education Objectives

After four years, the students will be


PEO1 : ready to apply the state-of-art technology in industry and meeting the societal needs
with knowledge of Electronics and Communication Engineering due to strong academic
culture.
PEO2 : competent in technical and soft skills to be employed with capability of working in
multidisciplinary domains.
PEO3 : professionals, capable of pursuing higher studies in technical, research or management
programs.

Program Specific Outcomes

PSO1 : Design, develop and integrate electronic circuits and systems using current practices and
standards.
PSO2 : Apply the knowledge of hardware and software in designing Embedded &
Communication systems.

Department of Electronics & Communication Engineering


Dayananda Sagar College of Engineering, Bangalore, Karnataka, India

BASIC ELECTRONCIS 2021-22 Course Code : 21EC105 - 21EC205

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