GR 78 Corei02

Generic Requirements for the Physical
Design and Manufacture of

Telecommunications Products and
Equipment
(A Module of FD-29, FR-796, and FR-2063)
Telcordia Technologies Generic Requirements

GR-78-CORE
Issue 2, September 2007
Comments Requested (See Preface)

GR-78-CORE
Copyright Page Issue 2, September 2007
Physical Design and Manufacture of Telecommunications Products

Target audience: Telecommunications Service Providers and Equipment Manufacturers
This document replaces: GR-78-CORE, Issue 1, September 1997, which replaced
TR-TSY-000078, Issue 2, December 1988; TA-NWT-000078, Issue 3, December 1990; and
TR-NWT-000078, Issue 3, December 1991.
Where technical material has been added or changed, the location of the change is marked by a
vertical bar (|) in the outer margin.
This document is a module of FD-29, Network Functions and Emerging Technologies;
FR-796, Reliability and Quality Generic Requirements (RQGR); and FR-2063, NEBS™ Family
of Requirements (NEBSFR).
Technical contact:
Richard Kluge, Director
Telcordia — GR-78-CORE
One Telcordia Drive, Room 4D-660
Piscataway, NJ 08854-4182
Phone: + 1.732.699.5490
FAX: + 1.732.336.3235
E-Mail: rkluge@telcordia.com
To obtain copies of this document, contact your company’s document coordinator or your
Telcordia account manager, or call 1.866.672.6997 (USA) or + 1.732.699.6700 (Worldwide),
or visit our Web site at http://telecom-info.telcordia.com.
Copyright © 1997, 2007 Telcordia Technologies, Inc. All rights reserved.
Trademark Acknowledgments
Telcordia is a registered trademark of Telcordia Technologies, Inc.
All other brand or product names are trademarks of their respective companies or organizations.
ii
GR-78-CORE Generic Requirements Notice of Disclaimer
Generic Requirements Notice of Disclaimer

This Generic Requirements document (GR) is published by Telcordia Technologies
to inform the industry of the Telcordia view of proposed Generic Requirements for
the Physical Design and Manufacture of Telecommunications Products and
Equipment. The generic requirements contained herein are subject to review and
change, and superseding generic requirements regarding this subject may differ
from those in this document. Telcordia reserves the right to revise this document for
any reason (consistent with applicable provisions of the Telecommunications Act of
1996 and applicable FCC rules).
TELCORDIA AND THE OTHER PARTICIPANTS IDENTIFIED IN THE PREFACE
MAKE NO REPRESENTATION OR WARRANTY, EXPRESSED OR IMPLIED, WITH
RESPECT TO THE SUFFICIENCY, ACCURACY, OR UTILITY OF ANY
INFORMATION OR OPINION CONTAINED HEREIN.
TELCORDIA AND THE OTHER PARTICIPANTS EXPRESSLY ADVISE THAT ANY
USE OF OR RELIANCE UPON SAID INFORMATION OR OPINION IS AT THE RISK
OF THE USER AND THAT NEITHER TELCORDIA NOR ANY OTHER
PARTICIPANT SHALL BE LIABLE FOR ANY DAMAGE OR INJURY INCURRED BY
ANY PERSON ARISING OUT OF THE SUFFICIENCY, ACCURACY, OR UTILITY OF
ANY INFORMATION OR OPINION CONTAINED HEREIN.
LOCAL CONDITIONS MAY GIVE RISE TO A NEED FOR ADDITIONAL
PROFESSIONAL INVESTIGATIONS, MODIFICATIONS, OR SAFEGUARDS TO
MEET SITE, EQUIPMENT, ENVIRONMENTAL SAFETY OR COMPANY-SPECIFIC
REQUIREMENTS. IN NO EVENT IS THIS INFORMATION INTENDED TO
REPLACE FEDERAL, STATE, LOCAL, OR OTHER APPLICABLE CODES, LAWS,
OR REGULATIONS. SPECIFIC APPLICATIONS WILL CONTAIN VARIABLES
UNKNOWN TO OR BEYOND THE CONTROL OF TELCORDIA. AS A RESULT,
TELCORDIA CANNOT WARRANT THAT THE APPLICATION OF THIS
INFORMATION WILL PRODUCE THE TECHNICAL RESULT OR SAFETY
ORIGINALLY INTENDED.
This GR is not to be construed as a suggestion to anyone to modify or change any
product or service, nor does this GR represent any commitment by anyone,
including but not limited to Telcordia and the other participants in the development
of this Telcordia GR, to purchase, manufacture, or sell any product with the
described characteristics.
Readers are specifically advised that any entity may have needs, specifications, or
requirements different from the generic descriptions herein. Therefore, anyone
wishing to know any entity’s needs, specifications, or requirements should
communicate directly with that entity.
Nothing contained herein shall be construed as conferring by implication, estoppel,
or otherwise any license or right under any patent, whether or not the use of any
information herein necessarily employs an invention of any existing or later issued
patent.
iii
GR-78-CORE
Generic Requirements Notice of Disclaimer Issue 2, September 2007
TELCORDIA DOES NOT HEREBY RECOMMEND, APPROVE, CERTIFY,

WARRANT, GUARANTEE, OR ENDORSE ANY PRODUCTS, PROCESSES, OR
SERVICES, AND NOTHING CONTAINED HEREIN IS INTENDED OR SHOULD BE
UNDERSTOOD AS ANY SUCH RECOMMENDATION, APPROVAL,
CERTIFICATION, WARRANTY, GUARANTY, OR ENDORSEMENT TO ANYONE.
For general information about this or any other Telcordia documents, please
contact:
Telcordia Customer Service
One Telcordia Drive, Room 1B-180
1.866.672.6997 (USA)
+ 1.732.699.6700 (Worldwide)
+ 1.732.336.2226 (FAX)
e-mail: document-info@telcordia.com
web site: http://telecom-info.telcordia.com
iv
GR-78-CORE Table of Contents
Table of Contents
1 Introduction
1.1 Reason for GR-78-CORE, Issue 2 . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1
1.2 Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1
1.3 Requirements Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2
1.4 Requirement Labeling Conventions . . . . . . . . . . . . . . . . . . . . . . . . . 1–3
1.4.1 Numbering of Requirement and Related Objects . . . . . . . . . . . . . . 1–3
1.4.2 Requirement, Conditional Requirement, and Objective Identification . . . 1–3
1.5 General Criteria . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–4
2 Requirements for All Products

2.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–1
2.2 Electrical and Mechanical Integrity . . . . . . . . . . . . . . . . . . . . . . . . . 2–2
2.3 Administration of Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–3
3 Materials and Finishes Requirements

3.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–1
3.2 Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–1
3.2.1 Fire Resistance Requirements . . . . . . . . . . . . . . . . . . . . . . . . . 3–1
3.2.2 Fire Risk Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–2
3.2.3 Fluxes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–2
3.2.4 Silver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–2
3.2.5 Silicones . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–3
3.3 Finishes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–3
4 Separable Connector Requirements

4.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1
4.1.1 Connector Selection Considerations . . . . . . . . . . . . . . . . . . . . . 4–1
4.1.2 Lubrication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–3
4.1.3 Connector Durability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–5
4.2 Two-Part and PWB Edge Card Connectors . . . . . . . . . . . . . . . . . . . . . 4–7
4.2.1 Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–7
4.2.2 Polarization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–7
4.2.3 Insertion and Removal Forces . . . . . . . . . . . . . . . . . . . . . . . . . 4–8
4.2.4 Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–8
4.3 Insulation Displacement Connectors (IDCs) . . . . . . . . . . . . . . . . . . . . 4–8
5 Wire and Cable Requirements

5.1 Metallic Wire and Cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1
5.1.1 Outside Plant Cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1
5.1.2 Outside Plant Wire (OPW) . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–2
5.1.3 Inside Wire and Cable (Customer Premises and COs) . . . . . . . . . . . 5–2
5.1.4 Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–3
5.1.5 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–4
5.1.6 Wire and Cable Preparation for Equipment Assemblies . . . . . . . . . . 5–4
5.1.7 Cable and Wire Termination . . . . . . . . . . . . . . . . . . . . . . . . . . 5–5
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GR-78-CORE
Table of Contents Issue 2, September 2007
5.2 Optical Fiber and Optical Fiber Cables . . . . . . . . . . . . . . . . . . . . . . . 5–6
6 Printed Wiring Board (PWB) Requirements

6.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–1
6.1.1 Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–1
6.1.1.1 Laminates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–1
6.1.1.2 Solder Mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–2
6.1.1.3 Legend and Marking Inks . . . . . . . . . . . . . . . . . . . . . . . . 6–2
6.1.1.4 Repair Polymers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–2
6.1.1.5 Conductor Materials and Finishes . . . . . . . . . . . . . . . . . . . 6–2
6.1.2 Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–3
6.1.2.1 Dimensioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–3
6.1.2.2 PWB Contact Fingers . . . . . . . . . . . . . . . . . . . . . . . . . . 6–3
6.1.2.3 Interlayer Connections . . . . . . . . . . . . . . . . . . . . . . . . . 6–4
6.1.2.4 Warpage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–4
6.1.2.5 Protective Coatings . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–5
6.1.2.6 Resistance to Airborne Contaminants . . . . . . . . . . . . . . . . . 6–5
6.1.3 Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–5
6.1.3.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–5
6.1.3.2 Conductor Widths and Spacings . . . . . . . . . . . . . . . . . . . . 6–6
6.1.3.3 Conductor Adhesion . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–6
6.1.3.4 Plated Through Holes (PTHs) . . . . . . . . . . . . . . . . . . . . . . 6–7
6.1.3.5 Conductor Finishes . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–8
6.1.3.6 Solderability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–9
6.1.3.7 Solder Masks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–9
6.1.3.8 PWB Contact Fingers . . . . . . . . . . . . . . . . . . . . . . . . . 6–11
6.1.3.9 Insulation Resistance Testing . . . . . . . . . . . . . . . . . . . . . 6–12
6.1.3.10 Solvent Extract Conductivity Testing . . . . . . . . . . . . . . . . 6–13
6.1.3.11 Mechanical Damage . . . . . . . . . . . . . . . . . . . . . . . . . 6–14
6.1.3.12 Laminate and Processing Defects . . . . . . . . . . . . . . . . . . 6–15
6.1.3.13 Electrical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–16
6.1.3.14 Repairs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–16
6.1.3.15 Modifications — General . . . . . . . . . . . . . . . . . . . . . . 6–17
6.1.3.16 Modifications — Subtractive . . . . . . . . . . . . . . . . . . . . 6–18
6.1.3.17 Modifications — Additive . . . . . . . . . . . . . . . . . . . . . . 6–19
6.2 Multilayer PWBs — General Requirements . . . . . . . . . . . . . . . . . . . 6–21
6.2.1 Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–21
6.2.1.1 Dimensioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–21
6.2.1.2 Interlayer Connections . . . . . . . . . . . . . . . . . . . . . . . . 6–22
6.2.1.3 Construction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–22
6.2.2 Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–24
6.2.2.1 Conductor Widths and Spacings . . . . . . . . . . . . . . . . . . . 6–24
6.2.2.2 Plated Through Holes (PTHs) . . . . . . . . . . . . . . . . . . . . . 6–24
6.2.2.3 Insulation Resistance Testing — Inner Signal Layers . . . . . . . 6–25
6.2.2.4 Insulation Resistance Testing — Interlayer . . . . . . . . . . . . . 6–26
6.2.2.5 SEC Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–26
6.2.2.6 Laminate and Processing Defects . . . . . . . . . . . . . . . . . . 6–26
6.2.2.7 Electrical Requirements . . . . . . . . . . . . . . . . . . . . . . . . 6–27
6.2.2.8 Repairs — Inner Layers Before Lamination . . . . . . . . . . . . . 6–27
6.2.2.9 Repairs — Finished Multilayer PWBs . . . . . . . . . . . . . . . . 6–28
vi
6.2.2.10 Modifications — Inner Layers Before Lamination . . . . . . . . . 6–28

6.2.2.11 Modifications — Completed Multilayer PWBs . . . . . . . . . . . 6–28
6.3 PWBs for Surface Mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–29
6.3.1 General Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–29
6.3.1.1 Materials — Laminates . . . . . . . . . . . . . . . . . . . . . . . . . 6–29
6.3.1.2 Materials — Solder Masks . . . . . . . . . . . . . . . . . . . . . . . 6–29
6.3.1.3 Design — Component Mounting Pads . . . . . . . . . . . . . . . . 6–30
6.3.1.4 Design — Solder Masks . . . . . . . . . . . . . . . . . . . . . . . . 6–30
6.3.1.5 PWBs for Adhesive and Wavesolder Soldering
Processes — Conductor Finish . . . . . . . . . . . . . . . . . . . . 6–30
6.3.1.6 PWBs for Adhesive and Wavesolder Soldering
Processes — Component Mounting Pads . . . . . . . . . . . . . . 6–31
6.3.1.7 PWBs for Reflow Surface-Mount Soldering
Processes — Conductor Finish . . . . . . . . . . . . . . . . . . . . 6–31
6.3.1.8 PWBs for Reflow Surface-Mount Soldering
Processes — Component Mounting Pads . . . . . . . . . . . . . . 6–32
6.4 PWBs for Backpanels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–33
6.4.1 Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–33
6.4.1.1 Dimensioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–33
6.4.1.2 Method of Manufacture . . . . . . . . . . . . . . . . . . . . . . . . 6–33
6.4.2 Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–33
6.4.2.1 Drilling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–33
6.4.2.2 Plated Through Holes (PTHs) . . . . . . . . . . . . . . . . . . . . . 6–34
6.5 Encapsulated Discrete Wire (EDW) Interconnection Boards . . . . . . . . . . 6–34
7 Printed Wiring Board (PWB) Assembly Requirements

7.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–1
7.1.1 Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–1
7.1.1.1 Conformal Coatings . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–1
7.1.1.2 Fluxes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–1
7.1.1.3 Solders and Solder Pastes . . . . . . . . . . . . . . . . . . . . . . . . 7–1
7.1.2 Assembly Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–2
7.1.2.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–2
7.1.2.2 Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–3
7.1.2.3 Layout — General . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–5
7.1.2.4 Layout — Thermal Considerations . . . . . . . . . . . . . . . . . . . 7–5
7.1.2.5 Layout — Clearances . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–6
7.1.2.6 Layout — Lead Forms . . . . . . . . . . . . . . . . . . . . . . . . . . 7–7
7.1.2.7 Separable Connections . . . . . . . . . . . . . . . . . . . . . . . . . . 7–7
7.1.2.8 Conformal Coatings . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–7
7.1.3 Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–8
7.1.3.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–8
7.1.3.2 Clearances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–10
7.1.3.3 Solderability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–10
7.1.3.4 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–10
7.1.3.5 Bow and Twist . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–11
7.1.3.6 Solder Masks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–12
7.1.3.7 Conformal Coatings . . . . . . . . . . . . . . . . . . . . . . . . . . 7–12
7.1.3.8 Insulation Resistance Testing . . . . . . . . . . . . . . . . . . . . . 7–13
7.1.3.9 SEC Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–13
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GR-78-CORE
7.1.3.10 Lubrication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–14

7.1.3.11 Mechanical Damage and Defects . . . . . . . . . . . . . . . . . . 7–14
7.1.3.12 Repair of PWB Assemblies — General . . . . . . . . . . . . . . . 7–14
7.1.3.13 Repair of PWB Assemblies — Component Removal and
Replacement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–15
7.1.3.14 Repair of PWB Assemblies — PWB Repairs . . . . . . . . . . . . 7–16
7.1.3.15 Modifications to PWB Assemblies — General . . . . . . . . . . . 7–16
7.1.3.16 Modifications to PWB Assemblies — Wiring Design . . . . . . . 7–16
7.1.3.17 Modifications to PWB Assemblies — Wire Routing . . . . . . . . 7–17
7.1.3.18 Modifications to PWB Assemblies — Wire Preparation . . . . . 7–18
7.1.3.19 Modifications to PWB Assemblies — Soldering of Modification
Wires . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–18
7.1.3.20 Modifications to PWB Assemblies — Securing of Modification
Wires . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–19
7.1.3.21 Modifications to PWB Assemblies — PWB Modifications . . . . 7–20
7.1.3.22 Modifications to PWB Assemblies — Components . . . . . . . . 7–20
7.2 PWB Assemblies — Through-Hole Mounted Components . . . . . . . . . . . 7–21
7.2.1 Assembly Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–21
7.2.2 Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–21
7.2.2.1 Soldering — PTH Solder Joints . . . . . . . . . . . . . . . . . . . . 7–21
7.2.2.2 Soldering — Non-PTH Solder Joints . . . . . . . . . . . . . . . . . 7–23
7.2.2.3 Compliant Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–23
7.3 PWB Assemblies — Surface Mounted Components (SMCs) . . . . . . . . . . 7–23
7.3.1 Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–23
7.3.1.1 Solder Pastes — Incoming Material Controls . . . . . . . . . . . . 7–23
7.3.1.2 Solder Pastes — In-Process Controls . . . . . . . . . . . . . . . . 7–24
7.3.1.3 Solder Masks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–25
7.3.1.4 Adhesives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–25
7.3.2 Assembly Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–26
7.3.2.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–26
7.3.2.2 Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–26
7.3.2.3 Thermal Considerations . . . . . . . . . . . . . . . . . . . . . . . . 7–27
7.3.2.4 Lead Forms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–27
7.3.2.5 Termination Metallizations . . . . . . . . . . . . . . . . . . . . . . 7–27
7.3.3 Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–27
7.3.4 Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–28
7.3.4.1 Soldering — General . . . . . . . . . . . . . . . . . . . . . . . . . . 7–28
7.3.4.2 Soldering — Reflow Processes . . . . . . . . . . . . . . . . . . . . 7–28
7.3.4.3 Soldering — Wavesoldering Processes . . . . . . . . . . . . . . . 7–29
7.3.4.4 Bow and Twist . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–29
7.3.4.6 Repairs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–30
7.3.4.7 Modifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–30
7.3.4.8 Ball Grid Array (BGA) Assembly . . . . . . . . . . . . . . . . . . . 7–30
7.4 Backpanel PWB Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–32
7.4.1 Assembly Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–32
7.4.1.1 Terminals/Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–32
7.4.1.2 Dimensioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–32
7.4.2 Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–32
7.4.2.1 Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–32
viii

7.4.2.3 Plated-Through Hole (PTH) Deformation/Damage . . . . . . . . . 7–33
8 Equipment Sub-Assembly and Assembly Requirements

8.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–1
8.1.1 Materials, Piece-Parts, and Sub-Assemblies . . . . . . . . . . . . . . . . . 8–1
8.1.2 Sub-Assemblies and Assemblies . . . . . . . . . . . . . . . . . . . . . . . . 8–1
8.1.3 Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–1
8.2 Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–4
8.2.1 Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–4
8.2.1.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–4
8.2.1.2 Soldered Connections . . . . . . . . . . . . . . . . . . . . . . . . . . 8–4
8.2.1.3 Solderless Wrapped Connections . . . . . . . . . . . . . . . . . . . . 8–5
8.2.2 Wiring and Cabling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–7
8.3 Equipment Modifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–7
8.3.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–7
8.3.2 Modification Wiring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–7
8.4 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–8
8.4.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–8
8.4.2 Operation Under Environmental Extremes . . . . . . . . . . . . . . . . . 8–8
9 Electrostatic Discharge (ESD)

9.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9–1
9.2 Susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9–1
9.3 ESD Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9–1
9.4 Circuit Pack ESD Test Methods and Requirements . . . . . . . . . . . . . . . . 9–2
9.4.1 Scope and Purpose . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9–2
9.4.2 ESD Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9–2
9.4.2.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9–2
9.4.2.2 Susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9–2
9.4.2.3 Performance Criteria . . . . . . . . . . . . . . . . . . . . . . . . . . . 9–2
9.4.2.4 Documentation Specifications . . . . . . . . . . . . . . . . . . . . . 9–2
9.4.3 Test Preparation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9–3
9.4.4 Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9–3
9.4.5 Experimental ESD Failure Threshold Measurement . . . . . . . . . . . . 9–4
9.4.5.1 Required Test Method . . . . . . . . . . . . . . . . . . . . . . . . . . 9–4
9.4.5.2 Equipment Required . . . . . . . . . . . . . . . . . . . . . . . . . . . 9–4
9.4.5.3 Waveform Verification Procedure . . . . . . . . . . . . . . . . . . . 9–6
9.4.5.4 Circuit Pack Testing Procedure . . . . . . . . . . . . . . . . . . . . . 9–6
9.4.5.5 Circuit Pack Selection . . . . . . . . . . . . . . . . . . . . . . . . . . 9–7
9.4.6 Documentation of Test Result Definitions and Categories . . . . . . . . . 9–7
9.5 ESD Labeling Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9–8
9.5.1 ESD Susceptibility Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . 9–8
9.5.1.1 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9–8
9.5.1.2 Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9–8
9.5.2 ESD Protective Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9–8
ix
GR-78-CORE
10 Product Identification and Markings Requirements
11 Package Requirements
11.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11–1
11.2 Shipping of Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11–2
12 Repair and Modification of Customer Return Units

12.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12–1
12.2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12–2
12.3 Repairs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12–2
13 Qualification Test Procedures

13.1 Corrosiveness of Soldering Fluxes . . . . . . . . . . . . . . . . . . . . . . . 13–1
13.1.1 Preparation of Fluxes for Testing . . . . . . . . . . . . . . . . . . . . . 13–1
13.1.2 Test Patterns for SIR and Electromigration Resistance Testing . . . . 13–2
13.1.2.1 Test Pattern Preparation — Liquid Fluxes . . . . . . . . . . . . . 13–3
13.1.2.2 Test Pattern Preparation — Solder Pastes . . . . . . . . . . . . . 13–4
13.1.2.3 Test Pattern Preparation — Cored Solder Wire . . . . . . . . . . 13–5
13.1.3 Surface Insulation Resistance (SIR) Test . . . . . . . . . . . . . . . . . 13–5
13.1.3.1 Equipment Required . . . . . . . . . . . . . . . . . . . . . . . . . 13–5
13.1.3.2 Test Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13–6
13.1.4 Electromigration Resistance Test . . . . . . . . . . . . . . . . . . . . . 13–7
13.1.4.2 Test Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13–7
13.1.4.3 Data Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13–8
13.1.4.4 Visual Examination . . . . . . . . . . . . . . . . . . . . . . . . . . 13–9
13.2 Polymeric Coatings and Adhesive Materials . . . . . . . . . . . . . . . . . . 13–9
13.2.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13–9
13.2.2 Visual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13–10
13.2.3 Adhesion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13–10
13.2.4 Corrosion of Copper . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13–11
13.2.5 Test Patterns for Surface Insulation Resistance and Electromigration
Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13–11
13.2.5.1 Test Pattern Preparation . . . . . . . . . . . . . . . . . . . . . . . 13–12
13.2.6 Surface Insulation Resistance (SIR) Test . . . . . . . . . . . . . . . . . 13–12
13.2.6.2 Test Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13–12
13.2.6.3 Data Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13–13
13.2.7 Testing for Resistance to Electromigration . . . . . . . . . . . . . . . 13–14
13.2.7.2 Test Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13–14
13.2.7.3 Data Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13–15
13.2.7.4 Visual Examination . . . . . . . . . . . . . . . . . . . . . . . . . . 13–15
13.2.8 Pre-Production Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . 13–16
13.3 Separable Connector and Socketed Component Lubricant Qualification . . 13–16
13.3.1 Lubricants for Gold-to-Gold or Similar Noble Metallizations . . . . . . 13–16
13.3.2 Lubricants for Tin-to-Tin and Solder-to-Solder Separable
Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13–17
13.4 Qualification of Additive Circuitry for Bare PWB Modifications . . . . . . . 13–19
x
14 Tests and Methods

14.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14–1
14.2 Metal Finishes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14–1
14.2.1 Noble Metal Contact Finishes . . . . . . . . . . . . . . . . . . . . . . . 14–1
14.2.2 Noble Metal Porosity Testing . . . . . . . . . . . . . . . . . . . . . . . . 14–1
14.2.2.1 Electrographic Testing — Paper . . . . . . . . . . . . . . . . . . . 14–1
14.2.2.2 Electrographic Tests — Gel . . . . . . . . . . . . . . . . . . . . . 14–2
14.2.2.3 Corrosive Gas Tests — Nitric Acid Vapor . . . . . . . . . . . . . . 14–2
14.2.2.4 Finish Adherence . . . . . . . . . . . . . . . . . . . . . . . . . . . 14–2
14.3 PWBs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14–3
14.3.1 Preparation of Cross-Sections . . . . . . . . . . . . . . . . . . . . . . . 14–3
14.3.2 Thermal Shock Testing of Plated Through Holes (PTHs) . . . . . . . . 14–3
14.4 Insulation Resistance Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . 14–3
14.4.1 Equipment Required . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14–3
14.4.2 Insulation Resistance Test Patterns . . . . . . . . . . . . . . . . . . . . 14–3
14.4.3 Terminating Test Patterns . . . . . . . . . . . . . . . . . . . . . . . . . 14–5
14.4.4 Test Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14–5
14.4.5 Data Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14–6
14.4.6 Insulation Resistance Requirements . . . . . . . . . . . . . . . . . . . . 14–7
14.5 Solvent Extract Conductivity Testing . . . . . . . . . . . . . . . . . . . . . . 14–7
14.5.1 Equipment and Reagents Required . . . . . . . . . . . . . . . . . . . . 14–7
14.5.1.1 Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14–7
14.5.1.2 Reagents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14–8
14.5.2 Calibration Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14–8
14.5.2.1 Determination of Test Duration . . . . . . . . . . . . . . . . . . . 14–8
14.5.2.2 Determination of Contamination Threshold . . . . . . . . . . . . 14–9
14.5.3 Testing of Production PWBs and Assemblies . . . . . . . . . . . . . . . 14–9
Appendix A: References
Appendix B: Acronyms and Glossary

B.1 Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B–1
B.2 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B–3
Appendix C: Deleted Requirements
Requirement-Object Index
xi
GR-78-CORE
List of Figures Issue 2, September 2007
List of Figures
Figure 7-1 Schematic Representation of a Minimum Pin-Wetted Length . . . 7–22

Figure 14-1 Standard Insulation Resistance Test Pattern . . . . . . . . . . . . 14–11
Figure 14-2 Striped Solder Mask Coated Standard Test Pattern . . . . . . . . 14–12
Figure 14-3 Solder Mask Coated Standard Test Pattern . . . . . . . . . . . . . 14–13
Figure 14-4 Simplified Schematic of the ESD Simulator . . . . . . . . . . . . . 14–14
Figure 14-5 Theoretical Waveform . . . . . . . . . . . . . . . . . . . . . . . . . 14–14
Figure 14-6 Discharge Electrode and Resistive Current Monitor . . . . . . . . 14–15
Figure 14-7 Waveform Monitor Using a Current Probe . . . . . . . . . . . . . 14–15
Figure 14-8 Pictorial Schematic of Test Procedure . . . . . . . . . . . . . . . . 14–16
Figure 14-9 Logo for ESD-Sensitive Equipment . . . . . . . . . . . . . . . . . . 14–16
Figure 14-10 Logo for ESD Protected Area . . . . . . . . . . . . . . . . . . . . . 14–17
Figure 14-11 Etched Copper (a matrix of pads) on the Bottom Layer
(the 6 sets of lines are labelled A through F) . . . . . . . . . . . . 14–17
Figure 14-12 Added Conductor Providing Daisy Chain Continuity Between
the Pads Modification of A, B, C, and D Circuitry . . . . . . . . . . 14–18
Figure 14-13 Added Conductor for Insulation Integrity Measurement
Modification of E and F Lines . . . . . . . . . . . . . . . . . . . . . 14–19
xii
GR-78-CORE List of Tables
List of Tables
Table 4-1 Lubricants for Contacts with Noble Metallizations . . . . . . . . . . 4–3

Table 4-2 Lubricants for Contacts with Non-Noble Metallizations . . . . . . . 4–4
Table 4-3 Connector Applications and Durability . . . . . . . . . . . . . . . . . 4–5
Table 4-4 Connector Metallization, Lubrication, Durability . . . . . . . . . . . 4–6
Table 5-1 Outside Plant Cable Requirements . . . . . . . . . . . . . . . . . . . 5–1
Table 5-2 Outside Plant Wire Requirements . . . . . . . . . . . . . . . . . . . . 5–2
Table 5-3 Inside Wire and Cable Requirements . . . . . . . . . . . . . . . . . . 5–2
Table 5-4 Minimum Torques . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–6
Table 6-1 Requirements by PWB Type . . . . . . . . . . . . . . . . . . . . . . . 6–1
Table 6-2 8-Layer Multilayer Structure (Example Only) . . . . . . . . . . . . 6–23
Table 6-3 8-Layer Multilayer Layup (Example Only) . . . . . . . . . . . . . . 6–23
Table 8-1 Turns Required for Solderless Wrapped Connections . . . . . . . . 8–6
Table 8-2 Strip-Off Forces for Solderless Wrapped Connections . . . . . . . . 8–6
Table 9-1 Verification Parameters for a Body/Finger ESD Waveform
Into a Short . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9–5
(Into a 500-Ohm Resistor) . . . . . . . . . . . . . . . . . . . . . . . . 9–5
Table 13-1 Sample Preparation — Liquid Fluxes . . . . . . . . . . . . . . . . . 13–3
Table 13-2 Sample Preparation — Solder Pastes . . . . . . . . . . . . . . . . . 13–4
Table 13-3 Sample Preparation — Cored Solder Wire . . . . . . . . . . . . . . 13–5
Table 13-4 Minimum Insulation Resistance Values . . . . . . . . . . . . . . . . 13–6
Table 13-5 Tests Required for Polymeric and Adhesive Materials . . . . . . . 13–9
Table 13-6 Values of IRmin(megohms) Versus Pattern Spacing . . . . . . . . . 13–13
Table 14-1 Typical Pore Counts for Electrographic Porosity Test . . . . . . . 14–2
Table 14-2 Insulation Resistance Test Pattern Requirements . . . . . . . . . . 14–4
Table 14-3 Summary of Insulation Resistance Requirements . . . . . . . . . . 14–6
Table 14-4 Summary of Contamination Limits . . . . . . . . . . . . . . . . . . 14–10
Table C-1 Deleted Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . C–1
xiii
GR-78-CORE
List of Tables Issue 2, September 2007
xiv
GR-78-CORE Preface
Preface
The Telcordia Technologies GR Process
Generic Requirements documents (GRs) provide the Telcordia Technologies view
of proposed generic criteria for telecommunications equipment, systems, or
services, and involve a wide variety of factors, including interoperability, network
integrity, the expressed needs of industry members who have paid a fee to
participate in the development of specific GRs, and other input.
The Telcordia GR process implements Telecommunications Act of 1996 directives
relative to the development of industry-wide generic requirements relating to
telecommunications equipment, including integral software and customer premises
equipment. Pursuant to that Act, Telcordia invites members of the industry to
participate in the development of GRs. Invitations to participate and the
participation fees are published monthly in the Telcordia Digest of Technical
Information, and posted on the Web, at http://www.telcordia.com/digest.
At the conclusion of the GR development process, Telcordia publishes the GR,
which is available for license. The license fee entitles the licensee to receive that
issue of the GR (GR-CORE) along with any Issues List Report (GR-ILR) and
revisions, if any are released under that GR project. ILRs contain any technical
issues that arise during GR development on which Telcordia and the other
participants would like further industry interaction. The ILR may present issues for
discussion, with or without proposed resolutions, and may describe proposed
resolutions that lead to changes to the GR. Significant changes or additional material
may be released as a revision to the GR-CORE.
Telcordia may also solicit general industry nonproprietary input regarding such GR
material at the time of its publication, or through a special Industry Interaction
Notice appearing in the Telcordia Digest of Technical Information. While
unsolicited comments are welcome, any subsequent work by Telcordia regarding
such comments will depend on participation in such GR work. Telcordia will
acknowledge receipt of comments and will provide a status to the submitting
company.
xv
GR-78-CORE
Preface Issue 2, September 2007
About GR-78-CORE
Participants in the development of GR-78-CORE, Issue 2, are
Company Participants Company Representatives Company Web Sites

ADC Garhart Auzenne www.adc.com
Todd Morgenstern
Adtran Trevor Bowers www.adtran.com
Jeff Whitmire
Alcatel-Lucent Joseph Smetana www.alcatel-lucent.com
Richard Lerwick
Tim Pantalis
AT&T Bon Pipkin https://ebiznet.sbc.com/
Mahmoud Elkenaney sbcnebs
Cisco Systems Lavanya Gopalakrishnan www.cisco.com
John Krahner
Daisy Poon
Emerson Energy System Mike Visk www.emersonenergy.com
Tom Wanek
Fujitsu Network Steven Peacock www.fujitsu.com/us
Communications Patricia Tobin
Hitachi Communication Seiji Asai www.hitachi-com.com
Technologies Hiroshi Kuwaki
Intel Kevin Bross www.intel.com
Steven Hackett
Motorola Banerji Kingshuk www.motorola.com
Harry Saraidaridis
Harry Weber
Sun Microsystems Lew Kurtz www.sun.com
Tekelec John Armstrong www.tekelec.com
Tony Cosentino
Gary Raper
Sue Reade
Relative Maturity Level, Status, and Plans for Issue 2
Although the design and manufacturing practices continually advance, Telcordia

considers GR-78-CORE a mature document for most technical areas. A notable
exception is the area of lead (Pb)-free solders. International desires to reduce Pb
waste have accelerated investigations of lead (Pb)-free alternatives to tin-lead
(SnPb) solder. At the time of publication, the telecommunications products
addressed by this GR are exempt from most major lead (Pb)-free solder mandates.
However, global market expectations, commercial component availability and
manufacturing economics are driving rapid investigation of lead (Pb)-free and
mixed processing options. The GR-78-CORE participants fully embrace the goal of
identifying reliable and environmentally favorable manufacturing techniques
suitable for telecommunications products and applications. Because realization of
xvi
GR-78-CORE Preface
this goal with respect to lead (Pb)-free solder is on-going, it is anticipated that ILRs
and reissues will be required to keep GR-78-CORE current, as new findings,
standards, and practices are made public.
This GR states the Telcordia view of minimum generic physical design requirements
that are, in the Telcordia view, currently appropriate for products and equipment
used by a Network Operator. Each Network Operator may choose to include some
or all of these requirements in contracts or purchase orders, or otherwise adopt
them, or each may choose not to adopt these requirements – such a decision is
solely a Network Operator decision, not that of Telcordia. It is expected that
Telcordia will apply criteria derived from generic requirements in analyses of the
physical design and reliability of equipment. However, use of these generic
requirements by an equipment supplier is at the supplier’s own risk (see the “Notice
of Disclaimer”), and Telcordia reserves the right to change these requirements at
any time.
GR-78-CORE, Issue 2, completely replaces Issue 1 and any previous TR/TA-78
documents. Issue 2 incorporates recently adopted Telcordia documentation
standards, and much of the deliberate duplication in the major sections has been
removed.
The requirements in this GR have been updated to reflect new advances in materials,
processing and assembly, and to refine other requirements as a result of ongoing
interactions with the telecommunications equipment manufacturing community.
To Submit Comments
When submitting comments, please include the GR document number, and cite any
pertinent section and requirement number. In responding to an ILR, please identify
the pertinent Issue ID number. Please provide the name and address of the contact
person in your company for further discussion.
Send comments to:
Richard Kluge, Director
Telcordia — GR-78-CORE
One Telcordia Drive, Room 4D-660
Phone: + 1.732.699.5490
FAX: + 1.732.336.3235
E-Mail: rkluge@telcordia.com
To Request Telcordia Testing Services

Requests for Telcordia Testing Services may also be sent to Richard Kluge, as listed
above.
xvii
GR-78-CORE
Preface Issue 2, September 2007
xviii
GR-78-CORE Introduction
1 Introduction
This Generic Requirements document (GR) contains the Telcordia view of physical
design and manufacturing requirements applicable to products to be used in the
delivery of telecommunications services by network operators. These include
design, engineering, manufacturing, and workmanship requirements.
1.1 Reason for GR-78-CORE, Issue 2

GR-78-CORE, Issue 2, addresses the following issues:
• The industry position on the use of lead (Pb)-free solder has been stated.
• Allowance for alternative board finishes (such as immersion silver) have been
identified.
• Minimum board insulation and lamination thicknesses have been reduced.
• Dimensional and plating limits for Plated Through Holes (PTHs) have been
revised.
• Minimum fiber bend radius has been modified.
• Solder mask thickness specifications have been modified.
• Connector application criteria have been provided.
• Connector lubrication requirements have been revised.
• Via in pad has been permitted, and via dimensional requirements modified.
• Ongoing reliability methods have been emphasized over periodic requalification.
GR-78-CORE, Issue 2, completely replaces Issue 1, which was published by
Telcordia in September 1997. The Issue 2 requirements begin at absolute
requirement number [860].
1.2 Organization
This document is organized as follows:
• Section 2 — Generic requirements applicable to all products
• Section 3 — Generic requirements for materials and finishes
• Section 4 — Generic requirements for the use of separable connectors
• Section 5 — Information and generic requirements for the use of wire and cable
• Section 6 — Generic requirements for Printed Wiring Board (PWB)
• Section 7 — Generic requirements for PWB assembly
• Section 8 — Generic requirements for equipment sub-assemblies and assemblies
• Section 9 — Generic requirements for Electrostatic Discharge (ESD)
requirements for all new equipment assemblies and non-installed circuit packs
• Section 10 — Generic requirements for product identification and markings
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GR-78-CORE
Introduction Issue 2, September 2007
• Section 11 — Generic requirements for packaging and shipping assemblies

• Section 12 — Generic requirements for repair and modification of customer
return units
• Section 13 — Qualification test procedures
• Section 14 — Test and methods used to determine compliance to the generic
criteria in this GR
• Appendix A: References — A list of documents cited in this GR and ordering
information
• Appendix B: Acronyms and Glossary — A list of acronym and glossary
definitions
• Appendix C: Deleted Requirements — A list of deleted requirements
• Requirement-Object Index — A list of all requirements in this GR.
1.3 Requirements Terminology

The following requirements terminology is used throughout this document:
• Requirement — Feature or function that, in the view of Telcordia, is necessary
to satisfy the needs of a typical client company. Failure to meet a requirement
may cause application restrictions, result in improper functioning of the
product, or hinder operations. A Requirement contains the words shall or must
and is flagged by the letter “R.”
• Conditional Requirement — Feature or function that, in the view of Telcordia,
is necessary in specific applications. If a client company identifies a
Conditional Requirement as necessary, it shall be treated as a requirement for
the application(s). Conditions that may cause the Conditional Requirement to
apply include, but are not limited to, certain client companies’ application
environments, elements, or other requirements, etc. A Conditional Requirement
is flagged by the letters “CR.”
• Objective — Feature or function that, in the view of Telcordia, is desirable and
may be required by a client company. An Objective represents a goal to be
achieved. An Objective may be reclassified as a Requirement at a specified date.
An objective is flagged by the letter “O” and includes the words it is desirable or
it is an objective.
• Conditional Objective — Feature or function that, in the view of Telcordia, is
desirable in specific applications and may be required by a client company. It
represents a goal to be achieved in the specified Condition(s). If a client
company identifies a Conditional Objective as necessary, it shall be treated as a
requirement for the application(s). A Conditional Objective is flagged by the
letters “CO.”
• Condition — The circumstances that, in the view of Telcordia, will cause a
Conditional Requirement or Conditional Objective to apply. A Condition is
flagged by the letters “Cn.”
1–2
• IP — The word should is used in this document to express what is expected or

is usually regarded as good industry practice; such items are considered
“Industry Practices (IPs).” They are designated by the prefix “IP.” IPs are
frequently believed helpful in producing reliable product(s), although alternate
procedures may be equally or more effective.
The word specified and the phrase as specified, unless otherwise qualified, are used
in this document to imply the requirements contained in this document.
1.4 Requirement Labeling Conventions

As part of the Telcordia GR Process, proposed requirements and objectives are
labeled using conventions that are explained in the following two sections.
1.4.1 Numbering of Requirement and Related Objects
Each Requirement, Objective, Condition, Conditional Requirement, and Conditional

Objective object is identified by both a local and an absolute number. The local
number consists of the object's document section number and its sequence number
in the section (e.g., R3-1 is the first Requirement in Section 3). The local number
appears in the margin to the left of the Requirement. A Requirement object's local
number may change in subsequent issues of a document if other Requirements are
added to the section or deleted.
The absolute number is a permanently assigned number that will remain for the life
of the Requirement; it will not change with new issues of the document. The
absolute number is presented in brackets (e.g., [2]) at the beginning of the
requirement text.
Neither the local nor the absolute number of a Conditional Requirement or
Conditional Objective depends on the number of the related Condition(s). If there is
any ambiguity about which Conditions apply, the specific Condition(s) will be
referred to by number in the text of the Conditional Requirement or Conditional
Objective.
References to Requirements, Objectives, or Conditions published in other Generic
Requirements documents will include both the document number and the
Requirement object’s absolute number. For example, R2345-12 refers to
Requirement [12] in GR-2345-CORE.
1.4.2 Requirement, Conditional Requirement, and Objective Identification
A Requirement object may have numerous elements (paragraphs, lists, tables,

equations, etc.). To aid the reader in identifying each part of the requirement, rules
are used above and below requirement content.
Introductory information.
Content of Requirement object(s).
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GR-78-CORE
1.5 General Criteria
R1-1 [1] The equipment manufacturer shall, at a minimum, meet its own design standards
and design engineering requirements, and all requirements imposed by law.
Manufacturing requirements, manufacturing and workmanship standards, and the
use of accepted commercial practices supplement the manufacturer's design and
engineering criteria, and therefore, shall also be met when relevant to product
integrity, performance, and reliability.
R1-2 [2] If there is disagreement as to which of several different documents applies (as,
for example, any conflict between these requirements and any specifications for the
product or other contractual provisions) any such disagreement shall be promptly
brought to the attention of the Network Operator, or its designated representative,
for review.
R1-3 [3] Product integrity shall be maintained and there shall be no deviations from
physical criteria that may or will adversely affect the product with respect to safety,
reliability, interchangeability, life, performance and operation, quality, protectants,
maintenance, or aesthetics.
R1-4 [4] The equipment manufacturer shall make any proposal to the Network Operator
that will improve the product with respect to safety, reliability, interchangeability,
life, performance and operation, quality, protectants, maintenance or aesthetics.
O1-5 [860] In general, telecommunications equipment is intended for long application

life and continuous operation. For these reasons, the product’s energy use and
cooling requirements can have a large impact on the overall cost of equipment
ownership. It is desirable that equipment suppliers design products, select
components, and provide features to optimize energy efficiency over the life of the
product.
R1-6 [5] It is the responsibility of the equipment manufacturer to promptly notify the
Network Operator of any field problems with respect to safety, reliability,
interchangeability, life, performance and operation, quality, protectants,
maintenance, or aesthetics, regardless of where such problems occurred.
Acceptance of nonconforming products is not the subject of this document. Such

decisions are made by the Network Operator or its designated representative.
R1-7 [6] The equipment manufacturer shall propose to the Network Operator any
alternatives, deviations, or modifications to its product necessitated by site-specific
conditions or other factors.
R1-8 [7] Products shall be manufactured in accordance with the following:

• Federal Communications Commission (FCC) requirements
• National Electrical Code (NEC) requirements
• Applicable Underwriters Laboratories (UL) requirements
1–4
• Department of Labor — Occupational Safety and Health Standards (OSHA) e.g.,

Part 1910[1]
• All other applicable federal, state, and local requirements including, but not
limited to, statutes, rules, regulations, orders, or ordinances, or otherwise
imposed by law.
CR1-9 [8] Where requirements are not specified in this document, contractual technical
requirements, or other applicable documents (e.g., GR-63-CORE[2]), the equipment
manufacturer's requirements consistent with industry standards shall be met. If
published industrial standards contain several classes, the class specified for high
reliability equipment is typically appropriate.
R1-10 [9] The quality of commercially-available materials, hardware, components, etc.,

used in the manufacture of products shall be such that product integrity is not
compromised.
R1-11 [10] Questions regarding acceptability of industry standards, materials, hardware,

components, etc., shall be resolved by written correspondence between the
manufacturer and the Network Operator, or its designated representative, but such
resolutions and interpretations shall not in any way relieve the manufacturer of
either its responsibility to comply with standards or requirements imposed by law,
or its ultimate responsibility for the design, safety, and performance of its products.
R1-12 [11] The equipment manufacturer shall perform further tests and employ more
stringent requirements than those referred to in this document, as needed, to ensure
product safety and reliability.
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GR-78-CORE
1–6
GR-78-CORE Requirements for All Products
2 Requirements for All Products

2.1 General
R2-1 [12] Each product shall be free of foreign materials such as dust, dirt, corrosion
products, wire clippings, lint, etc., and excesses of materials specified by the
equipment manufacturer such as lubricants, varnishes, fluxes, solder, etc.
R2-2 [13] Each product shall be of the size, shape, color, and weight specified by
contract, or as designated (e.g., manufacturer’s technical specifications) if there is
no such contractual specification.
R2-3 [14] Each product shall have the stability, rigidity, compatibility, and flexibility as
designed (e.g., manufacturer’s technical specifications) and as specified in
GR-63-CORE[2], NEBSTM Requirements: Physical Protection.
R2-4 [15] Each product shall meet human factors criteria consistent and compatible with
its function and intended environment.
R2-5 [16] Each product shall contain all parts, finishes, identifications, and markings as
designated and as specified in this document.
R2-6 [17] Each product shall be manufactured using materials, fastening methods and
devices, connecting methods and devices, and protective methods and devices as
designed and as specified in this document.
R2-7 [18] Except for the permitted exceptions of this document (e.g., Section 6.1.3.11,
“Mechanical Damage”), each product shall be free from damage.
R2-8 [19] Each product shall be free from excessive stress under worst case storage,
transportation, and operating conditions.
R2-9 [20] Each product shall be free from excessive temperature rise. (See Section 8.4.2,
“Operation Under Environmental Extremes.”)
R2-10 [21] Each product shall be free from hazardous conditions and safety violations.
R2-11 [22] Each product shall be free from interferences with moving parts and
protective devices.
R2-12 [23] Each product shall be free from corrosion.
R2-13 [24] Each product shall be free from materials that support fungus growth.
R2-14 [25] Each product shall be free from major cosmetic defects.
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GR-78-CORE
Requirements for All Products Issue 2, September 2007
R2-15 [26] Piece parts, components, wire, and cable shall, where practical, be so marked
as to allow traceability to their original manufacturer; this requirement does not
apply to structural metalwork and machined hardware such as screws. Such
markings shall not be obliterated or removed except by the original manufacturer to
re-mark incorrectly marked parts. On a temporary basis, part markings that fail to
withstand assembly processing may be re-marked with the original component
markings. With the exception of markings identifying program-related information
for programmable devices such as Erasable Programmable Read-Only Memories
(E-PROMs), additional markings (such as labels added in the equipment
manufacturing process) shall not obscure the original manufacturer’s markings.
R2-16 [27] Parts shall have clearances among them as designed and as specified in this
document.
R2-17 [28] Parts requiring lubrication shall be lubricated as designed and as specified in
this document.
R2-18 [29] Adjustable, movable, removable, and plug-in parts shall retain positions under
normal operation and use.
R2-19 [30] Excessive force shall not be required to remove and replace removable and
plug-in parts, move movable parts, and adjust adjustable parts.
2.2 Electrical and Mechanical Integrity
R2-20 [31] The electrical and mechanical integrity and the reliability of all components
and assemblies shall be retained after exposure to all processes employed during
manufacture and assembly (e.g., handling, fluxing, soldering, and cleaning). It is the
responsibility of the equipment manufacturer to satisfactorily demonstrate that
each assembly and generic component type meets this requirement. Proof of the
electrical and mechanical integrity of both components and assemblies shall be
made available to the Network Operator, or its designated representative, upon
request.
NOTE: This requirement is typically satisfied by the component qualification/
re-qualification programs detailed in GR-357-CORE[3], Generic
Requirements for Assuring the Reliability of Components Used in
Telecommunications Equipment, and by periodic product qualification/
re-qualification to the requirements of GR-63-CORE[2].
R2-21 [32] Where a novel or new technology is introduced by an equipment manufacturer,

the manufacturer shall demonstrate the reliability of such technology. Accelerated
testing will typically be required; alternate approaches such as mathematical
modeling may be acceptable if validity can be demonstrated. Third-party (e.g.,
supplier) data may be acceptable.
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GR-78-CORE Requirements for All Products
A novel or new technology may be one that has not previously been used, one that
has not previously been used in telecommunications, or one that has not previously
been used by the particular equipment manufacturer. Reliability data shall be made
available to the Network Operator, or its designated representative, upon request.
R2-22 [33] All power sources shall have a fold-back electrical characteristic for protection
of the powered assemblies.
In case of a short on the backplane or one of the plug-ins, the power supply shall
detect the short and shut itself down. This requirement is necessary to prevent fires
occurring in the case of a short with power supplies delivering maximum power to
the short area.
2.3 Administration of Requirements

