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Topic 2
Topic 2
BONDING
Types of bonds between atoms determine
arrangement of atoms in lattice.
Different arrangement, different atomic
structure, affect materials properties.
Subatomic particles :
1. Neutrons
2. Protons
neutron
3. electrons proton
Atomic mass
◼ Electrical
◼ Thermal
◼ Optical
Octet Rule = atoms tend to gain, lose or share electrons so
as to have 8 electrons
✓C would like to Gain 4 electrons
✓N would like to Gain 3 electrons
✓O would like to Gain 2 electrons
1s22s2 1s22s22p4
1s22s22p63s23p4
Element Atomic # Electron configuration
Hydrogen 1 1s 1
Helium 2 1s 2 (stable)
Lithium 3 1s 2 2s 1
Beryllium 4 1s 2 2s 2
Boron 5 1s 2 2s 2 2p 1
Carbon 6 1s 2 2s 2 2p 2
... ...
Neon 10 1s 2 2s 2 2p 6 (stable)
Sodium 11 1s 2 2s 2 2p 6 3s 1
Magnesium 12 1s 2 2s 2 2p 6 3s 2
Aluminum 13 1s 2 2s 2 2p 6 3s 2 3p 1
... ...
Argon 18 1s 2 2s 2 2p 6 3s 2 3p 6 (stable)
... ... ...
Krypton 36 1s 2 2s 2 2p 6 3s 2 3p 6 3d 10 4s 2 4p 6 (stable)
Electron Dot Structures
Symbols of atoms with dots to represent the valence-shell
electrons
H• He:
• • • •• •• •• ••
• • • •• •• •• ••
Dissimilar electronegativities
Cl atom
Cl ion
Na atom
Na ion
Na+ and Cl- forming an ionic bond. The
electron orbitals generally do not overlap
Ionic bonding (NaCl)
Covalent bond
Ion
cores
Sea of
electrons
Metallic materials have moderate melting point. No
breakage of bonds needed for melting process. (p69-70
Mc Graw Hill)
Metallic materials are soft and deformable thus
mechanically different than ionic and covalently bonded
materials.
Metallic materials are excellent electrical conductors due
to delocalized nature of electrons.
Metals are also thermal conductors due to thermal atomic
vibrations across the metallic body.
Primary Bonding – mixture
◼ Metallic Bond -- delocalized as electron cloud
(3.5 −1.3)2
−
% ionic character = 1 − e 4 x (100%) = 70.2% ionic
SECONDARY BONDING
(INTERMOLECULAR BONDING)
Arises from interaction between dipoles
• Fluctuating dipoles (H bond)
asymmetric electron ex: liquid H 2
clouds H2 H2
+ - + - H H H H
secondary secondary
bonding bonding
secondary
-ex: liquid HCl H Cl bonding H Cl
Metallic Variable
large-Tungsten Nondirectional (metals)
small-Mercury
Secondary smallest Directional
inter-chain (polymer)
inter-molecular
Bond energies – type of materials
Ceramics Large bond energy
large Tm Tm = melting
(Ionic & covalent bonding):
large E temperature
small a a = thermal
expansion
Metals Variable bond energy
(Metallic bonding): moderate Tm
moderate E
moderate a