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74AC573, 74ACT573 Rev 2008
74AC573, 74ACT573 Rev 2008
January 2008
74AC573, 74ACT573
Octal Latch with 3-STATE Outputs
Features General Description
■ ICC and IOZ reduced by 50% The 74AC573 and 74ACT573 are high-speed octal
■ Inputs and outputs on opposite sides of package latches with buffered common Latch Enable (LE) and
allowing easy interface with microprocessors buffered common Output Enable (OE) inputs.
■ Useful as input or output port for microprocessors The 74AC573 and 74ACT573 are functionally identical
■ Functionally identical to 74AC373 and 74ACT373 to the 74AC373 and 74ACT373 but with inputs and
■ 3-STATE outputs for bus interfacing outputs on opposite sides.
■ Outputs source/sink 24mA
■ 74ACT573 has TTL-compatible inputs
Ordering Information
Package
Order Number Number Package Description
74AC573SC M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300"
Wide
74AC573SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74AC573MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,
4.4mm Wide
74ACT573SC M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300"
Wide
74ACT573SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74ACT573MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,
4.4mm Wide
74ACT573PC N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
IEEE/IEC
Pin Description
Pin Names Description
D0–D7 Data Inputs
LE Latch Enable Input
OE 3-STATE Output Enable Input
O0–O7 3-STATE Latch Outputs
Functional Description
Truth Table
The 74AC573 and 74ACT573 contain eight D-type
latches with 3-STATE output buffers. When the Latch Inputs Outputs
Enable (LE) input is HIGH, data on the Dn inputs enters OE LE D On
the latches. In this condition the latches are transparent,
i.e., a latch output will change state each time its D-type L H H H
input changes. When LE is LOW the latches store the L H L L
information that was present on the D-type inputs a L L X O0
setup time preceding the HIGH-to-LOW transition of LE.
The 3-STATE buffers are controlled by the Output H X X Z
Enable (OE) input. When OE is LOW, the buffers are H = HIGH Voltage
enabled. When OE is HIGH the buffers are in the high
L = LOW Voltage
impedance mode but this does not interfere with entering
new data into the latches. Z = High Impedance
X = Immaterial
O0 = Previous O0 before HIGH-to-LOW transition of
Latch Enable
Please note that this diagram is provided only for the understanding of logic operations and should not be used to
estimate propagation delays.
Capacitance
Symbol Parameter Conditions Typ. Units
CIN Input Capacitance VCC = OPEN 5.0 pF
CPD Power Dissipation Capacitance VCC = 5.0V
AC 25.0 pF
ACT 42.0
13.00
12.60 A
11.43
20 11
B
9.50
10.65 7.60
10.00 7.40
2.25
1 10 0.65
PIN ONE 0.51 1.27 1.27
INDICATOR 0.35
0.25 M C B A
LAND PATTERN RECOMMENDATION
0.33
C 0.20
0.10 C
0.30
0.75 0.10 SEATING PLANE
X 45°
0.25
NOTES: UNLESS OTHERWISE SPECIFIED
(R0.10)
A) THIS PACKAGE CONFORMS TO JEDEC
GAGE PLANE
(R0.10) MS-013, VARIATION AC, ISSUE E
0.25 B) ALL DIMENSIONS ARE IN MILLIMETERS.
8°
0° C) DIMENSIONS DO NOT INCLUDE MOLD
FLASH OR BURRS.
1.27 D) CONFORMS TO ASME Y14.5M-1994
0.40 SEATING PLANE E) LANDPATTERN STANDARD: SOIC127P1030X265-20L
(1.40) DETAIL A F) DRAWING FILENAME: MKT-M20BREV3
SCALE: 2:1
Figure 1. 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
Figure 2. 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
Figure 3. 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
26.92
24.89
PIN #1 7.11
6.09
3.43
(0.97) 1.78 3.17 7.87
7° TYP
5.33 MAX
1.14
7° TYP
2.54 3.55
0.36 3.17 7.62
0.56 0.38 MIN 10.92 MAX
0.20
0.35
.001[.025] C
NOTES:
Figure 4. 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS
HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE
APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS
PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S
WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.