The requirements in this document apply to all assemblies, sub-assemblies,
components, piece parts, and materials contained within a piece of equipment.
R2-23 [34] It is the responsibility of the primary equipment supplier to ensure that all
major assemblies, sub-assemblies, components, piece parts, and materials used in
the equipment comply with the requirements of this document. This requirement
includes Original Equipment Manufacturer (OEM)1 assemblies and sub-assemblies
when they are used to perform a function integral to the operation of the equipment.
R2-24 [35] The primary equipment supplier shall establish adequate incoming inspection
and auditing procedures to demonstrate compliance with the requirements in this
document. The use of secondary supplier data or source inspection are acceptable
alternatives.
CR2-25 [36] At the primary equipment manufacturer’s discretion, secondary supplier data
may be used, in lieu of routine incoming inspection, to demonstrate compliance with
the requirements in this document. Such data shall be adequate to demonstrate
compliance, and periodic audits shall be conducted by the primary equipment
supplier to ensure the validity of the data.
NOTE: Certificates of Conformance are not acceptable unless supported by
adequate test/inspection data.
CR2-26 [37] At the primary equipment manufacturer’s discretion, source inspection may be
used, in lieu of routine incoming inspection, to demonstrate compliance with the
requirements of this document. Such inspection shall be adequate to demonstrate
ongoing compliance with requirements.
1. OEM equipment is equipment designed and built by an outside manufacturer (secondary supplier)
and typically available on the open market. Equipment designed and/or manufactured by the
primary equipment supplier is not considered OEM equipment.
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GR-78-CORE
Requirements for All Products Issue 2, September 2007
2–4
GR-78-CORE Materials and Finishes Requirements
3 Materials and Finishes Requirements

3.1 General
CR3-1 [38] Unless otherwise specified in this or supporting documents, materials and
finishes shall meet approved industry standards such that product integrity is not
compromised.
CR3-2 [39] Where practical, materials that are particularly fragile shall not be used, e.g.,
materials and finishes that, because of their fragility, require special handling
procedures.
CR3-3 [40] Materials particularly susceptible to ozone degradation shall not be used
without careful consideration of design and exposure to the ambient. Examples of
such materials are:
• Rubber under stress (e.g., O-rings, belts)
• Unsaturated polymers (e.g., polybutadiene).
For critical components such as O-rings, careful design can minimize exposure of
the sealing surfaces to the ambient.
R3-4 [41] Materials and finishes shall meet all fire resistance and toxicity requirements
imposed by law, as well as those specified by contract, those referred to herein, and
those otherwise applicable.
R3-5 [42] All materials shall be subjected to and shall pass the appropriate qualification
testing requirements contained in this document.
CR3-6 [43] Requalification shall be required whenever there is a significant change in the
material, material combination, or in the key process parameters used in
manufacturing. Additionally, if field problems or process inconsistencies identify
problems with a material or material combination, corrective actions shall include
requalification of the material or material combination if warranted by the type of
issues.
R3-7 [44] This requirement has been deleted per Issue 2.
3.2 Materials
3.2.1 Fire Resistance Requirements
Fire resistance requirements for equipment materials, wire and cable, and
components are contained in Section 4.3 of GR-63-CORE[2]. Component
flammability requirements are also contained in GR-357-CORE[3]; in the event of
conflict, GR-63-CORE takes precedence.
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GR-78-CORE
Materials and Finishes Requirements Issue 2, September 2007
R3-8 [45] Materials, wire and cable, and components in equipment and cable
distribution assemblies shall meet the requirements of Section 4.2 of GR-63-
CORE[2].
3.2.2 Fire Risk Analysis
R3-10 [47] The equipment supplier shall provide (upon request) an estimate of the
maximum possible fuel load of polymeric materials in a fully equipped frame or
subassembly to the Network Operator or its designated representative. This
database is usually required as part of a product technical analysis.
R3-11 [48] The equipment supplier shall provide (upon request) a database detailing the
flammability characteristics of all equipment, materials, components, and wire and
cable to the Network Operator or its designated representative.
R3-12 [49] For any other Printed Wiring Board (PWB) additive materials in combination
with the laminates used, flammability assessment is typically made with an amount
and distribution of these materials that represents actual usage in a worst-case
condition. For example, Surface Mount Component (SMC) mounting adhesive
would be applied in a pattern of dots characteristic of high density placement of
devices, and not over the entire board surface.
3.2.3 Fluxes
R3-13 [50] Fluxes used for assembly soldering operations shall meet the requirements of
Section 13.1, “Corrosiveness of Soldering Fluxes.” The term fluxes here includes
prefluxes used for solderability retention and other pre-soldering treatments used
for surface activation/oxide removal.
3.2.4 Silver
CR3-15 [52] Silver-containing materials shall not be used where there is a possibility of
silver migration that could cause circuit malfunction, especially where these
materials are separated by or associated with materials that can absorb moisture.
3–2
GR-78-CORE Materials and Finishes Requirements
3.2.5 Silicones
R3-16 [53] If exposed make-break contacts are present or on the circuit board or
immediate adjacent boards or devices, then evidence shall be provided to show that
the silicone-based material or any of its components shall not migrate. This
requirement can be met by using one or more of the following:
A. Room-temperature hexane extraction for 12 hours as per TR-NWT-000930[4] of
silicone material in question shall find either less than 7% extractable hexane or
less than 18% extractable hexane if viscosity of the material is greater than
1,000 cps.
B. Thermal analysis by Differential Scanning Calorimetry (DSC) of any curable
silicone material shall measure less than 5% residual cure.
C. An analysis of weight % and type of volatiles generated after heating the coating
(e.g., headspace analysis by GC/MS techniques with heating to 100°C) shall find
less than 2 weight % total extractable materials.
3.3 Finishes
R3-17 [54] All finishes shall have good adhesion consistent with industry standards or
approved equivalent.
R3-18 [55] Cosmetic and protective finishes shall be of uniform appearance and typically
smooth; deliberately textured finishes are permissible. Such finishes shall be free of
contamination and porosity that could cause tarnishing or corrosion.
CR3-19 [56] Tin, zinc, or cadmium finished materials shall not be used within or close to
electrical circuits where filamentary metallic (whisker) growth, or loose whiskers
from such growth, could cause low resistance connections resulting in circuit
malfunctions.
R3-20 [57] This requirement has been deleted and replaced by R3-21 [447] per Issue 2.
R3-21 [447] Because of the potential for whisker growth, electroplated tin (Sn) finishes
containing less than 2% (by weight) of lead (Pb) should be avoided when possible.
When tin finishes that do not contain 2% lead are used where there is a potential for
electrical shorts or performance degradation from whisker growth, proven
mitigation methods of reducing or preventing whisker growth shall be employed.
These include component level full reflow of the tin finish, post plating annealing of
the tin finish, nickel underlayer plating, and alloying with other metals. See
IPC/JEDEC JP002[5] for additional information on mitigation practices. Additionally,
the finishes shall pass the tin whisker test requirements of JEDEC JESD-201[6], Class
2. Reflow of tin component finishes during assembly soldering operations is not an
adequate tin whisker mitigation practice. Lugs used in high-current circuits are
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GR-78-CORE
Materials and Finishes Requirements Issue 2, September 2007
excluded from this requirement if they are not near circuitry that could be affected
by tin whiskers becoming detached from such lugs.
GR-468-CORE[7], Generic Reliability Assurance Requirements for Optoelectronic

Devices Used in Telecommunications Equipment, details requirements for optical
components.
R3-22 [58] Brass or other alloys containing zinc shall be plated with a minimum of
50 micro inches of nickel or copper before tin or solder plating.
R3-23 [59] Stock materials susceptible to corrosion, such as solder-coated steel, shall not
be used for flat terminals or multileaded devices.
R3-24 [60] Plating shall not be applied over solder.
3–4
GR-78-CORE Separable Connector Requirements
4 Separable Connector Requirements

The proper selection and use of separable connectors are important aspects in the
design and manufacture of reliable telecommunications products. GR-1217-
CORE[8], Generic Requirements for Separable Electrical Connectors Used in
Telecommunications Hardware, contains detailed design and performance
expectations for separable electrical connectors. GR-326-CORE[9], Generic
Requirements for Singlemode Optical Connectors and Jumper Assemblies,
provides performance criteria for optical connectors. This section of GR-78-CORE
provides criteria for proper selection, assembly, and use of connectors that have
been evaluated per GR-1217-CORE[8] and GR-326-CORE[9].
4.1 General
General requirements apply to all separable connector types, including component
sockets. Additional requirements for specific connector types are contained in
subsequent sections. See also Section 5.1.7, “Cable and Wire Termination.”
4.1.1 Connector Selection Considerations
R4-1 [61] The same or similar metals (e.g., gold to gold, silver to silver, tin-lead to
tin-lead, or tin to tin) shall be used for all separable contacts.
R4-6 [66] Connectors shall be used so that mounting and mating stresses transmitted to
the connector contacts, mechanical (e.g., compliant pins), or soldered connections
do not affect interconnection reliability, e.g., surface-mount solder joints shall not
be subjected to shear or tensile stress that could result in creep failures.
IP4-7 [67] PWB mounted connectors should utilize physical attachment of the connector
housing to the PWB (e.g., by screws or heat staking) in addition to their mechanical
(e.g., compliant pin) or soldered connections, and should be so attached. For small
connectors and component sockets, solder joints alone may be adequate, provided
the assembly complies with the provisions of R4-6 [66].
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GR-78-CORE
Separable Connector Requirements Issue 2, September 2007
R4-10 [70] For PWB mounted connectors employing press-fit technology, the Plated
Through Hole (PTH) dimensions shall be per the manufacturer’s connector
specifications.
R4-11 [72] For connector pins used for solderless wrapped connections, the spacing
between adjacent pins shall be in accordance with Telcordia’s MDP-326-316[10].
IP4-12 [73] Leaded connectors for surface mounting that are hand placed should include
location features to assist registration of the connector terminals to the substrate
conductor pattern before soldering.
IP4-13 [861] The use of location features on Ball Grid Array (BGA) connectors and
machine-placed leaded connectors for surface mounting should be avoided to allow
the machine and BGA self-centering to accurately locate the connectors.
R4-14 [74] Connector design dimensions and tolerances shall be sufficient to ensure
satisfactory assembly of connectors, backplanes, card guides, frames, etc., i.e., the
alignment of contacts shall always allow engagement with mating contacts
irrespective of the build-up of allowable tolerances on hole locations, contact
position, and housing dimensions. This requirement also applies to sequenced
contact arrangements, i.e., the mating sequence of contacts shall be maintained
under all tolerance conditions.
R4-15 [137] Polymeric materials used in the construction of connectors shall be resistant
to solvents and cleaners used in the manufacturing/assembly processes.
R4-16 [75] All materials used in connectors—base metal spring material, contact
finishing, insulating, and structural materials—shall be adequate and compatible
with the physical and environmental stresses to which they will be subjected.
Minimum requirements are specified in the following section and in GR-63-CORE[2].
R4-19 [78] Minimum contact normal forces for separable connections shall be maintained
over the full operating and storage temperature ranges specified in GR-63-CORE[2],
Section 4, and for the life of the equipment. An acceptable alternative for
qualification, when the specified contact normal force is less than 100 grams, is the
pre-qualification test program (GR-1217-CORE[8], Section 7) to demonstrate
reliability.
O4-21 [80] Connector and component sockets should be permanently marked to allow
traceability to the original manufacturer; such markings should remain visible after
assembly. Other methods of achieving the same objective may be acceptable, e.g.,
the maintenance of a database that allows traceability by PWB assembly (circuit
pack) date code or serial number.
4–2
CR4-23 [82] This requirement has been deleted per Issue 2.
4.1.2 Lubrication
Lubrication applied to connectors at the time of manufacture or assembly is

important in preserving connector contact finish and providing expected durability.
The lubricant ensures low and stable contact resistance for the life of the equipment.
Lubrication may be done at any level in the process, such as by the connector
manufacturer or next level assembly. Sealants or environmental barriers applied to
connectors may also serve as lubricants.
Lubrication may be applied to either the male or the female parts of the connector
system. The lubricant formulations detailed in Table 4-1 and Table 4-2 have proven
satisfactory in long-life field applications for the noted connector metallizations.
Table 4-1 Lubricants for Contacts with Noble Metallizations
Material Concentration by Weighta

1. Polyphenyl Ethers, or 1-2% in Solvent
2. Long Chain Hydrocarbon Oils, or 1-2% in Solvent
3. Paraffin Wax, or 1-2% in Solvent
4. Fluoro Carbon Ethers 1-2% in Solvent
a. See Section 13.3.1 for qualification requirements for lubricants
with noble metals.
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GR-78-CORE
Table 4-2 Lubricants for Contacts with Non-Noble Metallizations
Chemical Formulation Viscosity

Synthetic Hydrocarbon Grease High
Pentaerythritol Ester Medium
Synthetic Hydrocarbon High
Sebacate Oil/Methacrylate Polymer/Additives High
Polyphenal Ether High
Poly-Alpha-Olefin (PAO) Low
R4-32 [95] The equipment supplier shall be responsible to ensure separable connections
(including connectors, PWB contact fingers, and socketed devices) are lubricated as
needed for the application.
NOTE: Lubrication is not required for coaxial cable connectors or for very
high pressure distorting type connectors, such as spade connectors,
which form a gas-tight connection by a cutting action during mating.
For socketed components, lubrication may be applied to either the component leads
or the sockets, before the initial insertion.
R4-33 [862] A minimum lubricant thickness of 1 micron (1µm) shall be required for non-
noble metal lubricants.
R4-34 [863] It is required that lubricants function as intended after exposure to the
storage temperature ranges of GR-63-CORE[2] and throughout the operating
temperature range of the equipment assembly.
R4-35 [864] Assembly processes subsequent to connector lubrication shall not remove
the lubricant.
R4-36 [96] The lubricant formulations detailed in Table 4-1 and Table 4-2 have proven
satisfactory in long-life field applications and one of these or a demonstrated
equivalent shall be used.
R4-37 [97] Use of a demonstrated equivalent requires approval of the Network Operator
or its designated representative. Such approval is contingent on submission of
satisfactory qualification test data to the requirements of GR-1217-CORE[8],
Lubrication Qualification Tests.
4–4
R4-40 [100] Petroleum jelly or silicone-containing materials shall not be used as

lubricants.
4.1.3 Connector Durability
R4-41 [865] Connectors shall have sufficient durability to withstand the number of design
cycles required for the connector application. Table 4-3 identifies connector
applications and expected durability expressed as the number of mating cycles.
Table 4-3 Connector Applications and Durability
Durability
Connector Application (Number of
Mating Cycles)
Circuit Pack/Backplane Including PWB 200
Contact Fingers
Circuit Pack or Chassis/ External Cable 200
Circuit Pack Header/ Internal Cable or 25
Daughter Card
Component/Socket 25
Mother/Daughter Card Connection 25
R4-42 [866] Connector metallization and lubrication shall be selected to achieve the
durability needed to withstand the number of design cycles required for the
connector application. Table 4-4 identifies typical connector metallization,
lubrication, and resultant durability suitable for discrete connectors and PWB
contact fingers. Other metallizations conforming to GR-1217-CORE[8] may be used.
4–5
GR-78-CORE
Table 4-4 Connector Metallization, Lubrication, Durability
Typical
Typical Lubrication
Durability
Metallization Thickness Typically
(Number of
(Micro Inches) Required
Mating Cycles)
Au/Ni 50/50 No 200
Au/Ni 30/50 Yes 200
Au/Ni 30/50 No 25
Au/Pd/Ni 2/25/50 Yes 200
Sn or SnPb 50 Yes 25
Ag* 75 Yes 25
Au/Pd-Ni/Ni 2/25/50 Yes 200
Au/Pd-Ni/Ni 2/25/50 No 25
Ag = Silver Sn = Tin
Au = Gold Pb = Lead
Ni = Nickel Pd = Palladium
* See Section 3.2.4 for restrictions on use of silver.
R4-43 [89] Indentations, pits, or scratches in noble metal finishes shall not expose base
metal (or base metal underlayers) in contact areas.
R4-44 [91] Contact metallization adhesion shall be tested per Section 14.2.2.4, “Finish
Adherence.”
4–6
4.2 Two-Part and PWB Edge Card Connectors
4.2.1 Design
O4-58 [114] It is desirable that the mating ends of both female and male contacts be
radiused or chamfered to assist entry and minimize insertion forces.
R4-60 [116] Cable connectors shall be provided with some kind of locking mechanism to
minimize movement of mated connectors in the presence of mechanical vibration.
4.2.2 Polarization
O4-61 [117] It is an objective that interconnection schemes using separable connectors

incorporate polarization, keying, or another technique (e.g., control of cable length
on cable connectors) to physically prevent wrong insertions.
R4-62 [118] Circuit pack design shall preclude damage due to wrong insertions.
When practical, physical prevention of wrong insertions shall be accomplished by a
method that precludes mating in more than one position, e.g., a circuit pack inserted
in the wrong position shall not make electrical contact with the connector.
Where impractical to physically prevent wrong insertions, for example, where there
are only firmware differences between circuit packs, standard connection schemes
for each family (i.e., mating connectors/assemblies with identical mechanical
interfaces) shall be used to prevent electrical damage to the system or circuit pack
resulting from wrong insertions. If this approach is used, all members of the family
shall use identical power and ground connections.
CR4-63 [119] This requirement was combined with R4-62 [118] per Issue 2.
R4-64 [120] No damage to the circuit pack or system shall occur if a circuit pack or
connector is inverted during insertion, i.e., is inserted upside-down.
4–7
GR-78-CORE
Connector polarization or common power and grounding scheme may be used to

prevent damage from inverted insertion. Because of the risk of inverted insertion,
extreme care must be exercised if symmetrical (about the center line of the PWB)
profiles are used for PWBs with plated contact fingers.
4.2.3 Insertion and Removal Forces
R4-65 [121] The maximum force required to insert a circuit pack into its mating
connector(s), or to remove a circuit pack from its mating connector(s), or to insert
or remove a cable connector, shall not exceed 32 pounds. This force shall be
measured using new, conforming parts in an actual use situation.
CR4-66 [867] Where latches or other mechanical devices are provided to assist mating or
removal, the 32-pound maximum insertion or removal force requirement for circuit
packs is applied to the total force necessary to operate such devices, e.g., 16 pounds
at each of two latches; 32 pounds for a single latch. However, this provision only
applies if the closure of such devices ensures adequate connector mating under all
tolerance conditions. If there is only sufficient space for a single finger pull to open
such devices for circuit pack ejection, this force shall be limited to 7 pounds per
latch.
IP4-67 [122] Where latches or other mechanical devices are used to assist mating or
removal of circuit packs, two such devices per assembly should be employed to
minimize the possibility of jamming.
R4-68 [123] The application of a force of 1/4 pound per contact to a fully mated circuit
pack or cable connector shall not result in any damage to the connector, to the
connector contacts, to the connector mounting, or to the circuit pack.
4.2.4 Usage
4.3 Insulation Displacement Connectors (IDCs)
R4-72 [129] When IDCs are used, strain relief shall be provided. Strain relief may be
incorporated in the housing slots, insulation support tab, or otherwise provided
adjacent to the connector.
4–8
R4-74 [131] IDC terminals shall be selected to accommodate the maximum diameter of
the wire conductor being terminated.
4–9
GR-78-CORE
4–10
GR-78-CORE Wire and Cable Requirements
5 Wire and Cable Requirements

5.1 Metallic Wire and Cable
R5-1 [138] Wires and cables used in the manufacture of telecommunications products
shall be adequate and compatible with the physical and environmental stresses to
which they may be subjected. Table 5-1 through Table 5-3 list performance
documents pertaining to metallic wire and cable applications.
5.1.1 Outside Plant Cable
Table 5-1 lists outside plant cable types and the Telcordia GR documents that
pertain to them.
Table 5-1 Outside Plant Cable Requirements
Cable Document
Title
Type Number
General Cable Criteria
Generic Requirements for Metallic Telecommunication --- GR-421-CORE[13]
Cable
Application-Specific Criteria
PIC Filled ASP Cable WMCa GR-421-CORE[13]
Aircore PIC ALPETH Cable APMCb GR-421-CORE[13]
Generic Requirements for PIC Self Support Cable (Non- APMC GR-421-CORE[13]
Reinforced and Reinforced)
Underground Foam-Skin PIC Bonded STALPETH Cable APMC GR-421-CORE[13]
PIC Bonded PASP Cable APMC GR-421-CORE[13]
PIC Filled Screened ASP Cable WMC GR-421-CORE[13]
Generic Requirements for Thermoplastic Insulated APMC GR-110-CORE[14]
Steam Resistant Cable
Generic Requirements for Thermoplastic Insulated Riser APMC GR-111-CORE[15]
Cable
PIC Bonded Screened PASP Cable APMC GR-421-CORE[13]
PIC PAP Cable APMC GR-421-CORE[13]
PIC Screened PAP Cable APMC GR-421-CORE[13]
Generic Requirements for Inter-City PIC Screened Cable WMC GR-115-CORE[16]
(Filled ASP, Bonded STALPETH, and Bonded PASP)
Cable Outer Protection --- GR-421-CORE[13]
PIC Filled Bonded ASP Cable WMC GR-421-CORE[13]
a. WMC – Waterproof Multi-Pair Cable.
b. APMC – Air Core PIC Multi-Pair Cable.
5–1
GR-78-CORE
Wire and Cable Requirements Issue 2, September 2007
5.1.2 Outside Plant Wire (OPW)
R5-2 [139] This requirement has been replaced by the following paragraph.
Table 5-2 lists OPW types and the Telcordia GR documents that pertain to them.
Table 5-2 Outside Plant Wire Requirements
Cable Document
Title
Type Number
General Wire Criteria
Wire
Customer Premises or Network Ground Wire OPW TA-TSY-000120[17]
Generic Requirements for One Pair Aerial Service Wire OPW TR-NWT-000121[18]
Multiple Pair Aerial Service Wire OPW TR-NWT-000122[19]
Generic Requirements for Single Pair Buried Distribution OPW TR-NWT-000123[20]
Wire
Generic Requirements for Multiple Pair Buried Wire OPW TR-NWT-000124[21]
Generic Requirements for Network Outdoor Customer OPW GR-126-CORE[22]
Premises, and Universal Cross-Connecting Wire
Network Aerial Block Wire OPW TA-TSY-000127[23]
Generic Requirements for Non-Metallic Reinforced OPW GR-1069-CORE[24]
Aerial Service Wire
5.1.3 Inside Wire and Cable (Customer Premises and COs)
Table 5-3 lists the documents where wire and cable requirements for use in
customer premises and COs are found.
Table 5-3 Inside Wire and Cable Requirements (Sheet 1 of 2)
Cable Document
Title
Type Number
General Criteria
Wire
Generic Requirements for Plenum Cable/Wire SWCa TR-NWT-000131[26]
Generic Requirements for Network Shielded Station Wire SWC TR-NWT-000132[27]
and Cable
Generic Requirements for Inside Wiring Cable (3 to 125 SWC TR-NWT-000133[28]
Pair Sizes)
Generic Requirements for Network Two Pair Station SWC TR-NWT-000134[29]
Wire
Miniature Ribbon Connector and Cable Assembly SWC TA-TSY-000135[30]
5–2
Table 5-3 Inside Wire and Cable Requirements (Sheet 2 of 2)
Cable Document
Title
Type Number
Generic Requirements for Distributing Frame Wire COWCb GR-136-CORE[31]
Generic Requirements for CO Cable COWC GR-137-CORE[32]
Generic Requirements for CO Coaxial Cable COWC GR-139-CORE[33]
Generic Requirements for Network Outdoor Customer SWC/ GR-126-CORE[22]
Premises, and Universal Cross-Connecting Wire COWC
Generic Requirements for Telecommunications COWC GR-347-CORE[34]
Power Cable
Commercial Building Telecommunications SWC/ ANSI/TIA/EIA-568-B[35]
Cabling Standard COWC
Commercial Building Standard for Telecommunications SWC ANSI/TIA/EIA-569-B[36]
Pathways and Spaces
a. SWC – Station Wire and Cable.
b. COWC – Central Office Wire and Cable.
R5-3 [140]This requirement has been deleted per Issue 2.
5.1.4 Materials
Section 3.2.1, “Fire Resistance Requirements,” contains flammability requirements

for wires and cable.
R5-4 [141] Wire and cable shall be permanently marked with identification and NEC
listing mark if required by product type per the applicable requirements of Section 8
of GR-492-CORE[25], Generic Requirements for Metallic Telecommunication Wire.
O5-6 [143] Wire for solderless wrapped and insulation displacement connections should
be tin-plated to achieve desirable life expectancies and reliable connections free
from noise.
CR5-7 [144] For CO applications, silver-plated wire may be used for solderless wrapped
connections.
NOTE: In the above case, the possibility of corrosion to the exposed surfaces
of the wires, resulting in changed appearance, must be recognized.
R5-8 [145] The plating thickness for silver-plated copper wire used for solderless
wrapped connections shall be a minimum of 40 micro inches.
5–3
GR-78-CORE
CR5-10 [147] For CO applications, the use of bare copper wire for solderless wrapped
connections may be acceptable, with the prior approval of the Network Operator or
its designated representative, if the extra turns specified for copper wire in Table 8-1
are applied.
5.1.5 Performance
R5-11 [148] The conductors of wires not covered by the requirements detailed in
Section 5.1.1 through Section 5.1.3 shall meet the elongation requirements of
Section 2.4 of GR-492-CORE.[25]
R5-12 [149] Factory joints in the conductors of wires not covered by the requirements
detailed in Section 5.1.1 through Section 5.1.3 shall comply with the requirements of
Section 2.3 of GR-492-CORE[25].
R5-13 [150] The conductors of wires not covered by the requirements detailed in
Section 5.1.1 through Section 5.1.3 shall have a minimum tensile strength of 50% of
the nominal breaking strength specified in the American Society for Metals (ASM)
Metals Handbook[37]. Tensile loading shall be applied at a rate of 1 inch per minute.
R5-14 [151] For wires not covered by the requirements detailed in Section 5.1.1 through
Section 5.1.3, insulating materials such as PTFE (Polytetrafluoroethylene) may be
used provided their performance is equivalent to, or better than, that of PVC.
R5-15 [152] Wires not covered by the requirements detailed in Section 5.1.1 through
Section 5.1.3 shall have a minimum cut-through resistance ratio of 0.2 (the force in
pounds divided by diameter in mils [0.001 inch]) when tested in accordance with the
methods in Appendixes C or I of GR-492-CORE[25].
R5-16 [153] For wires not covered by the requirements detailed in Section 5.1.1 through
Section 5.1.3, the minimum stripping force of the insulation in pounds, divided by
the conductor circumference in mils, shall be no less than 0.0475.
R5-17 [154] Power and interface leads shall be separated and, when required, shall be
adequately shielded. Insulation between power and other leads shall be capable of
withstanding 600 Vac (50 - 60Hz) applied for 1 minute or 1000 Vdc applied for
1 minute.
R5-18 [868] Power leads shall not be spliced.
5.1.6 Wire and Cable Preparation for Equipment Assemblies
IP5-19 [155] Wires and cables should be cut and stripped by machine.
5–4
IP5-20 [156] Hand tools used to cut and strip wires should be custom tools (designed for a
particular wire size), or adjustable (set to the wire size being used).
IP5-21 [157] The use of multi-purpose hand tools (i.e., tools designed to strip several
different wire gauges) increases the risk of conductor damage and should be
discouraged.
CR5-22 [158] Where a specified strip length is required, hand tools for cutting and stripping
wire shall be provided with a means of setting strip length; visual judgement of strip
length shall not be acceptable.
R5-23 [159] Cut-and-strip machines and tooling, and hand tools, shall not nick or damage
wire or cable conductors or insulation beyond acceptable limits (e.g., 5% reduction
in conductor cross-section).
R5-24 [160] Wires with conductors or insulation damaged beyond acceptable limits shall
not be used. (See Section 8.2.2 for assembly level requirements.)
R5-25 [161] During handling and preparation, coaxial cables shall not be bent around a
radius of less than 5 times the cable diameter unless specifically permitted by the
cable manufacturer and approved by the Network Operator or its designated
representative.
IP5-26 [162] The insulation of ribbon cables should only be partially removed during the
cut-and-strip operation to minimize the risk of conductor displacement before
subsequent assembly.
R5-27 [163] The color coding of wires and cables shall be consistent and as specified by
contract or by the equipment manufacturer. If there is no such contractual
requirement, substitutions shall only be permitted if such substitutions are
unambiguous and cannot result in the misidentification of a color-coded wire or
cable.
5.1.7 Cable and Wire Termination
R5-28 [164] The minimum axial load required to separate a wire from its crimped
connection shall be as follows:
• No less than 37.5% of the nominal breaking strength specified in the ASM Metals
Handbook[37] for wire sizes #6 AWG and smaller.
• No less than 20% of the nominal breaking strength specified in the ASM Metals
Handbook[37] for wire sizes from #2 AWG to 4/0 AWG.
• No less than 15% of the nominal breaking strength specified in the ASM Metals
Handbook[37] for wire sizes 250 kcmil and larger.
5–5
GR-78-CORE
Tensile loading shall be applied at a rate of 1 inch per minute. Where contact/
terminal designs include an insulation crimp, the insulation crimp shall be removed
before testing.
CR5-29 [165] Where crimped coaxial connections have a crimped outer sleeve that exhibits
a number (generally 6) of approximately flat surfaces there shall be no fins or
excessive rounding at bends.
R5-30 [166] Crimped coaxial connections shall show no evidence of double crimping of
the outer sleeve. The outer sleeve shall be free of cracks or fractures when examined
at up to 10× magnification.
R5-31 [167] Crimped shield terminations to connectors, jacks, plugs, etc., shall meet
either the minimum torques specified in Table 5-4, or the cable retention
requirements detailed in MIL-PRF-39012E[38]. The torque test shall be made with the
body of the connector, jack, or plug held stationary and the torque applied to the
crimped outer sleeve in both directions. This requirement is met if no movement
occurs in the outer sleeve.
Table 5-4 Minimum Torques
Cable Diameter Minimum Non-Turning Torque

(inches) (inch-pounds)
0.100 or less 1.0
0.101 to 0.200 1.2
0.201 to 0.300 4.0
0.301 or larger 6.0
R5-32 [168] The frequency of maintenance and verification of crimp tooling and
equipment shall be such as to ensure that all requirements are continuously met.
R5-33 [169] There shall be no splices in coaxial cables. Separable connections in coaxial
cables are not considered splices for the purpose of this requirement.
5.2 Optical Fiber and Optical Fiber Cables

GR-20-CORE[39], Generic Requirements for Optical Fiber and Optical Fiber Cable,
contains requirements for optical fiber and optical fiber cables.
R5-34 [170] Optical fiber cables shall not be bent to a radius of less than that specified by
the manufacture at any stage during manufacturing or field deployment.
For generic requirements on single-mode optical fiber connectors and jumper

assemblies, see GR-326-CORE.[9]
5–6
GR-78-CORE Printed Wiring Board (PWB) Requirements
6 Printed Wiring Board (PWB) Requirements

ANSI/IPC-T-50G[40], Terms and Definitions for Interconnecting and Packaging
Electronic Circuits, contains definitions of the terms used in this section.
6.1 General
R6-1 [171] The requirements in this section (Section 6.1) apply to all PWBs, regardless of
technology. Table 6-1 lists PWB types and the applicable sections containing
additional requirements.
Table 6-1 Requirements by PWB Type
PWB Type Applicable Requirements

Single Sided/Double Sided Section 6.1
(Through-Hole Technology)
Single Sided/Double Sided Sections 6.1 and 6.3
(Surface-Mount Technology [SMT])
Multilayer Sections 6.1 and 6.2
(Through-Hole Technology)
Multilayer Sections 6.1, 6.2, and 6.3
(Surface-Mount Technology [SMT])
Double Sided Backpanel Sections 6.1 and 6.4
Multilayer Backpanel Sections 6.1, 6.2, and 6.4
Encapsulated Discrete Wire Section 6.5
Interconnection Boards
6.1.1 Materials
The term “laminate” is used here to describe the substrate on which circuitry is
defined; it is not restricted to conventional glass reinforced materials.
6.1.1.1 Laminates
R6-2 [172] PWB laminates shall meet the fire resistance requirements detailed in
GR-63-CORE[2], Section 4.2.3, “Use of Fire-Resistant Materials, Components, Wiring,
and Cable.”
R6-3 [173] Laminates shall be used that are equivalent or better than FR-4 in the
following aspects: fire resistance, resistance to electromigration, and resistance to
processing chemicals and environmental stresses.
6–1
GR-78-CORE
Printed Wiring Board (PWB) Requirements Issue 2, September 2007
6.1.1.2 Solder Mask
R6-4 [174] Solder masks for PWBs, in combination with the laminates used, shall meet
the fire resistance requirements detailed in Section 4.2.3 of GR-63-CORE[2]. Tests
shall be conducted using samples of the laminate material, with the copper cladding
removed, coated on both sides with solder mask. The thickness of the solder mask
shall be the maximum expected in manufacturing.
R6-5 [175] Solder masks and any other PWB additive materials in combination with the
laminates used shall meet the qualification requirements in Section 13.2, “Polymeric
Coatings and Adhesive Materials.”
6.1.1.3 Legend and Marking Inks
R6-6 [176] Legend and marking inks used on PWBs shall meet the qualification
requirements in Section 13.2, “Polymeric Coatings and Adhesive Materials.”
6.1.1.4 Repair Polymers
R6-7 [177] Polymers used for the repair of PWB laminates, or solder masks, shall meet
the qualification requirements in Section 13.2, “Polymeric Coatings and Adhesive
Materials.”
6.1.1.5 Conductor Materials and Finishes
R6-8 [178] Electroplated silver shall not be used as a conductor or contact finish.
R6-9 [869] Silver shall not be used in conductive polymeric materials used in the
manufacture of PWBs, unless acceptable reliability data is provided to the Network
Operator or its designated representative.
CR6-10 [870] Immersion silver finishes may be used as the final finish of PWBs provided
they have passed electromigration testing per Section 13.2.7, “Testing for Resistance
to Electromigration,” as received. In addition, the assembler of the final product
must ensure that there is no silver migration failure as defined by Section 13.2.7 after
the product is assembled.
R6-11 [871] Immersion tin finishes may be used as the final finish of PWBs provided that
the finish has demonstrated adequate whisker performance for the application.
See IPC-4554[43], Specification for Immersion Tin Plating for Printed Circuit
Boards.
6–2
R6-12 [872] Electroplated tin shall not be used as a conductor or contact finish unless
subjected to an approved re-flow process. Tin (Sn) plating, with a minimum of
2% lead (Pb), is acceptable and does not require re-flow (see R3-21 [447]).
6.1.2 Design
6.1.2.1 Dimensioning
R6-13 [179] Dimensions and tolerances shall be sufficient to ensure satisfactory assembly
of connectors, backplanes, card guides, frames, etc.
R6-14 [180] The plug end(s) of the PWBs using contact fingers shall be within the
tolerance range specified by the manufacturer of the mating connector(s).
6.1.2.2 PWB Contact Fingers
O6-15 [181] PWBs with contact fingers should be provided with polarizing/keying features
to prevent damage due to wrong insertions. (See Section 4.2.2, “Polarization.”)
R6-16 [182] To avoid degradation of connector contacts that may be required for future
modifications, PWB contact fingers shall not be omitted where connector contacts
mate with the PWB (i.e., if a PWB mates with a fully loaded connector, a full
complement of contact fingers shall be present).
R6-17 [183] Because of the abrasive nature of the beveled edges of PWBs, consideration
shall be given when designing such beveled edges to the need to minimize the length
of engagement with the connector contacts during insertion.
R6-18 [184] To minimize connector contacts wiping the surface of the laminate, and the
possibility of resin contamination of such contacts, consideration shall be given at
the design stage to minimizing exposure of laminate between the beveled edges of
the PWB and the contact fingers.
CR6-19 [185] If staggered contact finger designs are used on PWBs to control the contact
make/break sequence, the profile of the PWB should, where possible by design, be
adjusted to prevent contacts wiping the surface of the laminate. Caution shall be
taken to ensure that profile modifications that result in non-chamfered edges of the
PWB do not result in connector stubbing during insertion.
6–3
GR-78-CORE
6.1.2.3 Interlayer Connections
R6-20 [186] Electrical connections between the surfaces of double-sided PWBs shall be
made by using Plated Through Holes (PTHs).
Exception: Clinched wires or rivets, soldered at the assembly level, may be

used for making small numbers of electrical connections between conductor
patterns on opposite sides of non-PTH boards.
R6-21 [187] Holes used for the mechanical attachment of hardware to PWBs shall not rely
on interconnects of the immediate PTHs to provide functional electrical
connections.
CR6-22 [188] PTHs in PWBs separated by less than a nominal 0.030 inch “Manhattan” (sum
of orthogonal X and Y distance relative to glass weave) drilled hole wall to drilled
hole-wall distance, on compliant pin connectors shall not be used without
supporting reliability data per IPC-TM-650[11], Method 2.6.25 at 65°C/85% relative
humidity for 500 hours. Testing (if required) shall be performed using test vehicles
with representative materials, layer counts, and thickness, with connectors installed
and the bias applied across both the X and Y directions of the connector.
R6-23 [873] Plated through via holes that carry a sustained voltage greater than 5V and are
separated by less than a nominal of 0.024 inch “Manhattan” (sum of orthogonal X and
Y distance relative to glass weave) drilled hole wall to drilled hole-wall distance from
adjacent via holes shall not be used without supporting reliability data per
IPC-TM-650[11], Method 2.6.25 (or equivalent) at 65°C/85% relative humidity for 500
hours. To account for process variability between fabricators, these tests shall pass
a minimum of 0.004 inch below that actually used in the designs. For example, if the
design requirement is hole wall to hole-wall spacing of 0.020 inch, the tests shall pass
at 0.016 inch. Testing (if required) shall be performed using test vehicles with
representative materials, layer counts, and thickness.
R6-24 [874] Microvia holes in PWBs shall use Conductive Anodic Filament (CAF)
resistant materials. Materials are considered CAF resistant if they pass reliability
data per IPC-TM-650[11], Method 2.6.25 (or equivalent) at 65°C/85% relative humidity
for 500 hours at a hole wall to hole-wall spacing less than 0.020 inch. Alternatively,
a microvia test pattern may be used for the CAF testing with a hole wall to hole-wall
spacing of 0.011 inch.
6.1.2.4 Warpage
R6-25 [189] Bow and twist (warpage) limits shall be specified by the equipment
manufacturer to prevent difficulties
• During subsequent assembly operations
• With the insertion or removal of assembled circuit packs
6–4
• In maintaining adequate clearances to adjacent boards or frames

• In ensuring proper contact with connectors.
The commonly used industry standard of 0.010 inch/inch may be unsatisfactory to

meet the above requirements.
IP6-26 [190] For PWBs designed for Surface Mounted Components (SMCs), bow and twist
limits shall comply with IPC-2221A[41], Generic Standard on Printed Board Design,
as measured per IPC-TM-650[11], Method 2.4.22C.
6.1.2.5 Protective Coatings
R6-27 [191] PWB surface circuit patterns shall be protected with either a solder mask
applied as part of the PWB manufacturing process, or a conformal coating applied
after circuit pack assembly (see exceptions in R6-58 [220] and R7-107 [518]). This
finish shall minimize failures due to current leakage between conductors. Such a
material limits the consequence of accumulation of contaminants and moisture
condensation between printed conductors.
6.1.2.6 Resistance to Airborne Contaminants
Throughout their use, PWBs will be exposed to particulate and volatile organic
airborne contaminants that will deposit at various rates on all exposed surfaces.
Some of these materials, particularly fine particle sulfate salts, are hygroscopic; they
will absorb moisture and this will change the electrical properties of the surfaces.
These environments are defined in Section 4.5 of GR-63-CORE[2] for system level
evaluation of products.
R6-28 [192] PWB materials shall be selected to avoid electrical performance degradation
due to the airborne contaminant environments defined in GR-63-CORE[2].
6.1.3 Manufacturing
6.1.3.1 General
R6-29 [193] In-process handling procedures for PWBs shall be such as to minimize the
possibility of damage to PWBs at all stages in the manufacturing process.
R6-30 [194] PWBs with noble metal contact fingers shall not be stacked during
manufacturing unless the contact fingers are protected from possible damage.
6–5
GR-78-CORE
R6-31 [195] Noble metal contact fingers on PWBs shall be protected from possible
damage during shipment. Examples of suitable protection are individual packaging
of the boards or local masking of the contact fingers.
6.1.3.2 Conductor Widths and Spacings
R6-32 [196] General PWB conductor width and spacing dimensions shall be at least 70%
of nominal. The term nominal here applies to the dimensions specified by the
designer, and not to the artwork. Artwork may be adjusted to compensate for
processing variables.
R6-33 [197] Isolated protrusions on outer layer conductors of PWBs shall not reduce
interconductor spacings to less than 0.0035 inch. Where nominal line spacings are
such that this cannot be met, reliability data shall be available to demonstrate
satisfactory performance. In any event, line spacing reduction by isolated
protrusions shall not exceed 25% of the nominal line spacing.
R6-34 [198] Line spacing reduction by isolated protrusions shall not exceed 25% of the
nominal line spacing.
When design conductor spacings are less than 0.003 inch, or where isolated
protrusions on inner layer conductors of PWBs reduce interconductor spacings to
less than 0.0025 inch, reliability data shall be available to demonstrate satisfactory
performance. The reliability can be verified by ensuring proper fill of fine conductor
spacings by the prepreg resin system. A comb pattern with representative spacings,
material construction, and prepregs shall be tested using a 500V hi-pot test.
R6-35 [199] Isolated defects on PWBs, including but not limited to nicks, scratches, pits,
or pinholes, shall not reduce the conductor width to less than 35% of the nominal
width.
or pinholes, that reduce conductor width to between 35% and 50% of the nominal
width, shall be no longer than 4 times the nominal width.
or pinholes, that reduce conductor width to between 50% and 70% of the nominal
width, shall be no longer than 8 times the nominal width.
R6-38 [202] Isolated defects on PWBs shall not reduce conductor thickness by more than
50%.
6.1.3.3 Conductor Adhesion
R6-39 [203] PWBs shall meet the “Land Bond Strength, Unsupported Component Hole”
requirement of IPC-6012B[42], Qualification and Performance Specification for
6–6
Rigid Printed Boards. This test is of particular significance where SMCs are used
on PWBs.
Alternate methods of verifying conductor adhesion may be used after simulating

two or more rework operations.
6.1.3.4 Plated Through Holes (PTHs)
O6-40 [204] It is desirable that there not be any PWB hole breakout.
CR6-41 [205] For lands 0.012 inch in diameter or greater than the drilled hole size (prior to
plating), there shall not be any PWB hole breakout (i.e., the minimum annular ring
requirement is tangency).
R6-42 [875] For lands less than 0.012 inch in diameter greater than the drill size, breakout
may be allowed if the design and/or fabricator processes can ensure that the hole
wall to conductor spacing is not less than 0.004 inch (0.0035 inch after accounting
for protrusions). In all cases, PWB hole breakout shall not exceed 25% of the finished
hole circumference (i.e., breakout is limited to 90 degrees).
R6-43 [206] Misalignment of holes in PWBs shall not reduce the width of conductor
connections to pads to less than 50% of the nominal conductor width.
R6-44 [207] Holes in PWBs intended for subsequent through-hole plating shall have
sufficiently smooth walls for metal deposition.
IP6-45 [208] Tooling holes in PWBs to be used for registration purposes should not be
plated through.
R6-46 [209] Plating on the wall of each PWB PTH shall meet the acceptability
requirements of IPC-A-600G[45].
R6-47 [210] The thickness of the copper on the walls of PTHs in PWBs shall be per IPC-
6012B[42], Class 2, for PTH aspect ratios of 6:1 or less where aspect ratio is defined
by the board thickness over laminate divided by the drill-hole size.
CR6-48 [211] The thickness of the copper on the walls of PTHs in PWBs shall be per IPC-
6012B[42], Class 3, for PTH aspect ratios of 6:1 or greater where the aspect ratio is
defined by the board thickness over laminate divided by the drill-hole size.
In such cases, the adequacy of the minimum plating thickness specified by the
supplier shall be verified by, for example, subjecting samples to 5 thermal shocks
per Section 14.3.2, “Thermal Shock Testing of Plated Through Holes (PTHs).”
R6-49 [876] The thickness of the copper walls of plated microvia and buried via core holes
in PWBs shall be per IPC-6012B[42], Class 2.
6–7
GR-78-CORE
R6-50 [212] Where pattern plating processes are used, PWB plating thickness
measurements shall be made in high and low current density areas, i.e., in areas with
the least and the greatest amount of surrounding copper. Such measurements shall
be made on actual product and not on test coupons, unless the relationship between
PWB and test coupon plating thicknesses has been established.
R6-51 [213] There shall be no more than 3 voids per PTH. The total area of voids shall not
exceed 10% of the total wall area. Circumferential voids are not permitted.
When back-drilling is used, the area of the hole wall that is removed by back-drilling
shall not be considered a void area. However, the full thickness of the board shall be
used in the denominator of the void area percentage calculation.
R6-52 [214] There shall be no cracks at the junction of PTH walls and conductor paths or
terminal areas before or after thermal shock. See Section 14.3.1, “Preparation of
Cross-Sections,” and Section 14.3.2, “Thermal Shock Testing of Plated Through
Holes (PTHs),” for more information.
R6-53 [215] There shall be no open circuits in PTHs.
6.1.3.5 Conductor Finishes
R6-54 [216] Conductor finishes on PWBs shall be adequate to retain solderability for the
storage life of the PWB, and throughout the manufacturing processes.
R6-55 [217] Where the equipment manufacturer specifies a surface finish, PWB conductor
paths and conductor lands shall be coated with a finish material wherever a solder
mask material is not applied.
R6-56 [218] Tin/lead finishes on PWBs shall be sufficiently thick to retain solderability for
the storage life of the PWB, and throughout the manufacturing processes. These
requirements apply to plated tin/lead and hot-applied solder coatings (e.g., coatings
applied by Hot Air Solder Leveling [HASL]).
NOTE: Where multiple assembly soldering processes are used, e.g., re-flow
soldering of SMCs followed by wave soldering of through-hole mounted
components, a minimum of 0.00010 inch of solder in PTHs may be
insufficient to ensure solderability retention after the interim processes.
Copper/tin intermetallic (Cu6Sn5) forms when molten solder is in contact
with copper; if all of the tin in the thin solder coating is converted to
copper/tin intermetallic during a reflow process, the subsequent
solderability of the PTHs will be severely affected.
Cu6Sn5 in the oxidized state becomes unsolderable using non-corrosive
fluxes.
Similar problems exist with non-metallic finishes used for solderability
retention; organic coatings (prefluxes), for example, can polymerize
destroying subsequent solderability.
6–8
6.1.3.6 Solderability
R6-57 [219] All PWBs shall meet IPC/EIA J-STD-003B[44], Solderability Test for Printed
Boards, Class 2-Category 2 requirements for solderability.
All PWBs processed to the point of component assembly shall meet Category 2
solderability requirements of IPC/EIA J-STD-003B[44]. Where multi-stage soldering
processes are used, PWBs shall continue to meet this requirement between each
soldering process. Category 3 with durability conditioning shall be used when
the storage time can be greater than 6 months. If expected storage times are
exceeded, PWBs shall be retested before use.
6.1.3.7 Solder Masks
R6-58 [220] Solder masks on PWBs shall cover all circuitry except for component
mounting pads, test points, and PWB contact fingers, and be compliant to
IPC-A-600G[45], Acceptability of Printed Boards, Class 2. Solder mask is not
required on pads around PTHs, or in non-circuit areas.
Exceptions:
1. Solder mask is not essential between mounting pads for multileaded devices,
such as Integrated Circuits (ICs), if there are no conductors between such pads.
2. Solder mask is not essential on conductors between the mounting pads for
multileaded devices when the spacings between such conductors and mounting
pads are equal to or greater than 0.020 inch.
3. Solder mask is not required on conductors of 0.050 inch width or greater.
4. “Pad-only outer” PWB designs consisting of a “checkerboard” of pads (e.g.,
0.062-inch square pads on 0.100-inch centers) with no external interconnections
do not require solder mask if there is a minimum of 0.020 inch between pads.
5. “Pad-only outer” PWB designs with only functional pads (pads for component
mounting, interlayer connection, or testing) with no external connections do not
require solder mask.
6. Bare spots in solder mask coatings (e.g., skips and pinholes) shall not
collectively expose more than 1% of the intended coated area of conductors.
7. Bare spots in solder mask coatings shall not expose adjacent conductor paths
less than 0.020 inch apart.
8. Solder mask is not required on RF traces where the application of solder mask
would electrically degrade the circuit performance.
9. Solder mask is not required on bare traces that do not support active circuits.
O6-59 [221] To minimize the possibility of flaking and chipping, solder mask should not
extend to the edge of PWBs.
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GR-78-CORE
R6-61 [223] On PTH PWBs, solder mask shall not enter holes used for component
mounting.
R6-62 [224] On PTH PWBs, the application of solder mask up to and into via holes (PTHs
not used for component mounting) shall be permitted subject to the restrictions of
O6-63 [225] and R6-64 [226].
O6-63 [225] Super via holes (i.e., via holes that connect outer layers) in PTH PWBs,
plugged or tented, using solder mask from a single side of the board, shall only be
plugged after the final PWB finish is applied.
Exception: O6-63 [225] does not apply when electroplated nickel gold is used as
an etch resist.
R6-64 [226] Super via holes in PTH PWBs shall only be plugged or tented on one side
where there is no possibility of entrapment of corrosive processing chemicals and
other corrosive contaminants.
R6-65 [227] On PTH PWBs, the use of solder mask to plug or tent blind via holes [i.e., via
holes connecting inner layer(s) to one outer layer] shall be permitted.
R6-66 [228] Dry film solder mask tents over via holes in PWBs shall be sufficiently robust
to survive subsequent assembly processing without fracturing.
R6-68 [230] When post-solder mask processing involves the use of fluxes or pre-fluxes
that do not comply with Section 13.1, “Corrosiveness of Soldering Fluxes,” then
defects in the solder mask that could result in flux entrapment shall not be
permitted.
R6-69 [231] Solder mask coatings on PWBs shall meet the adhesion requirements of
Paragraph 3.5.2.1 of ANSI/IPC-SM-840D[47].
R6-70 [232] Particulate matter embedded in solder mask shall not bridge more than half
the distance between adjacent conductive elements, reduce inter-conductor spacing
to less than 0.0035 inch, or degrade the properties of the circuit below specified
requirements.
6–10
6.1.3.8 PWB Contact Fingers
The term “contact area,” as used here, is defined as the area that encompasses all
points that could be contacted by the mating connector contacts under all tolerance
conditions; it includes the area of wipe from the edge of the PWB to the fully mated
contact position, but excludes copper exposed by chamfering the leading edge of
the PWB.
R6-73 [235] Metallization, surface finish, and porosity requirements shall apply only to the
contact area of noble metal PWB contact fingers.
R6-74 [84] Regardless of the noble metal used or its thickness, suppliers of PWBs with
noble metal contact fingers, shall retain data related to thickness and porosity
measurements for a minimum of 1 year, and provide the same to the Network
Operator, or its designated representative, on request. Section 14.2.1, “Noble Metal
Contact Finishes,” contains suitable noble metal contact finish thickness
measurement methods.
R6-75 [87] Once a supplier establishes the porosity norm for a well controlled plating
process for PWB contact fingers, ongoing routine porosity data shall be used to
verify process control.
R6-76 [236] Noble metal finishes on PWB contact fingers shall be smooth and of uniform
color in the contact areas.
R6-77 [237] Noble metal plating on PWB contact fingers shall not be applied over solder.
R6-78 [238] Exposed copper shall not be permitted in the contact area of noble metal
PWB contact fingers.
R6-79 [239] To prevent excessive wear or roughness in noble metal PWB contact fingers,
nodular conditions shall be minimized consistent with industry standards or
approved equivalent.
R6-80 [240] Noble metal plated contact fingers shall not be tumbled or burnished with
steel wool or other abrasives that leave residues. All requirements shall be met after
burnishing or tumbling.
R6-81 [241] Solder spots, visible at 1.75× (using a standard 3 diopter lens) magnification,
shall not be permitted in the contact area of noble metal contact fingers. Higher
magnification may be used to determine the nature of spots visible at 1.75×.
R6-82 [242] There shall be no pinholes in the contact area of the noble metal contact
fingers. Pinholes are caused by defects in the PWB conductor and result in exposure
of the laminate.
R6-83 [243] Excessive touch-up (e.g., brush plating) of noble metal contact fingers shall
not be permitted. Stripping and re-plating are permitted.
6–11
GR-78-CORE
R6-84 [244] Noble metal contact finger repair/replacement processes shall be qualified to
the satisfaction of the Network Operator or its designated representative.
R6-85 [245] Noble metal contact finger repair/replacements shall be limited to 1% of

