Professional Documents
Culture Documents
CH 12
CH 12
CHAPTER
1
Introduction to
Materials Science
and
Engineering
1-1
Copyright © The McGraw-Hill Companies, Inc. Permission required for reproduction or display
• Examples :-
Silicon and Iron constitute 27.72
and 5.00 percentage of weight of
earths crust respectively.
Nitrogen and Oxygen constitute
78.08 and 20.95 percentage of dry
air by volume respectively.
1-2
1
21/09/2020
Copyright © The McGraw-Hill Companies, Inc. Permission required for reproduction or display
1-3
Copyright © The McGraw-Hill Companies, Inc. Permission required for reproduction or display
1-4
2
21/09/2020
Copyright © The McGraw-Hill Companies, Inc. Permission required for reproduction or display
Types of Materials
• Metallic Materials
Composed of one or more metallic elements.
Example:- Iron, Copper, Aluminum.
Metallic element may combine with
nonmetallic elements.
Example:- Silicon Carbide, Iron Oxide.
Inorganic and have crystalline structure.
Good thermal and electric conductors.
Ferrous Nonferrous
Eg: Steel, Eg:Copper
Cast Iron Aluminum
1-5
Copyright © The McGraw-Hill Companies, Inc. Permission required for reproduction or display
Types of Materials
1-6
3
21/09/2020
Copyright © The McGraw-Hill Companies, Inc. Permission required for reproduction or display
Types of Materials
• Ceramic Materials
Metallic and nonmetallic elements are chemically
bonded together.
Inorganic but can be either crystalline, noncrystalline
or mixture of both.
High hardness, strength and wear resistance.
Very good insulator. Hence used for furnace lining for
heat treating and melting metals.
Also used in space shuttle to insulate it during exit and
reentry into atmosphere.
Other applications : Abrasives, construction materials,
utensils etc.
1-7
Copyright © The McGraw-Hill Companies, Inc. Permission required for reproduction or display
Types of Materials
• Composite Materials
Mixture of two or more materials.
Consists of a filler material and a binding material.
Materials only bond, will not dissolve in each other.
Mainly two types :-
o Fibrous: Fibers in a matrix
o Particulate: Particles in a matrix
o Matrix can be metals, ceramic or polymer
Examples :-
Fiber Glass ( Reinforcing material in a polyester
or epoxy matrix)
Concrete ( Gravels or steel rods reinforced in
cement and sand)
Applications:- Aircraft wings and engine, construction.
1-8
4
21/09/2020
Copyright © The McGraw-Hill Companies, Inc. Permission required for reproduction or display
Types of Materials
• Electronic Materials
1-9
Copyright © The McGraw-Hill Companies, Inc. Permission required for reproduction or display
5
21/09/2020
Copyright © The McGraw-Hill Companies, Inc. Permission required for reproduction or display
Future Trends
• Metallic Materials
Production follows US economy closely.
Alloys may be improved by better chemistry and
process control.
New aerospace alloys being constantly
researched.
o Aim: To improve temperature and corrosion
resistance.
o Example: Nickel based high temperature super
alloys.
New processing techniques are investigated.
o Aim: To improve product life and fatigue
properties.
o Example: Isothermal forging, Powder metallurgy.
Metals for biomedical applications
1-11
Copyright © The McGraw-Hill Companies, Inc. Permission required for reproduction or display
Future Trends
1-12
6
21/09/2020
Copyright © The McGraw-Hill Companies, Inc. Permission required for reproduction or display
Future Trends
• Ceramic Materials
New family of engineering ceramics are produced
last decade
New materials and applications are constantly
found.
Now used in Auto and Biomedical applications.
Processing of ceramics is expensive.
Easily damaged as they are highly brittle.
Better processing techniques and high-impact
ceramics are to be found.
1-13
Copyright © The McGraw-Hill Companies, Inc. Permission required for reproduction or display
Future Trends
• Composite Materials
Fiber reinforced plastics are primary
products.
On an average 3% annual growth from
1981 to 1987.
Annual growth rate of 5% is predicted
for new composites such as Fiberglass-
Epoxy and Graphite-Epoxy
combinations.
Commercial aircrafts are expected to
use more and more composite materials.
1-14
7
21/09/2020
Copyright © The McGraw-Hill Companies, Inc. Permission required for reproduction or display
Future Trends
• Electronic Materials
Use of electronic materials such as silicon
increased rapidly from 1970.
Electronic materials are expected to play
vital role in “Factories of Future”.
Use of computers and robots will increase
resulting in extensive growth in use of
electronic materials.
Aluminum for interconnections in
integrated circuits might be replaced by
copper resulting in better conductivity.
1-15
Copyright © The McGraw-Hill Companies, Inc. Permission required for reproduction or display
Future Trends
8
21/09/2020
Copyright © The McGraw-Hill Companies, Inc. Permission required for reproduction or display
Copyright © The McGraw-Hill Companies, Inc. Permission required for reproduction or display
Low cost but Light and Very light and Light, moderately Slightly better
Heavy. Less strong. But strong. No Strong. Corrosion Than Al
Corrosion Cannot be corrosion. Resistance. alloys. But much
resistance shaped Very expensive expensive expensive
9
21/09/2020
Copyright © The McGraw-Hill Companies, Inc. Permission required for reproduction or display
Mechanical properties
Copyright © The McGraw-Hill Companies, Inc. Permission required for reproduction or display
Materials Tetrahedron
Processing
Performance
Microstructure Properties
10
21/09/2020
CHAPTER
2
Atomic Bonding
2-1
Copyright © The McGraw-Hill Companies, Inc. Permission required for reproduction or display
2-12
11
21/09/2020
Copyright © The McGraw-Hill Companies, Inc. Permission required for reproduction or display
I
O
N
I Chlorine Ion
Sodium Ion Cl -
C
Na+
B
O
Figure 2.10
N
D
2-15
Copyright © The McGraw-Hill Companies, Inc. Permission required for reproduction or display
Covalent Bonding
12
21/09/2020
Copyright © The McGraw-Hill Companies, Inc. Permission required for reproduction or display
Metallic Bonding
• Atoms in metals are closely packed in crystal
structure.
• Loosely bounded valence electrons are attracted
towards nucleus of other atoms.
• Electrons spread out among atoms forming electron
clouds. Positive Ion
• These free electrons are
reason for electric
conductivity and ductility
• Since outer electrons are
shared by many atoms,
metallic bonds are
Non-directional
Valence electron charge cloud Figure 2.24
2-28
Copyright © The McGraw-Hill Companies, Inc. Permission required for reproduction or display
Secondary Bonding
• Secondary bonds are due to attractions of electric
dipoles in atoms or molecules.
• Dipoles are created when positive and negative charge
centers exist.
2-30
13