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21/09/2020

CHAPTER
1
Introduction to
Materials Science
and
Engineering
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What are Materials?

• Materials may be defined as substance of


which something is composed or made.
• We obtain materials from earth crust and
atmosphere.

• Examples :-
 Silicon and Iron constitute 27.72
and 5.00 percentage of weight of
earths crust respectively.
 Nitrogen and Oxygen constitute
78.08 and 20.95 percentage of dry
air by volume respectively.

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Why the Study of Materials is Important?


• Production and processing of materials constitute a
large part of our economy.
• Engineers choose materials to suite design.
• New materials might be needed for some new
applications.

 Example :- High temperature resistant materials.


 Space station and Mars Rovers should sustain
conditions in space.
* High speed, low temperature, strong but
light.
• Modification of properties might be needed for some
applications.

 Example :- Heat treatment to modify properties.

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Materials Science and Engineering

• Materials science deals with basic knowledge


about the internal structure, properties and
processing of materials.
• Materials engineering deals with the application
of knowledge gained by materials science to
convert materials to products.

Materials Science and


Materials Science Engineering Materials Engineering
Basic Resultant Applied
Knowledge Knowledge Knowledge
of of Structure and of Materials
Materials Properties

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Types of Materials

• Metallic Materials
 Composed of one or more metallic elements.
 Example:- Iron, Copper, Aluminum.
 Metallic element may combine with
nonmetallic elements.
 Example:- Silicon Carbide, Iron Oxide.
 Inorganic and have crystalline structure.
 Good thermal and electric conductors.

Metals and Alloys

Ferrous Nonferrous
Eg: Steel, Eg:Copper
Cast Iron Aluminum
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Types of Materials

• Polymeric (Plastic) Materials


 Organic giant molecules and mostly
noncrystalline.
 Some are mixtures of crystalline and
noncrystalline regions.
 Poor conductors of electricity and hence
used as insulators.
 Strength and ductility vary greatly.
 Low densities and decomposition
temperatures.

 Examples :- Poly vinyl Chloride (PVC),


Polyester.
 Applications :- Appliances, DVDs, Fabrics
etc.

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Types of Materials

• Ceramic Materials
 Metallic and nonmetallic elements are chemically
bonded together.
 Inorganic but can be either crystalline, noncrystalline
or mixture of both.
 High hardness, strength and wear resistance.
 Very good insulator. Hence used for furnace lining for
heat treating and melting metals.
 Also used in space shuttle to insulate it during exit and
reentry into atmosphere.
 Other applications : Abrasives, construction materials,
utensils etc.

 Example:- Porcelain, Glass, Silicon nitride.

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Types of Materials

• Composite Materials
 Mixture of two or more materials.
 Consists of a filler material and a binding material.
 Materials only bond, will not dissolve in each other.
 Mainly two types :-
o Fibrous: Fibers in a matrix
o Particulate: Particles in a matrix
o Matrix can be metals, ceramic or polymer
 Examples :-
 Fiber Glass ( Reinforcing material in a polyester
or epoxy matrix)
 Concrete ( Gravels or steel rods reinforced in
cement and sand)
 Applications:- Aircraft wings and engine, construction.

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Types of Materials

• Electronic Materials

 Not Major by volume but very


important.
 Silicon is a common electronic
material.
 Its electrical characteristics are
changed by adding impurities.

 Examples:- Silicon chips, transistors


 Applications :- Computers, Integrated
Circuits, Satellites etc.

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Competition Among Materials


• Materials compete with each
other to exist in new market Example:-
Aluminum
1600
Iron
1400 Plastic
• Over a period of time usage Steel
1200
of different materials changes
1000
lb/Car

depending on cost and


800
performance.
600
400
• New, cheaper or better 200
materials replace the old 0
materials when there is a 1985 1992 1997
Model Year
breakthrough in technology
Figure 1.14
Predictions and use of
materials in US automobiles.
1-10 After J.G. Simon, Adv. Mat. & Proc., 133:63(1988) and new data

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Future Trends

• Metallic Materials
 Production follows US economy closely.
 Alloys may be improved by better chemistry and
process control.
 New aerospace alloys being constantly
researched.
o Aim: To improve temperature and corrosion
resistance.
o Example: Nickel based high temperature super
alloys.
 New processing techniques are investigated.
o Aim: To improve product life and fatigue
properties.
o Example: Isothermal forging, Powder metallurgy.
 Metals for biomedical applications
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Future Trends

• Polymeric (Plastic Materials)


 Fastest growing basic material (9%
per year).
 After 1995 growth rate decreased
due to saturation.
 Different polymeric materials can
be blend together to produce new
plastic alloys.
 Search for new plastic continues.