product (i.e., no more than 1% of PWBs of a particular code).
R6-86 [246] Subject to the 1% limit (i.e., only 1 in 100 PWBs may be repaired), contact
finger replacements shall not exceed 2 fingers on a single PWB.
R6-87 [247] Repaired PWB contact fingers shall meet all requirements.
6.1.3.9 Insulation Resistance Testing
Insulation resistance testing is intended as a control of PWB manufacturing

processes. Such testing is required whenever “non-conformant” pre-assembly fluxes
or other materials are employed, but testing remains an objective, even if
“conformant” fluxes or other materials are employed. Tests shall be conducted at
the prescribed frequency for each specified process and for each PWB
manufacturing line. Test coupons need not be related to a particular lot of PWBs, but
rather to a production period. Therefore, a PWB manufacturer supplying several
Network Operators may satisfy the following stated requirements with one test/
process/period/line.
6.1.3.9.1 Surface Insulation Resistance (SIR)
R6-88 [248] PWBs shall have a minimum insulation resistance of 1x104 megohms,
immediately before solder mask coating, when tested in accordance with
Section 14.4, “Insulation Resistance Testing.” This insulation resistance level applies
to the standard 0.050-inch spacing interlocking comb test pattern (Figure 14-1).
Section 14.4 details the constraints that apply to the use of other patterns.
R6-89 [249] For insulation resistance testing of PWBs before solder mask coating, initial
test frequency shall be weekly for each process by which PWBs are manufactured.
Ongoing frequency may be adjusted, based on performance, with the concurrence
of the Network Operator, or its designated representative. Ongoing frequency shall
be at least monthly.
R6-90 [250] For insulation resistance testing of PWBs before solder mask coating,
immediate process correction and retesting shall be performed upon a test failure;
no further product shall be passed until minimum insulation resistance
requirements are met. Test frequency shall be increased to at least once per week
after a failure; this frequency shall be maintained until 4 successive tests are passed.
R6-91 [251] If pre-assembly PWB manufacturing processes, such as the application of

solder, involve the use of materials that do not comply with Section 13.1,
“Corrosiveness of Soldering Fluxes,” PWBs shall have a minimum insulation
resistance of 7×104 megohms, after such processes, when tested in accordance with
6–12
Section 14.4, “Insulation Resistance Testing.” This insulation resistance level applies
to the standard, solder-mask-striped, interlocking comb test pattern (Figure 14-2).
Section 14.4 details the constraints that apply to the use of other patterns.
R6-92 [252] Initial test frequency for insulation resistance testing of PWBs after solder
mask coating shall be weekly for each process by which PWBs are manufactured.
Ongoing frequency may be adjusted, based on performance, with the concurrence
of the Network Operator or its designated representative. Ongoing frequency shall
be at least monthly.
R6-93 [253] For insulation resistance testing of PWBs after solder mask coating,
immediate process correction and retesting shall be performed upon a test failure;
no further product shall be passed until minimum insulation resistance
requirements are met. Test frequency shall be increased to at least once per week
after a failure; this frequency shall be maintained until 4 successive tests are passed.
6.1.3.10 Solvent Extract Conductivity Testing
Solvent Extract Conductivity (SEC) testing is intended as a control of PWB

manufacturing processes. Such testing is required whenever “non-conformant” pre-
assembly fluxes or other materials are employed, but testing remains an objective
even if “conformant” fluxes or other materials are employed. Tests shall be
conducted at the prescribed frequency for each specified process and for each PWB
manufacturing line. Tests need not be conducted for each lot of PWBs. Therefore, a
PWB manufacturer supplying several Network Operators may satisfy the following
stated requirements with one test/process/period/line.
R6-95 [255] PWB surface contamination shall not exceed 1 µg/cm2 sodium chloride
equivalent, immediately prior to solder mask coating, when tested in accordance
with Section 14.5, “Solvent Extract Conductivity Testing.” This contamination limit
applies to all processing lines and to production boards or panels, not test patterns.
It is not necessary to test each code; however, the code(s) selected for testing shall
represent the highest density/technology level being processed on a particular
processing line in the period represented by the test.
R6-96 [256] Pre-solder mask coating SEC testing shall be performed once per shift.
R6-97 [257] A 50% isopropanol/50% water mixture or a 75% isopropanol/25% water

mixture shall be used for the SEC testing.
R6-98 [258] For PWBs before solder mask coating, product rework and immediate
process correction shall be performed upon an SEC test failure; no further product
shall be passed until SEC requirements are met.
6–13
GR-78-CORE
R6-99 [259] If pre-assembly processes for PWBs, such as the application of solder, involve
the use of materials that do not comply with Section 13.1, “Corrosiveness of
Soldering Fluxes,” PWB surface contamination shall not exceed 1 µg/cm2 sodium
chloride equivalent, after such processes, when tested in accordance with
Section 14.5, “Solvent Extract Conductivity Testing.” This contamination limit
applies to all processing lines and to production boards or panels, not test patterns.
It is not necessary to test each code; however, the code(s) selected for testing shall
represent the highest density/technology level being processed on a particular
processing line in the period represented by the test.
R6-100 [260] Post-solder mask coating SEC testing shall be performed once per shift.

mixture shall be used for SEC testing.
R6-102 [262] For post-solder mask coating SEC testing, product rework and immediate
process correction shall be performed upon a test failure; no further product shall
be passed until SEC requirements are met.
6.1.3.11 Mechanical Damage
O6-104 [264] It is desirable that PWBs be free of mechanical damage. However, minor
damage can occasionally occur during the manufacturing process.
R6-105 [265] Damage to PWBs, however minor, shall not affect a significant percentage of
product.
R6-106 [266] Cracks shall not be permitted in PWB conductor patterns.
R6-107 [267] Cracks shall not be permitted between electrically isolated portions of PWB
conductor patterns.
R6-108 [268] Cracks shall not be permitted in PWBs between electrically isolated
conductor patterns and functional PTHs.
R6-109 [269] Cracks shall not be permitted between functional PTHs in PWBs.
R6-110 [270] Cracks in PWBs shall not be permitted to extend completely through the base
laminate from surface to surface other than from a peripheral mounting hole to the
closest board edge.
R6-111 [271] Cracks in PWBs shall not be permitted in the walls of holes used for mounting
face plates and card ejectors.
6–14
R6-112 [272] Chips in PWBs shall not be permitted under any portion of the conductor
pattern, including the contact fingers.
R6-113 [273] Chips in PWBs shall not be permitted if total laminate removed is more than
half the thickness of the board.
R6-114 [274] Tool marks in PWBs shall not cause delamination or damage the conductor
pattern.
R6-115 [275] Isolated defects in PWBs, including but not limited to indentations, nicks,
scratches, or pits in the contact area of the noble metal contact fingers, shall not
expose base metal.
R6-116 [276] Discoloration of PWBs due to charring is not permitted. Slight discoloration
due to thermal processes such as infrared reflow and solder mask curing is normal.
R6-117 [277] Dents in PWBs shall not cause cracking through the board or damage to the
conductor pattern.
R6-118 [278] Separation of PWB conductor patterns from the base laminate shall not
exceed that allowed in IPC-A-610D,[50] Paragraph 10.2.9.2, Class 2. Repairs of this
type of defect are not acceptable (see R6-140 [300]).
6.1.3.12 Laminate and Processing Defects
O6-119 [279] It is desirable that PWB laminates are defect free. However, defects
occasionally occur due to deficiencies in the laminate or PWB manufacturing
processes.
R6-120 [280] PWB laminate and processing defects, however minor, shall not affect a
significant percentage of product.
R6-121 [281] Gross cosmetic defects, such as crazing, which do not meet the
IPC-A-600G[45] Class 3 PWB requirements, shall not be permitted.
R6-122 [282] Gross cosmetic defects on PWBs such as measling and crazing, which cause
minimum spacing requirements to be violated, or exceed 50% of the physical spacing
between internal conductors, shall not be permitted.
R6-123 [283] Metallic particles, inclusions, blistering, delamination, or resin starvation

shall not cause minimum spacing requirements on PWBs to be violated.
R6-124 [284] Haloing, as defined in IPC-A-600G[45], shall not violate minimum spacing
requirements on PWBs.
6–15
GR-78-CORE
R6-125 [285] There shall be no weave exposure, as defined in IPC-A-600G[45], on PWBs.
6.1.3.13 Electrical
R6-126 [286] On PWBs, the dielectric resistance between any two isolated nets shall be
greater than 10 megohms. This test shall be made at room ambient temperature; pre-
baking is not permitted. This requirement may be satisfied by qualification and
periodic re-qualification testing; representative codes may be used to qualify a
family of PWBs (e.g., double-sided codes using 0.008-inch line-and-space
technology).
R6-127 [287] Where PWBs are subjected to “shorts-and-opens” testing, units shall comply
with IPC-9252[46], Class 3 requirements, except that midpoint testing specified by
IPC-9252, Class 3, is not required.
O6-128 [288] To avoid costly and potentially unreliable assembly level PWB repairs,
electrical testing of all PWBs is desirable. Automatic Optical Inspection (AOI) is a
viable alternative to electrical testing for double-sided PWBs.
Modern AOI systems are capable of performing sophisticated inspections at many

stages in the PWB manufacturing process, and analyzing the data collected, without
the need for dedicated test fixtures. They have the potential to replace visual
inspection for all types of PWBs, with greatly improved efficiency and accuracy, and
to replace electrical test for double-sided boards.
R6-129 [289] Electrical testing of PWBs shall not be used as an alternative to visual
inspection for compliance with dimensional requirements.
R6-130 [290] For high-voltage circuits, minimum test voltage shall equal maximum
operating voltage for the circuit. High-voltage testing, however, shall not be used to
determine the adequacy of interconductor spacings on PWBs; such tests have the
potential to degrade marginal circuitry and affect reliability.
R6-131 [291] High-current “fusing” tests shall not be used to determine the adequacy of
conductor width defects on PWBs. Such tests have the potential to degrade marginal
circuitry and affect reliability.
6.1.3.14 Repairs
R6-132 [292] Conductor short repairs shall be limited to a maximum of 6 per PWB,
provided a qualified polymeric coating (per Section 13.2, “Polymeric Coatings and
Adhesive Materials”) is subsequently applied to the affected area. The use of razors,
knives, etc., is permitted.
6–16
R6-133 [293] Repairs to the outer layer conductors of PWBs for open circuits shall not
exceed 5 for a single defect cause (such as a single scratch through up to 5 adjacent
conductors; however, the limit is 1 solitary defect per 100 square inches) per 100
square inches. For boards of less than 100 square inches, 5 repairs for a single defect
cause are permitted.
R6-134 [294] Repairs to the outer layer conductors of PWBs for open circuits shall be
limited to welded strap repairs unless equivalent reliability can be demonstrated for
alternate methods.
R6-135 [295] Open circuit repairs to PWBs shall only be permitted where there is sufficient
conductor material at either end of the repair to ensure adequate overlap of the
conductors for strap attachment; strap repairs at right angles to conductors are
typically not acceptable due to insufficient overlap.
R6-136 [296] Open circuit repairs to PWBs shall not encroach onto component mounting
pads or lands, test points, or contact fingers.
R6-137 [297] Open circuit repairs to PWBs shall not violate minimum spacing or dielectric
thickness requirements.
R6-138 [298] Where open circuit strap repairs to PWBs cross electrically isolated
conductors, the conductor or the strap shall be covered with an insulating material.
R6-139 [299] Solder mask or conformal coating shall be used to cover repairs of open
circuits in PWB outer layer conductors.
R6-140 [300] Repairs of lifted conductors and mounting pads on PWBs shall not be
permitted.
R6-141 [301] Repairs of PTHs in PWBs shall not be permitted.
R6-142 [302] Repairs to previous repairs of PWBs shall not be permitted. See Section 12,
“Repair and Modification of Customer Return Units,” for the restrictions that apply
to the repair of the PWBs of circuit packs returned from the field.
R6-143 [303] Repaired PWB products shall meet all requirements after repair.
6.1.3.15 Modifications — General
CR6-144 [304] Except for deliberately designed permanent changes, such as conductor cuts
to allow the use of one basic PWB design for several codes, modifications to bare
PWBs shall be short term in nature.
R6-145 [305] Subtractive modifications to PWBs (e.g., conductor cutting or through hole
disconnection), which may be achieved by simple artwork changes, without
6–17
GR-78-CORE
rerouting, shall only be permitted until such artwork changes can be implemented.
The finished product and work-in-process may be modified.
R6-146 [306] Modified PWBs shall be clearly identified (e.g., by raising issue or revision
levels), to avoid confusion with unmodified product.
The same identification may be used for PWBs after physical modification, and the
same product manufactured using modified artwork to achieve the same changes.
This only applies to simple subtractive modifications, and not to changes involving
rerouting or wiring changes at the assembly level.
R6-147 [307] Modifications to PWBs shall be limited to those specifically detailed in this
document. Other modification techniques may only be used with the prior approval
of the Network Operator or its designated representative.
R6-148 [308] Modified PWBs shall meet all requirements after modification.
6.1.3.16 Modifications — Subtractive
The term “Subtractive Modifications” refers to modifications that require the

removal of conductor material.
CR6-149 [309] Where practical, subtractive modifications to PWBs should be made before
the application of solder mask.
IP6-150 [310] Routing or drilling should be used for cutting conductors in the modification
of PWBs. Routing or drilling is preferred to the use of razors, knives, etc.; these may,
however, be used for modifying work-in-process.
R6-151 [311] Minimum dielectric thickness requirements shall not be violated when cutting
conductors for PWB modifications.
R6-152 [312] For subtractive modifications to PWBs, cuts are only permitted in conductor
runs; cuts in lands shall not be permitted unless the entire land is to be removed.
R6-153 [313] After subtractive modifications to PWBs, the area of the cut shall be cleaned,
and repaired using a qualified repair polymer. (See Section 13.2, “Polymeric
Coatings and Adhesive Materials.”) This requirement does not apply to
modifications made by routing or drilling through the board or where modifications
are made before solder mask coating.
R6-154 [314] Modifications to PWBs to remove PTH connections shall only be made by
drilling.
R6-155 [315] No metal shall remain in hole barrels after drill modifications to PWBs to
remove PTHs.
6–18
R6-156 [316] Modifications to PWBs to remove PTHs shall not violate minimum spacing
and dielectric thickness requirements.
R6-157 [317] Drilled-out holes in modified PWBs shall not be used for mounting through-
hole components in subsequent assembly operations unless
• They are plugged using a qualified repair polymer (see Section 13.2, “Polymeric
Coatings and Adhesive Materials”), unused mounting pads are overcoated with the
repair polymer, and the holes are re-drilled with an undersize drill, or
• The component lead is covered with an insulating sleeve, or
• Unused component mounting pads are completely removed (this applies only to
double-sided PWBs; removal of mounting pads is not an acceptable alternative
for multilayer PWBs).
6.1.3.17 Modifications — Additive
The term “Additive Modifications” refers to modifications requiring the addition of

conductors to PWBs.
R6-158 [318] Section 13.4, “Qualification of Additive Circuitry for Bare PWB
Modifications,” presents an alternative qualification method. Where applicable, the
testing outlined in Section 13.4 shall be passed.
R6-159 [319] Additive modifications to the outer layer conductors of PWBs shall be limited
to welded strap modifications unless equivalent reliability can be demonstrated for
alternate methods.
R6-160 [320] Welded strap modifications to PWBs shall only be permitted where there is
sufficient conductor material at either end of the repair to ensure adequate overlap
of the conductors for welding; strap repairs at right angles to conductors are
typically not acceptable due to insufficient overlap.
R6-161 [321] Welded strap modifications to PWBs shall not encroach onto component
mounting pads or lands, test points, or contact fingers.
R6-162 [322] Welded strap modifications to PWBs shall not violate minimum spacing or
dielectric thickness requirements.
R6-163 [323] If welded strap modifications to PWBs cross electrically isolated conductors,
the conductor or the strap shall be covered with an insulating material.
O6-164 [324] It is an objective that additive modifications to PWBs be made before solder
mask coating.
R6-165 [325] Additive modifications to PWBs shall be coated with a qualified solder mask
or repair polymer. (See Section 13.2, “Polymeric Coatings and Adhesive Materials.”)
6–19
GR-78-CORE
IP6-166 [326] Polymer thick film modifications to PWBs should not be used; however, they
may be acceptable, with the prior approval of the Network Operator, or its
designated representative.
R6-167 [327] Polymer thick film modifications to PWBs shall not violate minimum
dielectric thickness requirements (i.e., the thickness of dielectric between the PWB
conductors and the polymer thick film conductors shall be at least 0.004 inch).
R6-168 [328] Polymer thick film conductors used for PWB modifications shall be
terminated on a non-melting metal (e.g., copper), and not a melting metal (e.g.,
solder).
R6-169 [329] Polymer thick film materials used for PWB modifications shall not violate
minimum spacing requirements.
R6-170 [330] Silver loaded polymer thick film conductors shall not be used for PWB
modifications.
R6-171 [331] Polymer thick film conductors shall not be used for PWB modifications where
soldering to such conductors is required during subsequent processing.
R6-172 [332] Polymer thick film conductor materials used for PWB modifications shall
meet the electromigration requirements of Section 13.2.7, “Testing for Resistance to
Electromigration.” The following test samples shall be used:
• 0.0125-inch interlocking comb patterns, printed with the conductor material
under test on the dielectric to be used in manufacturing, and coated with solder
mask (bias shall be applied to the test patterns), and
• 0.0125-inch interlocking comb patterns, printed with the conductor material
under test and separated by 0.004 inch of the dielectric to be used in
manufacturing from a copper plane. Bias shall be applied between the patterns
and the copper plane.
R6-173 [333] Polymer thick film conductors used for PWB modifications shall be coated
with solder mask.
R6-174 [334] After exposure to thermal shock testing as detailed in Section 14.3.2,
“Thermal Shock Testing of Plated Through Holes (PTHs),” of this document,
polymer thick film conductors used for PWB modifications shall meet the adhesion
requirements of Section 13.2.3, “Adhesion,” over dielectric, laminate, and
conductors.
6–20
6.2 Multilayer PWBs — General Requirements
6.2.1 Design
R6-175 [335] Artwork designs for PWBs shall include allowances for laminate shift during
processing, to ensure that finished multilayer PWBs meet basic requirements (e.g.,
minimum spacing and hole breakout).
R6-176 [336] Insulation thickness between adjacent PTHs and conductors shall be a
minimum of 0.004 inch (0.0035 inch after accounting for isolated protrusions).
R6-177 [337] The distance between the edge of a copper conductor and the edge of a
multilayer PWB on all internal layers shall be 0.020 inch minimum. This requirement
only applies to copper that is electrically connected to the circuitry.
R6-178 [338] Nominal (design) insulation thickness between core metallization layers
(laminate) of multilayer PWBs shall be greater than 0.003 inch unless constructed
with low profile copper (e.g., flip double-treat or Reverse Treated Foils [RTFs]).
CR6-179 [339] When the nominal (design) insulation thickness between core metallization
layers (laminate) of multilayer PWBs is 0.003 inch or less, construction with low
profile copper is required (e.g., flip double-treat or Reverse Treated Foils [RTFs]).
CR6-180 [877] When the nominal (design) insulation thickness between core metallization
layers (laminate) separating two non-common electrical plane layers (e.g., power
and ground, or two power planes at different potentials) is 0.003 inch or less, the
finished PWB shall successfully pass a 500-VDC dielectric withstand test per IPC-
TM-650[11], 2.5.7, Condition A.
CR6-181 [878] When the nominal (design) insulation thickness between adjacent conductor
layers separated by prepreg materials (i.e., not core laminate materials) is less than
0.0032 inch, CAF-resistant materials are required. Materials are considered CAF-
resistant if they pass reliability data per IPC-TM-650[11], Method 2.6.25 (or
equivalent) at 65°C/85% relative humidity for 500 hours at a hole wall to hole-wall
spacing less than 0.020 inch.
R6-182 [879] The nominal (design) insulation thickness between two non-common
electrical plane layers (e.g., power and ground, or two power planes at different
potentials) separated by prepreg materials (i.e., not core laminate materials) shall
not be less than 0.0024 inch.
CR6-183 [880] When the nominal (design) insulation thickness between two non-common
electrical plane layers (e.g., power and ground, or two power planes at different
potentials) consists of single-ply prepreg materials (i.e., not core laminate materials)
6–21
GR-78-CORE
of 0.004 inch or less, the finished PWB shall successfully pass a 500-Vdc dielectric
withstand test per IPM-TM-650[11], 2.57, Condition A.
R6-184 [881] For all trace-to-plane or trace-to-trace layer constructions, the nominal
(design) insulation thickness between adjacent layers separated by prepreg
materials (i.e., not core laminate materials) shall not be less than 0.002 inch.
R6-185 [340] Insulation thickness between PTH walls and conductors shall not be less than
0.004 inch. Isolated protrusions on conductors between layers shall not reduce this
spacing to less than 0.0035 inch.
6.2.1.2 Interlayer Connections
R6-186 [341] Electrical connections between layers of multilayer PWBs shall be made by
using PTHs.
R6-187 [342] With the exception of microvias and buried core vias, buried vias (PTHs
between inner layers), and blind vias (PTHs between inner layer[s] and one outer
layer) in multilayer PWBs shall meet the same requirements as PTHs between outer
layers.
R6-188 [882] Microvias and buried via cores shall meet the requirements of IPC-6012B[42],
Class 2.
R6-189 [343] Except for leadless SMT components and similar packages that rely on PTH
for conduction cooling, thermal isolation shall be provided between PTHs used for
component mounting and large conductor areas (e.g., ground planes) on multilayer
PWBs.
O6-190 [344] This objective has been deleted per Issue 2.
6.2.1.3 Construction
R6-191 [345] With the exception of controlled-impedance designs (where construction

details are adjusted to provide specified electrical performance), finished
dimensions of multilayer PWBs (e.g., layer-to-layer dimensions, copper weights,
etc.) shall be specified by the PWB designer, and not left to the discretion of the PWB
manufacturer.
CR6-192 [346] To control bow and twist1, multilayer PWBs shall be of balanced construction
(i.e., the structure should be symmetrical about a reference plane centrally located
1. Other methods for controlling bow and twist may be acceptable.
6–22
between, and parallel to, the outer layers), unless there are sound technical reasons
for requiring an unbalanced structure.
Table 6-2 and Table 6-3 show an example of a balanced construction.

Modified or matched Thermal Coefficient of Expansion (TCE) designs may require
the use of unbalanced construction, as may the increased separation of the first two
layers of a backpanel to minimize potential damage due to pin insertion.
CR6-193 [347] To control bow and twist in multilayer PWBs, copper distribution shall be
symmetrical about the central reference plane, unless there are sound technical
reasons for requiring an unbalanced structure. Where practical, the largest copper
areas should be concentrated toward the center of the structure, with reducing
densities toward the outers.
For example, an 8-layer multilayer structure might be as Table 6-2 shows.
Table 6-2 8-Layer Multilayer Structure (Example Only)
Conductor Description
Layer 1 Pad only outer (1/2 oz. copper starting thickness)
Layer 2 Low density signal layer – x direction routing (1 oz.)
Layer 3 High density signal layer – y direction routing (1 oz.)
Layer 4 Power (2 oz.)
Layer 5 Ground (2 oz.)
Layer 6 High density signal layer – x direction routing (1 oz.)
Layer 7 Low density signal layer – y direction routing (1 oz.)
Layer 8 Pad only outer (1/2 oz. copper starting thickness)
CR6-194 [348] To control bow and twist,1 laminates and prepregs shall be used in multilayer
PWBs in a balanced fashion, unless there are sound technical reasons for requiring
an unbalanced structure. Table 6-3 shows an example.
R6-195 [349] To control bow and twist,1 consideration shall be given to laminate and
prepreg warp and fill in multilayer PWB structures.
In the example in Table 6-3, the 1/2 oz. outers should have warp and fill in the same
directions, as should the 1 oz. inners.
Table 6-3 8-Layer Multilayer Layup (Example Only) (Sheet 1 of 2)
Laminate (C-Stage)/Prepreg (B-Stage) Conductor

1/2 oz. clad single sided laminate (0.008 inch thick) Layer 1
Prepreg (0.002 inch thick)
1 oz. clad double sided laminate (0.010 inch thick) Layers 2 & 3
6–23
GR-78-CORE
Table 6-3 8-Layer Multilayer Layup (Example Only) (Sheet 2 of 2)
Laminate (C-Stage)/Prepreg (B-Stage) Conductor

1/2 oz. clad single sided laminate (0.008 inch thick) Layer 8
R6-196 [350] Single-ply prepreg constructions shall demonstrate proper fill and flow and
conform to CR6-181 [878] through R6-184 [881].
IP6-197 [351]This IP has been deleted per Issue 2.
6.2.2 Manufacturing
IP6-198 [352] This IP has been deleted per Issue 2.
6.2.2.1 Conductor Widths and Spacings
Conductor width and spacing requirements detailed in Section 6.1.3.2, “Conductor

Widths and Spacings,” of this document also apply to the inner layers of multilayer
PWBs.
R6-199 [353] Cross-sections of PTHs in multilayer PWBs shall be made routinely, per
Section 14.3.1, “Preparation of Cross-Sections,” to verify the absence of drill smear;
no smear is permitted.
R6-200 [354] Etchback and wicking in multilayer PWBs shall not exceed 0.003 inch. This
shall be demonstrated by routine cross-sections of PTHs per Section 14.3.1,
“Preparation of Cross-Sections.”
6–24
R6-201 [355] Negative etchback in multilayer PWBs shall not exceed 0.0005 inch. This shall
be demonstrated by routine cross-sections of PTHs per Section 14.3.1, “Preparation
of Cross-Sections.”
R6-202 [356] Where test coupons are used to monitor the quality of PTHs in multilayer
PWBs, the last “hit” of each drill (i.e., the last hole drilled by each drill) used for
functional PTHs shall be contained in such test coupons, and all shall be cross-
sectioned to demonstrate compliance with R6-199 [353] through R6-201 [355].
Other techniques, such as black oxide treatment before electroless copper
deposition followed by visual inspection (any copper color in the drilled hole equals
smear), may be used to demonstrate absence of drill smear.
R6-203 [357] Multilayer PWB test coupon traceability shall be maintained for a sufficient
time to allow screening in the event of a test coupon failure.
R6-204 [358] Whether or not test coupons are used to monitor the quality of PTHs in
multilayer PWBs, a cross-section shall be made to demonstrate compliance with R6-
199 [353] through R6-201 [355]. Such a cross-section shall intersect the last “hit”
of the largest and the last “hit” of the smallest drill sizes used for functional PTHs.
Other techniques, such as black oxide treatment before electroless copper followed
by visual inspection, may be used to demonstrate the absence of drill smear.
6.2.2.3 Insulation Resistance Testing — Inner Signal Layers
R6-205 [359] Inner signal layers of multilayer PWBs shall have a minimum insulation
resistance of 1×104 megohms, immediately before lamination, when tested in
accordance with Section 14.4, “Insulation Resistance Testing.” This insulation
resistance level applies to the standard 0.050-inch spacing interlocking comb test
pattern (Figure 14-1). Section 14.4 details the constraints that apply to other
patterns.
The Insulation Resistance test detailed in Method 2.6.3 of IPC-TM-650[11] may be

substituted for the above inner layer insulation resistance requirement. The
conformal coating may be omitted.
R6-206 [360] For insulation resistance testing of the inner layers of multilayer PWBs, the
test frequency shall be monthly for each process by which PWBs are manufactured.
R6-207 [361] For insulation resistance testing of the inner layers of multilayer PWBs,
immediate process correction shall be performed upon a test failure. No further
product shall be passed until minimum insulation resistance requirements are met.
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GR-78-CORE
6.2.2.4 Insulation Resistance Testing — Interlayer
R6-208 [362] Finished multilayer PWB test coupons per Method 5.8.4 of IPC-TM-650[11]
shall be subjected to static elevated temperature/humidity testing for 4 days at
35°C (±2°C), 90 (+5/-0) %RH per Class 2, Method 2.6.3 of IPC-TM-650[11] with the
100 Vdc polarization applied between adjacent layers of Specimen A, and measured
per Section 5.4 of Method 2.6.3; the minimum insulation resistance between layers
shall be a minimum of 1000 megohms. The insulation resistance shall be measured
at the end of the exposure period without removing the test sample from the
humidity chamber. If other test patterns are used for this test, the insulation
resistance requirement shall be adjusted to compensate for different electrode
areas, and so justified to the Network Operator or its designated representative. This
is a qualification test, and need only be repeated after material or major process
changes.
6.2.2.5 SEC Testing
R6-209 [363] Multilayer PWB inner layer surface contamination shall not exceed 1 µg/cm2
sodium chloride equivalent immediately before lamination (i.e., after oxide
treatment) when tested in accordance with Section 14.5, “Solvent Extract
Conductivity Testing.” This contamination limit applies to production inner layers,
not test patterns. It is not necessary to test each code; however, the code(s) selected
for testing shall represent the highest density/technology level being processed on a
particular processing line in the period represented by the test.
R6-210 [364] Pre-lamination PWB inner layer SEC testing shall be performed once per shift
for each processing line.

mixture shall be used for the SEC testing.
R6-212 [366] For inner layers of multilayer PWBs before lamination, product rework and
immediate process correction shall be performed upon an SEC test failure; no
further product shall be passed until SEC requirements are met.
6.2.2.6 Laminate and Processing Defects
R6-213 [367] Metallic particles, inclusions, blistering, delamination, or resin starvation

shall not extend under the conductor patterns of multilayer PWBs or cause the
minimum spacing requirements to be violated.
R6-214 [368] Laminate and processing defects shall not affect a significant percentage of
product (see R6-120 [280]).
6–26
6.2.2.7 Electrical Requirements
R6-215 [369] Multilayer PWBs shall meet the “Dielectric Withstanding Voltage” Class 3
requirements of IPC-6012B[42] using a voltage of 600 Vac (50 - 60Hz) applied for
1 minute or 1000 Vdc applied for 1 minute. This requirement may be satisfied by
qualification and periodic re-qualification testing; actual product or test coupons
may be used.
O6-216 [370] To avoid costly and potentially unreliable assembly level multilayer PWB
repairs, electrical testing of all inner signal layers, before lamination, is desirable.
AOI is a viable alternative.
R6-217 [371] Electrical testing of inner layers of multilayer PWBs shall not be used as an
alternative to visual inspection for compliance with dimensional requirements.
R6-218 [372] Neither high-current “fusing” nor high-voltage clearance tests shall be used to
determine the adequacy of PWB inner layer conductor width and spacing defects.
Such tests have the potential to degrade marginal circuitry and affect reliability.
6.2.2.8 Repairs — Inner Layers Before Lamination
R6-219 [373] Conductor short repairs shall be limited to a maximum of 6 per multilayer
PWB inner layer. The use of razors, knives, etc., is permitted. This operation shall be
conducted before oxide treatment and lamination.
O6-220 [374] It is an objective that repairs for open circuits not be made to the inner layers
of multilayer PWBs.
R6-221 [375] Where essential, repairs to the inner layer conductors of multilayer PWBs for
open circuits shall not exceed 5 for a single defect cause (such as a single scratch
through up to 5 adjacent conductors; however, the limit is 1 solitary defect per
100 square inches) per 100 square inches. For boards of less than 100 square inches,
5 repairs for a single defect cause are permitted.
R6-222 [376] Repairs to the inner layer conductors of multilayer PWBs for open circuits
shall be limited to welded strap repairs unless equivalent reliability can be
demonstrated for alternate methods.
6–27
GR-78-CORE
R6-223 [377] Open circuit repairs to multilayer PWBs shall not violate minimum spacing or
dielectric thickness requirements. To ensure compliance with this requirement,
worst-case conditions (coincident repairs to adjacent layers) shall be assumed
S – 2T > 0.004 inch

where: S = Separation between facing conductor layers
T = Thickness of a single repair.
6.2.2.9 Repairs — Finished Multilayer PWBs
R6-224 [378] Drill repairs to multilayer PWB shorts shall not exceed one per 100 square
inches of PWB surface area. Any two drilled repairs shall be greater than 1 inch
apart. For boards less than 100 square inches, 1 drilled repair shall be permitted.
R6-225 [379] Except for drill repairs per R6-224 [378], no inner layer repairs shall be
permitted on finished multilayer PWBs.
6.2.2.10 Modifications — Inner Layers Before Lamination
R6-226 [380] Modifications to inner layers of multilayer PWBs, before lamination, shall be
limited to subtractive (conductor cutting) modifications. Additive modifications
shall not be permitted.
R6-227 [381] Where subtractive modifications to the inner layers of PWBs are made by
drilling or routing, the PWB manufacturer shall provide satisfactory evidence that
such drilled holes are completely filled during lamination. Such evidence shall be
made available to the Network Operator, or its designated representative, upon
request.
R6-228 [382] Inner layer modifications to multilayer PWBs shall be made before oxide
treatment.
6.2.2.11 Modifications — Completed Multilayer PWBs
R6-229 [383] Modifications to completed multilayer PWBs shall comply with the
requirements in:
• Section 6.1.3.15, “Modifications — General”
• Section 6.1.3.16, “Modifications — Subtractive”
• Section 6.1.3.17, “Modifications — Additive.”
6–28
6.3 PWBs for Surface Mounting

PWBs for surface mounting are categorized by assembly soldering technology.
“Adhesive and Wavesolder” designs require the attachment of SMCs to the PWB by
means of non-conductive adhesive, with solder joints formed in a subsequent wave,
drag, dip, or jet soldering process. In “Reflow Solder” processes, the solder is first
applied to the mounting pads, normally as solder cream, and is then reflowed after
the placement of components. Various reflow techniques are used, including
infrared and vapor phase soldering.
Although many requirements are common, there are significant differences between
these two technologies. With “Adhesive and Wavesolder” processes, unlimited
solder is available for joint formation. In “Reflow Solder” processes, the joint is
limited by the quantity of solder delivered to the mounting pad before component
assembly.
6.3.1 General Requirements
6.3.1.1 Materials — Laminates
Surface-mount PWB designs including large leadless components (e.g., components

with >0.300 inch between the most widely separated solder joints), will require
substrates with TCEs more closely matched to the components (than FR-4 laminate)
to satisfy reliability requirements.
Section 7.3.3, “Reliability,” addresses assembly reliability.
R6-230 [384] Laminates used for surface-mount PWBs shall be capable of surviving
assembly soldering and repair temperature extremes and durations without
significant degradation.
In vapor phase soldering, for example, boards may be exposed to soldering

temperatures for 1 minute or more; this is considerably more severe than normal
exposure during a wavesoldering operation.
6.3.1.2 Materials — Solder Masks
R6-231 [385] Solder masks used on PWBs for surface mounting shall be capable of
surviving assembly soldering and repair temperature extremes and durations
without significant degradation.
Infrared soldering operations, for example, may cause high local temperatures and
differential heating, resulting in damage to marginally adherent solder masks.
6–29
GR-78-CORE
6.3.1.3 Design — Component Mounting Pads
R6-232 [386] SMC mounting pads on PWBs for components of a given type and size shall
be of similar size unless there are sound technical reasons for differences.
R6-233 [387] SMC mounting pads on PWBs shall be so designed as to ensure that all solder
joints remain separate. Common mounting pads (i.e., 2 or more pads connected
without any barrier to prevent solder joints merging) shall not be permitted.
R6-234 [388] Conductors connected to mounting pads for SMCs on PWBs shall be coated
with solder mask to prevent solder flow from such pads along the conductors.
O6-235 [389] For a given SMC, it is an objective that mounting pads on PWBs possess
similar heatsinking properties. It is desirable that design rules include the following:
• Standard dimensions for conductors connected to component mounting pads.
Such conductors should be relatively narrow (compared with the mounting pad)
for a minimum specified length from the mounting pad. Conductor widths of
0.010 to 0.012 inch are normally suitable.
• Standard thermal isolation schemes for component mounting pads that are part
of large copper planes.
CR6-237 [391] If “mixed technology” (i.e., a mix of through-hole mounted and SMCs) is used,
via holes located beneath leadless SMCs shall be tented or plugged subject to the
restrictions of Section 6.1.3.7, “Solder Masks.”
6.3.1.4 Design — Solder Masks
IP6-238 [392] If solder masks are used to define SMC mounting pads on PWBs (i.e., where
solder mask is deliberately applied to pads to delineate the areas to be soldered),
photoimageable (wet or dry film) solder masks should be used.
Because of bleed inherent with screen printed wet solder masks, these materials are
not typically suitable for defining component mounting pads, except where these
are located on large copper planes where flat topography will minimize bleed.
6.3.1.5 PWBs for Adhesive and Wavesolder Soldering Processes — Conductor Finish
IP6-239 [393] Solder mask over non-melting metals technology (e.g., solder mask over bare
copper) should be used for PWBs designed for adhesive and wavesolder surface-
mount soldering processes.
6–30
6.3.1.6 PWBs for Adhesive and Wavesolder Soldering Processes — Component Mounting
Pads
O6-240 [394] In PWBs for surface mounting and adhesive and wavesolder processing, it is
desirable that open via holes not be located in mounting pads for SMCs.
CR6-241 [883] If open via holes are located in SMT pads on the wave solder side, they shall
not be plugged or tented from either side of the board. This will help prevent gas
entrapment and ensure proper fill.
R6-242 [395] On PWBs for adhesive and wavesolder processing of SMCs, component
mounting pad extensions beyond the component terminations or leads shall be
sufficient to ensure proper solder joint formation under all tolerance conditions (i.e.,
worst-case tolerances for component body size, component lead or termination
position and size, and mounting pad position and size).
R6-243 [396] On PWBs for adhesive and wavesolder processing of SMCs, component
mounting pad extensions under the component bodies shall be such as to ensure
proper solder joint formation under all tolerance conditions (i.e., worst-case
tolerances for component body size, component lead or termination position and
size, and mounting pad position and size).
Typical pad designs for “adhesive and wavesolder” PWBs are the same width as
leadless component terminations, or narrower; extensions from component bodies
are relatively large to ensure that the solder wave is able to contact the pads under
worst-case conditions.
R6-244 [397] Consideration shall be given, at the design stage, to the orientation of the PWB
and components during the assembly wavesoldering process(es).
For example, footprints for two terminal components (chip resistors and
capacitors) should be positioned at right angles to the conveyor of the soldering
machine. This orientation minimizes the “shadowing” effect of the component, on
the mounting pads, during assembly soldering.
6.3.1.7 PWBs for Reflow Surface-Mount Soldering Processes — Conductor Finish
R6-245 [398] Solder mask over non-melting metals technology (e.g., solder mask over bare
copper) shall be used for PWBs designed for reflow surface-mount soldering, unless
tight control of solder joints during assembly soldering can be demonstrated for
solder mask over melting metals (usually solder over copper).
The use of conductor finishes that melt during assembly soldering can result in loss
of control of the volume of solder in reflowed solder joints.
6–31
GR-78-CORE
6.3.1.8 PWBs for Reflow Surface-Mount Soldering Processes — Component Mounting Pads
R6-246 [399] On PWBs for reflow soldering of SMCs, open through-hole via holes shall not
be located in component mounting pads unless adequate control of the volume of
the solder after assembly soldering can be demonstrated. The use of microvias in
SMT pads are acceptable without a demonstration of solder volume control after
assembly processing.
R6-247 [400] On PWBs for reflow soldering of SMCs, component mounting pad extensions
under the component bodies shall be such as to ensure proper solder joint formation
under all tolerance conditions (i.e., worst-case tolerances for component body size,
component lead or termination position and size, and mounting pad position and
size).
O6-248 [401] For leadless components, the distance between the inboard edges of pads
should be less than, or equal to, the minimum distance between leadless component
terminations.
O6-248 [401] is an objective, and not a requirement, since in some instances, it will
be very difficult to comply with. Also, typical pad designs for “reflow solder” PWBs
are wider than the leadless component terminations. Pads are extended beyond and
under leadless component bodies to ensure proper solder fillets at either end of the
component termination, and a significant thickness of solder between the
component termination and the mounting pad.
For designs for some infrared reflow soldering processes for the assembly of SMCs,
some pad exposure is necessary to ensure complete solder reflow during radiant
heating; insufficient pad exposure can result in incomplete solder cream reflow and
unreliable solder joints.
O6-249 [402] Consideration should be given, at the design stage, to the orientation of PWBs
for reflow soldering during the soldering process(es), to help ensure that solder
joints reach liquidous temperature in a preferred sequence.
O6-250 [403] The solder joints at either end of a component should melt simultaneously,
minimizing the occurrence of “tombstoning” (the surface tension of the solder at one
end of a component causing the component to stand up at right angles to the board).
O6-251 [404] On PWBs for surface mounting, footprints for two terminal components (chip
resistors and capacitors) to be wave soldered should be positioned at right angles to
the conveyor of the wave-soldering machine. Two terminal SMT components to be
reflow soldered may be oriented in any direction.
6–32
6.4 PWBs for Backpanels
6.4.1 Design
CR6-252 [405] Except for sound technical reasons, finished PWB PTH dimensions for press-
fit (e.g., conformant pin) connections, measured copper-to-copper, not tin/lead to
tin/lead, and drilled hole dimensions, shall be within the tolerance range specified
by the manufacturer of the backpanel pin/connector.
CR6-253 [406] Except for sound technical reasons, drilled hole pitches and positions in
backpanel PWBs shall be within the tolerance range specified by the backpanel pin
or connector manufacturer.
6.4.1.2 Method of Manufacture
R6-254 [407] When fabricating backpanel PWBs designed for use with press-fit pins or
connectors, careful attention shall be given to plating thickness distributions. That
is, the area of copper exposed to the plating process shall be reasonably consistent
for each face of the PWB; the side-to-side plating areas shall also be consistent. This
may be achieved by panel plating, copper balancing during design, or by adding
thieving for copper balancing of the outer layers by either the designer or fabricator.
6.4.2 Manufacturing
6.4.2.1 Drilling
O6-258 [411] To optimize hole diameter and positional accuracy, it is desirable that
backpanel PWBs are drilled one-up.
6–33
GR-78-CORE
R6-259 [412] For backpanel PWBs to be used with press-fit pins or connectors, both drilled
hole diameters, and finished hole diameters (copper-to-copper, not tin/lead-to-tin/
lead) shall be measured routinely in order to control the manufacturing process and
ensure that the product is within the tolerance range required.
R6-260 [413] Unless “pad-only” technology is used, where pattern plating processes are
employed in the manufacture of backpanel PWBs, actual product, not test coupons,
shall be used to make plating thickness measurements.
R6-261 [414] Where pattern plated PWBs are intended for use with press-fit connections,
finished hole dimensions shall be measured in both low current-density and high
current-density areas, i.e., hole diameters shall be measured in large areas of copper
such as ground planes, and in isolated areas with little surrounding copper.
6.5 Encapsulated Discrete Wire (EDW) Interconnection Boards

This section recognizes the role of EDW interconnection boards as a useful
alternative to a multilayer implementation for some speciality telecommunication
applications.
When processed with appropriate manufacturing controls, this product has proven
to be as reliable as multilayer interconnection boards. Applications have included
telecommunication network systems, commercial and military avionics, and high-
performance mainframes. Multiwire usage is necessary to meet either physical or
electrical enhancements. Such enhancements might include very high
interconnection densities, reduced weight and board thickness, superior controlled
impedance, or improved high-frequency performance.
Basic Construction
R6-262 [415] In general, construction of EDW boards shall be governed by the

requirements of IPC-DW-424[12], “General Specification for Encapsulated Discrete
Wire Interconnection Board,” but they shall also meet the Telcordia generic
requirements. In the event of a conflict between IPC-DW-424 and a Telcordia
requirement, the Telcordia requirement shall take precedence.
R6-263 [416] EDW boards shall meet the requirements for quality, reliability, and
environmental stress resilience contained in Section 3.0 of IPC-DW-424[12] as well as
applicable Telcordia requirements.
R6-264 [417] The printed circuit layers incorporated within an EDW board (normally used
to provide power and ground distribution but also sometimes used to provide signal
traces) shall meet the requirements of IPC-DW-424[12] in any instance not
specifically addressed by the Telcordia requirements for multilayer PWBs, including
those contained in this document.
6–34
R6-265 [418] The discrete wiring layers incorporated within an EDW board shall meet the
requirements of IPC-DW-424[12] in any instance not specifically covered by the
Telcordia requirements for multilayer PWBs, including those contained in this
document.
6–35
GR-78-CORE
6–36
GR-78-CORE Printed Wiring Board (PWB) Assembly Requirements
7 Printed Wiring Board (PWB) Assembly Requirements

7.1 General
These requirements apply to all PWB assemblies, including backplanes, regardless
of the technology used.
7.1.1 Materials
7.1.1.1 Conformal Coatings
R7-1 [419] Conformal coatings for assembled PWBs (circuit packs), in combination with
the laminates used, shall meet the fire resistance requirements detailed in Section
4.2 of GR-63-CORE[2].
R7-2 [420] Conformal coatings for PWB assemblies shall meet the requirements of
Section 13.2, “Polymeric Coatings and Adhesive Materials.”
7.1.1.2 Fluxes
R7-3 [421] Fluxes used in PWB assembly processes shall meet the requirements of
Section 13.1, “Corrosiveness of Soldering Fluxes.” This requirement applies to all
fluxes used in assembly, including repair fluxes.
7.1.1.3 Solders and Solder Pastes
O7-5 [884] SnPb-based solders and SnPb-based solder pastes should be used in the
assembly of PWBs for telecommunications equipment.
CR7-6 [885] Other solders may be used when there are sound technical reasons, such as
the use of high-melting temperature SnAg or SnCu for hierarchical soldering.
Reliability data supporting these alternative solder compositions shall be available.
CR7-7 [886] Pb-free solders and solder pastes may be used in place of SnPb only when
their reliability performance for the intended application is met and supporting data
has been presented in advance and accepted by the Network Operator or its
designated representative. SnPb reliability is to be used as a baseline to compare to
the performance of Pb-free solders and solder pastes. Acceptance is determined by
the Network Operator in accordance with industry standards.
7–1
GR-78-CORE
Printed Wiring Board (PWB) Assembly Requirements Issue 2, September 2007
CR7-8 [887] If SnPb component lead finishes are used with Pb-free assembly processes,
reliability data supporting their use in the application shall be provided and
accepted. Acceptance is determined by the Network Operator in accordance with
industry standards.
CR7-9 [888] If Pb-free BGAs are soldered with SnPb solder paste, reliability data
supporting their use in the application shall be provided and accepted. Acceptance
is determined by the Network Operator in accordance with industry standards.
7.1.2 Assembly Design
7.1.2.1 General
O7-10 [423] PWB technologies that result in exposed surface copper on the PWBs of
completed assemblies, including backpanels, should not be used in equipment that
may be deployed in uncontrolled (e.g., unsealed outside cabinets) environments.
Surfaces of copper covered by “bare copper organic solder preservatives” shall not
be considered “bare” in this context.
Section 5, “Wire and Cable Requirements,” contains requirements for wiring used in
PWB assemblies.
Accumulation of dust on telecommunications products can provide the potential for
electrical breakdown. Interconnection and circuit pack design rules need to include
adequate spacings or shielding to avoid surface bridging due to settling,
electrostatic, or thermophoretic deposition of dust. For example, electrostatic
deposition increases with increasing electrical fields.
R7-11 [424] Interconnection and circuit pack design rules shall include a limiting voltage
gradient between conductors and between connector parts (e.g., conductor
separation versus maximum applied voltage shall be specified).
R7-12 [425] Interconnection design rules shall specify minimum connector contact pitch
and density.
R7-13 [426] Interconnection and circuit pack design rules shall include an interconductor
voltage limit where wet (screen printed) solder masks are used. Above this voltage,
dry film or demonstrated equivalent photoimageable wet solder mask shall be used;
conformal coatings are a viable alternative.
R7-14 [427] Interconnection and circuit pack design rules shall include consideration of
shielding exposed device leads and connector pins to physically prevent harmful
accumulations of dust.
7–2
R7-15 [428] Where conformal coatings are used to protect all or part of the circuitry on
assembled PWBs from the effects of dust contamination, product repairability
methods shall be consistent with the coating used.
R7-16 [429] PWB mounted parts shall be attached securely using screws, nuts, washers,
insulators, bushings, etc., usual to such parts except where special mounting parts
or procedures are specified by the telecommunications equipment manufacturer.
R7-17 [430] Screws, nuts, etc., used for the mechanical attachment of parts or
subassemblies to PWBs, shall either be fitted with some type of locking feature (e.g.,
lock washers), or adhesive thread lock, to prevent them from working loose under
the influence of vibration, or shall be designed to be immune from the effects of
vibration.
IP7-18 [431] This requirement has been deleted per Issue 2.
IP7-19 [432] Circuit packs should be equipped with latches (ejectors) to assist mating and
removal, except where removal of an assembly from a frame could cause a serious
maintenance problem. See also R4-65 [121] and IP4-67 [122] for further
requirements related to latches.
R7-20 [433] Where removal of an assembly from a frame could cause a serious
maintenance problem, a special tool shall be required to prevent accidental removal.
R7-21 [434] Where either of a pair of threaded mating parts are made of aluminum or
aluminum alloy, an antiseize compound shall be used. Antiseize compounds shall
not contain silicone. This requirement only applies to parts that may require removal
during maintenance conducted by a Network Operator.
R7-22 [435] Assemblies requiring user testing, repair, or maintenance shall provide ready
access for such user testing, repair, or maintenance.
7.1.2.2 Components
R7-23 [436] Unless otherwise specified by the equipment designer for sound technical
reasons, passive devices (resistors and capacitors) with standard values shall be
used.
Requirements for electrical and electronic components are detailed in

GR-357-CORE[3].
R7-24 [437] Since soldering techniques used for surface-mount assemblies often subject
components to greater thermal stresses than conventional wavesoldering
techniques, component qualification tests shall be conducted after exposing
components for surface mounting to processing temperature extremes (e.g.,
immersion in molten solder). In view of possible changes due to mechanical
stresses, qualification tests for leadless components shall be conducted with the
7–3
GR-78-CORE
components mounted on a laminate similar to that to be used in manufacturing (e.g.,

FR-4 laminate).
R7-25 [438] Leaded components that are not mounted flush to the PWB, and could be
permanently deflected when subjected to the conditions detailed in GR-63-CORE[2],
Sections 4.3 and 4.4, shall be mechanically attached to the PWB besides being
secured by their lead connections.
R7-26 [439] Large electrolytic capacitors shall be mounted so their vent holes or plugs are
not blocked.
R7-27 [440] Components shall either be through-hole mounted or surface mounted. They
shall not be solely attached to the leads or terminals of other components. “Piggy-
back” mounting of components shall not be permitted (see Section 7.1.3.22 for
requirements applying to component modifications).
Section 4.1, “General,” contains component socket requirements.
R7-28 [441] Adjustable components shall be capable of maintaining adjustment over the
range of shipping and operating mechanical and thermal environments detailed in
GR-63-CORE[2]. If the component design is not adequate to ensure that settings are
maintained, such components shall be locked, either mechanically or with an
adhesive, after adjustment.
R7-29 [442] Socketed components shall be capable of maintaining their position over the
range of shipping and operating mechanical and thermal environments detailed in
GR-63-CORE[2]. If the component/socket design is not adequate to ensure that
position is maintained, such components shall be locked in their sockets.
IP7-30 [128] Component lead forms should be designed for insertion into sockets. The
flared (non-parallel) form normally supplied for automatic insertion into PWBs may
not be suitable for plug-in devices. Device “walk-out” can result from incorrect lead
forms.
R7-31 [443] Where insulators are used to provide electrical insulation between
components and their mounting plates, such insulators shall be capable of
1 minute.
R7-32 [444] Brass component leads shall have a barrier plate (e.g., copper or nickel)
before solder coating.
R7-33 [445] Component leads shall meet specified solderability requirements.
7–4
7.1.2.3 Layout — General
R7-35 [448] Axial leaded components should be mounted with their axes parallel to the
PWB.
R7-36 [449] To minimize dust and metal particle collection on the contact surfaces,
components such as jacks and keys that do not have their contacts enclosed or
protected by dust covers should be mounted so that spring contact surfaces are in a
vertical plane under normal use.
R7-37 [450] Components susceptible to handling damage or dislocation shall be

positioned to minimize the possibility of damage or dislocation (e.g., Single In-Line
Packages [SIPs]), shall not be located near the front or sides of circuit packs unless
they are rigidly mounted.
R7-38 [653] Where a mounting pad accesses a via or PTH, methods shall be taken to
preclude loss of solder to the via or PTH, such as:
• Dogbone interconnect
• Solder mask dam
• Microvia in pad
• Plated over via in pad.
Alternatively, additional solder volume can be used.
7.1.2.4 Layout — Thermal Considerations
R7-39 [451] Placement of components on PWBs shall consider heat dissipation and the
proximity of temperature-sensitive components and materials. Such placement shall
be consistent with requirements regarding layout, mounting, and clearances (e.g.,
temperature-sensitive wires and components shall be dressed or mounted away
from components such as vitreous enamel-type resistors or other components that
dissipate large amounts of heat).
R7-40 [452] Under all operating conditions, hot spot temperatures, measured at the
surface of the PWB, shall not exceed the Maximum Operating Temperature (MOT)
of the board materials as determined by ANSI/UL 746[48].
R7-41 [453] Charring (beyond brown discoloration) of PWBs resulting from the proximity
of heat-dissipating components shall not be acceptable.
R7-42 [454] Component temperatures, under worst-case operating conditions, shall not
exceed the maxima specified by the component manufacturer.
7–5
GR-78-CORE
7.1.2.5 Layout — Clearances
R7-43 [455] Clearances between uninsulated conductive surfaces shall not be less than
0.005 inch unless they are at the same circuit potential.
Exception: Isolated PWB defects as defined in R6-35 [199].

Necessary clearances between temperature-sensitive components, including
insulated wire, and components dissipating heat depend on several factors including
the size and surface temperature of such components.
R7-44 [456] Design clearances shall be based on worst-case heat dissipation (e.g., under
known fault conditions); they shall be sufficient to prevent thermal damage to
temperature-sensitive components and materials.
R7-45 [457] Clearances shall be specified by the designer to allow their control in
manufacturing.
As a guide, the following clearances have been historically specified for

telecommunications equipment:
• No less than 0.016 inch between temperature-sensitive components and
materials, including insulated wire, and components dissipating 0.5 watt or less.
materials, including insulated wire, and components dissipating between 0.5 and
2.0 watts.
materials, including insulated wires, and components dissipating more than 2.0
watts.
R7-46 [458] Bare leads of components assembled to PWBs shall be protected with
insulating sleeving if they are not sufficiently restricted from moving to ensure that
minimum clearances are met when the component or leads are moved to their most
adverse position.
R7-52 [464] Adequate spacing shall be provided, between the components and the PWB,
where free air circulation is necessary for component cooling.
7–6
7.1.2.6 Layout — Lead Forms
R7-54 [466] The leads of leaded components shall be of a form to provide stress relief
when the components are soldered in position (i.e., the leads shall provide some
compliance between the solder joints and the component bodies).
R7-56 [468] For heat-sensitive components, the distance between the component body
and the point of soldering shall be sufficient to prevent component damage (e.g.,
melted insulation) during soldering operations.
R7-57 [469] Component leads shall not be bent closer than twice their diameter or
thickness from their point of emergence (e.g., leads of 0.020 inch diameter or
thickness shall be straight for at least 0.040 inch from their point of emergence).
Where leads have been extended by soldering or welding other leads close to the
point of emergence, this dimension shall apply from the end of the overlap of the two
attached leads remote from the component body.
The above requirement applies only to lead forming conducted by the user, and not
to lead forms (e.g., IC lead forms) provided by the component manufacturer.
R7-58 [470] The inside bend radius for component leads formed by the user shall conform
to acceptable industry standards, as illustrated in Figure 6-16 of J-STD-001D[49], but
shall not be less than the diameter or thickness of the lead.
7.1.2.7 Separable Connections
Section 4, “Separable Connector Requirements,” contains requirements for

separable connection.
R7-59 [471] If PWBs are not protected with solder mask, PWB assemblies shall be
conformally coated. (See also Section 7.1.3.7, “Conformal Coatings.”)
Section 13.2, “Polymeric Coatings and Adhesive Materials,” contains conformal

coatings qualification requirements.
7–7
GR-78-CORE
7.1.3 Manufacturing
7.1.3.1 General
Manufacturers are encouraged to follow IPC-610D[50], Acceptability of Electronic

Assemblies, in the manufacture and assembly of PWBs. The following requirements
amend or emphasize the information contained in IPC-610D.
R7-60 [487] Components on PWBs shall be mounted, located, aligned, oriented, and
secured as specified by the equipment manufacturer, consistent with industry
standards.
R7-61 [472] “Loose shipped” circuit packs (i.e., circuit packs shipped separately as spares
or for growth, and not as part of a system), shall be processed in the same way as
circuit packs supplied as part of a system, e.g., if packs supplied with a system are
tested in a system configuration, then “loose shipped” packs shall be tested in a
system configuration or in an equivalent setup.
R7-63 [474] All parts of PWB assemblies shall be present, properly mounted, and free
from damage.
R7-64 [475] PWB assemblies shall be free of burrs, protrusions, or sharp edges that may
cause personal injury, damage to parts, or result in hazardous conditions.
R7-65 [476] PWB assemblies shall be free of foreign materials such as dust, dirt,
corrosion products, wire clippings, lint, etc., and excesses of materials specified by
the equipment manufacturer such as lubricants, varnishes, fluxes, solder, etc., of
such size and quantity as may cause hazardous conditions, operating failures,
decreased life, or increased maintenance.
R7-66 [477] Excessive flux residue on assembled PWBs shall not be permitted.
R7-67 [478] Wires and cables on PWB assemblies shall be protected from contact with
rough or sharp edges.
R7-68 [479] Conductors crossing uninsulated printed circuit paths on PWB assemblies
shall be insulated.
R7-69 [480] Temperature-sensitive insulated wires shall be dressed away from heat-
dissipating devices to comply with the requirements in Section 7.1.2.4, “Layout —
Thermal Considerations,” and Section 7.1.2.5, “Layout — Clearances.”
R7-71 [482] The bend radius for optical fiber cables on PWB assemblies shall conform to
the cable manufacturer’s specifications.
7–8
R7-72 [483] Forms of coaxial cable and optical fiber cable shall not be secured so tightly
that the circular cross-section is disturbed or any damage is caused.
R7-73 [484] Where necessary, component leads on PWB assemblies shall be clinched
• To hold the component prior to soldering
• To ensure electrical and mechanical integrity.
R7-76 [488] Torque requirements for threaded fasteners used in the manufacture of PWB
assemblies shall be specified. Threaded fasteners shall be tightened to the
equipment manufacturer’s specified values at assembly.
CR7-78 [490] Where practical, components having code markings shall be mounted on
PWBs so that these markings are visible after assembly.
R7-79 [491] Noble metal contact fingers on PWB assemblies shall not be burnished with
steel wool or other abrasives that leave residues. All requirements shall be met after
burnishing.
R7-80 [492] Care shall be taken throughout the manufacturing process when handling
PWB assemblies, particularly those with noble metal contact fingers (contact
fingers can easily be damaged or contaminated).
R7-81 [493] PWB assemblies shall not be stored in stacks during the manufacturing
process; racks or totes with provisions to physically separate PWB assemblies shall
be used.
R7-82 [494] All semiconductor devices and assemblies containing such devices shall be
treated as sensitive to Electrostatic Discharge (ESD). Manufacturing and handling
procedures shall be established in accordance with ANSI/ESD S20.20[52] and/or
JEDEC JESD 625-A[53] to protect semiconductor devices and assemblies from ESD
damage.
Any processes that involve the use of brushes after PWB assembly soldering, e.g.,
underbrush cleaning and brushing after lead trimming, have the potential to degrade
insulation resistance. Brushes become contaminated with solder and may deposit
thin, visually undetectable, films of solder on the surface of the PWB.
R7-83 [495] Any brushes used on components or PWB assemblies shall be ESD-safe, i.e.,
these brushes shall not generate static charges that exceed the limits specified in
Section 6.3 of TR-NWT-000870[51]. These brushes shall not mechanically damage the
surface of the board.
7–9
GR-78-CORE
R7-86 [498] Insulation resistance testing of post-solder brushing operations by processing

soldered test patterns per Figure 14-2 and testing to the requirements of
Section 7.1.2.8, “Conformal Coatings,” shall be used to determine brush
maintenance frequencies. For example, testing with worn brushes would provide a
bench mark for routine brush replacement.
7.1.3.2 Clearances
R7-87 [499] Minimum clearances between temperature-sensitive wire, components and

materials, and heat-dissipating components shall be as specified by the designer (see
Section 7.1.2.5, “Layout — Clearances.”)
IP7-88 [500] Gaps between components and PWBs should be minimized, to ensure that
minimum spacing requirements are not violated with components in their most
adverse positions.
R7-89 [501] Welding, riveting, crimping, and other fastening methods used on PWB
assemblies shall be secure and meet industry standards or approved equivalents.
7.1.3.3 Solderability
R7-91 [503] All components shall meet the solderability requirements of GR-357-CORE[3].
The above tests are qualitative, rather than quantitative. The use of commercially-
available solderability testers that monitor wetting forces and times, and therefore
provide a quantitative measure of solderability, is preferred.
7.1.3.4 Soldering
R7-92 [509] Soldered connections shall meet IPC-A-610D[50], Acceptability of Electronic

Assemblies, Class 2, requirements.
7–10
R7-96 [508] During PWB assembly, when hand soldering close to the body of heat-
sensitive devices, a heat conducting device shall be used, if necessary, to restrict the
heat flow into the component.
O7-97 [506] Solder joints on PWB assemblies should not adversely affect the compliance
provided by component lead forms, or abut the body of leaded components.
Ideally, solder joints on PWB assemblies should not affect the compliance provided
by component lead forms or abut the body of leaded components. In some instances,
the solder joint will fully wet the component lead or abut the body.
CR7-98 [889] When solder joints abut the body of the lead components or the solder joint
fillets adversely affect the compliance provided by the lead forms, the equipment
manufacturer shall ensure that the resulting component solder joint reliability is
sufficient for the design life of the product.
R7-100 [511] Bulk solder in soldering machines used for PWB assembly soldering shall be
analyzed regularly and replaced or appropriately cleaned when contamination
reaches detrimental levels. Frequency of analysis may be determined based on
historical data. If no such data exists, initial analysis frequency shall be once a
month.
R7-101 [512] Contaminants in the bulk solder of soldering machines shall not exceed the
limits specified in J-STD-001D[49], Requirements for Soldered Electrical and
Electronic Assemblies.
R7-102 [513] Appropriate monitoring of assembly soldering process parameters (e.g., flux
maintenance, pre-heat temperatures, solder temperatures, contact time, etc.) shall
reflect conservative industry practices for both wave and reflow soldering.
Frequency of analysis may be determined based on historical data. If no such data
exists, initial analysis frequency shall be, as a bare minimum, once per month even
for relatively stable parameters such as the temperature profile. Some parameters,
such as the top-side preheat temperature for wavesoldering, must be critically
watched, and should be monitored much more frequently, e.g., once per shift.
7.1.3.5 Bow and Twist
R7-103 [514] Bow and twist of assembled PWBs shall not be acceptable if it may cause
difficulties
• With their insertion or removal
• In maintaining adequate clearances to adjacent boards or frames
• In ensuring proper contact with connectors.
7–11
GR-78-CORE
R7-104 [515] Blistering, cracking, and peeling of solder mask coatings on PWB laminates
shall be in accordance with IPC-A-610D[50], Acceptability of Electronic Assemblies,
Class 3.
R7-107 [518] Where conformal coatings are used instead of solder mask, such coatings
shall cover all circuitry except pads required for connection after assembly (e.g.,
PWB contact fingers).
Exceptions:
1. Conformal coating is not essential between mounting pads for multi-leaded
devices (e.g., ICs), if there are no conductors between such pads.
2. Conformal coating is not essential on conductors between the mounting pads for
multi-leaded devices when the spacings between the conductors and mounting
pads are equal to or greater than 0.020 inch.
3. “Pad-only outer” PWB designs consisting of a “checkerboard” of pads (e.g.,
0.062 inch square pads on 0.100 inch centers) with no external interconnections
do not require conformal coating if there is a minimum of 0.020 inch between
pads.
4. “Pad-only outer” PWB designs with only functional pads (pads for component
mounting, interlayer connection, or testing) with no external connections do not
require conformal coating.
5. Bare spots in conformal coatings (e.g., skips and pinholes) shall not collectively
expose more than 1% of the intended coated area of conductors.
6. Bare spots in conformal coatings shall not expose adjacent conductor paths less
than 0.020 inch apart.
7. Conformal coating is not required on RF traces where its application would
electrically degrade the circuit performance.
8. Conformal coating is not required on bare traces that do not support active
circuits.
7–12
7.1.3.8 Insulation Resistance Testing
Insulation resistance testing is an objective as a control of PWB assembly cleaning

processes. Tests should be conducted at the prescribed frequency for each PWB
assembly cleaning line. Test coupons need not be related to a particular lot of PWB
assemblies, but rather to a production period. Therefore, an equipment supplier may
satisfy the following requirements with one test/process/period/line.
O7-108 [521] Initial test frequency should be weekly. Ongoing frequency may be adjusted,
based on performance, with the concurrence of the Network Operator or its
designated representative. Ongoing frequency shall be at least monthly.
O7-109 [519] Assemblies should have a minimum insulation resistance of 7,000 megohms
when tested according to Section 14.4, “Insulation Resistance Testing.” This
insulation resistance level applies to the standard, solder-mask-striped, interlocking
comb test pattern (Figure 14-2) processed through the standard production
soldering and cleaning operations. Section 14.4 details the constraints that apply to
the use of other patterns.
O7-110 [520] Where conformal coatings are used in place of solder mask, PWB assemblies
should have a minimum insulation resistance of 1×104 megohms, immediately
before the application of conformal coating, when tested according to Section 14.4,
“Insulation Resistance Testing.” This insulation resistance level applies to the
standard 0.050-inch spacing interlocking comb test pattern (Figure 14-1) processed
through the standard production soldering and cleaning operations. Section 14.4
details the constraints that apply to the use of other patterns.
O7-111 [522] Immediate process correction and retesting should be performed upon a test
failure; no further product should be passed until minimum insulation resistance
requirements are met. Test frequency should be increased to at least once per week
after a failure; this frequency should be maintained until four successive tests are
passed.
NOTE: Where the use of “no-clean” assembly soldering processes would

distort insulation-resistance test results, alternate approaches may be
proposed to the Network Operator or its designated representative to
demonstrate that non-conformant materials do not compromise long-
term reliability.
7.1.3.9 SEC Testing
SEC testing is an objective as a control of PWB assembly cleaning processes. Tests

should be conducted at the prescribed frequency for each PWB assembly cleaning
line. Tests need not be conducted for each lot of PWB assemblies. Therefore, an
equipment supplier may satisfy the following requirements with one test/process/
period/line.
7–13
GR-78-CORE
O7-114 [526] Routine SEC tests should be performed as a cleaning process monitor. A
specific contamination limit may not be meaningful, but contamination level data
should be plotted and sudden changes investigated.
O7-115 [525] A 50% isopropanol/50% water mixture or a 75% isopropanol/25% water

mixture should be used for the SEC testing.
7.1.3.10 Lubrication
Section 4.1.2, “Lubrication,” contains lubrication requirements for separable

connections.
Lubrication of PWB connectors may be included as part of the PWB assembly
process, or as part of the frame/rack assembly processes.
CR7-116 [890] If pre-lubricated socketed devices are not used, application of socket
lubrication (if required) shall be part of the assembly process.
CR7-117 [891] Lubrication on pre-lubricated connectors must be verifiable after assembly

processes are complete.
7.1.3.11 Mechanical Damage and Defects
R7-118 [527] PWB assemblies shall be free of mechanical damage and defects as defined in
IPC-A-610D[50], Acceptability of Electronic Assemblies, Class 3.
7.1.3.12 Repair of PWB Assemblies — General
R7-122 [531] Repaired PWB assemblies shall meet all requirements after repair.
R7-123 [532] Repairs to previous repairs of PWB assemblies shall not be permitted.
7–14
R7-125 [534] PWB assemblies that have never been shipped to the Network Operator, but
have been repaired because of failure during factory test shall be processed through
the entire testing cycle (e.g., circuit pack level, system level, burn-in) required for
unrepaired units.
7.1.3.13 Repair of PWB Assemblies — Component Removal and Replacement
R7-126 [892] Component removal and replacement repairs to PWB assemblies shall
conform to those listed in IPC-7711[54], as applicable, and the completed repair shall
conform to IPC-A-610D[50], acceptability standard, as well as conform to all
requirements listed within this standard (i.e., solder used, conformant fluxes,
damage and/or other workmanship criteria within this standard).
CR7-127 [893] When a clinched component is removed, damage to the assembly shall be
avoided. It is permissible to cut the leads of the component and remove individually.
O7-128 [894] Through-hole mounted components, when removed with a general purpose
soldering iron, should have the iron applied to the non-component side of the
assembly, in relation to the component being removed.
O7-129 [895] Components soldered to an assembly and removed should not be reused.
CR7-130 [896] If a removed component is intended for reuse, care shall be taken to prevent
thermal or other damage.
R7-131 [535] This requirement has been replaced by R7-126 [892] through CR7-130 [896]
per Issue 2.
per Issue 2.
per Issue 2.
per Issue 2.
per Issue 2.
per Issue 2.
per Issue 2.
7–15
GR-78-CORE
per Issue 2.
per Issue 2.
per Issue 2.
7.1.3.14 Repair of PWB Assemblies — PWB Repairs
R7-141 [545] PWBs burned or charred before shipment to a Network Operator shall not be
repaired. See Section 12.3, “Repairs,” for the restrictions that apply to the repair of
customer plug-in units.
R7-142 [546] Failures of pre-tested PWBs in PWB assemblies shall result in failure analysis
to determine the cause of failure, and corrective action to prevent the recurrence of
such failures.
R7-143 [547] The restrictions applied to bare PWBs for repairs shall also apply to the
boards of assembled PWBs. (See Section 6.1.3.14, “Repairs.”)
Exception: Open circuits of known cause may be repaired using insulated

wires. In this case, the restrictions of Section 7.1.3.17 through Section 7.1.3.21
shall apply.
7.1.3.15 Modifications to PWB Assemblies — General
R7-144 [548] Only modifications to PWB assemblies specifically detailed in this section
shall be permitted without the prior approval of the Network Operator or its
designated representative.
R7-145 [549] Modified PWB assemblies shall be clearly identified (e.g., by raising issue or
revision levels) to avoid confusion with unmodified products.
7.1.3.16 Modifications to PWB Assemblies — Wiring Design
R7-147 [551] Modification wire routings, application, and fastening methods for PWB
assemblies shall be specified and documented per the requirements of this section
and Section 7.1.3.17 through Section 7.1.3.21.
7–16
O7-148 [552] Insulated wire with PTFE (Polytetrafluoroethylene) or similar temperature-

resistant insulation is preferred for wiring modifications to PWB assemblies.
Exception: Short “jumper” modifications (<1 inch) that do not cross
uninsulated conductors may be made using uninsulated solid wire (e.g., tinned
copper wire).
R7-149 [553] The insulation of modification wiring for PWB assemblies shall be capable of
1 minute.
CR7-150 [554] Where PWB assemblies have components mounted on only one side of the
board, modification wires shall, where practical, be mounted on the component
side.
R7-151 [555] A unique color shall be used for modification wires on PWB assemblies; this
shall be different from the colors used during normal manufacturing.
Modification wiring, adhesives, and mechanical fastenings are subject to the

flammability requirements referenced in Section 3.2.1, “Fire Resistance
Requirements.”
7.1.3.17 Modifications to PWB Assemblies — Wire Routing
The shortest orthogonal (x, y) routings shall be used for modification wiring on PWB
assemblies unless technical justification warrants otherwise. Routing modification
wires together to allow harnessing and the use of common fastenings, and
Electromagnetic Interference (EMI) considerations are examples of technical
justifications for not using the shortest orthogonal routing for each wire.
R7-152 [556] Modification wires on PWB assemblies shall not be routed over components
of any type.
R7-153 [557] Modification wires on PWBs shall not be routed under SMCs of any type.
R7-154 [558] The routing of modification wires under the leads of through-hole mounted
axial leaded components shall be permitted if the wire insulation is able to withstand
short exposures to soldering temperatures (e.g., PTFE).
R7-155 [559] If the wire insulation is able to withstand short exposures to soldering
temperatures, the routing of modification wires on PWB assemblies under through-
hole mounted radial leaded components (e.g., dip encapsulated tantalum
capacitors) shall be permitted if there is sufficient space to facilitate such routing
without difficulty and without the need to move such components.
R7-156 [560] Modification wires on PWB assemblies shall not be routed under ICs and
other multi-leaded components.
7–17
GR-78-CORE
Exception: Certain through-hole mounted IC sockets have a sufficiently high

profile to allow modification wire routing without difficulty or the risk of
damage.
The requirements of Section 7.1.2.5, “Layout — Clearances,” with respect to the

proximity of heat-dissipating components, apply to the routing of modification wires
on PWB assemblies.
7.1.3.18 Modifications to PWB Assemblies — Wire Preparation
7.1.3.19 Modifications to PWB Assemblies — Soldering of Modification Wires
CR7-159 [563] Modification wires on PWBs shall, where possible, be inserted into PTHs and
soldered in position.
R7-160 [564] On PWB assemblies, the insertion of modification wires into component lead
mounting holes shall be acceptable if
• The mounting hole is sufficiently large to accept both the modification wire and
the component lead.
• The modification wire is, where practical, inserted from the component side of
the PWB and the solder is melted from the opposite side.
R7-161 [565] Where PTH installation of modification wires on PWB assemblies is not
possible, lap soldering of modification wires to surface-mount pads, vias, through-
holes, and even traces, can be performed if IPC-A-610D[50], Acceptability of
Electronic Assemblies, requirements are met. The gap between the end of the
surface-mount pad or annular ring of the hole and the stripped insulation on the wire
shall ensure that the minimum clearance requirement (R7-42 [454]) of 0.13 mm
(0.005 inch) shall not be violated. No spacing between adjacent conductors, pads, or
component leads shall be reduced by more than 30%. There shall be no wire
insulation within the solder. Proper wetting of the wire and the pad/annular ring
shall exist. Where surface soldered wires are used, the wire immediately next to
each solder joint shall be secured per Section 7.1.3.20, “Modifications to PWB
Assemblies — Securing of Modification Wires.”
CR7-162 [566] Modification wires on PWB assemblies released to manufacturing may be

soldered directly to component leads or terminations only if appropriate through
holes or SMT pads are unavailable as alternative soldering locations.
Prototype board assemblies, with established plans to re-spin, and containing not
more than five modification wires, may be temporarily permissible for a period not
exceeding 6 months.
7–18
R7-163 [567] Before beginning a modification process per CR7-162 [566], the supplier
shall have initiated a documented process for revised artwork for the circuit packs
in question in order to place a numerical bound on the numbers of circuit packs to
receive such modifications.
The solder joint requirements of

• Section 7.1.3.4, “Soldering,”
• Section 7.2.2.1, “Soldering — PTH Solder Joints,”
• Section 7.2.2.2, “Soldering — Non-PTH Solder Joints,”
apply to modification wire solder joints on PWB assemblies.
7.1.3.20 Modifications to PWB Assemblies — Securing of Modification Wires
R7-166 [570] Modification wires on PWB assemblies shall be secured to the PWB; wires
shall not be secured to components or component leads.
R7-167 [571] Adhesives used to secure modification wires shall not spread to adjacent
components or solder joints.
O7-168 [572] Modification wires on the same sides of PWB assemblies as components
should be secured sufficiently to ensure that they cannot be lifted above the height
of the lowest component next to the run, subject to a 1/8 inch maximum. This
objective provides some assurance that R7-170 [574] will be satisfied, even for
instances where the PWB assembly is used in applications not originally included in
the original design.
O7-169 [573] Modification wires on the sides of PWB assemblies without components
should be secured sufficiently to ensure that they cannot be lifted more than
1/8 inch. This objective provides some assurance that R7-170 [574] will be satisfied,
even for instances where the PWB assembly is used in applications not included in
the original design.
R7-170 [574] Modification wires on PWB assemblies shall be secured sufficiently to ensure
they cannot be lifted enough to cause fouling with adjacent PWB assemblies during
insertion into, or removal from, a shelf or frame.
R7-171 [575] Modification wires on PWB assemblies shall be secured sufficiently to ensure
that in their most adverse position, such wires meet the requirements of
Section 7.1.2.5, “Layout — Clearances,” with respect to the proximity of
heat-dissipating components.
7–19
GR-78-CORE
R7-172 [576] Modification wires on PWBs shall not contact sharp edges.
Qualification requirements for adhesives used to secure modification wires are

contained in Section 13.2, “Polymeric Coatings and Adhesive Materials.”
R7-173 [577] If thermal curing adhesives are used to secure modification wires to PWB
assemblies, the curing temperature shall not exceed the maximum storage
temperature of any of the components used on the circuit pack or backpanel, or the
Tg (glass transition temperature) of any of the polymeric materials used in the
assembly.
R7-174 [578] Adhesives used to secure modification wires to PWB assemblies shall be
compatible with the solder mask/conformal coating and the modification wire
insulation to which they are attached.
R7-175 [579] Adhesives used to secure modification wires to PWB assemblies shall
maintain their adhesive properties for the design life of the equipment.
R7-178 [582] Mechanical fastenings used to secure modification wires to PWB assemblies
shall not damage the insulation on the modification wires and shall maintain
adequate hold-down characteristics for the life of the equipment.
7.1.3.21 Modifications to PWB Assemblies — PWB Modifications
7.1.3.22 Modifications to PWB Assemblies — Components
7–20
R7-185 [589] Except for surface-mount additions subject to the restrictions of R7-243
[645], components added to PWB assemblies for modification shall be through-hole
mounted, subject to the following:
• Where practical, unused through holes shall be used.
• Through holes already containing component leads may be used if there is
sufficient room for additional leads.
R7-186 [590] Modification components added to PWB assemblies using through holes
occupied by an existing component shall be mounted on the same side of the PWB
as the original component(s).
R7-188 [592] This requirement has been deleted per Issue 2
R7-189 [593] The leads, or the profiles of the leads, of modification components added to
the through holes occupied by original components on PWB assemblies, and the
leads of the original components, shall be visible from the non-component side of
the PWB after soldering.
R7-190 [594] Components added for the modification of PWB assemblies shall not be
solely attached to other component leads or terminals. “Piggy-back” mounting of
components shall not be permitted unless the leads of both components are
soldered into PTHs.
CR7-191 [595] Where practical, the addition of components for the modification of PWB
assemblies shall not require the removal of original components.
7.2 PWB Assemblies — Through-Hole Mounted Components
R7-192 [596] Potting compound meniscus on the components of PWB assemblies shall be
controlled to ensure that, with components fully seated, the meniscus on the leads
does not enter the PTHs of the PWB.
7.2.2 Manufacturing
7.2.2.1 Soldering — PTH Solder Joints
R7-193 [597]This requirement has been deleted per Issue 2.
7–21
GR-78-CORE
O7-197 [601] In PWB assemblies, each PTH solder joint should have a solder connection
that covers at least 75% of the conductor land available for soldering on one side of
the board and have an acceptable fillet above the surface of that side of the board.
The solder on the opposite side may be recessed below the surface of the board.
CR7-198 [602] Where large areas of copper (e.g., ground or power planes) or other heat sinks
(e.g., heavy component leads) are connected to PTHs in PWBs, or pin-in-paste
processes are used on thick PWBs and O7-197 [601] cannot be met due to these
design or process considerations, hole fill shall be sufficient to ensure that the
minimum pin-wetted length within the barrel is at least .047 inch regardless of board
thickness.
Figure 7-1 Schematic Representation of a Minimum Pin-Wetted Length
R7-200 [604] Components, terminals, hardware, or other items that are fastened to the
PWBs of PWB assemblies by spinning, swaging, or similar operations and that
require electrical connection to the conductor pattern shall exhibit a source side
fillet that wets a total of at least 180 degrees of the periphery of the fastening device
and the land.
7–22
7.2.2.2 Soldering — Non-PTH Solder Joints
7.2.2.3 Compliant Pin
R7-205 [71] For PWB-mounted connectors or other components employing press-fit

(compliant pin) technology, the minimum average copper thickness in the PTH
remaining between the pin and the laminate, averaged over a 10-hole microsection
sample, shall be no less than 0.0003 inch. In addition, there shall be no copper cracks
or other interplane separation from the PTH barrel or separations between the PWB
laminate and the barrel. These requirements apply after initial insertion and after
replacement of the connector or component.
7.3 PWB Assemblies — Surface Mounted Components (SMCs)
7.3.1 Materials
7.3.1.1 Solder Pastes — Incoming Material Controls
Since consistency is one of the keys to the success of assembly soldering processes
using solder paste, it is essential that these materials are subject to some kind of
rigorous control before their use in manufacturing. As with electronic components,
several different approaches may be used; all are directed at ensuring that only
solder pastes meeting all requirements are used in production.
R7-210 [613] One of the following methods shall be used to ensure the adequacy of solder
pastes before they are used in production:
7–23
GR-78-CORE
• Provision of lot-by-lot data by the supplier of the solder paste; such data might
include the following:
— Viscosity
— Solids contents
— Particle size, shape, and distribution
— Tendency to produce solder balls during reflow.
If this approach is used, supplier’s data shall be periodically verified (e.g., every
6 months).
• Incoming inspection of solder pastes by the user
• A “use” acceptance test. Here, samples1 should be prepared for each application
and reflow process to be used in manufacturing. The following are examples of
parameters that may be monitored:
— Wet print thickness
— Print definition
— Weight of solder paste dispensed
— Tendency to produce solder balls during reflow.
7.3.1.2 Solder Pastes — In-Process Controls
R7-211 [614] Shelf-life or “use-before” restrictions specified by the solder paste

manufacturer shall be observed for solder pastes used in PWB assembly. Out-of-
shelf-life materials shall not be used in manufacturing.
R7-212 [615] Solder pastes for PWB assembly shall be stored under the conditions
recommended by the solder paste manufacturer.
R7-213 [616] During PWB assembly, frequent checks of key parameters shall be made in-
process to ensure consistency of solder paste delivery and performance. As a
minimum, the following parameters shall be monitored:
• Wet print thickness or weight of solder paste dispensed
• Print definition
• Tendency to produce solder balls during reflow.
The useful life of solder paste in-process is limited, depending on the application
process used and the particular material.
1. Actual product or specially designed test patterns may be used for the above tests.
7–24
R7-214 [617] Appropriate restrictions shall be placed on the length of time solder paste
may remain in use in PWB assembly processes. For example, the useful life of solder
paste after application to a stencil for printing may be measured in hours.
R7-215 [618] Solder paste that has been exposed to air for a significant length of time shall
not be reused. For example, solder paste from a printer shall not be returned to
storage after several hours on the screen.
R7-216 [619] After solder paste used in PWB assembly has been removed from its original
container and applied to the stencil of a printer, it shall not be returned to the
container and mixed with fresh material.
R7-217 [620] If reflow soldering processes are used with solder compositions possessing a
wide pasty range, in-process controls shall ensure that the
• Solder exceeds the liquidus temperature during the reflow process
• Time and temperature above the liquidus temperature are sufficient for proper
joint formation.
As Section 13.2, “Polymeric Coatings and Adhesive Materials,” states, solder masks
for use in surface-mount assembly processes shall be capable of withstanding
processing temperature extremes encountered in such processes. These are often
considerably more severe than extremes encountered in conventional
wavesoldering processes.
7.3.1.4 Adhesives
R7-218 [621] Non-conductive adhesives used for component mounting on PWB assemblies
shall be tested to determine the degree of slumping that occurs during curing. To
minimize the risk of mounting pad contamination, only adhesives with minimal
slumping characteristics shall be used.
R7-219 [622] The Tg (glass transition temperature) of permanent non-conductive adhesives

used for component attachment to PWB assemblies should be relatively low
(<100°C) to facilitate component removal without the need for excessive heat or
mechanical force.
Qualification requirements for permanent non-conductive adhesives (i.e., adhesives

that remain part of the PWB assembly after soldering and cleaning) used for the
attachment of SMCs to PWB assemblies are contained in Section 13.2, “Polymeric
Coatings and Adhesive Materials.”
Temporary adhesives (i.e., adhesives that are removed in post-solder cleaning
processes) used for the attachment of SMCs need not meet specific performance
requirements.
7–25
GR-78-CORE
R7-220 [623] Where temporary non-conductive adhesives are used for the attachment of
SMCs to PWB assemblies, the equipment manufacturer shall demonstrate that
Either • Post-solder cleaning processes are capable of totally

removing temporary adhesives, and
• Process controls are in place to ensure the ongoing efficiency
of such cleaning processes.
Or • The residues from the temporary adhesive do not affect
assembly reliability. Reliability test data, including data from
biased high temperature and humidity tests (e.g., 85°C/85%
relative humidity), will be necessary to demonstrate that
temporary adhesive residues do not compromise reliability.
7.3.2.1 General
Consideration shall be given, at the design stage of PWB assemblies containing

SMCs, to the potentially harmful effects of substrate flexure, both during the
manufacturing process and in field use.
Some key factors affecting flexure are as follows:
• Mechanical properties of the base laminate
• Size of the PWB
• PWB bow and twist
• Types of components and co-planarity of leads
• Number of connector pins (which determines the force required to mate the
connector).
R7-221 [624] If PWB assemblies with SMCs are intended for reflow soldering using infrared
processes that rely on direct radiant heating of the solder paste, component
mounting pad extensions shall be such as to ensure that under all tolerance
conditions, sufficient pad is exposed to allow proper reflow of the solder paste.
7.3.2.2 Components
IP7-222 [625] It is desirable that for surface mount on PWB designs, components in leaded
packages with leads providing some compliance to accommodate TCE differences
between components and substrate are used in preference to the equivalent
components in leadless packages.
7–26
CR7-223 [626] Where practical, surface mount on PWB designs that use leadless packages
for devices subject to power cycling shall be avoided. This applies to devices that are
frequently turned on and off and experience a significant temperature change when
switched between quiescent and operating states.
7.3.2.3 Thermal Considerations
R7-224 [627] In surface mount on PWB designs, maximum surface-mount solder joint
temperatures shall be at least 50°C below the solidus temperature of the solder used.
This requirement applies to systems under full electrical loading, operating at the
maximum ambient temperatures specified in GR-63-CORE[2].
7.3.2.4 Lead Forms
R7-225 [628] The co-planarity of leads of multi-leaded SMCs on PWB assemblies shall be
controlled to ensure satisfactory soldering and reliability under worst-case
tolerance conditions.
7.3.2.5 Termination Metallizations
R7-226 [629] To improve solderability, shelf life, and leach resistance, and to simplify
solder joint metallurgy, thick film metallizations of leadless SMCs shall be protected
with a barrier metallization such as nickel.
A typical termination of the type referred to in R7-226 [629] may consist of a

primary metallization of thick film silver/palladium, a barrier coating of nickel, and
an outer layer of solder or tin.
7.3.3 Reliability
R7-227 [630] The reliability of the particular Surface Mount Technology (SMT) used on
PWB assemblies shall be demonstrated by the equipment manufacturer by means of
accelerated testing2; where the validity of mathematical models has been
satisfactorily demonstrated experimentally, these may be accepted in lieu of actual
testing. Reliability test data shall be made available to the Network Operator, or its
designated representative, upon request.
2. Temperature cycling or isothermal stress cycling are examples of suitable accelerated tests.
7–27
GR-78-CORE
CR7-229 [632] Where the limit conditions specified by the equipment manufacturer for
surface-mount solder joint inspection (i.e., accept/reject criteria) of PWB assemblies
are not consistent with industry standards for high reliability products, the reliability
of such limit conditions shall be demonstrated by accelerated testing.2
R7-230 [633] For PWB assemblies containing SMCs, significant changes shall not be made
to PWBs, components, materials, or processes without supporting reliability test
data.
7.3.4 Manufacturing
7.3.4.1 Soldering — General
Control of solderability is essential in the manufacture of assemblies containing

SMCs. To ensure consistency and reliability, the solderability of PWBs and
component terminations or leads shall be carefully controlled.
R7-231 [634] All solder joints for leadless SMCs on PWB assemblies shall be physically
separated, i.e., one component termination/solder joint (see R6-233 [387]).
Multiple joints shall not be permitted.
R7-232 [635] On PWB assemblies, all surface-mount solder joints for a given component
and pad geometry shall be of similar size and shape (see R6-232 [386]).
7.3.4.2 Soldering — Reflow Processes
These requirements apply to all assembly soldering techniques where solder or

solder paste is applied to the component mounting pads before component
assembly. After component assembly, the solder is re-flowed.
Section 7.3.1.1, “Solder Pastes — Incoming Material Controls,” and Section 7.3.1.2,
“Solder Pastes — In-Process Controls,” detail solder paste controls. Section 7.1.3.4,
“Soldering,” describes controls for other solder processes.
R7-233 [636] The following shall be considered in establishing visual inspection standards
for the solder joints of SMCs on PWB assemblies:
• The volume of solder available for joint formation is fixed.
• If significant quantities of solder are permitted on the ends of component
terminations, or even on top of the terminations, the amount of solder in the
joint, and therefore the joint thickness, is reduced.
• The quantity of solder available must be limited to allow for inspection of
wetting angles.
7–28
The minimum thickness of solder between the mounting pads and terminations of
leadless components may be inferred by the geometry of the joint, if the solder
application process is consistent.
IP7-234 [637] Where the solder joints of leadless and other SMCs on PWB assemblies are
concealed, visual inspection should be supplemented by another technique to
ensure the adequacy of the parts of joints that are not visible.
7.3.4.3 Soldering — Wavesoldering Processes
These requirements apply to assembly techniques where components are attached

to PWBs using non-conductive adhesive, and are then wavesoldered. This process is
typically only used for mixed-technology assemblies (i.e., assemblies that use a mix
of conventional through-hole mounted, and SMCs); surface and through-hole solder
joints are simultaneously formed during wavesoldering.
See Section 7.1.3.4, “Soldering,” for additional requirements on solder control.
R7-235 [638] The quantities of adhesive used for component attachment to PWB
assemblies before wavesoldering shall be minimized to reduce the risk of spreading
onto component mounting pads.
R7-236 [639] Radiation cured adhesives must extend outside the component body outline
to allow for curing.
R7-237 [640] For surface mount on PWB assembly processes, using adhesive attachment
before wavesoldering, the accuracy of component placement shall be such as to
ensure that, under all tolerance conditions, sufficient mounting pad area is exposed
to permit the formation of proper solder joints in the wavesoldering process.
If pad exposure is insufficient, solder may not contact the mounting pad.
R7-238 [897] Provisions shall be made at assembly to prevent via holes located beneath
leadless SMCs from entrapping wave solder fluxes.
7.3.4.4 Bow and Twist
Bow and twist of PWBs for surface mounting shall be controlled within the limits
acceptable to the assembly process. Typically, surface-mount assembly processes
may be less tolerant of bow and twist than conventional through-hole assembly
processes, i.e., PWBs for surface-mount assembly may need to be flatter (see IP6-
26 [190]).
7–29
GR-78-CORE
R7-239 [641] When fixtures used for testing PWB assemblies containing SMCs employ
probes that directly contact SMC leads or terminations, provision shall be made to
ensure the integrity of the leads, terminations, and associated solder joints are not
degraded by probe contact.
7.3.4.6 Repairs
R7-240 [642] To minimize thermal shock, the boards of PWB assemblies shall be preheated
before the removal and replacement of large SMCs. The commonly used hot-air or
hot-gas techniques satisfy this requirement.
7.3.4.7 Modifications
The following sections contain requirements for modifications:

• Section 7.1.3.15, “Modifications to PWB Assemblies — General”
• Section 7.1.3.16, “Modifications to PWB Assemblies — Wiring Design”
• Section 7.1.3.17, “Modifications to PWB Assemblies — Wire Routing”
• Section 7.1.3.18, “Modifications to PWB Assemblies — Wire Preparation”
• Section 7.1.3.19, “Modifications to PWB Assemblies — Soldering of Modification
Wires”
• Section 7.1.3.20, “Modifications to PWB Assemblies — Securing of Modification
Wires”
• Section 7.1.3.21, “Modifications to PWB Assemblies — PWB Modifications”
• Section 7.1.3.22, “Modifications to PWB Assemblies — Components.”
R7-243 [645] SMCs shall not be added to PWB assemblies unless mounting pads have been
provided, on the PWB, to permit the proper attachment of such components.
7.3.4.8 Ball Grid Array (BGA) Assembly
R7-245 [647] Reflow oven profiling shall be performed at a frequency sufficient to ensure
that the solder paste product requirements are met as a minimum.
7–30
R7-246 [648] The reflow process thermal cycle shall be of sufficient time and temperature
so as to ensure proper reflow of the most thermally shielded solder joint on the
circuit pack.
R7-248 [650] The circuit pack assembler shall be responsible for ensuring the solderability
of the PWB substrates and all component leads that are to be used for circuit pack
assembly. While the assembler can hold its component suppliers responsible for
meeting individual solderabilities, it alone is responsible for reliably manufactured
hardware.
R7-249 [651] If non-hermetic packages are exposed to temperature and humidity

conditions for a greater time period than the device manufacturer’s floor life
specifications relative to moisture sensitivity, then they shall be baked per the
requirements of IPC/JEDEC J-STD-033[55] prior to the circuit pack assembly.
R7-250 [652] Circuit pack manufacturers shall demonstrate that the incidence of voids in
its BGA solder joints does not exceed the requirements of IPC-A-610D[50],
Acceptability of Electronic Assemblies, Class 2.
R7-251 [654] When replacement of Plastic Ball Grid Array (PBGA) is necessary, the
replacement part shall meet all manufacturer's specified floor life requirements
relative to the moisture sensitivity of the parts. Parts that exceed these requirements
shall be baked as necessary to remove moisture prior to use.
R7-252 [655] Careful inspection shall be made of the BGA package replacement site after
all of the excess solder and other residues are removed from the PWB substrate. The
solder mask shall appear to be useful and viable; otherwise, solder will wick to PTHs
or other undesirable land areas during the solder paste reflow process, and
reliability at the site will be jeopardized. If the solder mask is so damaged, it shall be
repaired by use of a qualified solder mask or repair polymer such that it will prevent
the solder from wicking to the Plated Through Holes (PTHs) during rework, or the
circuit pack shall be discarded. Inspection after reflow shall only result in the
acceptance of replacement BGA packages that appear reliably placed and soldered.
R7-253 [656] The circuit designer and/or circuit pack assembler shall be responsible to the
system purchaser to prove that the reliability of the BGAs used on circuit packs is
sufficient to function reliably over the life of the product. The proof shall be done
using thermal cycling of the component itself, or by analogy to other BGA packages
having the same lead configuration.
7–31
GR-78-CORE
7.4 Backpanel PWB Assemblies

This section principally applies to the assembly of hardware to backpanel PWBs,
e.g., connectors and/or pins, and not to the wiring of assembled backpanels after
assembly into frames. Section 8.2.1.3, “Solderless Wrapped Connections,” contains
solderless wrap connection requirements. These requirements also apply to press-
fit connections to PWBs generally; they are not restricted to backpanels.
R7-254 [659] Regardless of the type, all press-fit connections to PWBs shall meet the
requirements of Section 7.4, “Backpanel PWB Assemblies.”
7.4.1.1 Terminals/Pins
R7-255 [657] Terminals for solderless wrapped connections shall be according to

Telcordia’s MDP-326-316[10].
R7-256 [658] Bare (unfinished) terminals shall not be used where solderless wrapped
connections will be made with bare copper wire.
O7-257 [898] Press-fit connections with compliant sections should not be soldered.
Section 6.4.1.1, “Dimensioning,” contains dimensional requirements for PTHs in

backpanels.
R7-258 [660] Where press-fit pins with non-compliant sections are used, the manufacturer
shall demonstrate the ability to tightly control both PTH and pin dimensions. Lot-by-
lot dimensional data shall be available for both the pins and PWB PTHs.
7.4.2 Manufacturing
7.4.2.1 Dimensions
R7-259 [661] For assembled backpanels with backpanel pins to be connectorized, the pin
tip position tolerances shall be within the range specified by the manufacturer of the
mating connector.
7–32
R7-260 [662] For assembled backpanels with backpanel pins to be connectorized, the
angular displacement tolerance of the pins shall be within the range specified by the
manufacturer of the mating connector.
R7-261 [663] For assembled backpanels where backpanel pins are to be automatically
wirewrapped, pin tip position tolerances shall be within the range specified by the
manufacturer of the automatic wire wrapping equipment.
O7-262 [664] Where assembled backpanels are subjected to “shorts-and-opens” testing,

10 megohms should be used for the “opens” threshold. The “shorts” threshold
should be established based on expected resistances and the contribution of
interconnecting cables and interfaces used for testing purposes.
7.4.2.3 Plated-Through Hole (PTH) Deformation/Damage
R7-265 [667] Where press-fit pins or contacts are inserted into the PTHs of PWBs, there
shall be no copper cracks or other interplane separations from the hole wall barrel
or separations between the laminate and the plated copper barrel. Both horizontal
(parallel to the PWB surface) and vertical (at right angles to the PWB surface)
microsections shall be examined.
7–33
GR-78-CORE
7–34
GR-78-CORE Equipment Sub-Assembly and Assembly Requirements
8 Equipment Sub-Assembly and Assembly Requirements

8.1 General
8.1.1 Materials, Piece-Parts, and Sub-Assemblies
• Section 4 contains requirements for separable connectors.

• Section 5 contains requirements for wire and cable.
• Section 6 contains requirements for PWBs.
• Section 7 and Section 9 contain requirements for assembled PWBs, including
backpanels.
8.1.2 Sub-Assemblies and Assemblies
R8-1 [668] Equipment sub-assemblies and assemblies shall be free of burrs, protrusions
or sharp edges that may cause personal injury, damage to parts, or result in
hazardous conditions.
R8-2 [669] Equipment sub-assemblies and assemblies shall be substantially free of

foreign materials such as dust, dirt, corrosion products, wire clippings, lint, etc., and
excesses of materials specified by the equipment manufacturer such as lubricants,
varnishes, fluxes, solder, etc., of such size and quantity as may cause hazardous
conditions, operating failures, decreased life or increased maintenance.
GR-63-CORE[2], NEBSTM Requirements: Physical Protection, contains additional

requirements for equipment sub-assemblies and assemblies.
8.1.3 Design
Accumulation of dust on telecommunications products can provide the potential for

electrical breakdown. As a result, equipment design rules need to include adequate
spacings or shielding to avoid surface bridging due to settling, electrostatic or
thermophoretic deposition of dust. For example, electrostatic deposition increases
with increasing electrical fields. R7-11 [424] through R7-15 [428] address these
concerns.
GR-63-CORE[2] contains the fan and air filter requirements for telecommunications
equipment. As required in GR-63-CORE[2], fan-cooled (or blower-cooled) equipment
shall be fitted with suitable filters to remove particulate matter that has not yet been
filtered out by the return air systems of the building. These particles are typically
greater than 2 microns in size and are generated by people and mechanical
processes within the switch room. They usually include human debris, paper and
textile fibers, and coarse dust carried in from outside by the building occupants.
8–1
GR-78-CORE
Equipment Sub-Assembly and Assembly Requirements Issue 2, September 2007
R8-11 [678] Welding, riveting, crimping, and other fastening methods used in equipment
sub-assemblies and assemblies shall be secure and meet industry standards or
approved equivalents.
R8-12 [125] Circuit packs shall be physically retained in place within a shelf or frame by a
positive locking mechanism.
R8-13 [679] Screws, nuts, etc., used in equipment assemblies shall either be fitted with
some kind of locking feature (e.g., lock washers), or adhesive thread lock, to prevent
them from working loose under the influence of vibration, or shall be designed to be
immune from the effects of vibration.
R8-14 [680] Minimum torque requirements for screws or nuts used in the manufacture of
equipment sub-assemblies and assemblies shall be specified by the equipment
manufacturer.
R8-15 [681] The design of power and ground connections for equipment sub-assemblies
and assemblies shall be such as to ensure that there is no risk of the connections
becoming loose because of vibration or accidental mechanical shocks. As a
minimum, screw-down power and ground connections shall be fitted with some type
of locking features (e.g., lock washers) that both prevent rotation and maintain
clamping forces, or shall be designed to be immune from the effects of shock and
vibration. Positive methods to prevent rotation are preferred, e.g., two-hole
terminals.
R8-16 [682] Wiring and cabling of equipment sub-assemblies and assemblies shall comply
with R7-67 [478] through R7-72 [483].
O8-17 [683] To avoid the need for splice repairs during manufacturing, multiconductor
buss cables (cables connectorized at both ends for inter- or intra-equipment
interconnection) should be sized to provide extra (normally unused) conductors to
allow for repairs.
8–2
R8-18 [684] Equipment sub-assemblies and assemblies shall comply with the
requirements in Section 7.1.2.5, “Layout — Clearances,” with respect to clearances.
R8-19 [685] Grounding between equipment frames, shelves, cabinets, and other metallic
structures shall consist of electrical conductors specifically provided for grounding
purposes. Incidental grounding paths through framework, cable rack, building steel,
etc., shall not be used.
R8-20 [686] Grounding paths on equipment sub-assemblies and assemblies shall be as

short as possible and conductors shall provide low impedance paths that will not
deteriorate under sustained environmental exposure. Detailed grounding
requirements are contained in GR-1089-CORE[56], Electromagnetic Compatibility
and Electrical Safety - Generic Criteria for Network Telecommunications
Equipment.
R8-21 [687] Parts of equipment sub-assemblies and assemblies requiring user repair and
maintenance shall provide ready access for such repairs and maintenance.
O8-22 [688] It is an objective that equipment sub-assemblies and assemblies be designed

to allow user repair and maintenance without the need for tools, particularly custom
tools.
O8-23 [689] It is an objective that card guides extend close to the front of shelves and
incorporate a tapered lead-in to facilitate circuit pack insertion.
R8-24 [690] To facilitate ESD protective measures during maintenance, all equipment
assemblies shall be fitted with clearly labeled jacks or similar devices for the
grounding of wrist straps. Provisions shall be made for such grounding at both the
front and the rear of equipment assemblies.
O8-25 [691] It is an objective that common indicator lamps, readouts, and manually
operated switches be mounted at the same location on each unit. Similarly, it is
desirable that indicators with the same function be mounted in a common location
on all plug-in circuit packs. Mounted indicators should be visible from all angles at
the front of the equipment and down the maintenance aisle. Indicators should not be
obstructed by equipment, wire, or cable. See also Section 12.1, “Human Factors
Criteria,” of GR-2914-CORE[57], Human Factors Requirements for Equipment to
Improve Network Reliability.
R8-26 [692] Contact breakers and other service-affecting switches shall be so designed as
to minimize the risk of accidental activation during routine maintenance and
operation. Consideration shall be given to recessing such breakers and switches, or
providing them with protective covers.
R8-27 [693] Adjustable components on equipment sub-assemblies and assemblies shall be

capable of maintaining adjustment over the range of shipping and operating
mechanical and thermal environments detailed in GR-63-CORE[2]. If the component
design is not adequate to ensure that settings are maintained, such components shall
be locked after adjustment.
8–3
GR-78-CORE
R8-28 [694] Equipment for CO deployment shall be capable of operation, without damage,
over the range of operating mechanical, temperature, and humidity environments
detailed in GR-63-CORE[2].
R8-29 [695] Equipment for loop and uncontrolled environment applications shall be
capable of operation, without damage, over the range of operating mechanical,
temperature, and humidity environments detailed in GR-3108-CORE[58], Generic
Requirements for Network Equipment in the Outside Plant (OSP).
R8-30 [696] Equipment shall be capable of surviving, without damage, the range of
storage and transportation mechanical, temperature,1 and humidity environments
detailed in GR-63-CORE[2].
8.2 Manufacturing
8.2.1 Connections
8.2.1.1 General
R8-31 [697] Screws or nuts used in equipment sub-assemblies and assemblies shall be
tightened to at least the minimum torques specified by the equipment manufacturer.
This requirement is critical for screw-down power and ground connections.
R8-32 [698] Connections to equipment sub-assemblies and assemblies shall be secure,

free from foreign materials, and shall meet minimum clearance requirements.
R8-33 [699] Terminals and conductors on equipment sub-assemblies and assemblies shall
be free of damage or defects that reduce their cross-section so that mechanical or
electrical integrity is compromised. Examples of damage or defects that
compromise integrity are terminals or conductors that break under pressure or
where more than 25% of the strands of stranded conductors are broken or missing.
Section 5.1.7, “Cable and Wire Termination,” contains requirements for crimped
connections to equipment sub-assemblies and assemblies.
8.2.1.2 Soldered Connections
Section 13.1, “Corrosiveness of Soldering Fluxes,” contains requirements for fluxes

used for equipment sub-assembly and assembly soldering.
1. Recent studies have shown that actual storage temperatures may exceed the 140°F maximum
specified in GR-63-CORE[2]. Where practical, the use of materials that could be damaged or
degraded by storage at 185°F (85°C) should be avoided.
8–4
R8-34 [700] Soldered connections to equipment sub-assemblies and assemblies shall

comply with the requirements contained in
• Section 7.1.3.4, “Soldering”
• Section 7.2.2.1, “Soldering — PTH Solder Joints”
• Section 7.2.2.2, “Soldering — Non-PTH Solder Joints.”
R8-35 [701] Where solderless wrapped connections to terminals on backpanels or

equipment frames are soldered, at least two of the turns on each connection shall be
soldered. If one solderless wrapped connection to a terminal is soldered, all
solderless wrapped connections to that terminal shall be soldered.
8.2.1.3 Solderless Wrapped Connections
Requirements for the wire used in solderless wrapped connections are contained in
Section 5.1.4, “Materials.” These requirements also detail the restrictions that apply
to the use of silver-plated and bare copper wire for solderless wrapped connections.
R8-36 [702] Solderless wrapped connections shall not be made over foreign material on a
terminal unless all such solderless wrapped connections on the terminal are
soldered. Loose particles are considered foreign material. Deliberately-applied
solder is not considered foreign material.
R8-37 [703] Solder splashes on terminals for solderless wrapped connections are
normally considered foreign material unless
• They firmly adhere to the terminal.
• There is only one solder splash on a single terminal.
• Only one corner of the terminal is affected by the solder splash.
• The length of a solder splash, measured along the affected corner, does not
exceed two wire diameters.
• The thickness of a solder splash does not exceed 0.002 inch.
8–5
GR-78-CORE
R8-38 [704] The minimum number of successive, non-overlapping turns of bare wire for
solderless wrapped connections shall be as shown in Table 8-1.
Table 8-1 Turns Required for Solderless Wrapped Connections
Number of Turns
Wire Terminal
Uninsulated Wire
Gauge Size Insulated Wire
Tin or Silver Coppera
#20 & #22 0.025 inch sq. 5 6 -
to
0.045 inch sq.
#24 0.025 inch sq. 6 7 -
to
0.045 inch sq.
#26 0.025 inch sq. 6 7 -
#26 0.045 inch sq. 7 8 -
#28 & #30 0.025 inch sq. 7 8 3/4 minimum
(Modified wrap)
a. See restrictions detailed in CR5-10 [147].
R8-39 [705] Shiners (the stripped ends of wires) used for previous solderless wrapped
connections shall not be reused.
R8-40 [706] For solderless wrapped connections, the total of the spacings between 3
adjacent turns (for 5-turn connections), between 4 adjacent turns (for 6-turn
connections), between 5 adjacent turns (for 7-turn connections), and between 6
adjacent turns (for 8-turn connections) shall not exceed the diameter of the wire
being wrapped. Individual spacings shall not exceed half a wire diameter.
R8-41 [707] The bare portion of the wire between a solderless wrapped connection and
the wire insulation shall be less than half the clearance to adjacent terminals and no
longer than 0.050 inch.
R8-42 [708] Solderless wrapped connections shall withstand the minimum strip-off forces
shown in Table 8-2, applied in the direction of the open terminal end, without
movement.
Table 8-2 Strip-Off Forces for Solderless Wrapped Connections
Minimum Strip-Off Force

20 to 24 gauge 2500 grams
26 gauge 2200 grams
28 gauge 1750 grams
30 gauge 1200 grams
8–6
R8-43 [709] Except for the requirement detailed in Section 8.2.1.3, solderless wrapped
connections shall meet the requirements in MDP-326-316.[10]
8.2.2 Wiring and Cabling
R8-44 [710] Skinners (single wires that come out of a wiring harness and go to a
connection) shall not break out more than one stitch or tie away from the stitch or
tie specified by the equipment manufacturer.
R8-45 [711] There shall be no splices in skinners; replacement wires are permitted if tied
to the original wiring harness.
For the purposes of the above requirement, separable connections are not
considered splices.
R8-46 [712] Equipment cable forming, support, and sewing shall be proper and sufficient.
Load-bearing supports should be so designed as to prevent long term compression
of the wire/cable insulation and the possibility of plastic flow causing premature
failure.
R8-47 [713] Color coding of leads, metal chassis ground, and power cord wiring shall be
as specified in the contract, or by the equipment manufacturer if there are no such
contractual requirements in the contract, or by the equipment manufacturer if there
are no such contractual requirements.
R8-48 [714] Power leads in equipment shall not be spliced.
8.3 Equipment Modifications
8.3.1 General
R8-49 [715] Modified equipment sub-assemblies and assemblies shall be clearly identified
(e.g., by raising issue or revision levels) to avoid confusion with unmodified frames.
R8-50 [716] Modified equipment sub-assemblies and assemblies shall meet all
requirements after modification.
8.3.2 Modification Wiring
R8-51 [717] The modification wiring requirements of Section 7.1.3.16 through

Section 7.1.3.21 shall also apply to equipment sub-assemblies and assemblies.
8–7
GR-78-CORE
R8-52 [718] Wiring modifications to backplanes shall be made using either solderless
wrapped connections or soldered connections.
8.4 Performance
8.4.1 General
R8-53 [719] All equipment shall be capable of reliable operation, for their design lives, in
the appropriate environments (either ambient or CO) defined in
GR-63-CORE[2], Section 4.5, “Airborne Contaminants.”
Suitable filters shall be included as part of the equipment design per GR-63-CORE[2],
Section 4.5, “Airborne Contaminants.”
GR-418-CORE[59], Generic Reliability Assurance Requirements for Fiber Optic
Transport Systems, details additional requirements for fiber optic equipment.
GR-284-CORE[60], Reliability and Quality Switching Systems Generic
Requirements (RQSSGR), details additional requirements for switching equipment.
8.4.2 Operation Under Environmental Extremes
R8-54 [720] Products shall be capable of performing as specified by the manufacturer,

without error, under conditions of maximum power dissipation, in the maximum
specified short-term temperatures ambient. Under these conditions, hot spot
temperatures shall not exceed the limits specified in this document, in GR-357-
CORE[3], or by the component manufacturers.
8–8
GR-78-CORE Electrostatic Discharge (ESD)
9 Electrostatic Discharge (ESD)

9.1 General
This section specifies the ESD requirements for all new equipment assemblies and
non-installed circuit packs intended for use in the telecommunications network.
Discharges of electrostatic voltages on or near equipment assemblies can be a
significant cause of failures or malfunctions. Equipment is susceptible to ESD
effects at all stages of storage, installation, testing, operation, adjustment, and
repair. Failure or malfunctions occur when ESD effects extend to the device level
and cause device damage. Protective circuitry, isolated ground paths, and similar
features designed into equipment help reduce ESD effects below the damage
threshold at the device level, and allow equipment to withstand a certain amount of
ESD on external surfaces without affecting its ability to function.
9.2 Susceptibility
While it may not be possible or practical to protect equipment from the maximum
ESD that may be experienced, equipment assemblies and non-installed circuit packs
that meet the Telcordia generic ESD requirements will be capable of functioning
normally after receiving typically encountered discharges on any external surfaces
that are likely to be touched during field operation and maintenance.
9.3 ESD Resistance

System-level ESD immunity requirements are contained in Section 2 of GR-1089-
CORE, Electromagnetic Compatibility and Electrical Safety - Generic Criteria for
Network Telecommunications Equipment[56]. The GR-1089-CORE requirements
address equipment resistance to ESD in an installed and operating configuration.
Section 9.4, “Circuit Pack ESD Test Methods and Requirements,” in this GR provides
testing methods for analyzing the capability of non-installed circuit card assemblies
(circuit packs) to withstand discharges that can be encountered during repair and
installation. The test method used in this document to characterize the ESD
immunity of circuit card assemblies is described in IEEE C62.38[61], IEEE Guide on
Electrostatic Discharge (ESD): ESD Withstand Capability Evaluation Methods
(for Electronic Equipment Subassemblies). Circuit card assemblies shall function
normally after ESD testing at the levels prescribed in Section 9.4.
For more information, see IEC 61000-4-2[63], Electromagnetic Compatibility
(EMC) — Part 4-2: Testing and Measurement Techniques, Electrostatic Discharge
Immunity Test; and IEEE C62.47[62], IEEE Guide on Electrostatic Discharge
(ESD): Characterization of the ESD Environment.
9–1
GR-78-CORE
Electrostatic Discharge (ESD) Issue 2, September 2007
9.4 Circuit Pack ESD Test Methods and Requirements
9.4.1 Scope and Purpose
This section details ESD requirements as they apply to all new equipment
subassemblies (circuit packs) intended for use in all telecommunications
equipment, including ancillary equipment. The intent is to establish the capability of
units to function normally after receiving typically encountered discharges.
9.4.2 ESD Considerations
9.4.2.1 General
Discharges of electrostatic voltages to circuit packs can be a significant cause of

failures or malfunctions. Circuit packs are susceptible to the effects of ESD during
any procedure that requires handling such as storage, installation, testing, operation,
adjustment, and repair. It is desirable therefore, to reduce their susceptibility to
ESD.
9.4.2.2 Susceptibility
R9-2 [722] Circuit packs for telecommunications equipment shall be ESD tested at the
following test voltages:
• 8 kV
• 15 kV.
9.4.2.3 Performance Criteria
R9-3 [723] The circuit pack shall be functionally tested before and after the application
of the simulated ESD at each voltage level. At the conclusion of a circuit pack ESD
application, the circuit pack shall meet all the performance requirements set by the
manufacturer. If not, the circuit pack has failed and shall be described as one of the
failure categories in Section 9.4.6, “Documentation of Test Result Definitions and
Categories.”
9.4.2.4 Documentation Specifications
R9-4 [724] System descriptive documentation shall indicate any special ESD
considerations and controls as they apply to circuit packs within the system.
9–2
R9-5 [725] Special site preparation requirements, restrictions on the ambient air, or the
choice of antistatic materials for furniture or dissipative floors, standard or raised,
shall be clearly specified.
R9-6 [726] Information supplied to field personnel by the supplier shall contain explicit
warnings about procedures to be followed to prevent electrostatic damage during
installation, adjustment, storage, or field repair.
R9-7 [727] Warnings to use only ESD-protective packaging materials shall appear as
appropriate in the descriptive documentation.
9.4.3 Test Preparation
R9-8 [728] The circuit card assemblies shall be tested in an environment of a

temperature of 15 to 35°C and a 20 to 50% relative humidity after stabilization in this
environment for at least 1 hour. The atmospheric pressure shall be between
106 kPa (-383 m) and 68 kPa (3226 meters altitude). (Standard conditions are
101.3 kPa and 20°C at sea level.)
R9-9 [729] All protective covers for input/output jacks and printed circuit board
connecting fingers shall be removed. The circuit pack shall be unterminated during
the stress.
9.4.4 Safety
Although the energy involved in ESD tests is generally not considered hazardous,
ESD tests do involve high voltages and generate significant fields. Therefore,
common sense dictates certain safety precautions.
• Do not perform tests near personnel with electronic life support items, such as
pacemakers or insulin injection systems.
• Do not test near robotic equipment or other machinery that may become
dangerous if control is disrupted.
• Do not test near explosive items or in a potentially explosive atmosphere.
• Do not perform tests if either the test equipment or the circuit pack seems to be
operating in an unusual manner, or if the laboratory conditions are not properly
controlled (e.g., if condensing humidity exits).
• Follow all operational and safety instructions provided by the test equipment
manufacturer.
9–3
GR-78-CORE
9.4.5 Experimental ESD Failure Threshold Measurement
This section describes the equipment, waveform calibration procedures, stressing,

and testing procedures that can be used to determine ESD susceptibility of circuit
card assemblies.
9.4.5.1 Required Test Method
R9-10 [730] Although the test method in IEEE C62.38[61] covers both the Body/Finger
(also known as the Human Body Model [HBM]) and Hand/Metal ESD, this document
shall only require the Body/Finger test to be completed.
The Body/Finger test best simulates the ESD encountered during normal handling
procedures of circuit card assemblies by telecommunications personnel. Body/
Finger ESD simulates a person discharging stored charge from their finger to the
circuit pack. This can occur when a person picks up or touches the assembly.
9.4.5.2 Equipment Required
R9-11 [731] The following equipment shall be required to perform ESD testing:
1. ESD Simulator — The main components of the simulator are the charging
resistor, energy-storage capacitor, discharge resistor and bipolar power supply.
MIL-STD-883G[65] and ANSI/ESD STM5.1[64], ESD Association Standard Test
Method for Electrostatic Discharge Sensitivity Testing, Human Body Model
(HBM) Component Level, specify 100 picofarads for the energy storage
capacitor, and 1500 ohms for the discharge resistor. The value for the charging
resistor is not very critical, but should be chosen so that it is much greater than
1500 ohms, and small enough to permit 1-second cycle times. Typical values are
between 10 and 100 megohms. The purpose of the simulator circuit is to deliver
stress pulses of adjustable amplitude and polarity to the circuit pack under test.
Most commercial simulators use the RC discharge circuit shown in Figure 14-4.
This is entirely adequate if steps are taken to minimize circuit parasitics
(particularly the shunt capacitances across the resistors and the relay, as well as
the series inductances). With control of the parasitics, the simulator will deliver
a current waveform closely resembling Figure 14-5, and meeting the waveform
requirements in Table 9-1 and Table 9-2. The output of the simulator is taken
from an air discharge electrode having an 8-millimeter diameter sphere at its tip.
The actual location of discharge on insulated edges of circuit card assemblies is
detailed in Section 9.4.5.4, “Circuit Pack Testing Procedure.”
9–4
Table 9-1 Verification Parameters for a Body/Finger ESD Waveform Into a Short
Peak Current Into

Equivalent Peak Pulse Rise Time Pulse Decay Time
a Short (Ips)
Voltage (Vp) (Trs) (Tds)
± 10%
(kV) (ns) (ns)
(A)
0.5 0.33 2-10 150 ±20
1.0 0.67 2-10 150 ±20
2.0 1.33 2-10 150 ±20
4.0 2.67 2-10 150 ±20
6.0 4.00 2-10 150 ±20
8.0 5.33 2-10 150 ±20

(Into a 500-Ohm Resistor)
Peak Current
Peak Current
Equivalent Into a Pulse Pulse Decay
Into a 500-Ohm
Peak 500-Ohm Rise time Time
Resistor With
Voltage (Vp) Resistor (Ips) (Trs) (Tds)
30 pF
(kV) ± 10% (ns) (ns)
(A)
(A)
1.0 0.5 0.42 5-20 1.4 × Tds ±20
2. Oscilloscope — The oscilloscope is used to calibrate the current waveforms.

The vertical amplifier of the scope must have a minimum bandwidth of 350 MHz
and sufficient writing speed to view the transitory waveform. The oscilloscope
should be capable of accurately measuring all the parameters required for the
waveforms, including ringing. The 500-ohm resistor is used only for tests at 1 kV.
An appropriate resistor for this test is one with minimal series inductance. The
tolerance of the resistance is less than 1%.
3. Current Probe/Target — Verification of the performance of the Body/Finger
simulator is based on the current waveform of the simulator discharging into
two different loads. A current probe with a bandwidth greater than 350 MHz is
used to measure the current waveform in each of two loads.
The current probe is used to measure the current waveform of the simulator under
essentially short-circuit conditions. Its minimum bandwidth is 350 MHz and should
reflect less than 1 ohm into the ESD simulator. The output impedance should be
matched to the scope vertical amplifier input impedance (typically 50 ohms). See
Figure 14-7 for an experimental waveform monitoring setup using a current probe.
9–5
GR-78-CORE
If a current probe is not available, the current can be sampled across a 2-ohm load
resistor. The load shall consist of at least five non-inductive resistors (carbon type,
minimum 1 watt power rating) connected in parallel forming a circular array. The
set of resistors shall be coaxial with the resistor for matching the impedance of the
oscilloscope. A constructional arrangement is shown in Figure 14-6.
The target for either current monitoring technique shall be an 8-mm metallic sphere
as shown in Figure 14-6 and Figure 14-7.
9.4.5.3 Waveform Verification Procedure
R9-12 [732] The current probe is placed at the point at which the ESD simulator would
have injected current into an actual circuit pack. The waveforms shall meet the
requirements of Table 9-1 and Table 9-2. There should be no transients after the
waveform, either positive or negative, whose peak values exceed 10% of the peak
amplitude of the waveform itself.
9.4.5.4 Circuit Pack Testing Procedure
1. The circuit pack shall be supported, component side up, on insulating spacers
above a ground plane. The PWB shall be parallel to the ground plane, and the
ground plane shall extend at least 2 inches beyond the PWB perimeter. The
thickness of the spacers shall be such as to ensure that the distance from the
ground plane to the closest protruding solder joint on the circuit pack’s PWB is
25.4 millimeters (1 inch). If there are electrical components on the underside of
the PWB, then the thickness of the spacers should maintain an 8-mm spacing
between the highest component and the ground plane. Figure 14-8 shows a
pictorial schematic of the test setup.
2. The ground plane shall be grounded and the ground return for the ESD simulator
(approximately 1 foot of 20-mm copper braid) shall be connected to the ground
plane. Before the first and after each ESD, the circuit pack shall be discharged
to the ground plane through the edge connector fingers or other suitable trace
such as the ground return using a resistive probe. The discharge probe of
Figure 14-8 may be made using three 22-megohm, 1-watt, carbon composition
resistors connected in series with one end connected to ground. For safety and
convenience, these should be mounted in an insulating tube with a finger grip at
the ground side of the resistors to minimize parasitic shunt capacitance. The
metallic probe tip used to discharge the circuit pack shall be less than 1 inch long
when measured from the body of the resistor.
3. ESDs shall be made at 3 points along each edge of the circuit pack, excluding
connector edges; the points shall include the center of each edge, and points half
way between the center and each end (i.e., points 1/4, 1/2, and 3/4 along each
edge). Circuit pack edges of less than 3 inches shall have one discharge point.
Test points shall be documented. The ESD simulator tip should approach the
circuit pack at an angle of 30 to 60 degrees to the ground plane. Five discharges
shall be applied to each location. These tests shall be performed for both
polarities, and both 8 and 15 kV potentials.
9–6
4. When the circuit packs contain mother/daughter board combinations, apply

ESDs along the perimeter of the daughter card also. If the circuit pack is made
up of two “back-to-back” PWBs, then place the bottom PWB on spacers above
the ground plane and apply ESDs to the top one. Then turn the circuit pack over
and repeat the test.
9.4.5.5 Circuit Pack Selection
R9-13 [733] The population of circuit packs selected for ESD testing shall include two of
every design used in the system.
9.4.6 Documentation of Test Result Definitions and Categories
Test result categories are as follows:

• Conforms: Circuit pack meets performance requirements after ESD.
• Failure Nonrecoverable: Damage to components or permanent loss of data. The
circuit pack must be repaired to restore operation.
• Failure Operator Intervention Required: An operator or technician must reload
or reboot a memory component to restore operation of the circuit pack.
• Failure Automatically Recoverable: Errors that require no operator intervention
to restore operation, such as redundant circuitry.
R9-14 [734] Results of circuit pack ESD tests shall become part of the vendor supplied
system documentation.
R9-15 [735] Results of circuit pack ESD tests shall become part of the qualification
information available from the manufacturer.
R9-16 [736] The circuit pack model number, serial number, bar code, date, time, climatic
conditions, and other critical information shall be included in the documentation.
R9-17 [737] Information shall be included about the simulator used. Record the simulator
manufacturer, model number, serial number, and last date of calibration.
R9-18 [738] The response data shall clearly indicate the circuit pack response to the
simulated ESD. For each circuit pack tested, record the test voltage level, polarity,
and test points, and results.
9–7
GR-78-CORE
9.5 ESD Labeling Requirements
9.5.1 ESD Susceptibility Symbol
The ESD susceptibility symbol incorporates a reaching hand in a triangle with a

slash through it. It is defined by EIA-471[66], Symbol and Label for Electrostatic
Sensitive Devices. It indicates an electrical or electronic device, assembly, or system
is susceptible from an ESD event.
9.5.1.1 Packaging
R9-19 [739] Caution labels shall be affixed to all packages that contain circuit packs and
other ESD-sensitive devices. The caution labels shall include the ESD susceptibility
symbol and the following wording:
“ATTENTION: OBSERVE PRECAUTION FOR HANDLING ELECTROSTATIC
SENSITIVE DEVICES.”
9.5.1.2 Equipment
R9-20 [899] Equipment that could be static sensitive shall have ESD susceptibility labeling
on the front of the equipment in accordance with EIA-471[66], Symbol and Label for
Electrostatic Sensitive Devices. If the ESD labeling cannot be located on the front
of the equipment, it should be located in another visible location. In addition, the
documentation for this type of equipment shall indicate ESD sensitivity, and contain
cautions that ESD mitigative procedures, such as wearing wrist straps, be used
during installation and maintenance.
O9-21 [740] It is an objective that all individual PWB assemblies be marked to indicate that
they contain electrostatic-sensitive parts by using either the ESD logo or the words
“STATIC SENSITIVE.”
CR9-22 [741] This requirement has been replaced by R9-20 [899] per Issue 2.
R9-23 [742] This requirement has been replaced by R9-20 [899] per Issue 2.
9.5.2 ESD Protective Symbol
CR9-24 [743] The ESD protective symbol differs from the ESD susceptibility symbol by
addition of an arc around the outside of the triangle, and omission of the slash across
the hand and triangle. The ESD protective symbol is defined in ANSI ESD S8.1[67],
Symbols — ESD Awareness (see Figure 14-10).
9–8
CO9-25 [744] The ESD protective symbol should be used to identify items that are
specifically designed to provide ESD protection for ESD-sensitive assemblies and
devices. Examples of these are packaging and personnel grounding equipment. The
ESD protective symbol should also be used on items designed to replace static
generative materials when the item is ESD protective or non-static generative by
design.
R9-26 [745] This requirement has been replaced by R9-20 [899] per Issue 2.
CR9-27 [746] This requirement has been replaced by R9-20 [899] per Issue 2.
9–9
GR-78-CORE
9–10
GR-78-CORE Product Identification and Markings Requirements
10 Product Identification and Markings Requirements

R10-1 [747] Designations and markings shall last for the life of the equipment, be in letters
of such size and contrast to the background as to be clearly legible with the
illumination levels specified in GR-63-CORE[2], Section 4.7, “Illumination.”
O10-2 [748] A non-glare finish should be applied to the background of all display panels.
O10-3 [749] It is an objective that functional designations, markings, and abbreviations be

consistent with standard Network Operator terminology.
R10-4 [750] The supplier shall demonstrate (by accelerated temperature and humidity,
and high-temperature storage testing) that adhesive labels will remain adherent and
legible for the life of the equipment specified by the equipment manufacturer.
R10-5 [751] Designations or markings on circuit packs shall permit visual identification of
the following:
• Hardware functionality (e.g., processor circuit pack, line card)
• Backward compatibility
• Hardware modifications to the circuit pack indicated by sequential series
numbering.
R10-6 [752] Additional designations or markings shall be employed for circuit packs
utilizing firmware to allow software compatibility and feature identification.
GR-284-CORE,[60] Section 2.4.3.11, contains additional requirements for the

identification of firmware circuit packs.
R10-7 [753] Designations and markings on circuit packs, such as color coding, shall
identify packs that require power disconnection before insertion/removal. This
requirement may be satisfied by the provision of mechanical interlocks to prevent
pack insertion/removal with the power on.
O10-8 [754] It is an objective that a uniform system of easily read frame identification
markings, and horizontal and vertical circuit pack location markings be provided for
all circuit pack positions on the equipment units and frames. It is desirable that the
location of all equipment within the frame, the frame type, and its number be located
on both the front and rear sides of the frame.
R10-9 [755] Designations and markings on circuit packs shall be consistent with frame
markings, maintenance documentation, and diagnostic printouts.
CR10-10 [756] Where practical, circuit pack identification and issue/revision codes should
appear on the faceplates or ejectors for ready identification of the product when
assembled.
10–1
GR-78-CORE
Product Identification and Markings Requirements Issue 2, September 2007
CR10-11 [757] To avoid equipment shutdown when conducting system inventories, CLEITM
labels shall, where possible, be bar-code readable with circuit packs inserted.
R10-12 [758] Designations and markings shall be provided to facilitate wiring, testing,
operation, and user maintenance of equipment by use of a convenient and logical
means of identifying the various parts, components, apparatus, and assemblies. For
example, identifications and values of user replaceable fuses shall be clearly
marked.
R10-13 [759] The identification materials on PWBs and components shall withstand all
assembly processes, including fluxing, soldering, and cleaning, to which they are
subjected.
R10-14 [760] When parts, components, apparatus, and assemblies are mounted and wired
in place, component and PWB designations and markings shall, if possible, be
plainly visible and leave no doubt as to which of these the designations and markings
apply.
R10-15 [761] Vintage designations or markings on circuit packs shall permit repair
personnel to determine how a repair shall be made and whether any addition
(updating), component, or wiring changes are required.
R10-16 [762] Designations or markings on circuit packs shall permit installation or repair
personnel to determine which part, component, apparatus, or assembly shall be
changed to correct unsatisfactory or inoperative conditions.
R10-17 [763] Designations or markings on circuit packs shall permit user maintenance
personnel to determine which test method to use.
R10-18 [764] Designations or markings on circuit packs shall permit identification of

original manufacturer, and the date of manufacture, of both the PWB and the circuit
pack.
The manufacturing date shall be indicated using an easily understood, unambiguous

date code allowing traceability. Week date codes are preferred, month date codes
may be acceptable; date codes shall be changed at least once a month. Coding
schemes typically use a one- or two-digit code for the year of manufacture and a two-
digit code for the week of manufacture. Date codes shall be numeric; alpha-numeric
codes should not be used.
IP10-19 [765] In addition to the criteria in R10-5 [751] through R10-12 [758], individual
serial numbering of circuit packs (e.g., using bar-coded labels) is strongly
encouraged since this permits the establishment of a computerized database
containing complete histories by serial number. In a recall situation, such databases
can allow a more restricted recall of a product than would be possible if a product
is not serialized.
10–2
GR-78-CORE Product Identification and Markings Requirements
O10-20 [766] To facilitate field tracking studies, warranty administration, and

identification of product for recall, serial number labels should be so located as to
be readable without the necessity for circuit pack removal.
R10-21 [767] Precautionary designations and markings on equipment needed to prevent

personal injury or property damage shall be as specified by law, by contract, and by
the equipment manufacturer.
R10-22 [768] Designations and markings necessary to ensure satisfactory and minimum
maintenance of equipment shall be as specified by contact, or by the equipment
manufacturer if there is no such contractual requirement.
R10-23 [769] All components that may be adjusted in the field and all terminals associated
with connections, options, or adjustments made during or after installation shall
have their reference designations (from the assembly drawing) clearly indicated on
PWB assemblies and the outer case or cover if the PWBs are mounted in a case and
adjustments are made through a hole in the case or cover.
R10-24 [770] The supplier shall mark equipment to facilitate rapid location of circuit packs
when maintenance of the product is required.
O10-25 [771] Shelves within a frame should be numbered from bottom to top, and circuit
pack locations from left to right.
O10-26 [772] Diagnostics should include frame, shelf, and circuit pack identifiers for ease
of maintainability.
10–3
GR-78-CORE
Product Identification and Markings Requirements Issue 2, September 2007
10–4
GR-78-CORE Package Requirements
11 Package Requirements
Proper product packaging ensures parts arrive undamaged, easily identifiable, and
ready for use in the customer’s network. The following packaging requirements
apply to all network products. More information may be found in GR-2759-CORE[68],
A View of Packaging, Packing, Palletization, and Marking Requirements.
11.1 General
R11-1 [773] Packages and packaging materials shall meet the requirements of the
Network Operator.
R11-2 [774] Packages and packaging materials shall be as specified in the contract, or as
specified by the equipment manufacturer if there is no such contractual
requirement.
R11-3 [775] Drawings, descriptions, or specifications required for installation shall be

packed with or shall otherwise accompany units, or be shipped separately as
specified in the Network Operator contractual agreement.
R11-4 [776] Units whose storage times vary shall be protected against deterioration,
corrosion, or other damage, consistent with customer requirements. Provision for
necessary preventive maintenance and inspections shall exist.
R11-5 [777] To minimize unprotected handling and to provide packaging materials for the
return of defective units, PWB assemblies shipped as spares and repaired customer
returns shall be packaged individually.
R11-6 [778] PWB assemblies shall be packaged in a manner to ensure that they remain
free from damage and contaminants such as silicone, chlorine, sulfur, and fibrous
material.
R11-7 [779] PWB assemblies containing solid state devices shall be protected against
ESD.
R11-8 [780] Bags and pouches used to package ESD-sensitive components and
assemblies shall meet the requirements of TR-NWT-000870[51].
R11-9 [781] Final and individual containers shall be marked as specified in the contract,
or as specified by the equipment manufacturer if there is no such contractual
requirement.
R11-10 [782] Packaged equipment shall meet the handling and transportation requirements
specified in GR-63-CORE[2].
11–1
GR-78-CORE
Package Requirements Issue 2, September 2007
11.2 Shipping of Assemblies

This section applies to “shipped loose” PWB assemblies, populated equipment
shelves and frames, and backplanes.
R11-11 [783] All PWB assemblies and populated equipment shelves/frames shall be
shipped in ESD protective containers.
R11-12 [784] All PWB assemblies shall be shipped in ESD protective containers meeting
the requirements of GR-1421-CORE[69], Generic Requirements for ESD-Protective
Circuit Pack Containers.
R11-13 [785] All populated equipment shelves/frames shall be shipped in ESD protective
containers or otherwise protected from ESD damage.
R11-14 [786] All connectors on PWB assemblies and backplanes shall be protected from
both physical and ESD damage.
R11-15 [787] The noble metal plated fingers of PWB assembly edge card connectors shall
be physically protected by an ESD protective shield meeting the requirements of GR-
1421-CORE[69].
R11-16 [788] The noble metal plated contact surfaces of PWB assembly two-piece
connectors shall be physically protected by either the connector housing or an ESD
protective shield meeting the requirements of GR-1421-CORE[69].
11–2
GR-78-CORE Repair and Modification of Customer Return Units
12 Repair and Modification of Customer Return Units

12.1 General
Customer returns are PWB assemblies or equipment subassemblies that belong to
the customer that are returned for repair, updating, or both. At any stage, the
supplier may choose to replace a customer return unit with a new unit of similar or
more recent vintage. The TL 9000 Quality Management System (QMS)
Measurements Handbook[73], Release 4.0, Section 7, contains instructions on
determining return rate measurements for telecommunications hardware Field
Replaceable Units (FRUs). Some customers may specify that data be collected and
FRU return rates calculated using TL 9000 techniques.
R12-1 [789] Network Operator customer returns that meet all test requirements shall be
marked according to Section 12.2, “Marking.” They may be returned to any Network
Operator that has returned units for repair (unless instructed otherwise by the
returning Network Operator).
R12-2 [790] Repairs and modifications to Network Operator customer returns shall meet
the requirements of this document.
R12-3 [791] PWB assemblies or equipment subassemblies returned to a Network

Operator after repair shall be of similar or more recent vintage to the units originally
returned for repair.
R12-4 [792] Network Operator customer returns shall be tested according to the approved
test requirements; these shall include any elevated temperature tests to which new
units are subjected.
CR12-5 [793] Where possible, Network Operator customer returns for repair shall be tested
before updating to more accurately identify No Trouble Found (NTF) conditions.
R12-6 [794] If a PWB assembly or equipment subassembly returned for repair has “N” as
its latest stamping, it shall be tested until the trouble is found. When found, the unit
shall be repaired and stamped with an “R” and the date of repair. If the trouble
cannot be found, the unit shall be tested, at product temperature extremes, for all
limits as defined in the contractual specifications pertaining to maximum and
minimum values for input voltage, output requirements, signal to noise, etc. If this
test finds no trouble, then an additional repair legend “N” and the date are applied.
As an alternative to physical marking of the product(s), repair status may be
maintained using a serial number tracking database. Database information on repair
status shall be made available to customers upon request.
R12-7 [795] If a PWB assembly or equipment subassembly returned for repair has two (2)
“N” repair legends, or the serial number tracking database indicates that it was
previously returned twice with no trouble found, the unit shall be tested again. If no
trouble is found, the unit shall be made the subject of an engineering analysis and
12–1
GR-78-CORE
Repair and Modification of Customer Return Units Issue 2, September 2007
the Network Operator informed of the disposition, or the unit may be replaced by a
new one.
R12-8 [796] The Failure In Time (FIT) rate for repaired PWBs or equipment
subassemblies shall be no higher than the FIT rate for new units of the same type.
12.2 Marking
When used, the following legends identify the types of customer repairs:
N = No Trouble Found. Indicates the unit passed all of the tests

specified by the equipment manufacturer for that circuit pack.
R = Repaired Unit. Indicates the unit required component replacement
or soldering to meet the end requirement.
M = Modifications. Indicates the unit was updated only and was not
returned for repair.
R12-9 [797] PWB assemblies or equipment subassemblies returned for repair shall be
marked, on the PWB, with the action legend, the location where the work was done,
and the repair date code. Physical marking on the designs is not required if the data
is captured in a database that ties the repair status to serial numbers.
The complete legend would be:
>AyyLLxxZ
where: A = Action (N, R, or M)
yy = Year
LL = Location
xx = Month or week
Z = Identifies preceding two digits: M for month, W for week.
Similar or equivalent procedures may be used with the prior approval of the
Network Operator or its designated representative.
12.3 Repairs
R12-10 [798] Repairs to defective PWB assemblies or equipment subassemblies, returned

by a Network Operator, shall conform to the requirements of this document, or be
done according to a procedure approved by the Network Operator or its designated
representative.
12–2
GR-78-CORE Repair and Modification of Customer Return Units
The noble metal contact fingers of PWB assemblies or equipment subassemblies

may show evidence of having been inserted in a connector when returned to a
Network Operator after repair.
R12-11 [799] Components authorized at the time of manufacture of a PWB assembly or

equipment subassembly shall be replaced if found defective when the unit is
returned for repair. If such components (whether or not defective) are replaced,
they shall be replaced with currently authorized components.
R12-12 [800] The PWB surfaces of PWB assemblies or equipment subassemblies shall be
unchanged after repair except for discoloration due to heating. Repairs of charred
boards shall be limited to one charring defect per board1 subject to the following:
• Repeat repairs for charring shall not be permitted. Repeated defects may
indicate drastic shortcomings, which should be corrected.
• Repairs to charring defects affecting more than 1/3 of the thickness of the PWB
shall not be permitted.
• Conductor spacing shall not be reduced below the design minimum by charring.
R12-13 [801] Each PWB charred in the field shall be subjected to an engineering evaluation
to determine the cause of charring. The Network Operator that returns units
containing such boards shall be notified of the results of each evaluation.
R12-14 [802] The charred surfaces on boards shall be repaired according to the following:
1. Remove all charred material by routing.
2. Clean the repaired areas by brushing with a suitable solvent,2 then dry,
e.g., by blowing with clean compressed air or dry nitrogen gas.
3. After cleaning repaired areas, fill the routed cavity with an approved epoxy resin.
(See Section 13.2, “Polymeric Coatings and Adhesive Materials.”)
1. Boards charred prior to initial shipment shall not be repaired.