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Future Trends

• Ceramic Materials
New family of engineering ceramics are produced
last decade
 New materials and applications are constantly
found.
 Now used in Auto and Biomedical applications.
 Processing of ceramics is expensive.
 Easily damaged as they are highly brittle.
 Better processing techniques and high-impact
ceramics are to be found.

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Future Trends

• Composite Materials
 Fiber reinforced plastics are primary
products.
 On an average 3% annual growth from
1981 to 1987.
 Annual growth rate of 5% is predicted
for new composites such as Fiberglass-
Epoxy and Graphite-Epoxy
combinations.
 Commercial aircrafts are expected to
use more and more composite materials.

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Future Trends

• Electronic Materials
 Use of electronic materials such as silicon
increased rapidly from 1970.
 Electronic materials are expected to play
vital role in “Factories of Future”.
 Use of computers and robots will increase
resulting in extensive growth in use of
electronic materials.
 Aluminum for interconnections in
integrated circuits might be replaced by
copper resulting in better conductivity.

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Future Trends

• Smart Materials : Change their properties by


sensing external stimulus.
 Shape memory alloys: Strained material reverts
back to its original shape above a critical
temperature.
 Used in heart valves and to expand arteries.

 Piezoelectric materials: Produce electric field when


exposed to force and vice versa.
 Used in actuators and vibration reducers.

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MEMS and Nanomaterials

• MEMS: Microelectromechanical systems.


 Miniature devices
 Micro-pumps, sensors

• Nanomaterials: Characteristic length < 100 nm


 Examples: ceramics powder and grain size < 100
nm
 Nanomaterials are harder and stronger than bulk
materials.
 Have biocompatible characteristics ( as in
Zirconia)
 Transistors and diodes are developed on a
nanowire.

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Case Study – Material Selection

• Problem: Select suitable material for bicycle


frame and fork.
Carbon fiber
Steel and Aluminum Ti and Mg
Wood Reinforced
alloys alloys alloys
plastic

Low cost but Light and Very light and Light, moderately Slightly better
Heavy. Less strong. But strong. No Strong. Corrosion Than Al
Corrosion Cannot be corrosion. Resistance. alloys. But much
resistance shaped Very expensive expensive expensive

Cost important? Select steel


Properties important? Select CFRP

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Mechanical properties

Atomic and Manufacturing


molecular structure Microstructure process

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Materials Tetrahedron

Processing
Performance

Microstructure Properties

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CHAPTER
2
Atomic Bonding

2-1

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Atomic and Molecular Bonds

• Ionic bonds :- Strong atomic bonds due to transfer of


electrons
• Covalent bonds :- Large interactive force due to
sharing of electrons
• Metallic bonds :- Non-directional bonds formed by
sharing of electrons
• Permanent Dipole bonds :- Weak intermolecular
bonds due to attraction between the ends of permanent
dipoles.
• Fluctuating Dipole bonds :- Very weak electric dipole
bonds due to asymmetric distribution of electron
densities.

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Ionic Bonding - Example

• Ionic bonding in NaCl


3s1
3p6 Chlorine
Sodium Atom
Atom Cl
Na

I
O
N
I Chlorine Ion
Sodium Ion Cl -
C
Na+
B
O
Figure 2.10
N
D
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Covalent Bonding

• In Covalent bonding, outer s and p electrons are


shared between two atoms to obtain noble gas
configuration.
• Takes place between elements
with small differences in
electronegativity and close by
in periodic table.
• In Hydrogen, a bond is formed between 2 atoms by
sharing their 1s1 electrons Electron Overlapping Electron Clouds
Pair
H H
H + H H H
1s1 Hydrogen
Electrons Molecule
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Metallic Bonding
• Atoms in metals are closely packed in crystal
structure.
• Loosely bounded valence electrons are attracted
towards nucleus of other atoms.
• Electrons spread out among atoms forming electron
clouds. Positive Ion
• These free electrons are
reason for electric
conductivity and ductility
• Since outer electrons are
shared by many atoms,
metallic bonds are
Non-directional
Valence electron charge cloud Figure 2.24
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Secondary Bonding
• Secondary bonds are due to attractions of electric
dipoles in atoms or molecules.
• Dipoles are created when positive and negative charge
centers exist.

Dipole moment=μ =q.d


+q -q q= Electric charge
d = separation distance
Figure 2.26 d

• There two types of bonds permanent and


fluctuating.

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