2. Avoid solvents restricted by the Montreal Accord.
12–3
GR-78-CORE
Repair and Modification of Customer Return Units Issue 2, September 2007
12–4
GR-78-CORE Qualification Test Procedures
13 Qualification Test Procedures

13.1 Corrosiveness of Soldering Fluxes
R13-1 [803] Fluxes shall be considered conformant (i.e., non-corrosive) if they meet the
acceptance criteria specified for each of the following four tests:
1. Copper Mirror
Flux Type L requirements of ANSI/IPC J-STD-004A[70], Requirements for
Soldering Fluxes, Paragraph 3.4.1 (IPC-TM-650[11], Test Method 2.3.32,
“Flux Induced Corrosion [Copper Mirror Method]”).
2. Halides
Flux Type L requirements of ANSI/IPC J-STD-004A[70], Paragraph 3.4.2.1
(IPC-TM-650[11], Test Method 2.3.33, “Presence of Halides in Flux, Silver
Chromate Method”).
3. Surface Insulation Resistance (SIR)
See Section 13.1.3, “Surface Insulation Resistance (SIR) Test.”
4. Electromigration Resistance
See Section 13.1.4, “Electromigration Resistance Test.”
These requirements are usually satisfied by the provision of suitable qualification

test data by the flux manufacturer.
13.1.1 Preparation of Fluxes for Testing
R13-2 [804] Liquid fluxes, such as those used in wavesoldering and repair (where
additional flux is added), shall be tested in as-received or as-used condition. If fluxes
are diluted for normal use, they shall be tested after dilution.
R13-3 [805] For Copper Mirror and Halide tests, if it is not possible to obtain solder-paste
flux samples from the manufacturer, then a flux solution shall be prepared by
melting solder paste in a crucible, extracting the flux residue with a suitable solvent
or solvent blend and concentrating the solution to 35% (by weight) or to the highest
practical concentration.
SIR and Electromigration test samples shall be prepared using as-received solder
paste.
R13-4 [806] For Copper Mirror and Halide tests, if it is not possible to obtain flux samples
from flux-cored solder wire from the manufacturer, then a flux solution shall be
prepared by melting cored solder wire in a crucible, extracting the flux residue with
a suitable solvent or solvent blend and concentrating the solution to 35% (by weight)
or to the highest practical concentration.
13–1
GR-78-CORE
Qualification Test Procedures Issue 2, September 2007
SIR and Electromigration test samples shall be prepared using as-received cored
solder wire.
13.1.2 Test Patterns for SIR and Electromigration Resistance Testing
Either the 0.050-inch space patterns (Figure 14-1) or the 0.0125-inch space IPC-B-25
(B or E) patterns (see IPC-TM-650[11]) may be used for SIR testing. IPC-B-25
(B or E) patterns shall be used for Electromigration testing.
Alternate test patterns may also be used for SIR testing. The minimum insulation
resistance requirement will be determined by comparison of the ‘squares count’
(‘squares count’ is the length of the parallel conductors in the test pattern divided by
their separation) for the alternate pattern with the ‘squares count’ for the standard
pattern (Figure 14-1), and adjusting the insulation resistance limit accordingly. For
example, if the alternate pattern contains 10 times as many squares as the standard
pattern, the minimum insulation resistance requirement will be reduced from
1×104 megohms to 1×103 megohms. Alternate patterns shall contain at least as many
squares as the standard pattern (Figure 14-1).
R13-5 [807] These patterns shall be manufactured using FR-4 copper clad laminate.
Copper weight is not important; 1/2 ounce is preferred to minimize the effects of
etchback. The finished patterns shall be untreated bare copper.
The patterns may be produced several-up on large panels, and then separated into
individual coupons after manufacture.
Simple print-and-etch technology, using dry film photo resist rather than screen-
printed resist in order to optimize conductor edge definition, is the preferred
method of manufacture. If a double-sided manufacturing process is used, the
metallic etch resist shall be removed to produce a bare copper finish.
If tin/lead is used as the etch resist, the tin/lead reflow step should be avoided (since
this tends to degrade insulation resistance).
Test patterns should be scrubbed, using brush or pumice, after etching. Anti-
oxidant, or other treatments normally used to protect the copper surface, shall not
be permitted.
Thoroughly clean and dry all test patterns using a cleaning process yielding a
minimum SIR of >2×105 megohms for the 0.050-inch space pattern (Figure 14-1) or
4×104 megohms for the IPC-B-25 (B or E) patterns. If the test patterns are not
intended for immediate use, they shall be stored in a clean environment as soon as
possible after cleaning.
13–2
13.1.2.1 Test Pattern Preparation — Liquid Fluxes
Twelve (12) interlocking comb test patterns are utilized for a single liquid flux SIR
test (9 if the optional control Group A is not used). Three (3) patterns are utilized for
an electromigration test. Table 13-1 summarizes sample preparation details.
Table 13-1 Sample Preparation — Liquid Fluxes
Sample Post
Group Flux Solder Clean Test
Aa (3 patterns) No No No SIR
B (3 patterns) Yes Pattern Up No SIR
C (3 patterns) Yes Pattern Down No SIR
Db (3 patterns) Yes Pattern Down Yes SIR
Ec (3 patterns) Yes Pattern Up Yes Electromigration
F (3 patterns) Yes Pattern Down No Electromigration
a. The use of control test patterns (Group A) is optional. It is good
experimental practice to use such controls, and as Section 13.1.3 states,
pre-test cleaning processes must produce samples with adequate SIRs
to allow successful testing.
b. Where post-solder cleaning is not intended, principally for low solids
(“no clean”) fluxes, the Group D tests are not required.
c. For “no clean” fluxes, the cleaning step shall be omitted.
1. Apply the flux under test to the entire surface of all Group B, C, D, E, and F
patterns. The flux may be applied by brushing liberal quantities onto the test
patterns, by dipping test coupons into a container of flux, or by floating test
coupons on the surface of a container of flux. In all cases, samples shall be
drained vertically for 1 minute with the fingers of the comb pattern vertical.
If flux is applied by spray, depositing a defined quantity per unit area, flux
qualification shall be restricted to the application process used.
The recommended equipment for test pattern soldering is a production
wavesoldering machine (so that the sample is exposed to a realistic preheat
schedule). An alternative for laboratory tests is a solder fountain;1 in this case,
the residence time should be similar to the residence time in a solder wave.
2. Solder the sample Group C, D, and F patterns fluxed-side down, and process the
sample Group B and E patterns fluxed-side up. Use solder (60% tin ±10%,
remainder lead) maintained at 260 ±6°C (500 ±10°F).
If any solder bridging of the conductors occurs, the pattern shall be discarded
and a replacement pattern prepared. Three (3) patterns from each sample group
shall be tested.
3. Clean the sample Group D and E patterns by immersion in room temperature
isopropyl alcohol for 1 minute with gentle agitation.
1. The use of a solder pot is no longer recommended for the fluxed-side down samples, due to the tendency
to form solder bridges and dross deposits.
13–3
GR-78-CORE
4. Attach test leads to the land areas of all patterns either by mechanical pressure
connections or by hand soldering using Rosin (R) or RMA flux cored solder wire.
A simple off-contact shield fixture should be used to protect the test patterns
from flux spitting during soldering; the flux shall not spread into the pattern area.
Do not remove the flux.
13.1.2.2 Test Pattern Preparation — Solder Pastes
Nine (9) interlocking comb test patterns are utilized for a single solder paste flux SIR
test (6 if the optional control Group A is not used). Three (3) patterns are utilized for
an electromigration test. Table 13-2 summarizes sample preparation details.
1. Using a squeegee or screen printer and an 0.008-inch thick stencil imaged with
the test pattern, print the Group B, C, and D patterns with the solder paste under
test.
2. Reflow the solder paste using suitable infrared, vapor phase, or convection
reflow equipment. If such equipment is not available, these patterns may be
floated, printed side up, on the surface of a solder bath maintained at 260 ±6°C
(500 ±10°F) until the solder paste reflows. If any solder bridging of the
conductors occurs, patterns shall be discarded and replacement patterns
prepared. Three (3) patterns from each sample group shall be tested.
3. Clean the sample Group C and D patterns by immersion in room temperature
isopropyl alcohol for 1 minute with gentle agitation.
Table 13-2 Sample Preparation — Solder Pastes
Sample Group Print/Reflow Post Clean Test

Aa (3 patterns) No No SIR
B (3 patterns) Yes No SIR
Cb (3 patterns) Yes Yes SIR
Dc (3 patterns) Yes Yes Electromigration
experimental practice to use such controls, and as Section 13.1.3
states, pre-test cleaning processes must produce samples with
adequate SIRs to allow successful testing.
(“no clean”) fluxes, the Group C tests are not required.
13–4
13.1.2.3 Test Pattern Preparation — Cored Solder Wire
Nine (9) interlocking comb test patterns are utilized for a single cored solder wire
flux SIR test (6 if the optional control Group A is not used). Three (3) patterns are
utilized for an electromigration test. Table 13-3 summarizes sample preparation
details.
Table 13-3 Sample Preparation — Cored Solder Wire
Sample
Hand Solder Post Clean Test
Group
Aa (3 patterns) No No SIR
B (3 patterns) Yes No SIR
Cb (3 patterns) Yes Yes SIR
Dc (3 patterns) Yes Yes Electromigration
experimental practice to use such controls, and as Section 13.1.3
states, pre-test cleaning processes must produce samples with
adequate SIRs to allow successful testing.
(“no clean”) fluxes, the Group C tests are not required.
1. Using a hand soldering iron and the cored solder wire under test, carefully apply
solder to the fingers of all Group B, C, and D comb patterns.
2. Clean the sample Group C and D solder-coated patterns by immersion in room
temperature isopropyl alcohol for 1 minute with gentle agitation.
13.1.3 Surface Insulation Resistance (SIR) Test
Equipment includes the following:

1. A temperature/humidity chamber that produces conditions of 35 ±2°C, 85%
minimum Relative Humidity (RH), and that allows the insulation resistance of
the patterns to be measured under these conditions
2. Measuring equipment such as that described in ASTM D257[71], with a range up
to 1×107 megohms and capable of yielding an accuracy of ±5% at
1×106 megohms and an applied potential of 100 Vdc. Standard resistors should
be used for routine calibration.
13–5
GR-78-CORE
13.1.3.2 Test Procedure
It is an option to pre-condition test samples for 24 hours at 23°C (73.4°F) and 50%
RH before testing.
1. Place the terminated test patterns in a suitable rack that maintains the patterns
at least 1/2 inch apart and does not obstruct air flow when the rack is installed
in the chamber.
2. Place the rack approximately in the center of the temperature/humidity
chamber, oriented to align the test patterns parallel to the chamber air flow.
Route the wires to the outside of the chamber. Dress the wiring away from the
test patterns.
3. Close the chamber, set the conditions to 35 ±2°C, 85% minimum RH, and allow
the chamber to stabilize (typically several hours).
4. After an unbiased stabilization period of 24 hours, measure the insulation
resistance at an applied voltage of 100 Vdc for 1 minute. Record the results.
5. After the stabilization measurement, apply a dc bias of 45V to 50V to all parallel
conductors during the entire conditioning period. Terminals 2 and 4 shall be at
one potential, and terminals 1, 3, and 5 at the opposite potential.
6. After 4 days, remove the bias and measure the insulation resistance, under test
conditions, using an applied voltage of 100 Vdc for 1 minute with the polarity
opposite to that of the conditioning bias. Average the test results for each sample
group.
R13-6 [808] The average insulation resistance (megohms), for each sample group, taken
at 24 hours and again at 4 days, shall be greater than the minimum specified in
Table 13-4.
Table 13-4 Minimum Insulation Resistance Values
IRmin
Pattern Type
(megohms)
0.050 inch space (Figure 14-1) 1×105
0.0125 inch space (IPC-B-25) 2×104
The average insulation resistance (IRavg) is calculated from the following equation:
 N 
1
 ---- 
 N∑
log IR i
 1 
IR avg = 10
where:
N = Number of test points (12 nominal)

IRi = Individual insulation resistance measurements.
13–6
Where an assignable cause of low insulation resistance, which is properly

attributable to the laminate itself or to the process used to produce the PWB, can be
found, then such a value can be excluded from calculating the average value
provided that 10 (of the original 12) test points are included in the average. Such
assignable causes include the following:
• Contamination on the insulating surface of the board such as lint, solder splines,
or water droplets from the conditioning chamber
• Incompletely etched patterns that decrease the insulating space between
conductors by more than the amount allowed in the appropriate design
requirements drawing
• Scratched, cracked, or obviously damaged insulation between conductors.
R13-7 [809] Discoloration of the patterns (green, blue-green, blue, or blue-black

coloration of the conductors) shall be considered a failure.
13.1.4 Electromigration Resistance Test

1. A test chamber, usually a temperature/humidity chamber, that produces an
environment of 65 ±2°C, 85% minimum RH, and allows the test patterns to be
biased and measured under these conditions.
to 10 ohms and capable of yielding an accuracy of ±5% at 10 ohms and an applied
potential of 100 Vdc; standard resistors should be used for routine calibration.
3. A power supply to provide 10 Vdc at 100 µA.
4. Twelve approximately 1 megohm current limiting resistors.
RH before testing.
at least 1/2 inch apart. Insert the current limiting resistors in terminating leads 1,
3, and 5 of each pattern.
2. Place the rack approximately in the center of the test chamber. Route the wires
to the outside of the chamber; dress the wiring away from the test patterns.
3. Close the chamber, and allow the samples to stabilize for 96 hours at test
conditions (65°C, 85% minimum RH). All fluxes shall be tested at 65°C and 85%
minimum RH.
13–7
GR-78-CORE
4. After the 96-hour stabilization period, the initial insulation resistance

measurements shall be made using 45 to 100 Vdc. Make measurements between
terminals 1 and 2, 2 and 3, 3 and 4, and 4 and 5 with the current limiting resistors
in-circuit. Measurements shall be made with the patterns under test conditions.
Terminals 2 and 4 shall be at one potential, and terminals 1, 3, and 5 at the
opposite potential.
5. Connect the samples to the power supply with the current limiting resistors in-
circuit, and apply 10 Vdc for the duration of the test. The test polarity shall be the
same as the measurement polarity used in Step 4.
6. After 500 hours, disconnect the power supply and repeat the measurements per
Step 4, with the patterns under test conditions.
13.1.4.3 Data Handling
R13-8 [810] The average insulation resistance value shall not degrade by more than a
decade as a result of the applied bias:
IR initial
IR final ≥ ---------------------------
10
R13-9 [811] The average insulation resistance (IRavg) is calculated from:

 N 
1
 ---- 
 N∑
log IR i
 1 
IR avg = 10
where:


13–8
13.1.4.4 Visual Examination
R13-10 [812] After completion of the electromigration test, the test samples shall be
removed from the test chamber and examined, with backlighting, at 10×
magnification. There shall be no evidence of electromigration (filament growth) that
reduces conductor spacings by more than 20%. Minor discoloration of 1 polarity of
comb pattern fingers is normal; heavy corrosion is not acceptable.
13.2 Polymeric Coatings and Adhesive Materials

Solder masks for use in surface-mount assembly processes shall be capable of
withstanding the processing temperature exposures encountered in such processes.
These are often considerably more severe than those experienced during wave
soldering.
13.2.1 General
This section details requirements that apply to solder masks, conformal coatings,
legend inks and marking inks, polymers used for repair, and non-conductive
adhesives used for component and modification wire attachment.
R13-11 [813] In lieu of the requirements in this section for solder mask, testing to IPC-SM-
840D[47], Class T requirements, shall be acceptable. The requirements contained in
the IPC document are similar or equivalent to the ones contained herein.
R13-12 [814] Polymeric coatings and adhesive materials shall be capable of meeting the
requirements summarized in Table 13-5 when applied, patterned, and fully cured on
the substrate (e.g., printed circuit laminate or solder mask) on which they will be
used.
These requirements are usually satisfied by the provision of suitable qualification

test data by the material manufacturer.
Table 13-5 Tests Required for Polymeric and Adhesive Materials (Sheet 1 of 2)
Solder Masks
Legend & Marking
Test Conformal Coatings Adhesives
Inks
Repair Polymers
Visual GR-78, 13.2.2 & None None
IPC-SM-840D, 3.4.8,
Class T
Non-Nutrient IPC-SM-840D, 3.4.6 None IPC-SM-840D, 3.4.6
Adhesiona IPC-SM-840D, 3.5.2 GR-78 and IPC-SM-817
(Rigid PWBs) R13-15 [817]
(Flexible)
Abrasion IPC-SM-840D, 3.5.1 None None
13–9
GR-78-CORE
Table 13-5 Tests Required for Polymeric and Adhesive Materials (Sheet 2 of 2)
Solder Masks
Legend & Marking
Test Conformal Coatings Adhesives
Inks
Repair Polymers
Flammability GR-63-CORE, None GR-63-CORE,
Section 4.2.3 & Section 4.2.3 &
IPC-SM-840D, 3.6.3, IPC-SM-840D, 3.6.3,
Class T Class T
Resistance to IPC-SM-840D, 3.7.2 GR-78, Section 13.2.3 GR-78, Section 13.2.3
Soldering Process
Hydrolytic GR-78, Section 13.2.4 None None
Stability & & IPC-SM-840D, 3.6.2
Corrosion
Dielectric IPC-SM-840D, 3.8.1 None None
Strength
Insulation GR-78, Section 13.2.6 None None
Resistance & IPC-SM-840D, 3.9.1,
Class T
Electromigration GR-78, Section 13.2.7 GR-78, Section 13.2.7 GR-78, Section 13.2.7
& IPC-SM-840D, 3.7.2,
Class T
a. See Section 13.2.3, “Adhesion.”
13.2.2 Visual
R13-13 [815] Solder masks and conformal coatings shall be sufficiently transparent to
permit inspection of the coated substrate and circuitry.
13.2.3 Adhesion
R13-14 [816] Adhesion tests shall be conducted for every material combination expected
to be used in manufacturing. For example, adhesives and legend inks shall be tested
on every solder mask used.
R13-15 [817] Test legend or marking ink adhesion as follows:

1. A strip of pressure sensitive tape (1/2 inch wide and 2 inches long) shall be
pressed firmly onto the surface of a sample PWB printed with the ink under test
(on solder mask). A hand roller or eraser shall be used to eliminate all air
bubbles.
2. Rapidly remove the tape by a snap pull applied approximately perpendicular to
the PWB. A new strip of tape shall be used for each test.
3. Visually examine the tape. No ink particles shall be removed.
R13-16 [818] Legend or marking inks or adhesives that will be exposed to molten solder
shall be tested for resistance to solder as follows:
13–10
1. Prepare a sample of solder mask-coated Printed Circuit Board (PCB) with

printed legend or marking ink, or dots of adhesive (representative of the
maximum size to be used in manufacturing).
2. Process through the production wavesoldering process, using production flux.
3. Examine after soldering. The materials under test shall be completely resistant
to the adherence of solder.
13.2.4 Corrosion of Copper
R13-17 [819] When test specimens are examined under 10× magnification, there shall be no
evidence of green, blue-green, blue, or blue-black coloration of the copper beneath
the polymeric coatings after IPC-SM-840D[47] hydrolytic stability testing.
As an alternative to samples from the hydrolytic stability test, unbiased samples that
have been exposed to the Electromigration test may be used.
13.2.5 Test Patterns for Surface Insulation Resistance and Electromigration Testing
Use the 0.050-inch space (Figure 14-1) or the IPC-B-25A (E or F) patterns for
Insulation Resistance testing. IPC-B-25 (B or E) patterns or IPC-B-25A (D) pattern
shall be used for Electromigration testing.
Alternate test patterns may also be used for Insulation Resistance testing. The
minimum insulation resistance requirement will be determined by comparison of
the ‘squares count’ (‘squares count’ is the length of the parallel conductors in the test
pattern divided by their separation) for the alternate pattern with the ‘squares count’
for the standard pattern (Figure 14-1), and adjusting the insulation resistance limit
accordingly. For example, if the alternate pattern contains 10 times as many squares
as the standard pattern, the minimum insulation resistance requirement will be
reduced from 1×104 megohms to 1×103 megohms. Alternate patterns shall contain
at least as many squares as the standard pattern (Figure 14-1).
These patterns shall be manufactured using FR-4 copper clad laminate. Copper
weight is not important; 1/2 ounce is preferred to minimize the effects of etchback.
The finished patterns shall be untreated bare copper unless the material to be tested
is only specified by the material manufacturer for use over tin/lead (as is the case
with some solder masks). Here, test samples shall be prepared with a fused tin/lead
conductor finish per the following procedure.
The patterns may be produced several-up on large panels, and then separated into
individual coupons after manufacture.
Simple print-and-etch technology, using dry film photo resist rather than screen
printed resist in order to optimize conductor edge definition, is the preferred
method of manufacture. If a double-sided manufacturing process is used, the
metallic etch resist shall be removed to produce a bare copper finish.
If tin/lead is used as the etch resist, the tin/lead reflow step should be avoided (since
this tends to degrade insulation resistance).
13–11
GR-78-CORE
Test patterns should be scrubbed, using brush or pumice, after etching. Anti-
oxidant, or other treatments normally used to protect the copper surface, shall not
be permitted. Test patterns with a tin/lead finish shall not be scrubbed.
Thoroughly clean and dry all test patterns using a cleaning process yielding a
minimum SIR of >3.2×105 megohms for the 0.050-inch space pattern (Figure 14-1).
If the test patterns are not intended for immediate use, they shall be stored in a clean
environment as soon as possible after cleaning.
13.2.5.1 Test Pattern Preparation
1. Use eight (8) test patterns (Figure 14-1) for Insulation Resistance testing of each
material/substrate combination to be tested, and three (3) IPC-B-25 (B or E) or
IPC-B-25A (D) patterns for each Electromigration test.
2. Overcoat test patterns with the material under test (per Figure 14-3 for the
Figure 14-1 patterns), and cure the material per the manufacturer’s specification.
13.2.6 Surface Insulation Resistance (SIR) Test

minimum RH, and that allows the insulation resistance of the patterns to be
measured under these conditions.
to 1×107 megohms and capable of yielding an accuracy of ±5% at 1×106 megohms
and an applied potential of 100 Vdc; standard resistors should be used for routine
calibration.
RH before testing.
in the chamber.
13–12
test patterns.
3. Close the chamber, set to 35 ±2°C, 85% minimum RH and allow the chamber to
stabilize (typically several hours).
4. After 4 days, the insulation resistance shall be measured using an applied voltage
of 45 to 100 Vdc. Make measurements between terminals 1 and 2, 2 and 3, 3 and
4, and 4 and 5. Measurements shall be 1 minute after the application of the
measuring voltage with the patterns under test conditions. Terminals 2 and 4
shall be at one potential, and terminals 1, 3, and 5 at the opposite potential.
R13-18 [820] The average insulation resistance of the coated samples shall not be less than
the minimum insulation requirement (IRmin), as calculated from the following
equation:
IR min = R p × R m ⁄ ( R p + R m )
where:
Rp = Parallel leakage resistance contributed by the coating

Rm = Average minimum allowed insulation resistance of the
subrate.
Table 13-6 lists values for IRmin 25/50 (mils) line/space interlocking comb patterns.
Table 13-6 Values of IRmin(megohms) Versus Pattern Spacing
Comb Pattern IRmin

(line/space) (megohms)
25/50 (mils) 1.2×105
Rp value of 2×105 megohms, and Rm value of 3.2×105 megohms, were used to

calculate these values.
The average insulation resistance (IRavg) is calculated from the following equation;
it shall be greater than the IRmin values shown in Table 13-6.
 N 
1
 ---- 
 N∑
log IR i
 1 
IR avg = 10
where:
13–13
GR-78-CORE
No individual insulation resistance value may be less than 0.1 × IRmin. Two
measurements may be excluded from calculating the average if there is an
assignable cause of low insulation resistance that can be attributable to the laminate
itself or to the process used to produce the PWB. Such assignable causes include the
following:
13.2.7 Testing for Resistance to Electromigration

1. A test chamber, usually a temperature/humidity chamber, that produces an
environment of 85 ±2°C, 85% minimum RH, and allows the test patterns to be
biased and measured under these conditions.
and an applied potential of 45 to 100 Vdc; standard resistors should be used for
routine calibration.
3. A power supply to provide 10 Vdc at 100 µA.
4. Twelve approximately 1 megohm current limiting resistors.
RH before testing.
in the chamber.
test patterns.
3. Close the chamber, and allow the samples to stabilize for 96 hours at test
conditions (85°C, 85% minimum relative humidity).
13–14
4. After the 96-hour stabilization period, the initial insulation resistance

measurements shall be made using 45 to 100 Vdc. Make measurements between
terminals 1 and 2, 2 and 3, 3 and 4, and 4 and 5. Measurements shall be made with
the patterns under test conditions. Terminals 2 and 4 shall be at one potential,
and terminals 1, 3, and 5 at the opposite potential.
5. Connect the samples to the power supply with the current limiting resistors in-
circuit, and apply 10 Vdc for the duration of the test. The test polarity shall be the
same as the measurement polarity used in Step 4.
6. After 500 hours, disconnect the power supply and repeat the measurements per
Step 4, with the patterns under test conditions.
The average insulation resistance (IRavg) is calculated from the following equation:
 N 
1
 ---- 
 N ∑ log IR i
 1 
IR avg = 10
where:

R13-19 [821] The average insulation resistance value shall not degrade by more than a
decade as a result of the applied bias.

13.2.7.4 Visual Examination
R13-20 [822] After completion of the electromigration test, the test samples shall be
removed from the test chamber and examined, with backlighting, at 10×
13–15
GR-78-CORE
magnification. There shall be no evidence of electromigration (filament growth) that

reduces conductor spacings by more than 20%.2 For adhesives there shall also be no
evidence of reversion as determined by examining the appearance and surface
tackiness in accordance with Test Method 2.6.11 of IPC-TM-650[11].
13.2.8 Pre-Production Testing
R13-21 [823] In addition to the qualification tests summarized in Table 13-4, cured
polymeric coatings and adhesives shall also be tested for compatibility with
solvents, cleaning agents, fluxes, and other chemicals that may be encountered in
the intended manufacturing, repair, and maintenance processes, or in the end use
environment, before their use in manufacturing.
R13-22 [824] In addition to the qualification test summarized in Table 13-4, PWBs and PWB
assemblies using polymeric coatings and adhesives shall meet the applicable
ongoing SEC and insulation resistance test requirements of
• Section 6.1.3.9, “Insulation Resistance Testing”
• Section 6.1.3.10, “Solvent Extract Conductivity Testing”
• Section 7.1.3.8, “Insulation Resistance Testing”
• Section 7.1.3.9, “SEC Testing.”
13.3 Separable Connector and Socketed Component Lubricant Qualification
13.3.1 Lubricants for Gold-to-Gold or Similar Noble Metallizations
R13-23 [825] The minimum sample size shall consist of 3 connectors, each containing 25
contacts.
R13-24 [826] All male and female contacts shall be cleaned and tested as follows:
• Solvent de-grease
• Deionized (DI) water rinse
• 30% reagent grade hydrogen peroxide rinse; 1 minute at room temperature
• Air dry at room temperature (maximum 30°C).
R13-25 [827] One connector shall be used as a control; the other two shall be lubricated.
Either the male or female parts may be lubricated.
2. This requirement only applies to transparent or semi-transparent materials such as solder masks and
conformal coatings.
13–16
O13-26 [828] The lubricant concentration should be a minimum of 2%3 in the solvent. While
it is not recommended, a minimum concentration of 1% may be qualified.
R13-27 [829] After lubrication, mate the contacts and measure the contact resistance. Bake
the mated connectors at 50°C for 24 hours. Re-measure the contact resistance.
Contact resistance increase shall not exceed 2 milliohms or be significantly different
from the contact resistance increase of the control samples.
R13-28 [830] After the 24-hour test in R13-27 [829], perform 200 connector insertions.
Measure the contact resistance after 25, 50, 100, 150, and 200 insertions. For the
lubricated connections, no single contact resistance increase shall exceed
20 milliohms.
R13-29 [831] After durability testing, wear-through of the noble contact metallization of
separable connectors exposing non-noble metal shall not exceed 10% of the wear
track area. Wear-through may be assessed by viewing in a scanning electron
microscope equipped with energy dispersive X-ray, Auger spectroscopy, or by using
a suitable porosity test. See Section 14.2.2, “Noble Metal Porosity Testing.”
R13-30 [832] Post-mortem failure analysis shall be performed for any contact that exceeds
the 20-milliohms criterion in R13-28 [830], or the exposed base metal criterion in
R13-29 [831].
R13-31 [833] If a single lubricated contact out of the 50 sets (50 male and 50 female parts)
fails either the electrical or exposed base metal criteria, the test may be repeated at
up to 5% lubricant concentration.
R13-32 [834] For a lubricant/concentration to pass, all 50 lubricated contact pairs shall
meet R13-28 [830] and R13-29 [831].
R13-33 [835] In actual product applications, the particular lubricant shall only be used at
the minimum qualified concentration up to a maximum of 5%.
13.3.2 Lubricants for Tin-to-Tin and Solder-to-Solder Separable Connections
R13-34 [836] The minimum sample size shall consist of 3 connectors or 3 IC/socket pairs
(as appropriate) containing a minimum of 25 contacts each.
R13-35 [837] All male and female contacts shall be cleaned and tested as follows:
• Solvent de-grease
• Deionized (DI) water rinse
• 30% reagent grade hydrogen peroxide rinse; 1 minute at room temperature
• Air dry at room temperature (maximum 30°C).
3. This recommendation is based on field experience.
13–17
GR-78-CORE
R13-36 [838] One connector shall be used as the control for baseline metallization damage
and shall remain unlubricated, while the other two shall be lubricated. Either the
male or female parts may be lubricated.
R13-37 [839] The lubricant shall be applied in such a manner as to meet a minimum initial
thickness requirement of 1 micron.
After lubrication and 5 mating cycles, mate the 2 lubricated sets and the control, and
perform the following:
1. Dynamically monitor contact resistance on a continuous basis for all contacts.
2. Introduce the 3 contact pairs into a temperature cycling chamber.
3. Cycle the 3 contact pairs at a minimum of 6 +20°C to +40°C cycles per hour up
to the maximum of 70 days (or less should failure occur).
4. Provide a muffin fan (or similar source) in the temperature chamber to provide
vibration to the chamber shelves of a minimum of 0.02-mm displacement
concurrent with the 70-day, 6-cycle per hour temperature cycling.
5. Log any resistance changes that occur for the constantly monitored contact
resistances in excess of 20 milliohms, even if the behavior is intermittent and the
connection recovers.
R13-38 [840] After the testing per R13-37 [839], all contacts shall be separated and
recleaned per the instructions immediately above.
R13-39 [841] All contacts from the passing group of contacts (contact resistance changes
of 20 milliohms or less) shall be examined microscopically and shall have greater
than 50% of the tin or solder plating remaining in the wear track and contact area.
R13-40 [842] Post mortem failure analysis shall be performed on all failed lubricated
contacts and unlubricated controls (the latter to establish a baseline).
R13-41 [843] If a single lubricated contact out of the 50 sets (50 male and female pairs) fails
either the 20 milliohms electrical requirement or has greater than 50% of the tin or
solder removed, the test is failed and the lubricant shall be noted as unqualified.
13–18
13.4 Qualification of Additive Circuitry for Bare PWB Modifications
R13-47 [849] Polymer thick film or other additive modification traces shall be tested for
electromigration resistance as described in R6-171 [331]. A minimum of eight (8)
FR-4 coupons shall be used with interdigitated modification circuitry pattern per
Figure 14-1. This pattern shall be defined as a copper comb pattern and in an
overlapping pattern in the additive circuitry. The electromigration test shall be
conducted to test for failure between either of the sets of comb patterns as well as
vertically through the dielectric. This can be most efficiently accomplished by
applying the bias simultaneously to the 2 sets of comb patterns with the opposite
polarity such that bias also appears vertically between the overlapping patterns.
R13-48 [850] Polymer thick film or other additive traces shall be tested for insulation
resistance (SIR) as described in R6-88 [248]. A minimum of eight (8) FR-4 coupons
shall be used with interdigitated modification circuitry pattern to evaluate the
integrity of both the connections to the pads and the dielectric that separates the
added circuitry from the original copper traces. The SIR test shall be conducted to
test for failure between either of the sets of comb patterns as well as vertically
through the dielectric. This can be most efficiently accomplished by measuring the
insulation resistance using the same wiring as was used in R13-47 [849], i.e.,
connecting the 2 sets of comb patterns with the opposite polarity such that bias also
appears vertically between the overlapping patterns.
R13-49 [851] Polymer thick film or other additive traces shall be tested for adherence and
immunity from environmental stresses.
A suitable test pattern employing 3 artwork layers is shown in Figure 14-11 through
Figure 14-13. Figure 14-11 shows the etched copper (a matrix of pads) on the bottom
layer. Figure 14-12 shows the pattern of added conductors that provide daisy
chained continuity between the pads on the bottom layer (by applying modification
circuitry to rows A, B, C, and D; the upper four U-shaped daisy chain patterns).
Figure 14-13 shows another layer of added conductor on the top layer that may
optionally be used to provide a test of insulation integrity down the bottom layer
(using the lower two U patterns, Lines E and F).
R13-50 [852] Post thermal shock adhesion testing shall be performed as described in R6-
174 [334]. A minimum of 5 of these completed boards are required for each polymer
thick film type, or additive circuitry metallization type, being qualified. At least 1
such board shall be processed each day, for 5 successive days (i.e., each day, another
pad layer board shall be modified to be a completed test board with the added
conductors using the modification process manufacturing line).
R13-51 [853] Hydrolytic stability testing shall be performed unbiased according to

IPC-SM-840D[47], 3.6.2, Class T and Section 13.2.4, “Corrosion of Copper,” of this
document. A minimum of 5 completed boards are required for each polymer thick
film type, or additive circuitry metallization type being qualified. At least 1 such
board shall be processed each day, for 5 successive days (i.e., each day, another pad
layer board shall be modified to be a completed test board with the added
13–19
GR-78-CORE
conductors using the modification process manufacturing line). The completed test
boards shall be subjected to 500 hours of an 85°C/85% RH environment.
R13-52 [854] Continuity testing shall be performed as part of this qualification. Pad layer
boards are modified per Figure 14-12 to link each U-shaped line of daisy chain pads.
A minimum of 5 of these completed boards are also required for each polymer thick
film type, or additive circuitry metallization type being qualified. At least 1 such
conductors using the modification process manufacturing line). The samples are
exposed to 50 temperature cycles for a total of 500 hours. Each cycle consists of
2 hours at 5°C, a 1-hour ramp to 85°C, 6 hours at 85°C, and a 1-hour ramp to 5°C. The
continuity of the modified and control lines shall be monitored throughout the
temperature cycling procedure. No single junction shall show a contact resistance
increase of greater than 10 milliohms.
R13-53 [855] Vertical breakdown testing, as Section 6.2.2.4, “Insulation Resistance Testing
— Interlayer,” describes, shall be performed as the final part of this qualification. A
minimum of 5 of these completed boards are also required for each polymer thick
film type, or additive circuitry metallization type, being qualified. At least 1 such
conductors using the modification process manufacturing line).
13–20
GR-78-CORE Tests and Methods
14 Tests and Methods

14.1 General
The following tests and methods are appropriate to verify the specific requirements
referenced. Alternate methods may be used if demonstrated to the satisfaction of the
Network Operator, or its designated representative, to be equivalent.
14.2 Metal Finishes
14.2.1 Noble Metal Contact Finishes
The noble metal plating thickness may be measured by the following non-
destructive tests:
• Beta Backscatter
• X-Ray Fluorescence
• Other approved methods.
14.2.2 Noble Metal Porosity Testing
Gold plating porosity shall be determined by either an electrographic test (paper or

gel) or a corrosive gas test. For other noble metal finishes, the porosity test used
shall be approved by the Network Operator or its designated representative.
14.2.2.1 Electrographic Testing — Paper
A number of suitable electrographic test methods are available. One example is

briefly described below.
Electrographic paper testing is restricted to flat parts (e.g., PWB contact fingers)
and simple forms. Complex shapes require alternate test methods such as the gel
test or one of the corrosive tests described in this section.
14.2.2.1.1 Outline of Method
This method for determining the porosity of gold or other noble metals over nickel
gives an accurate indication of porosity over a wide range of thicknesses and quality
levels.
During the test, a wet filter paper is sandwiched between the noble metal surface
and a metal plate. Pores in the noble metal plating expose the nickel underplate.
When a suitable bias is applied between the test sample and the metal plate, nickel
ions are anodically dissolved and collect in a filter paper. After testing, the filter
paper is removed and developed using a dimethylglyoxime (DMG) indicator
solution; red precipitate forms at each pore site.
14–1
GR-78-CORE
Tests and Methods Issue 2, September 2007
14.2.2.1.2 Test Details
1. Saturate a filter paper with an aqueous solution of 0.4M of Na2CO3 - 0.1M of NaCl.
2. Using a suitable press, sandwich the filter paper and a blotter sheet between the
test sample and a metal plate; the filter paper shall be in contact with the test
sample. Adjust the press to apply a pressure of 250 pounds per square inch to the
test sample.
3. For flat parts, the metal plate shall be flat; for shaped parts, the plate shall be
shaped to the contours of the part, and the part supported on a similar plate
shaped to the reverse side of the part.
4. Connect a dc power supply between the test sample (positive) and the pressure
plate (negative) and set the current to 5 mA/cm2. Maintain the bias for 30
seconds.
5. Remove the filter paper and develop in a 1% solution of DMG in a solvent made
of 95% volume of ethyl alcohol and 5% volume of concentrated ammonium
hydroxide.
6. Count the developed red spots using 10× magnification.
7. Typical pore counts for hard gold over nickel platings using this method are
shown in Table 14-1.
Table 14-1 Typical Pore Counts for Electrographic Porosity Test
Gold Thickness Porosity Range

≥50 micro inches <20 pores/cm2
30 micro inches <30 pores/cm2
25 micro inches <50 pores/cm2
14.2.2.2 Electrographic Tests — Gel
Suitable electrographic gel tests are described in ASTM B735[74]. The electrolyte and
indicator selected shall be capable of detecting pores in the gold plating that expose
both the underplate and the substrate, e.g., in the case of gold plating over nickel on
a copper or copper alloy substrate, the test shall detect both nickel and copper.
14.2.2.3 Corrosive Gas Tests — Nitric Acid Vapor
Suitable nitric acid porosity tests are described in ASTM B735[74]; other corrosive
gas tests may also be acceptable.
14.2.2.4 Finish Adherence
R14-1 [856] The adherence of both base metal and noble metal finishes shall be visually
examined at 10× magnification for blisters, cracks, or peeling. No such defects shall
14–2
be permitted. Where practical, a suitable bend test shall be performed before such
visual examination.
14.3 PWBs
14.3.1 Preparation of Cross-Sections
R14-2 [857] Microsections shall be done in accordance with IPC-TM-650[11], Method 2.1.1
“Microsectioning.”
14.3.2 Thermal Shock Testing of Plated Through Holes (PTHs)
R14-4 [900] Thermal Stress Testing of PTHs shall be done in accordance with IPC-TM-650,
Method 2.6.8, “Thermal Stress, Plated Through Holes.” When boards are to be
assembled using high temperature lead (Pb)-free solders such as
tin-silver-copper (SnAgCu), test condition A (288°C) is required. When boards are to
be assembled with tin-lead (SnPb) solder, test condition B (260°C) is required.
14.4 Insulation Resistance Testing
14.4.1 Equipment Required
Equipment utilized includes the following:

minimum RH, and that allows the insulation resistance of the patterns to be
measured under these conditions.
2. Measuring equipment, such as that described in ASTM D257[71], with a range up
and an applied potential of 45 to 100 Vdc. Standard resistors should be used for
routine calibration.
14.4.2 Insulation Resistance Test Patterns
Eight (8) test patterns are required for each insulation resistance test (32 readings/
test). The basic insulation test pattern is shown in Figure 14-1. This is used to control
inner layers of multilayer PWBs, bare PWBs before solder mask, and assemblies
14–3
GR-78-CORE
where no solder mask is used, before conformal coating. The same pattern,
overcoated with a striped solder mask pattern as shown in Figure 14-2, is used to
control PWBs after solder masking, and assemblies with solder mask.
Alternate test patterns may be used with the prior approval of the Network Operator
or its designated representative. The minimum insulation resistance requirement
will be determined by comparison of the ‘squares count’ (‘squares count’ is the
length of the parallel conductors in the test pattern divided by their separation) for
the alternate pattern with the ‘squares count’ for the standard pattern (Figure 14-1),
and adjusting the insulation resistance limit accordingly. For example, if the
alternate pattern contains 10 times as many squares as the standard pattern, the
minimum insulation resistance requirement will be reduced from 1×104 megohms to
1×103 megohms. Alternate patterns shall contain at least as many squares as the
standard pattern (Figure 14-1).
Table 14-2 summarizes test pattern requirements for each stage of the
manufacturing process to be controlled by insulation resistance testing.
Table 14-2 Insulation Resistance Test Pattern Requirements
Process Stage Pattern Description

Inner Signal Layers of MLBs 8 test patterns per Figure 14-1.
Processed to stage immediately before
lamination, i.e., after oxide application.
Bare PWBs Before Solder Mask 8 test patterns per Figure 14-1.
Processed to stage immediately before solder
mask application; including normal pre-solder
mask cleaning.
PWBs After Solder Application 8 test patterns per Figure 14-2.
Processed through solder application process
(e.g., Hot Air Solder Leveling [HASL]); including
normal post-solder application cleaning.
Assembled PWBs 8 test patterns per Figure 14-2.
(With Solder Mask) Processed through normal production soldering
and cleaning processes.
Assembled PWBs 8 test patterns per Figure 14-1.
(Without Solder Mask – Before Immediately before conformal coating;
Conformal Coating) processed through normal production soldering
and cleaning processes.
Comb patterns shall represent the PWB technology used on the processing line to be
controlled, e.g., if production PWBs employ bare copper conductors on FR-4
laminate, then the test patterns shall be manufactured using the same process.
Test patterns used for the control of the inner signal layers of multilayer PWBs and
bare PWBs before solder mask may be processed in quantity (using the
manufacturing process and materials they represent) up to, but not including, the
etching process. Such patterns shall then be processed through the etching and
subsequent processes, with production PWBs, as required for insulation resistance
testing.
14–4
Test patterns used for the control of the solder application processes and PWB
assemblies may be completed per Figure 14-2 (using the manufacturing process and
materials, including solder mask, they represent). Such patterns shall then be
processed through the assembly soldering and cleaning processes, with production
PWBs, as required for insulation resistance testing.
Only normal processes shall be used in the manufacture of insulation resistance test
patterns. Additional cleaning processes shall not be permitted. Test patterns may be
produced several-up on large panels, and then separated into individual coupons, if
necessary, after manufacture.
14.4.3 Terminating Test Patterns
1. Use eight (8) insulation resistance test patterns per Figure 14-1 or Figure 14-2, as
specified for the manufacturing stage represented by the insulation resistance
test. On double-clad laminates, a pattern may be on each side.
The solder or rosin shall not spread into the pattern area. A simple shield fixture
that does not contact the test patterns should be used to protect the patterns
from flux spitting during the lead soldering process; the flux shall not be
removed.
3. Handle test patterns only by the edges.
14.4.4 Test Procedure
Test patterns may be pre-conditioned for 24 hours before testing at 23°C (73.4°F)
and 50% RH.
1. Place the eight (8) terminated test patterns in a suitable rack that maintains the
patterns at least 1/2 inch apart and does not obstruct air flow when the rack is
installed in the chamber.
test patterns.
3. Close the chamber, set to 35°C (±2°C), 85% minimum RH, and allow the chamber
to stabilize at test conditions (this typically takes several hours).
4. After 24 hours, the insulation resistance shall be measured using an applied
voltage of 45 to 100 Vdc. Make measurements between terminals 1 and 2, 2 and
3, 3 and 4, and 4 and 5. Measurements shall be made one minute after application
of the measuring voltage with the patterns under test conditions. Terminals 2
and 4 shall be at one potential, and terminals 1, 3, and 5 at the opposite potential.
The insulation resistance test may be extended to 96 hours if the 24-hour values are
below specified minimum; in this case, the same acceptance criteria apply.
14–5
GR-78-CORE
R14-5 [859] The average insulation resistance (megohms) of the coated samples shall not
be less than the minimum specified (see Table 14-3).
Table 14-3 Summary of Insulation Resistance Requirements
Minimum Average Insulation Resistance

Process Stage (Test Patterns)
Inner Signal Layers of MLBs 1×104 megohms; immediately before
lamination, i.e., after oxide application
Bare PWBs Before Solder 1×104 megohms; immediately before solder
Mask mask application
PWBs After Solder 7×103 megohms; after solder application
Application process (e.g., HASL)
Assembled PWBs 7×103 megohms; after normal production
(With Solder Mask) soldering and cleaning processes
Assembled PWBs 1×104 megohms; immediately before
(Without Solder Mask – conformal coating
Before Conformal Coating)
14.4.5 Data Handling
The average insulation resistance (IRavg) is calculated from the following:

 N 
1
 ---- log IR i
 N∑ 
 1 
IR avg = 10
where:

No individual insulation resistance value may be more than a factor of 10 below the
specified minimum value. Where an assignable cause of low insulation resistance,
which is properly attributable to the laminate itself or to the process used to produce
the PWB, can be found, then such a value can be excluded from calculating the
average value provided that at least 30 test points are included in the average. Such
14–6
14.4.6 Insulation Resistance Requirements
Table 14-3 summarizes the minimum insulation resistance requirements at various

stages in the manufacturing process.
14.5 Solvent Extract Conductivity Testing

This test detects residual water/alcohol solvent soluble, ionizable contaminants on
PWBs, and presents a surface contamination level requirement. A PWB or PWB
assembly is immersed in a solvent of known conductivity. The solvent is then
agitated and the increase in conductivity of the solvent digest measured. The
relationship between the surface area of a PWB and the contamination level derived
from the measured conductivity, expressed in µg/cm as NaCl, is calculated. A
maximum allowable contamination level is specified. This test shall be performed
once per shift.
14.5.1 Equipment and Reagents Required
14.5.1.1 Equipment
Testing requires equipment capable of measuring the change in conductivity of a

water/alcohol solution resulting from the dissolution of ionic contaminants from a
PWB or PWB assembly immersed in a test tank. Such equipment contains the
following components:
• A covered test tank into which the sample to be tested is placed.
— For optimum sensitivity, the test tank should be so designed as to allow full
immersion of the PWB or assembly while minimizing the volume of solvent
necessary for such immersion.
— If a number of different sizes of PWBs or assemblies are to be measured,
several test tank sizes should be provided.
• A pump to circulate the alcohol/water mixture
• An ion exchange resin column to regenerate (remove the dissolved ionic
materials) the water/alcohol solvent between each test
• A conductivity meter to measure the conductivity of the solution before and
after testing
• A strip-chart recorder that displays conductivity versus time.
Commercially-available equipment is normally fitted with the necessary electronics
to automate solvent extract conductivity testing and display the results directly in
µg/cm of NaCl equivalent.
A pipette to dispense the calibration solution is required.
14–7
GR-78-CORE
14.5.1.2 Reagents
The following reagents are required to conduct the solvent extract conductivity
tests:
• Extraction Solvent — Deionized water and 99% isopropyl alcohol with a
conductivity of 1 microhm per centimeter or less is needed.
A ratio of 50% alcohol / 50% water or 75% alcohol / 25% water shall be used.
• Calibration Solution — 1 g/1000 cc solution of reagent grade NaCl in deionized
water.
14.5.2 Calibration Procedure
14.5.2.1 Determination of Test Duration
1. Regenerate the water/alcohol solvent to at least the level of cleanliness

recommended by the solvent extract conductivity equipment supplier.
2. Place a PWB or assembly, representative of the product to be measured, in the
test tank and replace the cover.
3. Switch the equipment to the measurement mode and allow it to run, observing
the strip chart that plots conductivity versus time. Continue this test until there
is no change in the strip-chart reading for 5 minutes.
Commercially-available equipment is usually fitted with a recording device that
shows increasing readings until a plateau is reached (typically the ion exchange
resin column used to regenerate the solution is not in-circuit in the measurement
mode, so solution conductivity will increase until all soluble ionic material is
removed from the sample under test). The maximum reading is related to the change
in conductivity of the test solution, and thence total dissolved ionic material is
expressed as µg/cm2 of NaCl equivalent.
In equipment where the ion exchange column is in-circuit in the measurement mode,
the strip-chart readings will increase to a peak and then decline to the original level
(solution conductivity will increase to a peak, representing the maximum
dissolution rate, and then decline as the dissolution rate tends to zero). In this case,
the area under the strip-chart curve is related to the dissolved ionic material.
Examine the strip-chart records from the above test, and select a time for
production testing that will ensure that at least 90% of the soluble ionic
contaminants will be detected during such testing. A 15-minute test time is typically
adequate.
This test shall be repeated periodically to ensure that the changing nature of the
ionic contaminants, and therefore their dissolution rate, does not affect the
accuracy of production testing. It is good practice to use strip-chart records for all
solvent extract conductivity testing.
14–8
14.5.2.2 Determination of Contamination Threshold
1. Calculate the wetted area of the PWB or assembly (in square centimeters) to be
tested as follows:
PWBs: 2 × surface area of one side of the PWB (edges do not contribute
significantly to the wetted area unless the PWB is very small)
Assemblies: 2 × surface area of one side of the PWB + surface area of
components
or
3 × surface area of one side of the PWB (allowing 50% of the PWB
wetted area for components – component surface area typically
less than 50% of the PWB surface area).
2. Multiply the area calculated above by the contamination limit (1 µg/cm2 of NaCl
equivalent) to determine the contamination threshold in µg of NaCl equivalent.
Divide by 1000 to convert to mg.
WettedArea ( sqcm )
Contamination Threshold (mg) = --------------------------------------------------
1000
4. Using the pipette, meter the quantity of standard sodium chloride solution
calculated in Step 2 (1 cc of the standard solution = 1 mg of sodium chloride) into
the test tank and replace the cover.
5. Switch the equipment to the measurement mode and allow it to run for the
duration determined in Section 14.5.2.1, “Determination of Test Duration.” Note
the equipment reading. This is the contamination threshold reading. When
measuring actual product, readings greater than this reading indicate failure.
The test equipment shall be calibrated for each size of PWB to be measured to
establish a database. Thereafter, provided that the specific gravity of the test
solution is carefully controlled, calibrations shall initially be conducted at least once
a week to establish the frequency necessary to maintain control.
14.5.3 Testing of Production PWBs and Assemblies

2. Place the PWB or assembly to be tested in the test tank and replace the cover.
3. Switch the equipment to the measurement mode and allow it to run for the
length of time determined in Section 14.5.2.1, “Determination of Test Duration.”
4. Note the contamination reading and compare this with the contamination
threshold reading determined per Section 14.5.2.2, “Determination of
Contamination Threshold.” If the reading is below the contamination threshold,
the product passes the test. If the reading is above the contamination threshold,
the product fails the test. In the event of failure, product represented by the
14–9
GR-78-CORE
sample selected for testing shall be recleaned until a further sample passes the
test.
Table 14-4 summarizes the contamination limits for product at various stages in the
manufacturing process.
Table 14-4 Summary of Contamination Limits
Process Stage Contamination Limit (Actual Product)

Inner Layers of MLBs 1 µg/cm2 (NaCl equiv.) based on wetted area;
immediately before lamination
Bare PWBs Before Solder Mask 1 µg/cm2 (NaCl equiv.) based on wetted area;
immediately before solder mask application
PWBs After Solder Application 1 µg/cm2 (NaCl equiv.) based on wetted area; after
solder application process (e.g., HASL)
Assembled PWBs 1.0 µg/cm2 (NaCl equiv.) based on wetted area of PWB
(With Solder Mask) and components, or
1.5 µg/cm2 (NaCl equiv.) based on wetted area of
PWB; after normal production soldering and cleaning
processes
Assembled PWBs 1.0 µg/cm2 (NaCl equiv.) based on wetted area of PWB
(Without Solder Mask – Before and components, or
Conformal Coating) 1.5 µg/cm2 (NaCl equiv.) based on wetted area of
PWB; after normal production soldering and cleaning
processes
14–10
Figure 14-1 Standard Insulation Resistance Test Pattern
1 3 5
2 4
All conductors are 1.2” long x 0.025” wide.

Spacing between conductors is 0.050”.
Unconnected ends of conductors are radiused.
Length of conductor overlap is 1.1”.
14–11
GR-78-CORE
Figure 14-2 Striped Solder Mask Coated Standard Test Pattern
1 3 5
2 4
All 19 solder mask lines are 0.025”.

All spacing between lines are 0.025”.
The ends of the conductors must be covered.
14–12
Figure 14-3 Solder Mask Coated Standard Test Pattern
1 3 5
2 4
14–13
GR-78-CORE
Figure 14-4 Simplified Schematic of the ESD Simulator
Charging Discharge
Resistor Resistor
Output
100 meg. ohms 1500 ohms
Charge Storage
Capacitor 100 pf
Ground
Figure 14-5 Theoretical Waveform
Normalized Current.
1.25
+ - 25% lpk
1
0.75
0.5
.368
0.25
0 150
0 100 200 300 400 500
Time in Nanoseconds.
14–14
Figure 14-6 Discharge Electrode and Resistive Current Monitor
Selected
Carbon Composition
8mm Target Sphere Matching Resistor
(48 ohms)
Discharge Electrode
Coax Connector
Circular Array of Five, 10 ohm

Simulator Return +/- 5% Resistors in Parallel.
Figure 14-7 Waveform Monitor Using a Current Probe
Faraday Shielded
ESD Simulator Discharge Probe
Current Probe
Target Sphere
Simulator Return
Coaxial Cable
to Scope
Ground Plane
14–15
GR-78-CORE
Figure 14-8 Pictorial Schematic of Test Procedure
ESD Simulator
Charge Removing Probe
Circuit Pack
Insulators
Figure 14-9 Logo for ESD-Sensitive Equipment
IEC symbol
adopted by the
Electronic Industries
Association
(RS 471)
14–16
Figure 14-10 Logo for ESD Protected Area
Figure 14-11 Etched Copper (a matrix of pads) on the Bottom Layer (the 6 sets
of lines are labelled A through F)
14–17
GR-78-CORE
Figure 14-12 Added Conductor Providing Daisy Chain Continuity Between the
Pads Modification of A, B, C, and D Circuitry
14–18
Figure 14-13 Added Conductor for Insulation Integrity Measurement

Modification of E and F Lines
14–19
GR-78-CORE
14–20
GR-78-CORE References
Appendix A: References
All Telcordia documents are subject to change, and their citations in this document
reflect the most current information available at the time of this printing. Readers
are advised to check current status and availability of all documents listed in this
section.
1. Title 29, Chapter XVII--Occupational Safety and Health Administration,
Department of Labor, July 2004.
2. GR-63-CORE, NEBSTM Requirements: Physical Protection (a module of
LSSGR, FR-64; TSGR, FR-440; and NEBSFR, FR-2063).
3. GR-357-CORE, Generic Requirements for Assuring the Reliability of
Components Used in Telecommunications Equipment (a module of RQGR,
FR-796; and NEBSFR, FR-2063).
4. TR-NWT-000930, Generic Requirements for Hybrid Microcircuits Used in
Telecommunications Equipment (a module of RQGR, FR-796; and NEBSFR,
FR-2063).
5. IPC-JP002/JEDEC JP002, Current Tin Whisker Theory and Mitigation
Practices Guideline.
6. JEDEC JESD 201, Environmental Acceptance Requirements for Tin
Whisker Susceptibility of Tin and Tin Alloy Surface Finishes.
7. GR-468-CORE, Generic Reliability Assurance Requirements for
Optoelectronic Devices Used in Telecommunications Equipment.
8. GR-1217-CORE, Generic Requirements for Separable Electrical
Connectors Used in Telecommunications Hardware (a module of RQGR,
FR-796; and NEBSFR, FR-2063).
9. GR-326-CORE, Generic Requirements for Single-Mode Optical Connectors
and Jumper Assemblies.
10. MDP-326-316, Requirements for Solderless Wrapped Connections.
(Formerly referred to as PUB 48010).
11. IPC-TM-650, Test Methods Manual.
12. IPC-DW-424, General Specification for Encapsulated Discrete Wire
Interconnection Board.
13. GR-421-CORE, Generic Requirements for Metallic Telecommunication
Cables.
14. GR-110-CORE, Generic Requirements for Thermoplastic Insulated Steam
Resistant Cable.
15. GR-111-CORE, Generic Requirements for Thermoplastic Insulated Riser
Cable.
16. GR-115-CORE, Generic Requirements for Inter-City PIC Screened Cable
(Filled ASP, Bonded STALPETH, and Bonded PASP).
17. TA-TSY-000120, Customer Premises or Network Ground Wire.
A–1
GR-78-CORE
References Issue 2, September 2007
18. TR-NWT-000121, Generic Requirements for One Pair Aerial Service Wire.
19. TR-NWT-000122, Generic Requirements for Multiple-Pair Aerial Service
Wire.
20. TR-NWT-000123, Generic Requirements for Single Pair Buried
Distribution Wire.
21. TR-NWT-000124, Generic Requirements for Multiple Pair Buried Wire.
22. GR-126-CORE, Generic Requirements for Network Outdoor Customer
Premises, and Universal Cross-Connecting Wire.
23. TA-TSY-000127, Network Aerial Block Wire.
24. GR-1069-CORE, Generic Requirements for Non-Metallic Reinforced Aerial
Service Wire.
25. GR-492-CORE, Generic Requirements for Metallic Telecommunication
Wire.
26. TR-NWT-000131, Generic Requirements for Network Plenum Cable/Wire.
27. TR-NWT-000132, Generic Requirements for Network Shielded Station
Wire.
28. TR-NWT-000133, Generic Requirements for Network Inside Wiring Cable.
29. TR-NWT-000134, Generic Requirements for Network Two Pair Station
Wire.
30. TA-TSY-000135, Miniature Ribbon Connector and Cable Assembly.
31. GR-136-CORE, Generic Requirements for Distributing Frame Wire.
32. GR-137-CORE, Generic Requirements for Central Office Cable.
33. GR-139-CORE, Generic Requirements for Central Office Coaxial Cable.
34. GR-347-CORE, Generic Requirements for Telecommunications Power
Cable.
35. ANSI/TIA/EIA-568-B, Commercial Building Telecommunications Cabling
Standard — Part 2: Balanced Twisted-Pair Cabling Components.
36. ANSI/TIA/EIA-569-B, Commercial Building Standard for
Telecommunications Pathways and Spaces.
37. ASM Metals Handbook, Ninth Edition, Volume 2, American Society for
Metals.
38. MIL-PRF-39012E, Connectors, Coaxial, Radio Frequency, General
Specification For.
39. GR-20-CORE, Generic Requirements for Optical Fiber and Optical Fiber
Cable.
40. ANSI/IPC-T-50G, Terms and Definitions for Interconnecting and
Packaging Electronic Circuits, December 2003.
41. IPC-2221A, Generic Standard on Printed Board Design.
A–2
42. IPC-6012B, Qualification and Performance Specification for Rigid

Printed Boards, plus Amendment 1. (IPC-6011 is the specification for Printed
Boards).
43. IPC-4554, Specification for Immersion Tin Plating for Printed Circuit
Boards.
44. IPC J-STD-003B, Solderability Tests for Printed Boards.
45. IPC-A-600G, Acceptability of Printed Boards.
46. IPC-9252, Guidelines and Requirements for Electrical Testing of
Unpopulated Printed Boards.
47. ANSI/IPC-SM-840D, Qualification and Performance of Permanent
Polymer Coating (Solder Mask) for Printed Boards.
48. ANSI/UL 746D, Standard for Polymeric Materials — Fabricated Parts;
ANSI/UL 746E, Standard for Polymeric Materials — Industrial
Laminates, Filament Wound Tubing, Vulcanized Fibre, and Materials Used
in Printed-Wiring Boards; ANSI/UL 746F, Standard for Polymeric
Materials — Flexible Dielectric Film Materials for Use in Printed-Wiring
Boards and Flexible Materials Interconnect Constructions.
49. J-STD-001D, Requirements for Soldered Electrical and Electronic
Assemblies.
50. IPC-A-610D, Acceptability of Electronic Assemblies.
51. TR-NWT-000870, Electrostatic Discharge Control in the Manufacture of
Telecommunications Equipment (a module of RQGR, FR-796).
52. ANSI/ESD S20.20, Standard for the Development of an Electrostatic
Discharge Control Program for Protection of Electrical and Electronic
Parts, Assemblies and Equipment.
53. JEDEC JESD 625-A, Requirements for Handling Electrostatic-Discharge-
Sensitive (ESDS) Devices.
54. IPC-7711A / IPC-7721A, Rework of Electronic Assemblies / Repair and
Modification of Printed Boards and Electronic Assemblies.
55. IPC/JEDEC J-STD-033, Standard for Handling, Packing, Shipping and
Use of Moisture/Reflow Sensitive Surface-Mount Devices.
56. GR-1089-CORE, Electromagnetic Compatibility and Electrical Safety —
Generic Criteria for Network Telecommunications Equipment.
57. GR-2914-CORE, Human Factors Requirements for Equipment to Improve
Network Reliability.
58. GR-3108-CORE, Generic Requirements for Network Equipment in the
Outside Plant (OSP).
59. GR-418-CORE, Generic Reliability Assurance Requirements for Fiber
Optic Transport Systems (a module of RQGR, FR-796).
A–3
GR-78-CORE
60. GR-284-CORE, Reliability and Quality Switching Systems Generic

Requirements (RQSSGR) (a module of RQGR, FR-796).
61. IEEE C62.38-1995, IEEE Guide on Electrostatic Discharge (ESD): ESD
Withstand Capability Evaluation Methods (for Electronic Equipment
Subassemblies).
62. IEEE C62.47-1992, IEEE Guide on Electrostatic Discharge (ESD):
Characterization of the ESD Environment.
63. IEC 61000-4-2, Electromagnetic Compatibility (EMC) — Part 4-2: Testing
and Measurement Techniques, Electrostatic Discharge Immunity Test,
April 2001.
64. ANSI/ESD STM5.1, Standards for Electrostatic Discharge (ESD)
Sensitivity Testing, Human Body Model (HBM) Component Level.
65. MIL-STD-883G, Test Method Standard Microcircuits.
66. EIA-471, Symbol and Label for Electrostatic Sensitive Devices.
67. ANSI EOS/ESD S8.1, ESD Awareness Symbols.
68. GR-2759-CORE, A View of Packaging, Packing, Palletization, and
Marking Requirements.
69. GR-1421-CORE, Generic Requirements for ESD-Protective Circuit Pack
Containers.
70. ANSI/IPC J-STD-004A, Requirements for Soldering Fluxes.
71. ASTM D257, Standard Test Methods for DC Resistance or Conductance of
Insulating Materials.
72. IPC-SM-817, General Requirements for Dielectric Surface Mounting
Adhesives.
73. TL 9000 Quality Management System (QMS) Measurements Handbook.
74. ASTM B735, Standard Test Method for Porosity in Gold Coatings on Metal
Substrates by Nitric Acid Vapor.
A–4
Note
To Contact Telcordia Customer Service or to Order Documents
Telcordia Customer Service

One Telcordia Drive, Room 1B-180
1.866.672.6997 (USA)
+ 1.732.699.6700 (Worldwide)
+ 1.732.336.2226 (FAX)
e-mail: document-info@telcordia.com
web site: http://telecom-info.telcordia.com
To Order Documents Online From the Telcordia Information SuperStore
1. Go to the SuperStore Web site: http://telecom-info.telcordia.com

(At this site, the Search and Browse selections provide access to the Telcordia
catalog of technical information.)
2. If you know the document number, enter it in the Search box in the left margin
and click Go!
3. Click on the desired product match.
If you do not know the document number, do the following:
1. Click on Search located on the top bar.
2. In the Keywords field, enter the keywords (or document number), then click
Submit Search.
3. Click on the desired product match.
To Order Documents From Within Telcordia (Employees Only)
1. Access the Telcordia Internal Home Page (InSite).

2. Click on Self-Service on the Navigation Bar.
3. Click on Document Database.
4. Click on Basic Search in the bullet list to obtain the Basic Search Criteria box.
5. In the Search by Document Number field, enter the document number
(e.g., GR-454), then scroll down to click on Submit Search.
6. In the Basic Search Navigation List, select Click for Abstract to order an
available document, or select Click for Document to view an available
document.
For New Information on Telcordia Technologies Technical Products
• Digest (Free Download or E-mail Distribution List)

Telcordia offers an electronic-only monthly publication — the Digest of
Technical Information, which provides the latest information on GRs and other
A–5
GR-78-CORE
products. At the Digest Web site, you may view recent document releases and
download the monthly Digest PDF files at no charge. For more information visit:
http://www.telcordia.com/digest
• Digest Plus (Free Subscription)

Telcordia also offers a printed publication — the Digest Plus, which includes a
quarterly compilation of new document releases and other items that appeared
in the monthly issues of the Digest. For more information visit:
http://telecom-info.telcordia.com (Click on Digest on the top.)
To Obtain Information on Additional Reference Material
American National Standards Institute (ANSI) http://web.ansi.org/

American Society for Testing and Materials (ASTM) http://www.astm.com/
Alliance for the Telecommunications Industry (ATIS) http://www.atis.org/
Electronic Code of Federal Regulations (e-CFR) http://ecfr.gpoaccess.gov/
Electronic Industries Alliance (EIA) http://www.eia.org/
Institute of Electrical and Electronics Engineers http://ieee.org/
(IEEE)
International Electrotechnical Commission (IEC) http://www.iec.ch/
International Organization for Standardization (ISO) http://www.iso.org/
National Fire Protection Association (NFPA) http://www.nfpa.org/
Underwriters Laboratories (UL) http://www.ul.com/
A–6
GR-78-CORE Acronyms and Glossary
Appendix B: Acronyms and Glossary
B.1 Acronyms
AC Alternating Current
ANSI American National Standards Institute
AOI Automatic Optical Inspection
APMC Air Core PIC Multi-Pair Cable
ASM American Society for Metals
ASTM American Society for Testing Materials
AWG American Wire Gauge
BGA Ball Grid Array
CAF Conductive Anodic Filament
CO Central Office
COWC Central Office Wire and Cable
DI Deionized
DIP Dual In-line Package
DMG Dimethylglyoxime
DSC Differential Scanning Calorimetry
EDW Encapsulated Discrete Wire
EIA Electronics Industries Association
EMI Electromagnetic Interference
E-PROM Erasable Programmable Read-Only Memory
ESD Electrostatic Discharge
FCC Federal Communications Commission
FIT Failure In Time
FR Family of Requirements (Telcordia document set)
FRU Field Replaceable Unit
GR Generic Requirements document (Telcordia document)
HASL Hot Air Solder Leveling
HBM Human Body Model
IC Integrated Circuit
IDC Insulation Displacement Connector
ILR Issues List Report
IP Industry Practice
IPC Institute for Interconnecting and Packaging Electronic Circuits
IR Insulation Resistance
JEDEC Joint Electron Device Engineering Council
MOT Maximum Operating Temperature
NEC National Electric Code
B–1
GR-78-CORE
Acronyms and Glossary Issue 2, September 2007
NTF No Trouble Found

OEM Original Equipment Manufacturer
OPW Outside Plant Wire
OSHA Occupational Safety and Health Standards
PAO Poly-Alpha-Olefin
PBGA Plastic Ball Grid Array
PCB Printed Circuit Board
PTFE Polytetrafluoroethylene
PTH Plated Through Hole
PVC Polyvinyl Chloride
PVDF Polyvinylidene Fluoride
PWB Printed Wiring Board
R Rosin
RC Resistance Capacitance circuit
RBOC Regional Bell Operating Company
RF Radio Frequency
RTF Reverse Treated Foil
RH Relative Humidity
RMA Rosin Mildly Activated
SEC Solvent Extract Conductivity
SIP Single In-line Package
SIR Surface Insulation Resistance
SMC Surface Mount Component
SMT Surface Mount Technology
SR Special Report (Telcordia document)
SWC Station Wire and Cable
TCE Thermal Coefficient of Expansion
TA Technical Advisory (Telcordia document)
TR Technical Reference (Telcordia document)
UL Underwriters Laboratories
WMC Waterproof Multi-Pair Cable
B–2
B.2 Glossary
Annular Ring The portion of a conductive material completely surrounding a hole.

Aspect Ratio The ratio of the length or depth of a hole to its pre-plated diameter.
Ball Grid Array A surface-mount package wherein the bumps for terminations are
(BGA) formed in a grid on the bottom of a package.
Blind Via A via extending only to one surface of a printed board.
Buried Via A via that does not extend to the surface of a printed board.
Compliant Pin A connector pin used in a press-fit connection that mechanically and
electrically joins the connector pin to a Plated Through Hole (PTH) of
a Printed Circuit Board (PCB) without solder.
Conductive Anodic Electrochemical dendrite growth on printed wiring board surface or
Filament (CAF) internal defect, as a result of temperature, humidity, and voltage bias.
Conformal Coating An insulating protective covering that conforms to the configuration
of the objects coated providing a protective barrier against deleterious
effects from environmental conditions.
Dielectric Strength The maximum voltage that a dielectric can withstand under specified
conditions without resulting in a voltage breakdown, usually
expressed as volts per unit dimension.
Electromigration An undesirable phenomenon in which metal ions migrate through a
suitable medium under the influence of an electrical field.
Etchback The controlled removal by a chemical process, to a specific depth, of
nonmetallic materials from the sidewalls of holes in order to remove
resin smear and expose additional internal conductor surfaces.
Etch Resist An organic or metal-plated material used to protect the conductive
pattern image from the etching chemistry. The organic material may
be photosensitive.
Flux A chemically- and physically-active compound that, when heated,
promotes the wetting of a base metal surface by molten solder by
removing minor surface oxidation and other surface films and by
protecting the surfaces from reoxidation during a soldering process.
Hi-Pot Test A method in which the unit under test is subjected to a high alternating
current (AC) voltage.
Hot Air Solder A physical deposition process using a solder bath into which the
Leveling (HASL) printed board is dipped into a molten solder bath and withdrawn
across a set of hot air knives (forced hot air flow) used to remove
excess solder.
Insulation The electrical resistance of an insulating material that is determined
Resistance under specific conditions between any pair of contacts, conductors, or
grounding devices in various combinations.
Lead A length of insulated or uninsulated metallic conductor that is used for
electrical interconnections.
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GR-78-CORE
Leadless Surface An SMC whose external connections consist of metallized

Mount Component terminations that are an integral part of the component body.
(SMC)
Measling A condition that occurs in laminated base material in which internal
glass fibers are separated from the resin at the weave intersection.
Metallization A deposition or plated thin metallic film that is used for its protective
and/or electrical properties.
Microvia A blind or subsequently buried via that is less than 0.15 mm in
diameter.
Negative Etchback Etchback in which the inner conductor layer material is recessed
relative to the surrounding base material.
Pattern Plating The selective plating of a conductive pattern and associated holes.
Pb-Free Solder An alloy that does not contain more than 0.1% lead (Pb) by weight as
its constituent and is used for joining components to substrates or
coating surfaces.
Photo Resist A photo-chemically reactive material, which polymerizes upon
exposure to ultraviolet energy at a given wavelength customarily used
to define an etching, plating, or selective stripping pattern on a
substrate.
Pinhole An imperfection in the form of a small hole that penetrates entirely
through a layer of material.
Plated Through A hole with plating on its walls that makes an electrical connection
Hole (PTH) between conductive patterns in internal layers, external layers, or
both, of a printed board.
Prepreg A sheet of material that has been impregnated with a resin cured to an
intermediate stage, i.e., B-staged resin.
Printed Wiring A printed board that provides point-to-point connections but not
Board (PWB) printed components in a predetermined arrangement on a common
base.
Power Plane A conductor layer, or portion thereof, that serves as a common voltage
source at other than ground potential for an electrical circuit,
shielding, or heat sinking.
Reflow Soldering The joining of surfaces that have been tinned and/or have solder
between them, placing them together, heating them until the solder
flows, and allowing the surface and the solder to cool in the joined
position.
Reverse Treated Metal foil on which the drum or smooth side has been chemically
Foil (RTF) treated to make the surface rougher for increased adhesion to bonder
surfaces.
Rosin A hard, natural resin, consisting of abietic and primaric acids and their
isomers, some fatty acids and terpene hydrocarbons, that is extracted
from pine trees and subsequently refined.
Signal Plane A conductor layer that carries electrical signals.
Silver Migration The ionic removal of silver and its redeposition in an adjacent area
under the influence of migration-inducing conditions.
B–4
Solderless Wrap The connecting of a solid wire to a square, rectangle, or V-shaped

terminal by tightly wrapping a solid-conductor wire around the
terminal with a special tool.
Solder Mask A heat-resistant coating material applied to selected areas to prevent
the deposition of solder upon those areas during subsequent
soldering.
Solvent Extraction The removal of one or more components from a liquid mixture by
intimate contact with a second liquid that is nearly insoluble in the
first liquid and which dissolves the impurities and not the substance
that is to be purified.
Surface Insulation The electrical resistance of an insulating material between a pair of
Resistance (SIR) contacts, conductors or grounding devices in various combinations,
that is determined under specified environmental and electrical
conditions.
Surface Mount The electrical connection of components to the surface of a
Technology conductive pattern that does not utilize component holes.
Surface Mount A leaded or leadless device (part) that is capable of being attached to
Component (SMC) a printed wiring surface.
Via A PTH that is used as an interlayer connection, but in which there is
no intention to insert a component lead or other reinforcing material.
Wetting The spreading of molten solder or glass on a surface, with proper
application of heat, and in some cases, flux.
Whisker A slender, acicular metallic growth filament.
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GR-78-CORE
B–6
GR-78-CORE Deleted Requirements
Appendix C: Deleted Requirements

Table C-1 lists all deleted requirements and the reason for deletion. The section,
table, and figure numbers; as well as the local requirement numbers may change in the
following table as GR-78-CORE is reissued.
Table C-1 Deleted Requirements (Sheet 1 of 23)
Issue 1
Issue 1 Original Issue 1 Requirement and
Frozen
Local Reason for Deletion
Absolute
Number
Number
3-7 44 In all cases requalification shall be initiated if at anytime:
(1) significant manufacturing and/or field problems are identified, or
(2) the material manufacturer introduces significant changes in its
design or processing and assembly practices.
Reason: Combined with CR3-6 [43].
3-9 46 In addition to the individual flammability requirements detailed
above, equipment shall conform to GR-63-CORE for a Fire Risk
Analysis (GR-63-CORE, Section 4.2, contains requirements for a “Fire
Resistance Analysis Database” and a “Equipment Fire Test”).
Reason: Addressed in GR-63-CORE.
3-14 51 If non-conformant (to Section 13.1) fluxes or similar materials are
used after solder mask is applied to PWBs, at either the bare board
or the assembly level, the applicable requirements of
Sections 6.1.3.9, 6.1.3.10, 7.1.3.8, and 7.1.3.9 shall be met.
Reason: Addressed in Section 6.
4-2 62 Connector contacts shall consist of a combination of a base material
with spring properties to achieve the desired contact forces, and
contact metals that ensure reliable connections for the service life of
the connector. Noble metal connectors typically incorporate gold-to-
gold contact achieved by the application of gold buttons, inlays, or
plating over the base material.
4-3 63 For separable noble metal connections, initial contact resistance
shall be less than 20 mΩ. End-of-design-life contact resistance shall
be no more than 10 mΩ greater than initial contact resistance (i.e., ∆R
≤ 10 mΩ).
4-4 64 For separable base metallizations, initial contact resistance shall be
less than 30 mΩ. End-of-design-life contact resistance shall be no
more than 20 mΩ greater than initial contact resistance (i.e., ∆R ≤ 20
mΩ).
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Deleted Requirements Issue 2, September 2007
Issue 1
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4-5 65 Connector contacts shall present a convex form to mating flat
contacts, i.e., contact shall be made to a radius rather than to two
corners or edges. Durability testing should not result in multiple
parallel wear tracks. This requirement does not apply to component
sockets using base metal contact technology.
4-8 68 For PWB mounted connectors employing press-fit (e.g., compliant
pin) technology, the maximum force required to insert or remove a
single pin or contact shall not exceed 45 pounds; this only applies to
connector pins or contacts that are not soldered in position.
4-9 69 For PWB mounted connectors employing press-fit technology, the
minimum force required to remove a single pin or contact shall not
be less than 7.5 pounds. This requirement applies after initial
insertion, after replacement, and after long-term thermal aging of the
assembly to simulate end-of-life conditions. If the connector system
design cannot achieve this requirement, the press fit connection shall
pass the requirements for electrical stability of the resistance of the
contacts as specified in Section 7.3 of GR-1217-CORE. The
requirements on the resistance and on the change in the resistance in
a press-fit contact (such values are expected to be less than 1 mΩ)
apply after initial insertion, after replacement of pins, and after
environmental stressing to simulate end-of-life conditions; but it
need not be experimentally verified if the connector pins or contacts
are soldered in position.
4-16 76 Non-noble contact metallizations shall not be used in conventional
connectors (with contact engagement during insertion), where the
number of insertions experienced during the design life of the
equipment may exceed the limits established by durability testing per
R-[109]. See Section 4.3.2 for component socket requirements.
Reason: Addressed in Tables 4-3 and 4-4.
4-17 77 The end-of-life contact normal force for separable connections shall
be 100 grams minimum. If this cannot be achieved, the contact
normal force at the beginning and end of life shall be specified by the
connector manufacturer. An acceptable alternative for qualification,
when the specified contact normal force is less than 100 grams, is the
Prequalification test program (Section 7 of GR-1217-CORE) to
demonstrate reliability in the face of R-[78], and also the
environmental stresses listed in GR-1217-CORE, Section 4.2.2.
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4-19 79 The maximum temperature of connectors, under worst-case
operating or storage conditions, shall not exceed the distortion
temperature of any of the polymeric materials that form part of the
connector structure. At maximum operating or storage
temperatures, plastic deformation shall not be sufficient to cause
connectors to fail to meet any of the requirements of GR-78, Issue 1.
Reason: Addressed in GR-63 and in R4-19 [78].
4-21 81 For gold-to-gold separable connector systems, the contact
metallization schemes detailed in Tables 4-1 and 4-2 shall apply.
Table 4-1 applies to all connectors except PWB contact fingers, and
Table 4-2 applies to PWB contact fingers.
Reason: Addressed in Tables 4-3 and Table 4-4.
CR 4-22 82 Noble contact metallizations other than those detailed in Tables 4-1
and 4-2 may be acceptable for use provided supporting laboratory
data is presented to the Network Operator, or its designated
representative, for concurrence before their introduction into the
product. For the purposes of control, such noble metallization
schemes shall be treated as “Acceptable” rather than “Preferred” (see
Tables 4-1 and 4-2).
CR 4-23 83 Contact metallizations composed of diffused gold over palladium-
silver may be proposed for use if such proposals are supported by the
appropriate laboratory reliability test data for qualification.
4-25 85 Metallization, surface finish, and porosity requirements shall apply
only to the contact area of connector contacts.
NOTE: A narrow peripheral region adjacent to the edges of
PWB contact fingers may be excluded from porosity
requirements, provided that it is outside the contact area,
since some base metal exposure along contact finger
edges is normal
4-26 86 The equipment supplier’s porosity requirements and methods for
testing contact finishes on connectors, sockets, and the contact
fingers of PWBs shall apply with the concurrence of the Network
Operator, or its designated representative.
4-28 88 Noble metal plating for separable connections shall be of uniform
color in the contact areas.
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4-30 90 Scratches in the contact area of separable connections shall not
violate the surface finish requirements of R-[115].
4-32 92 To prevent excessive wear or roughness in separable connection
finishes, nodular conditions shall be minimized consistent with
industry standards or approved equivalent.
4-33 93 The design of base metal separable connector systems shall be such
as to minimize relative movement between mating contacts when
assemblies are subjected to mechanical and thermal stressing.
4-34 94 The design of base metal separable connector systems shall be such
as to ensure gas-tight hermeticity at the contact interfaces.
Hermeticity may be demonstrated by subjecting mated contacts to
industrial atmosphere testing per R-[113].
4-38 98 Table 4-4 provides a variety of lubricant types. These types of
lubricants have demonstrated satisfactory long-life field applications
for separable base metallizations and one of these shall be used.
Necessary characteristics for base metal lubricants include thermal
stability to at least 85°C, low volatility and low toxicity; grease (wax)/
oil mixtures need to be thixotropic (to prevent separation of oil and
grease phases); and synthetic oils and greases needed to wet contact
surfaces.
4-39 99 Equivalents shall possess the characteristics detailed in R-[98] and
the demonstrated ability to prevent fretting corrosion. The use of
equivalents requires approval of the Network Operator or its
designated representative. Such approval is contingent on
submission of satisfactory qualification test data to the requirements
of Section 13.3.2.
4-41 101 Lubricated connectors or sockets, mated for the first time with new,
conforming connectors, PWB contact fingers, or components (as
appropriate), shall be tested according to Test Method 3.7 of IPC-TM-
650. The measured low-level contact resistance shall not exceed:
— 20 mΩ for noble metal contact metallizations
— 30 mΩ for base metal contact metallizations.
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4-42 102 Lubricated connectors or sockets, mated for the first time with new,
PWB contact fingers, or components (as appropriate), shall be tested
according to Test Method 3.1 of IPC-TM-650. The measured contact
resistance at rated current shall not exceed:
— 20 mΩ for noble metal contact metallizations
— 30 mΩ for base metal contact metallizations.
4-43 103 The insulation resistance of connectors or component sockets, when
tested according to Test Method 3.6 of IPC-TM-650, shall not be less
than 1000 MΩ.
4-44 104 When mated and wired (where appropriate) connectors or
component sockets are subjected to high temperature life testing
according to Test Method 3.14 of IPC-TM-650, Test Condition 3
(85°C), Test Time Condition C (500 hours), the following
requirements shall be met:
• There shall be no evidence of damage or significant material
change, e.g., significant distortion of the connector housing.
• Low-level circuit and rated current contact resistance values
shall not exceed the limits specified in R-[101] and R-[102].
• Insulation resistance shall not be less than the limits specified in
R-[103].
4-45 105 Both male and female parts of a separable connector system using
noble metal contact metallizations shall be capable of meeting the
individual requirements after 200 insertions. Connectors shall be
lubricated before durability testing.
4-46 106 After durability testing, wear-through of the noble contact
metallization of separable connectors exposing non-noble metal
shall not exceed 10% of the wear track area. Wear-through may be
assessed by viewing in a scanning electron microscope equipped
with energy dispersive X-ray, Auger spectroscopy, or by using a
suitable porosity test (Section 14.2.2) of Issue 1.
4-47 107 After durability testing, contact resistances of separable connectors
with noble contact metallizations shall meet the maximum end-of-life
requirement of initial resistance (20Ω maximum) + 10Ω.
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4-48 108 After durability testing, contact normal forces of separable
connectors with noble contact metallizations shall meet the 100-
gram minimum requirement.
4-49 109 The useful life of separable connector systems using non-noble metal
contact metallizations shall be established by actual testing. Tests
shall be conducted using new, conforming male and female parts.
Connectors shall be lubricated before testing.
4-50 110 After durability testing, the contacts of separable connectors with
non-noble metal contact metallizations shall not be damaged,
distorted, or misplaced.
4-51 111 After durability testing, the contact normal forces of separable
connectors with non-noble metal contact metallizations shall meet
the 100-gram minimum requirement.
4-52 112 After durability testing, the contact resistances of separable
the maximum end-of-life requirement of initial resistance (30 mΩ
maximum) + 20 mΩ.
4-53 113 After durability testing, the contact resistances of separable
the maximum end-of-life requirement of initial resistance (30 mΩ
maximum) + 20 mΩ after exposure to the gas-tight-joint test of
Paragraph 4.7.4.8 of MIL-C-28859B or other suitable industrial
atmosphere test.
4-55 115 The surface roughness of mating connector parts, including PWB
contact fingers, shall not exceed 20 µinch Center Line Average (CLA)
when measured in the direction of mating in a defect free area.
Exception: Scratches per R-[90].
4-64 124 For loose pin connectors, where contacts are individually installed in
the connector housing after termination, the maximum contact
insertion and removal forces, using the applicable tools, shall not
exceed 15 pounds (insertion) and 10 pounds (removal).
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4-66 126 The useful life of component sockets shall be established by actual
testing. Tests shall be conducted using new, conforming sockets and
devices; lubrication should be applied before testing (except where
the ‘PREFERRED’ metallization thicknesses of Table 4-1 are met by
both the socket and device leads). A new device shall be used for
each insertion.
4-67 127 Conventional component sockets (with contact engagement during
insertion) shall not be used in applications where the life established
in R-[126] may be exceeded during the design life of the equipment.
4-70 130 Open housing type IDCs shall also include strain relief ears molded
into the connector body. The addition of the relief ears will increase
the extraction force when a wire is pulled in the direction opposite
the slots into which it is inserted.
Reason: Duplicate of R4-72 [129].
4-72 132 Zero Insertion Force (ZIF) connectors shall be designed with no
contact engagement during insertion.
Reason: This is a connector-design requirement suitable to
GR-1217-CORE.
4-73 133 The design of ZIF connectors shall be such as to provide some
contact wipe as the connectors are closed.
Reason: This is a connector-design requirement suitable to
GR-1217-CORE.
4-74 134 The contact operating mechanism of ZIF connectors shall be non-
conductive to prevent system or circuit pack damage if the
connectors are operated while circuitry is powered.
4-75 135 Coaxial connector engagement and disengagement forces shall not
exceed those specified by the manufacturer.
4-76 136 Materials susceptible to corrosion shall not be used in the
construction of optical connectors.
5-2 139 Reason: R-[139] was turned into a paragraph in Section 5.1.2.
5-4 140 Requirements for central office wire and cable are contained in the
documents listed in Table 5-4.
Reason: The material is retained as informational.
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5-6 142 All materials used in wires and cables shall be adequate and
compatible with the physical and environmental stress to which they
will be subjected. Polymeric materials shall be resistant to photo,
thermal, oxidative, and hydrolytic degradations.
Reason: Included in R5-1 [138].
5-10 146 The insulation of silver-plated copper wire used for solderless
wrapped connections shall be either:
• Polyvinyl Chloride (PVC), or
• Polyester, or
• Polyfluorocarbon such as Polymonochlorotrifluoroethyle
(PCTFE), Polytetrafluoroethylene (PTFE), Fluorinated Ethylene
Propylene (FEP), and Polyvinylidene Fluoride (PVDF).
Reason: Addressed in other GRs and in Section 5.1.7 and
Section 3.2.1 of this document.
6-52 222 On plated-through hole PWBs, the application of solder mask up to
holes used for component mounting shall be permitted.
Reason: Addressed in IPC-A-600.
6-59 229 Solder masks shall conform to IPC-A-600 requirements, which
include the following:
• Solder mask shall not be permitted in the contact area of PWB
contact fingers.
• Solder mask coatings on PWBs shall be free from blisters.
• Solder mask coatings on PWBs shall be free from cracks.
• Solder mask coatings on PWBs shall be free from peeling.
• Solder mask coatings on PWBs shall be free from tackiness.
• Solder mask coatings on PWBs shall be free from wrinkling.
• Solder mask coatings on PWBs shall be free from areas
delaminated from the circuit.
• Solder mask coatings on PWBs shall be free from bubbles at the
substrate/solder mask interface; bubbles contained within the
solder mask material are permitted.
6-63 233 Solder mask coatings shall be uniform in appearance.
6-64 234 The minimum thickness of solder mask coatings on PWBs, measured
in the center of coated conductors, shall be 0.0005 inch. The edges of
conductors shall be coated.
Reason: Addressed in R6-58 [220].
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6-84 254 Where a pre-flux or chemical treatment used for solderability
retention on PWB conductors is non-conformant with the
requirements of Section 13.1, then the post-assembly insulation
resistance requirements of Section 7.1.3.8 shall be met. R-[459] to
R-[463] also apply.
Reason: Covered in R6-91 [251] and O7-109 [519].
6-93 263 Where a pre-flux or chemical treatment used for solderability
retention on PWB conductors is non-conformant with the
requirements of Section 13.1, then the post-assembly solvent extract
conductivity requirements of Section 7.1.3.10 shall be met. R-[459] to
R-[463] also apply.
Reason: Covered in R6-99 [259] and R7-112 [523].
O6-174 344 It is desirable that multilayer PWB designs incorporate pads for
plated-through holes on every conductor layer.
Reason: There is no industry evidence that the use of pads on every
conductor layer improved reliability of plated-through holes.
IP6-181 351 Unbalanced double-sided clad laminates (e.g., 1 oz./2 oz.) should not
be used in multilayer PWB structures.
Reason: The use of unbalanced double-sided clad laminates is
common in the industry.
IP6-182 352 To control warpage, laminates and particularly prepregs of different
types, from different vendors, or from different batches from the
same vendor, should not be mixed in multilayer structures. If this is
unavoidable, the mixed materials should be used in a balanced
fashion in balanced structures.
Reason: No longer an IP.
O6-220 390 It is an objective that the location of via holes beneath leadless
surface mounted components on PWBs be avoided.
Reason: This objective conflicts with current industry component
requirements.
6-238 408 Where pattern plating methods are to be used in the manufacture of
backpanel PWBs designed for use with press-fit pins or connectors,
careful attention shall be given to copper balance at the design stage,
both on each side of the PWB and from side-to-side, to minimize
plating thickness distributions, i.e., the area of copper exposed to the
plating process per unit area of the PWB shall be reasonably
consistent for each side of the PWB; the side-to-side plating areas
shall also be consistent.
Reason: Incorporated in the revised R6-254 [407].
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O6-239 409 If pattern plating methods are to be used in the manufacture of
multilayer backpanel PWBs, “pad-only-outer” designs consisting of a
“checkerboard” of pads (e.g., 0.062-inch square pads on 0.100-inch
centers) with no external interconnections are desirable since this
approach minimizes plating thickness distributions.
Reason: Incorporated in the revised R6-254 [407].
O6-240 410 It is desirable that backpanel PWBs to be used with press-fit pins or
connectors are drilled from the insertion side of the panel, i.e., drills
and pins or connectors should enter from the same side.
Reason: This objective is no longer reflective of normal
manufacturing techniques.
R7-4 422 If fluxes non-conformant with Section 13.1 are used in PWB
assembly, R-[459] through R-[463] and the requirements in Sections
7.1.3.8 and 7.1.3.9 shall be met.
Reason: Newer component packages do not allow for the reliable use
of non-conformant fluxes. All assembly and repair fluxes must
conform to Section 13.1.
IP7-13 431 Connectors should be mechanically attached to PWBs besides being
secured by their lead connections (see IP-[67]).
Reason: This is already addressed in Section 4.
O7-28 446 When tin is used as a lead finish, it should contain a minimum of 2%
lead.
Reason: The use of Pb in component lead finishes is no longer an
industry practice due to restrictions on the use of Pb.
R7-41 459 If the fluxes used in assembly soldering, or the pre-fluxes or
chemicals used on the PWB for solderability retention, are non-
conformant with Section 13.1, adequate spacing shall be provided
between the components and the PWB to allow for cleaning and
cleanliness monitoring (i.e., SEC testing).
of non-conformant fluxes for board assembly. All fluxes for board
assembly must conform to Section 13.1.
conformant with Section 13.1, the equipment manufacturer shall
demonstrate that post-solder cleaning processes are capable of
meeting assembly level insulation resistance and SEC requirements
(Sections 7.1.3.8 and 7.1.3.9).
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demonstrate that post solder cleaning solvents and cleanliness
monitoring solvents are capable of penetrating the areas under
surface mounted components.
demonstrate that process controls are adequate to ensure that
minimum component standoffs, consistent with efficient cleaning
and cleanliness monitoring, are maintained.
demonstrate that process controls are adequate to ensure the
ongoing efficiency of cleaning processes (i.e., insulation resistance
and solvent extract conductivity testing per Sections 7.1.3.8 and
7.1.3.9).
R7-47 465 Components having movable parts shall be mounted to avoid
interference with, or from, adjacent parts on assembled PWBs.
Reason: The intent of R-[465] is addressed by product quality
requirements.
R7-49 467 If leaded components on PWBs are mounted between rigid terminal
posts, at least one lead shall have a visible bow or other suitable lead
form to provide stress relief.
Reason: Information is addressed in R7-54 [466].
R7-55 473 Components and PWB assemblies shall be as specified in the
contract. If components and assemblies are not specified in the
contract, they shall be as specified by the manufacturer to the
Network Operator.
Reason: The information in R7-62 [473] is addressed in product
quality requirements and in R1-1 [1].
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R7-63 481 Wire forming and support on PWB assemblies shall be proper and
sufficient.
quality requirements.
R7-67 485 All clinched connections to PWBs shall be soldered.
quality requirements.
R7-68 486 Press-fit connections to PWBs shall comply with the requirements of
R-[68] to R-[71].
Reason: Addressed in Section 4.
R7-71 489 Screws or nuts used in PWB assemblies shall be tightened to at least
the minimum torques specified by the equipment manufacturer.
Reason: R7-77 [489] was combined in R7-76 [488].
R7-78 496 Any brushes used on PWB assemblies shall not mechanically damage
the surface of the board.
Reason: R7-84 [496] was combined with R7-83 [495].
R7-79 497 Regardless of the PWB assembly soldering fluxes used, post-solder
brushing processes shall be qualified by processing soldered test
patterns per Figure 14-2 through the brushing operation(s) and
testing to the requirements of Section 7.1.3.8.
Reason: R7-85 [497] was combined with R7-86 [498].
R7-84 502 All PWBs shall meet the standard solderability requirement per
J-STD-003. All PWBs processed to the point of component assembly
shall meet Category 2 solderability requirements of J-STD-003.
Where multi-stage soldering processes are used, PWBs shall
continue to meet this requirement between each soldering process.
Category 3 with steam aging shall be used when the storage time
can be greater than 6 months. If expected storage times are
exceeded, PWBs shall be retested before use.
Reason: The intent of R7-90 [502] is addressed in Section 6.1.3.6,
“Solderability.”
R7-86 504 There shall be no charring of PWB assemblies (beyond brown
discoloration), as a result of soldering.
Reason: The intent of R7-93 [504] is addressed by IPC-A-610, Class
2.
R7-87 505 Solder joints on PWB assemblies shall be clean, neat, smooth, and
feather out to a thin edge. There shall be no cold solder, disturbed
solder, or rosin joints.
2.
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R7-89 507 Wire insulation of PWB assemblies shall not be broken, frayed,
burned, or otherwise damaged so that conductors are exposed.
2.
R7-92 510 Soldered connections on PWBs shall be free from protruding wire
ends, spines, or droplets of solder that can cause safety hazards or
violate minimum clearance requirements (see R-[454]).
2 requirements.
R7-98 516 When applied over nonmelting metals (e.g., copper), solder mask
coatings on PWBs shall be free from blisters, cracks, and peeling
after assembly soldering.
Reason: The intent of R7-105 [516] is addressed in R7-104 [515]
and IPC-A-610.
R7-99 517 After assembly soldering, cracking and other defects in PWB solder
mask coatings over melting metals that could result in flux
entrapment shall not be permitted where non-conformant fluxes (per
Section 13.1) are used.
R7-105 523 If fluxes used in assembly soldering, or pre-fluxes or chemicals used
on the PWB for solderability retention, are non-conformant with
Section 13.1, the maximum allowable surface contamination level for
assemblies shall be 1.5 µg/cm2 of NaCl equivalent (based on the PWB
surface area), when tested according to Section 14.5. This
contamination limit applies to production assemblies, not test
patterns; it also applies to assemblies without solder mask before
conformal coating. It is not necessary to test each code; however, the
code(s) selected for testing shall represent the highest density/
technology level being processed in the period represented by the
test. Tests shall be performed once per shift.
Reason: Limits are not needed for conformant fluxes.
R7-106 524 In the event of a test failure, product rework and immediate process
correction shall be performed; no further product shall be passed
until SEC requirements are met.
Reason: N/A to conformant fluxes.
R7-110 528 Damage to PWB assemblies, however minor, shall not affect a
significant percentage of product.
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R7-111 529 The restrictions applied to bare PWBs for mechanical damage,
laminate and processing defects shall also apply to the boards of
assembled PWBs (see Sections 6.1.3.11 and 6.1.3.12).
R7-112 530 Defects such as measling and crazing shall not be propagated
because of any soldering operation.
R7-115 533 PWB assembly repair operations shall be subject to the same ESD
precautions as original manufacturing operations, e.g., all circuit
packs shall be considered sensitive to ESD damage.
Reason: Addressed elsewhere.
R7-117 535 When removing components from PWB assemblies, care shall be
taken to avoid disturbing adjacent components and solder joints.
Reason: Replaced by R7-126 [892] through CR7-130 [896].
R7-118 536 Proper tools (e.g., soldering/desoldering irons equipped with tips
designed for the removal of a particular component) shall be used for
the removal of multileaded components for PWB assemblies.
R7-119 537 Care shall be taken to avoid damage during the removal of clinched
components from PWB assemblies. It is permissible to cut the leads
of such components and remove each individually.
IP7-120 538 Where general purpose soldering irons are used in the removal of
through-hole mounted components in PWB assemblies, solder joints
should be melted by applying heat to the opposite side of the PWB
from the component.
O7-121 539 It is an objective that soldered-in components removed from PWB
assemblies are not reused.
IP7-122 540 Where a temperature-sensitive component being removed from a
PWB assembly may be reused, a heatsinking device should be used
to avoid thermal damage to the component during the removal
process.
R7-123 541 The removal of surplus solder after component removal from PWB
assemblies shall be achieved by using vacuum solder removal
devices or braided solder wick. Mechanical methods such as
shocking the assembly shall not be used.
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R7-124 542 The component removal/replacement process for PWB assemblies
shall be considered part of the assembly process. Therefore, fluxes
used (e.g., cored solder wire and the flux in solder wick) should meet
the requirements of Section 13.1. If fluxes do not meet these
requirements, the requirements of Sections 7.1.3.8 and 7.1.3.9 shall
apply.
R7-125 543 When soldering replacement components on PWB assemblies,
additional flux shall be used. This may be in the form of liquid flux,
cored solder wire, or solder cream.
R7-126 544 Where replacement components are hand soldered to PWB
assemblies, leads/terminals shall be soldered individually. Hand
soldering/desoldering tools used for the simultaneous melting of
multileaded component solder joints for removal shall not be used
for replacement component soldering.
R7-132 550 Modified PWB assemblies shall meet all requirements after
modification.
Reason: Redundant
CR7-143 561 Where practical, the installation of modification wiring on PWB
assemblies shall not involve the removal and replacement of hard
wired components.
Reason: Information is implicit in normal manufacturing practices.
O7-144 562 Modification wires for PWB assemblies should be cut to length and
stripped before commencing installation.
Reason: Information is implicit in normal manufacturing practices.
R7-150 568 Circuit packs modified shall be clearly marked as modified and
include a unique serial number for tracking purposes. The
designation “MOD” shall be clearly marked on the board, applied as
a stamp and/or as an addition to the serial number, to unambiguously
identify such modified boards to repair personnel without requiring
access to a data base.
Reason: Information is addressed by TL 9000 and other
manufacturing practices.
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R7-151 569 The supplier shall requalify its modification process per R-[566] to
match changing applications whenever a significant geometric,
dimensional, or technological change takes place for circuit packs
being modified. A realistic change amount is when the device lead
pitch, or modification wire attach area at a component lead changes
by 50%. The supplier shall also requalify the process, even without
such a significant change, according to the requirements and needs
of a Network Operator.
Reason: Lap-soldered mod wire reliability has been adequately
demonstrated.
R7-162 580 Uninsulated conductive materials shall not be used for mechanical
fastenings used to secure modification wires to PWB assemblies.
Reason: Implicit in R7-178 [582].
R7-163 581 Polymeric fasteners used to secure modification wires to PWB
assemblies shall maintain adequate hold-down characteristics for the
life of the equipment.
Reason: Combined with R7-178 [582].
R7-165 583 Mechanical fastenings used to secure modification wires to PWB
assemblies shall not cause the wires to contact sharp edges.
R7-166 584 Sharp edges on mechanical fastenings used to secure modification
wires to PWB assemblies shall not contact the wire insulation.
R7-167 585 Modifications to the PWBs of assembled circuit packs, apart from the
wiring modifications detailed in Sections 7.1.3.16 to 7.1.3.20, shall be
limited to circuit packs already completely or partially assembled.
Unassembled PWBs shall be modified before assembly.
Reason: Normal manufacturing processes would dictate same.
R7-168 586 Subtractive modifications to the PWBs of PWB assemblies shall
comply with the requirements of Section 6.1.3.16.
Reason: Redundant and covered elsewhere in this GR.
R7-169 587 The requirements contained in Section 7.1.3.13 also apply to
component modifications to PWB assemblies.
R7-170 588 The requirements of Sections 7.1.2.2 to 7.1.2.6 shall apply to the
modification of PWB assemblies by the addition of components.
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IP7-173 591 If the leads of modification components on PWB assemblies are
soldered into occupied plated-through holes, the original solder
joints should be melted by applying heat to the opposite side of the
board from the original component.
Reason: Covered elsewhere in GR or by IPC training.
R7-174 592 Where necessary, a heatsinking device shall be used to protect
temperature-sensitive modification components added to PWB
assemblies.
Reason: Covered elsewhere in GR or by IPC training.
R7-179 597 In PWB assemblies, the leads, wires, or terminals inserted into the
PTHs shall exhibit wetting.
Reason: This requirement is addressed in R7-92 [509].
R7-180 598 In PWB assemblies where leads, wires, or terminals are inserted into
the PTHs, the conductor paths or lands to which the soldered
connections are made shall exhibit wetting.
R7-181 599 In PWB assemblies where leads, wires, or terminals are inserted into
the PTHs, the wall of the PTHs shall exhibit wetting.
R7-182 600 In PWB assemblies, each PTH solder joint shall have a solder
connection that covers at least 75% of the component lead (e.g., 270°
for a round lead) or soldered-in terminal periphery available for
soldering on both sides of the board.
R7-185 603 Where the relative sizes of the lead and the terminal area prevent the
formation of appropriate solder fillets on PWB assemblies, a portion
of the component lead or hardware shall be outlined by solder. This
requirement applies to both PTH and non-PTH solder joints.
R7-187 605 When hand soldering leads close to the body of heat-sensitive
devices, a heat-conducting device shall be used, if necessary, to
restrict the heat flow into the component.
R7-188 606 Non-PTH solder joints to the PWBs of PWB assemblies shall have a
solder connection that covers at least 75% of the lead or soldered-in
terminal periphery available for soldering.
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R7-189 607 Non-PTH solder joints to the PWBs of PWB assemblies shall have a
solder connection that covers at least 75% of the conductor land
available for soldering.
R7-190 608 Where leads, wires, or terminals are soldered to non-PTHs in PWB
assemblies, the leads, the wires or terminals, and the conductor path
or land to which the soldered connection is made shall all show
evidence of wetting. The solder may not be recessed below the
surface of the board.
IP7-191 609 To minimize variations in the mechanical properties of surface
mount solder joints, solder joint metallurgy should be as simple as
possible. Ideally the composition of the coating on the component
termination, the coating on the PWB mounting pads, and the solder
should be the same.
Reason: No longer an industry practice.
IP7-192 610 Eutectic or near-eutectic solder compositions, such as 63/37 (tin/
lead) or 62/36/2 (tin/lead/silver), should be used for solder and solder
creams used to assemble surface mounted components to PWBs.
Reason: The intent of R-[610] has been incorporated in Section
7.1.1.3.
R7-193 611 Solders and solder creams employing solder compositions with
significant pasty ranges (temperature differences of >5°C between
liquidus and solidus) shall only be used in the assembly of surface
mounted components to PWBs with sound technical justification.
Supporting reliability test data shall be made available to the
Network Operator, or its designated representative upon request.
Reason: The intent of R-[611] has been incorporated in Section
7.1.1.3.
R7-194 612 Where surface mount assemblies on PWBs contain any leadless
components, fluxes (including the flux contained in the solder
cream) shall be non-corrosive per Section 13.1.
Reason: Redundant and covered elsewhere in this GR. All assembly
fluxes must conform to Section 13.1.
O7-213 631 It is an objective that reliability test programs for surface mount
technology used on PWB assemblies include worst-case tolerances
for PWBs, components, materials, and processes.
Reason: The intent of O7-228 [631] has been achieved in normal
commercial practices.
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R7-225 643 Surface mounted components shall be removed from PWB
assemblies by melting their solder joints. Other methods, such as
twisting components to shear solder joints shall not be used.
Reason: Covered by workmanship and IPC training.
R7-226 644 Proper tools shall be used to remove surface mounted components
from PWB assemblies. Soldering/desoldering irons with tips
designed for the component being removed are suitable for the
removal of small components; techniques such as hot gas or air are
preferred for the removal of large components.
Reason: Covered by workmanship and IPC training.
R7-228 646 The circuit pack assembler using BGA packages shall control solder
paste thickness by frequent print thickness monitoring. While
automated inspection of print height and quality is preferred, data
acquisition on a lot-by-lot or work shift basis is acceptable, provided
the assembler plots the data and includes feedback and corrective
actions at this manufacturing station in its quality assurance plan.
Reason: The intent of R7-244 [646] is addressed by normal
manufacturing and quality control practices.
R7-231 649 If fluxes non-conformant with Section 13.1 are used in BGA
assembly, in addition to R-[422], the cleaning process for a
manufacturing line shall be qualified using test vehicles that simulate
the BGA and other Surface Mount Technology (SMT) being used.
Reason: All fluxes for assembly must conform to Section 13.1.
R7-247 665 Tests to determine insertion and removal forces for press-fit pins or
connector contacts shall be performed periodically using tensile test
equipment with a cross-head speed of ≤ 1/2 inch/minute. Higher
cross-head speeds may be used if correlation with 1/2 inch/minute
results can be demonstrated.
Reason: The intent of this requirement is addressed in normal
manufacturing tuning processes.
R7-248 666 Measurements of PWB hole distortion and damage after the insertion
of press-fit pins or connector contacts, to R-[70] and R-[71], shall be
made periodically using cross-sections.
Reason: The intent of this requirement is addressed in normal
manufacturing tuning processes.
R8-3 670 All fan cooled equipments shall be equipped with filters.
Reason: GR-63-CORE contains fan and air filter requirements.
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R8-4 671 All equipment fan filters shall have a minimum dust arrestance of
80%. This represents a low efficiency 10 to 15% American Society of
Heating, Refrigerating, and Air-Conditioning Engineers (ASHRAE)
dust spot rating.
R8-5 672 Fan filters shall have a minimum fire rating of Underwriters
Laboratories (UL) Class 2.
R8-6 673 Construction and system fit of equipment fan filters shall prevent any
air bypass.
R8-7 674 Equipment shall provide for fan filter replacement with the fans shut
down or blocked to prevent handling contamination. Some designs
where the filters are withdrawn from the air flow for removal (e.g.,
door mounted filters) satisfy the intent of this requirement.
R8-8 675 The equipment manufacturer shall provide a method to determine
equipment fan filter replacement schedules.
O8-9 676 If possible, active alarming should be provided to indicate the need
for fan filter replacement.
O8-10 677 It is an objective that equipment fan filters are disposable and not the
types that require removal and cleaning.
R9-1 721 Circuit packs for telecommunications equipment shall be capable of
meeting the ESD test requirements outlined in the section.
Reason: Implied and combined with R9-2 [722].
CR9-21 741 Electronic Industries Association JEDEC/EIA Standard RS 471 logo
should be used for all products containing electrostatic-sensitive
parts and assemblies that require special handling to minimize
damage due to ESD exposure. Other symbols should not be used.
This symbol is illustrated in Figure 14-9.
Reason: Replaced by R9-20 [899].
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R9-22 742 The ESD susceptibility symbol should be used on systems,
assemblies, and devices that have sensitivity to ESD events. The
symbol may be incorporated on a sticker used to close or seal ESD
protective packaging to indicate that materials inside the package
are ESD susceptible. The symbol shall not be used on materials
designed for ESD protective areas, such as smocks, seating, work
surface materials, tools and equipment, packaging materials, or
personnel grounding equipment. The ESD protective symbol
described in Section 9.5.3.3 shall be used in these cases.
R9-25 745 ESD warning labels shall be of sufficient size and contrast as to be
clearly visible.
CR9-26 746 The following colors should be used for ESD warning labels:
• Black with yellow symbols for light backgrounds
• Yellow with black symbols for dark backgrounds.
R13-42 844 The qualification program shall involve tests for mechanical shock
with continuous continuity monitoring, vibration with continuous
continuity monitoring and with adherence strength retention testing,
temperature cycling with continuous continuity monitoring and with
adherence strength testing, and temperature/humidity soak under
bias per R-[845] through R-[848]. Wires shall be added by lap
soldering to actual product solder joints, pads, or traces in a
configuration similar to that of the proposed modification. A
minimum of 100 solder joints of a given geometry (either available
pads or existing component leads) shall be evaluated. The
modification test samples shall be representative of the
manufacturing process. A “daisy chain” of up to 25 wiring changes
may be employed to allow for an efficient mode of measurement for
a number of lap soldered joints connected in series.
demonstrated. The requirements in the original Section 13.4 are
sufficiently addressed in normal industry practices.
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R13-43 845 Mechanical shock testing shall be performed according to ANSI/IPC-
R-700C, 1988, using MIL-STD-202, Method 213, Test Condition J, 30g,
11 ms, half-sine. Three shocks along each of the three mutually
perpendicular axes (total 18 shocks) with electrical continuity
testing maintained throughout the test. Electrical continuity shall be
monitored during mechanical vibration testing where discontinuities
of 1 microsecond shall be registered by a resistance change of 10
ohms or more. The change in resistance (resistance of the chain),
measured after the test, shall be less than 2%. Any change in
resistance (resistance of the chain) greater than 1% shall be a trigger
for probing of the individual resistances pad to pad; any change of a
pad to pad resistance greater than twice the average of such
readings, or to a value of more than 10 milliohms, shall constitute a
failure of the test.
R13-44 846 A vibration test shall be performed according to ANSI/IPC-R-700C,
1988 using IPC-TM-650, 2.6.9. One sweep from 20 to 2000 to 20 Hz is
performed in 16 minutes. The input acceleration (g) over the 20 to
2000 Hz frequency range is 15g. Electrical continuity shall be
monitored during mechanical vibration testing where discontinuities
are registered by a resistance change of 10 ohms or more. The change
in resistance (resistance of the chain), measured after the test, shall
be less than 2%. Any change in resistance (resistance of the chain)
greater than 1% shall be a trigger for probing of the individual
resistances pad to pad; any change of a pad to pad resistance greater
than twice the average of such readings, or to a value of more than 10
milliohms, shall constitute a failure of the test.
R13-45 847 Temperature cycling shall be performed for 100 cycles according to
ANSI/IPC-R-700C, 1988 using IPC-TM-650, 2.6.6 Class A Modified.
The thermal cycle with continuous electrical continuity monitoring is
as follows:
• Step 1 – hold at +100 (+5/-0) °C for 45 minutes minimum.
• Step 3 – hold at -60 (+0/-5) °C for 45 minutes minimum.
demonstrated. The requirements in Section 13.4 are sufficiently
addressed in normal industry practices.
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R13-46 848 The resistance of the chain shall be monitored throughout the test.
Any change in resistance (resistance of the chain) throughout the
test shall be less than 2%. Any change in resistance (resistance of the
chain) greater than 1% shall be a trigger for probing of the individual
resistances pad to pad; any change of a pad to pad resistance greater
than twice the average of such readings, or to a value of more than 10
milliohms, shall constitute a failure of the test. Additionally, wire pull
tests shall be performed according to MIL-STD-202F, TM-107G, in
both the x and y axis before and after test condition exposure. The
tensile strength of the modification wires and solder joints shall be
retained after temperature cycling.
demonstrated. The requirements in Section 13.4 are sufficiently
addressed in normal industry practices.
R14-3 858 Cross-sections shall be etched for five seconds in a solution of 40%
by volume of 3% hydrogen peroxide and 60% by volume of
concentrated ammonium hydroxide before examination for smear.
Other acceptable etching methods may be used.
Reason: The method has been replaced by IPC-TM-650.
C–23
GR-78-CORE
C–24
GR-78-CORE Requirement-Object Index
Requirement-Object Index
[1] . . . R1-1 . . . . . . Page 1–4 [45] .. R3-8 . . . . . .Page 3–2 [89] . . R4-43 . . . . .Page 4–6
[2] . . . R1-2 . . . . . . Page 1–4 [46] .. R3-9 . . . . . .Page 3–2 [90] . . R4-28 . . . . .Page 4–3
[3] . . . R1-3 . . . . . . Page 1–4 [47] .. R3-10 . . . . .Page 3–2 [91] . . R4-44 . . . . .Page 4–6
[8] . . . CR1-9 . . . . . Page 1–5 [52] .. CR3-15 . . . .Page 3–2 [96] . . R4-36 . . . . .Page 4–4
[9] . . . R1-10 . . . . . Page 1–5 [53] .. R3-16 . . . . .Page 3–3 [97] . . R4-37 . . . . .Page 4–4
[10] . . R1-11 . . . . . Page 1–5 [54] .. R3-17 . . . . .Page 3–3 [98] . . R4-38 . . . . .Page 4–4
[11] . . R1-12 . . . . . Page 1–5 [55] .. R3-18 . . . . .Page 3–3 [99] . . R4-39 . . . . .Page 4–4
[12] . . R2-1 . . . . . . Page 2–1 [56] .. CR3-19 . . . .Page 3–3 [100] . R4-40 . . . . .Page 4–5
[13] . . R2-2 . . . . . . Page 2–1 [57] .. R3-20 . . . . .Page 3–3 [101] . R4-45 . . . . .Page 4–6
[17] . . R2-6 . . . . . . Page 2–1 [61] .. R4-1 . . . . . .Page 4–1 [105] . R4-49 . . . . .Page 4–6
[21] . . R2-10 . . . . . Page 2–1 [65] .. R4-5 . . . . . .Page 4–1 [109] . R4-53 . . . . .Page 4–6
[22] . R2-11 . . . . . Page 2–1 [66] .. R4-6 . . . . . .Page 4–1 [110] . R4-54 . . . . .Page 4–7
[23] . R2-12 . . . . . Page 2–1 [67] .. IP4-7. . . . . .Page 4–1 [111] . R4-55 . . . . .Page 4–7
[26] . . R2-15 . . . . . Page 2–2 [70] .. R4-10 . . . . .Page 4–2 [114] . O4-58 . . . . .Page 4–7
[27] . . R2-16 . . . . . Page 2–2 [71] .. R7-205 . . .Page 7–23 [115] . R4-59 . . . . .Page 4–7
[28] . . R2-17 . . . . . Page 2–2 [72] .. R4-11 . . . . .Page 4–2 [116] . R4-60 . . . . .Page 4–7
[29] . . R2-18 . . . . . Page 2–2 [73] .. IP4-12. . . . . Page 4–2 [117] . O4-61 . . . . .Page 4–7
[31] . . R2-20 . . . . . Page 2–2 [75] .. R4-16 . . . . .Page 4–2 [119] . CR4-63 . . . .Page 4–7
[34] . . R2-23 . . . . . Page 2–3 [78] .. R4-19 . . . . .Page 4–2 [122] . IP4-67 . . . . .Page 4–8
[36] . . CR2-25 . . . . Page 2–3 [80] .. O4-21 . . . . .Page 4–2 [124] . R4-69 . . . . .Page 4–8
[37] . . CR2-26 . . . . Page 2–3 [81] .. R4-22 . . . . .Page 4–3 [125] . R8-12 . . . . .Page 8–2
[38] . . CR3-1 . . . . . Page 3–1 [82] .. CR4-23 . . . .Page 4–3 [126] . R4-70 . . . . .Page 4–8
[39] . . CR3-2 . . . . . Page 3–1 [83] .. CR4-24 . . . .Page 4–3 [127] . R4-71 . . . . .Page 4–8
[40] . . CR3-3 . . . . . Page 3–1 [84] .. R6-74 . . . .Page 6–11 [128] . IP7-30 . . . . .Page 7–4
[43] . . CR3-6 . . . . . Page 3–1 [87] .. R6-75 . . . .Page 6–11 [131] . R4-74 . . . . .Page 4–9
ROI–1
GR-78-CORE
Requirement-Object Index Issue 2, September 2007
[133] . R4-76 . . . . . Page 4–9 [179] . R6-13 . . . . .Page 6–3 [225] . O6-63 . . . .Page 6–10
[134] . R4-77 . . . . . Page 4–9 [180] . R6-14 . . . . .Page 6–3 [226] . R6-64 . . . .Page 6–10
[135] . R4-78 . . . . . Page 4–9 [181] . O6-15 . . . . .Page 6–3 [227] . R6-65 . . . .Page 6–10
[138] . R5-1 . . . . . . Page 5–1 [184] . R6-18 . . . . .Page 6–3 [230] . R6-68 . . . .Page 6–10
[139] . R5-2 . . . . . . Page 5–2 [185] . CR6-19 . . . .Page 6–3 [231] . R6-69 . . . .Page 6–10
[142] . R5-5 . . . . . . Page 5–3 [188] . CR6-22 . . . .Page 6–4 [234] . R6-72 . . . .Page 6–10
[143] . O5-6 . . . . . . Page 5–3 [189] . R6-25 . . . . .Page 6–4 [235] . R6-73 . . . .Page 6–11
[144] . CR5-7 . . . . . Page 5–3 [190] . IP6-26. . . . . Page 6–5 [236] . R6-76 . . . .Page 6–11
[147] . CR5-10 . . . . Page 5–4 [193] . R6-29 . . . . .Page 6–5 [239] . R6-79 . . . .Page 6–11
[155] . IP5-19. . . . . Page 5–4 [201] . R6-37 . . . . .Page 6–6 [247] . R6-87 . . . .Page 6–12
[158] . CR5-22 . . . . Page 5–5 [204] . O6-40 . . . . .Page 6–7 [250] . R6-90 . . . .Page 6–12
[159] . R5-23 . . . . . Page 5–5 [205] . CR6-41 . . . .Page 6–7 [251] . R6-91 . . . .Page 6–12
[162] . IP5-26. . . . . Page 5–5 [208] . IP6-45. . . . . Page 6–7 [254] . R6-94 . . . .Page 6–13
[165] . CR5-29 . . . . Page 5–6 [211] . CR6-48 . . . .Page 6–7 [257] . R6-97 . . . .Page 6–13
[168] . R5-32 . . . . . Page 5–6 [214] . R6-52 . . . . .Page 6–8 [260] . R6-100 . . .Page 6–14
[171] . R6-1 . . . . . . Page 6–1 [217] . R6-55 . . . . .Page 6–8 [263] . R6-103 . . .Page 6–14
[172] . R6-2 . . . . . . Page 6–1 [218] . R6-56 . . . . .Page 6–8 [264] . O6-104 . . .Page 6–14
[175] . R6-5 . . . . . . Page 6–2 [221] . O6-59 . . . . .Page 6–9 [267] . R6-107 . . .Page 6–14
[177] . R6-7 . . . . . . Page 6–2 [223] . R6-61 . . . .Page 6–10 [269] . R6-109 . . .Page 6–14
[178] . R6-8 . . . . . . Page 6–2 [224] . R6-62 . . . .Page 6–10 [270] . R6-110 . . .Page 6–14
ROI–2
[271] . R6-111 . . . Page 6–14 [317] . R6-157 . . .Page 6–19 [363] . R6-209 . . .Page 6–26
[278] . R6-118 . . . Page 6–15 [324] . O6-164 . . .Page 6–19 [370] . O6-216 . . .Page 6–27
[279] . O6-119 . . . Page 6–15 [325] . R6-165 . . .Page 6–19 [371] . R6-217 . . .Page 6–27
[280] . R6-120 . . . Page 6–15 [326] . IP6-166. . .Page 6–20 [372] . R6-218 . . .Page 6–27
[282] . R6-122 . . . Page 6–15 [328] . R6-168 . . .Page 6–20 [374] . O6-220 . . .Page 6–27
[293] . R6-133 . . . Page 6–17 [339] . CR6-179 . .Page 6–21 [385] . R6-231 . . .Page 6–29
[298] . R6-138 . . . Page 6–17 [344] . O6-190 . . .Page 6–22 [390] . O6-236 . . .Page 6–30
[299] . R6-139 . . . Page 6–17 [345] . R6-191 . . .Page 6–22 [391] . CR6-237 . .Page 6–30
[300] . R6-140 . . . Page 6–17 [346] . CR6-192 . .Page 6–22 [392] . IP6-238 . . .Page 6–30
[301] . R6-141 . . . Page 6–17 [347] . CR6-193 . .Page 6–23 [393] . IP6-239 . . .Page 6–30
[302] . R6-142 . . . Page 6–17 [348] . CR6-194 . .Page 6–23 [394] . O6-240 . . .Page 6–31
[304] . CR6-144 . . Page 6–17 [350] . R6-196 . . .Page 6–24 [396] . R6-243 . . .Page 6–31
[309] . CR6-149 . . Page 6–18 [355] . R6-201 . . .Page 6–25 [401] . O6-248 . . .Page 6–32
[310] . IP6-150. . . Page 6–18 [356] . R6-202 . . .Page 6–25 [402] . O6-249 . . .Page 6–32
ROI–3
GR-78-CORE
[409] . O6-256 . . . Page 6–33 [455] . R7-43 . . . . .Page 7–6 [501] . R7-89 . . . .Page 7–10
[412] . R6-259 . . . Page 6–34 [458] . R7-46 . . . . .Page 7–6 [504] . R7-93 . . . .Page 7–10
[414] . R6-261 . . . Page 6–34 [460] . R7-48 . . . . .Page 7–6 [506] . O7-97 . . . .Page 7–11
[423] . O7-10 . . . . . Page 7–2 [469] . R7-57 . . . . .Page 7–7 [515] . R7-104 . . .Page 7–12
[427] . R7-14 . . . . . Page 7–2 [473] . R7-62 . . . . .Page 7–8 [519] . O7-109 . . .Page 7–13
[430] . R7-17 . . . . . Page 7–3 [476] R7-65 . . . . .Page 7–8 [522] . O7-111 . . .Page 7–13
[431] . IP7-18. . . . . Page 7–3 [477] . R7-66 . . . . .Page 7–8 [523] . R7-112 . . .Page 7–13
[432] . IP7-19. . . . . Page 7–3 [478] . R7-67 . . . . .Page 7–8 [524] . R7-113 . . .Page 7–14
[444] . R7-32 . . . . . Page 7–4 [490] . CR7-78 . . . .Page 7–9 [536] . R7-132 . . .Page 7–15
[450] . R7-37 . . . . . Page 7–5 [496] . R7-84 . . . .Page 7–10 [542] . R7-138 . . .Page 7–16
[454] . R7-42 . . . . . Page 7–5 [500] . IP7-88. . . .Page 7–10 [546] . R7-142 . . .Page 7–16
ROI–4
[555] . R7-151 . . . Page 7–17 [601] . O7-197 . . .Page 7–22 [647] . R7-245 . . .Page 7–30
[561] . CR7-157 . . Page 7–18 [607] . R7-203 . . .Page 7–23 [653] . R7-38 . . . . .Page 7–5
[563] . CR7-159 . . Page 7–18 [609] . IP7-206. . .Page 7–23 [655] . R7-252 . . .Page 7–31
[572] . O7-168 . . . Page 7–19 [618] . R7-215 . . .Page 7–25 [664] . O7-262 . . .Page 7–33
[576] . R7-172 . . . Page 7–20 [622] . R7-219 . . .Page 7–25 [668] . R8-1 . . . . . .Page 8–1
[579] . R7-175 . . . Page 7–20 [625] . IP7-222. . .Page 7–26 [671] . R8-4 . . . . . .Page 8–2
[580] . R7-176 . . . Page 7–20 [626] . CR7-223 . .Page 7–27 [672] . R8-5 . . . . . .Page 8–2
[584] . R7-180 . . . Page 7–20 [630] . R7-227 . . .Page 7–27 [676] . O8-9 . . . . . .Page 8–2
[585] . R7-181 . . . Page 7–20 [631] . O7-228 . . .Page 7–27 [677] . O8-10 . . . . .Page 8–2
[586] . R7-182 . . . Page 7–20 [632] . CR7-229 . .Page 7–28 [678] . R8-11 . . . . .Page 8–2
[587] . R7-183 . . . Page 7–20 [633] . R7-230 . . .Page 7–28 [679] . R8-13 . . . . .Page 8–2
[591] . R7-187 . . . Page 7–21 [637] . IP7-234. . .Page 7–29 [683] . O8-17 . . . . .Page 8–2
ROI–5
GR-78-CORE
[688] . O8-22 . . . . . Page 8–3 [734] . R9-14 . . . . .Page 9–7 [780] . R11-8 . . . .Page 11–1
[689] . O8-23 . . . . . Page 8–3 [735] . R9-15 . . . . .Page 9–7 [781] . R11-9 . . . .Page 11–1
[694] . R8-28 . . . . . Page 8–4 [740] . O9-21 . . . . .Page 9–8 [786] . R11-14 . . .Page 11–2
[695] . R8-29 . . . . . Page 8–4 [741] . CR9-22 . . . .Page 9–8 [787] . R11-15 . . .Page 11–2
[698] . R8-32 . . . . . Page 8–4 [744] . CO9-25 . . . .Page 9–9 [790] . R12-2 . . . .Page 12–1
[701] . R8-35 . . . . . Page 8–5 [747] . R10-1 . . . .Page 10–1 [793] . CR12-5 . . .Page 12–1
[702] . R8-36 . . . . . Page 8–5 [748] . O10-2 . . . .Page 10–1 [794] . R12-6 . . . .Page 12–1
[703] . R8-37 . . . . . Page 8–5 [749] . O10-3 . . . .Page 10–1 [795] . R12-7 . . . .Page 12–1
[704] . R8-38 . . . . . Page 8–6 [750] . R10-4 . . . .Page 10–1 [796] . R12-8 . . . .Page 12–2
[705] . R8-39 . . . . . Page 8–6 [751] . R10-5 . . . .Page 10–1 [797] . R12-9 . . . .Page 12–2
[708] . R8-42 . . . . . Page 8–6 [754] . O10-8 . . . .Page 10–1 [800] . R12-12 . . .Page 12–3
[710] . R8-44 . . . . . Page 8–7 [756] . CR10-10 . .Page 10–1 [802] . R12-14 . . .Page 12–3
[711] . R8-45 . . . . . Page 8–7 [757] . CR10-11 . .Page 10–2 [803] . R13-1 . . . .Page 13–1
[712] . R8-46 . . . . . Page 8–7 [758] . R10-12 . . .Page 10–2 [804] . R13-2 . . . .Page 13–1
[719] . R8-53 . . . . . Page 8–8 [765] . IP10-19. . .Page 10–2 [811] . R13-9 . . . .Page 13–8
[720] . R8-54 . . . . . Page 8–8 [766] . O10-20 . . .Page 10–3 [812] . R13-10 . . .Page 13–9
[721] . R9-1 . . . . . . Page 9–2 [767] . R10-21 . . .Page 10–3 [813] . R13-11 . . .Page 13–9
[722] . R9-2 . . . . . . Page 9–2 [768] . R10-22 . . .Page 10–3 [814] . R13-12 . . .Page 13–9
[723] . R9-3 . . . . . . Page 9–2 [769] . R10-23 . . .Page 10–3 [815] . R13-13 . .Page 13–10
[724] . R9-4 . . . . . . Page 9–2 [770] . R10-24 . . .Page 10–3 [816] . R13-14 . .Page 13–10
[725] . R9-5 . . . . . . Page 9–3 [771] . O10-25 . . .Page 10–3 [817] . R13-15 . .Page 13–10
[726] . R9-6 . . . . . . Page 9–3 [772] . O10-26 . . .Page 10–3 [818] . R13-16 . .Page 13–10
[727] . R9-7 . . . . . . Page 9–3 [773] . R11-1 . . . .Page 11–1 [819] . R13-17 . .Page 13–11
[730] . R9-10 . . . . . Page 9–4 [776] . R11-4 . . . .Page 11–1 [822] . R13-20 . .Page 13–15
ROI–6
[823] . R13-21 . . Page 13–16 [869] . R6-9 . . . . . .Page 6–2

[824] . R13-22 . . Page 13–16 [870] . CR6-10 . . . .Page 6–2
[825] . R13-23 . . Page 13–16 [871] . R6-11 . . . . .Page 6–2
[826] . R13-24 . . Page 13–16 [872] . R6-12 . . . . .Page 6–3
[827] . R13-25 . . Page 13–16 [873] . R6-23 . . . . .Page 6–4
[828] . O13-26 . . Page 13–17 [874] . R6-24 . . . . .Page 6–4
[829] . R13-27 . . Page 13–17 [875] . R6-42 . . . . .Page 6–7
[830] . R13-28 . . Page 13–17 [876] . R6-49 . . . . .Page 6–7
[831] . R13-29 . . Page 13–17 [877] . CR6-180 . .Page 6–21
[832] . R13-30 . . Page 13–17 [878] . CR6-181 . .Page 6–21
[833] . R13-31 . . Page 13–17 [879] . R6-182 . . .Page 6–21
[834] . R13-32 . . Page 13–17 [880] . CR6-183 . .Page 6–21
[835] . R13-33 . . Page 13–17 [881] . R6-184 . . .Page 6–22
[836] . R13-34 . . Page 13–17 [882] . R6-188 . . .Page 6–22
[837] . R13-35 . . Page 13–17 [883] . CR6-241 . .Page 6–31
[838] . R13-36 . . Page 13–18 [884] . O7-5 . . . . . .Page 7–1
[839] . R13-37 . . Page 13–18 [885] . CR7-6 . . . . .Page 7–1
[840] . R13-38 . . Page 13–18 [886] . CR7-7 . . . . .Page 7–1
[841] . R13-39 . . Page 13–18 [887] . CR7-8 . . . . .Page 7–2
[842] . R13-40 . . Page 13–18 [888] . CR7-9 . . . . .Page 7–2
[843] . R13-41 . . Page 13–18 [889] . CR7-98 . . .Page 7–11
[844] . R13-42 . . Page 13–18 [890] . CR7-116 . .Page 7–14
[845] . R13-43 . . Page 13–18 [891] . CR7-117 . .Page 7–14
[846] . R13-44 . . Page 13–18 [892] . R7-126 . . .Page 7–15
[847] . R13-45 . . Page 13–18 [893] . CR7-127 . .Page 7–15
[848] . R13-46 . . Page 13–18 [894] . O7-128 . . .Page 7–15
[849] . R13-47 . . Page 13–19 [895] . O7-129 . . .Page 7–15
[850] . R13-48 . . Page 13–19 [896] . CR7-130 . .Page 7–15
[851] . R13-49 . . Page 13–19 [897] . R7-238 . . .Page 7–29
[852] . R13-50 . . Page 13–19 [898] . O7-257 . . .Page 7–32
[853] . R13-51 . . Page 13–19 [899] . R9-20 . . . . .Page 9–8
[854] . R13-52 . . Page 13–20 [900] . R14-4 . . . .Page 14–3
[855] . R13-53 . . Page 13–20
[856] . R14-1 . . . . Page 14–2
[857] . R14-2 . . . . Page 14–3
[858] . R14-3 . . . . Page 14–3
[859] . R14-5 . . . . Page 14–6
[860] . O1-5 . . . . . . Page 1–4
[861] . IP4-13. . . . . Page 4–2
[862] . R4-33 . . . . . Page 4–4
[863] . R4-34 . . . . . Page 4–4
[864] . R4-35 . . . . . Page 4–4
[865] . R4-41 . . . . . Page 4–5
[866] . R4-42 . . . . . Page 4–5
[867] . CR4-66 . . . . Page 4–8
[868] . R5-18 . . . . . Page 5–4
ROI–7
GR-78-CORE
ROI–8
TELCORDIA ENTERPRISE LICENSE AGREEMENT AND LIMITED WARRANTY
For Technical Documents: Generic Requirements (GRs), Special Reports (SRs), Technical
References (TRs), Technical Advisories (TAs), Family of Requirements (FRs), Family of
Documents (FDs), Framework Advisories (FAs), Science Technologies (STs), Message
Driven Program (MDPs), Information Publications (IPs), Audio Visuals (AVs) and Telcordia
Practices (BRs)
IMPORTANT! PLEASE READ CAREFULLY.
USE OF THIS PRODUCT INDICATES THAT YOU (LICENSEE OR USER) HAVE READ AND
ACCEPT THE TERMS OF THIS AGREEMENT. IF YOU DO NOT AGREE WITH THE TERMS
OF THIS AGREEMENT, YOU WILL NOT BE ALLOWED TO PURCHASE THIS PRODUCT.
1. LICENSE GRANT
Telcordia grants to customer ("Licensee") a non-exclusive, non-transferable, limited license to

use this Licensed Product by employees of Licensee ("Users") for internal business purposes
only. All intellectual property rights, title and interest in all Licensed Products furnished to
Licensee remain in Telcordia. This License does not preclude the execution of additional license
agreements with Licensee for the Licensed Product(s).
Telcordia has exclusive rights to all Licensed Products which are protected by United States and
international copyright laws.
2. LICENSEE'S USE:
a. Licensee may place the Licensed Products on a Local Area Network, Wide Area
Network, server, internal web site, or other electronic computing platform shared or
accessible to employees or affiliates of Licensee. Licensee may make paper and
electronic copies of Licensed Products as determined by Licensee to be necessary for
Licensee's internal purposes; provided all copies, in whole or in part, of the Licensed
Products shall bear the same Telcordia copyright and disclaimer notices legend as
appear on the Licensed Products originally furnished to Licensee by Telcordia.
b. Subject to the preceding paragraph, Licensee may reproduce and distribute Licensed
Products to "Affiliates" defined as (i) the parent entity (corporation or partnership) which
directly or indirectly owns the majority of the outstanding shares or interests of Licensee,
(ii) a sibling entity (corporation or partnership) the majority of whose outstanding shares
or interests are owned by its parent entity, or (iii) a subsidiary entity (corporation or
partnership) the majority of whose outstanding shares or interests are owned by
Licensee, provided, however, that such entity shall continue to remain an Affiliate
hereunder only as long as the applicable ownership interest as described above exists.
Licensee may sublicense the rights granted in this section to an Affiliate, provided
Licensee shall remain responsible for any breach by such Affiliate. Licensee shall ensure
that such Affiliate as assignee agrees to be bound by the rights, obligations and
limitations set forth herein, and such Affiliate shall be responsible for any breach by such
Affiliate and Licensee shall ensure that Telcordia shall have the right of direct
enforcement of such obligations against such Affiliate. If a direct enforcement claim is
denied, for any reason, it is agreed that Licensor may assert such claim against
Licensee.
c. Licensee may copy portions of Licensed Products to create specifications and related
documentation (the "Licensee Documentation").
d. Licensee may, in marketing a product or related services (collectively, "Licensee
Product"), (i) make reference to the Licensed Product utilized in the development of
Licensee Product; provided that Licensee shall make no statement, representation or
warranty on behalf of Telcordia including but not limited to a certification by Telcordia of a
product's or related service's compliance with the Licensed Product, unless otherwise
agreed to by the parties in writing; or (ii) distribute the Licensee Documentation to a third
party prior to sale of the Licensee Product.
e. Licensee may refer to and/or incorporate portions of such Licensed Products in the
Licensee Documentation for the Licensee Product and copy the Licensee Documentation
for distribution in conjunction with the sale of the Licensee Product to any third party so
long as the original Telcordia and copyright legends, as applicable, are acknowledged on
the specifications and/or documentation.
f. Licensee must treat the Licensed Product(s) like any other copyrighted material.
g. Except as otherwise stated, it is understood that the foregoing license does not include
the right to make copies of the Licensed Products for sale to third parties or to create
derivative works for sale.
USER MAY NOT:
a. Copy the Licensed Product, except as provided above;

b. Make copies of the Licensed Product or portions thereof as are permitted above for
internal purposes that contain provisions that conflict or differ in content from comparable
provisions of the Licensed Product, unless such differences are identified specifically,
and it is made clear in such copies that the results are not part of the Licensed Product;
c. Transfer the Licensed Product to another party, except as provided above;
d. Licensee may not make the Licensed Product available, in whole or in part for the
purposes of external distribution to third parties other than Affiliates.
e. Grant sublicenses, leases, or other rights to the Licensed Product or rent the Licensed
Products to others, except as provided above; or
f. Make telecommunications data transmissions of the Licensed Product to the public or
any third party.
g. Data, in whole or in part, may not be extracted from the Licensed Product(s) for use in
any derivative Licensee product or used to verify and subsequently modify data in any
Licensee product which is sold, licensed or otherwise provided to third parties unless
Licensee has executed a separately negotiated Special License Agreement with
Telcordia, except as provided above.
3. AUDITS
Upon reasonable written notice to Licensee, Telcordia shall have the right to review Licensee's
compliance with the terms and conditions of this License Agreement ("Agreement"). If such
review reveals a violation of the requirements set forth herein, in addition to any other remedies it
may have, Telcordia may terminate this Agreement in accordance with the Termination section of
this Agreement.
4. FEES AND PAYMENTS
All fees and charges due hereunder shall be paid in full within thirty (30) days of the date of the
invoice. Overdue payments are subject to a late payment charge, calculated and compounded
monthly, and calculated at an annual rate of either (1) one percent (1%) over the prime rate
available in New York City, as published in The Wall Street Journal on the first Monday (or the
next bank business day) following the payment due date; or (2) 18 percent (18%), whichever shall
be higher. If the amount of the late payment charge exceeds the maximum permitted by law, the
charge will be reduced to that maximum amount.
Licensee shall pay or reimburse Telcordia for all sales or use taxes, duties, or levies imposed by
any authority, government or government agency (other than those levied on the net income of
Telcordia) in connection with this Agreement. If Telcordia is required to collect a tax to be paid by
Licensee, Licensee shall pay this tax on demand. If Licensee fails to pay these taxes, duties or
levies, Licensee shall pay all reasonable expenses incurred by Telcordia, including reasonable
attorney's fees, to collect such taxes, duties or levies.
Telcordia shall provide Licensee with one (1) Copy of the Licensed Product. Any additional copies
in cd or paper media will be provided to Licensee at a cost of $75.00 per copy. Please contact our
Customer Call Center noted below.
5. LIMITED WARRANTY
Telcordia warrants that the media on which the Licensed Product is provided is free from defects
in materials and workmanship for 90 days. Licensee's sole remedy for breach of this warranty is
Telcordia's Product Replacement Plan described below. This warranty applies only to the original
Licensee.
6. DISCLAIMER OF WARRANTIES
EXCEPT AS SET FORTH ABOVE, THE LICENSED PRODUCT IS PROVIDED "AS IS"
WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING, BUT
NOT LIMITED TO THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A
PARTICULAR PURPOSE, EVEN IF TELCORDIA HAS BEEN MADE AWARE OF SUCH
PURPOSE, OR ANY WARRANTY AGAINST INFRINGEMENT OF PATENTS OR OTHER
INTELLECTUAL PROPERTY RIGHTS. LICENSEE ASSUMES RESPONSIBILITY FOR THE
SELECTION OF THE LICENSED PRODUCT TO ACHIEVE ITS INTENDED RESULTS, AND
FOR THE USE AND RESULTS OBTAINED FROM THE LICENSED PRODUCT.
7. LIMITATION OF LIABILITY
THE ENTIRE LIABILITY OF TELCORDIA, AND LICENSEE'S EXCLUSIVE REMEDY, IS THE

REPLACEMENT OF ANY LICENSED PRODUCT WHICH DOES NOT MEET THE TELCORDIA
LIMITED WARRANTY AND IS RETURNED TO TELCORDIA WITHIN 90 DAYS.
IN NO EVENT WILL TELCORDIA BE LIABLE TO LICENSEE FOR ANY DAMAGES,

INCLUDING DIRECT DAMAGES, LOST PROFITS, OR OTHER INDIRECT, SPECIAL,
INCIDENTAL, EXEMPLARY OR CONSEQUENTIAL DAMAGES ARISING OUT OF THIS
AGREEMENT, EVEN IF TELCORDIA HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH
DAMAGES.
THE WARRANTY GIVES LICENSEE SPECIFIC LEGAL RIGHTS, AND LICENSEE MAY ALSO
HAVE OTHER RIGHTS WHICH VARY FROM STATE TO STATE. SOME STATES DO NOT
ALLOW THE EXCLUSION OR LIMITATION OF INCIDENTAL OR CONSEQUENTIAL
DAMAGES, SO THE ABOVE LIMITATION MAY NOT APPLY TO LICENSEE.
8. THIRD PARTY PRODUCTS AND INFORMATION WARRANTY
Telcordia does not warrant Third Party products or information which Telcordia may use to
prepare the Licensed Product. Third Party products or information may be warranted by Third
Parties as expressly provided in the documentation accompanying the Third Party product or
information, if any. Licensee's exclusive remedy under any Third Party warranty is as provided in
the Third Party documentation accompanying the Third Party product or information, if any.
9. LICENSED PRODUCT REPLACEMENT PLAN

During the first 30 days after Licensee licenses the Telcordia Licensed Product, Telcordia will
replace at no charge any Licensed Product which is returned to Telcordia because its media is
defective in materials or workmanship. Returns for replacement of a defective Licensed Product
should be sent postpaid to Telcordia using the Return Policy procedures stated below.
10. RETURN POLICY
Licensed Product(s) may be returned within 30 days of receipt for Telcordia credit only. Returned
Licensed Products must be in their original packaging with all seals intact. Returns not found to
be defective in materials or workmanship will be subject to a 10% restocking fee. Licensed
Products that have been delivered electronically (downloaded from the SuperStore) are not
eligible for credits, refunds or returns, even if duplicative with Licensed Products that are the
subject of prior or contemporaneous orders. Licensee assumes all responsibility for managing its
inventory of Licensed Product(s).
11. TERMINATION
If Licensee or its User breaches one or more of its obligations under this Agreement, Telcordia
may elect at any time, in addition to any other remedy, to terminate the license and rights
granted. Prior to the termination, Telcordia must give Licensee two (2) months written notice
specifying the breach. Telcordia may terminate the license and rights granted if Licensee does
not remedy all breaches specified in the written notice within the two (2) month notice period.
Upon termination of the license and rights granted, Licensee shall destroy or return all Licensed
Product(s) and Documentation, including all copies, and certify in writing to Telcordia the
destruction or return.
12. PUBLICITY
Notwithstanding anything herein to the contrary, each party is prohibited from using in advertising,
publicity, promotion, marketing, or other similar activity, any name, trade name, trademark, or
other designation including any abbreviation, contraction or simulation of the other without the
prior, express, written permission of the other.
13. GENERAL
Export/Reexport. Licensee acknowledges that any commodities and/or technical data provided
under this Agreement is subject to the Export Administration Regulations (“the EAR”)
administered by the U.S. Commerce Department and that any export or re-export thereof must be
in compliance with the EAR. Licensee agrees that it shall not export or reexport, directly or
indirectly, either during the term of this Agreement or after its expiration, any commodities and/or
technical data (or direct products thereof) provided under this Agreement in any form to
destinations in Country Group E, (as specified in Supplement No. 1 to Part 740 of the EAR
http://www.access.gpo.gov/bis/ear/pdf/740spir.pdf, and as modified from time to time by the U.S.
Department of Commerce, or to recipients or destinations that are otherwise controlled or
embargoed under U.S. law.
Licensee acknowledges it is not a foreign national of Country Group E or a denied party on U.S.
export regulations.
Foreign Tax Payment. For a Licensee which is not a United States corporation, Telcordia will not
accept remittance of less than the full amount billed to Licensee as full payment unless:
a. Licensee withholds that amount to satisfy tax withholding requirements imposed by the
country (other than the United States) in which Licensee resides or in which Licensee has
accepted delivery of the Licensed Product; and
b. Licensee furnishes a receipt issued by the withholding tax jurisdiction and certifying
deposit of the withheld amount into its treasury or other tax depository to Telcordia's sole
credit, or a certification on Licensee's stationery that Licensee has deposited the withheld
amount into its tax jurisdiction's treasury or other tax depository to Telcordia's sole credit.
Further, to ensure the orderly processing of Telcordia tax returns, Licensee shall provide to
Telcordia a summary of all amounts withheld during the year no later than ten business days after
December 31 of each year.
Governing Law. This Agreement is a contract between Telcordia and the Licensee of the
Licensed Product. This contract is to be interpreted in the federal and state courts of New Jersey,
in accordance with the laws of the State of New Jersey without regard to its conflict of laws
principles, and the parties consent to the jurisdiction of such courts for this purpose.
Entire Agreement. Licensee further agree that this is the complete and exclusive statement of
the Agreement between Licensee and Telcordia and supersedes any proposal or prior
Agreement, oral or written, or any other communication between us relating to the subject matter
of this Agreement.
All questions about this Agreement should be directed to:
Telcordia Technologies, Inc.

Customer Service Center
One Telcordia Drive, RRC 1B180
Piscataway, NJ 08854
Phone: 1.866.672.6997 (USA)
+1.732.699.6700 (Worldwide)
END OF TERMS AND CONDITIONS
Rev. 4/07

GR 78 Corei02

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GR 78 Corei02

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Generic Requirements for the Physical

Design and Manufacture of

Telcordia Technologies Generic Requirements

Comments Requested (See Preface)

Physical Design and Manufacture of Telecommunications Products

Copyright © 1997, 2007 Telcordia Technologies, Inc. All rights reserved.

Generic Requirements Notice of Disclaimer

TELCORDIA DOES NOT HEREBY RECOMMEND, APPROVE, CERTIFY,

2 Requirements for All Products

3 Materials and Finishes Requirements

4 Separable Connector Requirements

5 Wire and Cable Requirements

5.2 Optical Fiber and Optical Fiber Cables . . . . . . . . . . . . . . . . . . . . . . . 5–6

6 Printed Wiring Board (PWB) Requirements

6.2.2.10 Modifications — Inner Layers Before Lamination . . . . . . . . . 6–28

7 Printed Wiring Board (PWB) Assembly Requirements

7.1.3.10 Lubrication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–14

7.4.2.2 Electrical Requirements . . . . . . . . . . . . . . . . . . . . . . . . 7–33

8 Equipment Sub-Assembly and Assembly Requirements

9 Electrostatic Discharge (ESD)

10 Product Identification and Markings Requirements

12 Repair and Modification of Customer Return Units

13 Qualification Test Procedures

14 Tests and Methods

Appendix B: Acronyms and Glossary

Appendix C: Deleted Requirements

Figure 7-1 Schematic Representation of a Minimum Pin-Wetted Length . . . 7–22

Table 4-1 Lubricants for Contacts with Noble Metallizations . . . . . . . . . . 4–3

Company Participants Company Representatives Company Web Sites

Relative Maturity Level, Status, and Plans for Issue 2

Although the design and manufacturing practices continually advance, Telcordia

To Request Telcordia Testing Services

1.1 Reason for GR-78-CORE, Issue 2

• Section 11 — Generic requirements for packaging and shipping assemblies

1.3 Requirements Terminology

• IP — The word should is used in this document to express what is expected or

1.4 Requirement Labeling Conventions

1.4.1 Numbering of Requirement and Related Objects

Each Requirement, Objective, Condition, Conditional Requirement, and Conditional

1.4.2 Requirement, Conditional Requirement, and Objective Identification

A Requirement object may have numerous elements (paragraphs, lists, tables,

Content of Requirement object(s).

1.5 General Criteria

O1-5 [860] In general, telecommunications equipment is intended for long application

Acceptance of nonconforming products is not the subject of this document. Such

R1-8 [7] Products shall be manufactured in accordance with the following:

• Department of Labor — Occupational Safety and Health Standards (OSHA) e.g.,

R1-10 [9] The quality of commercially-available materials, hardware, components, etc.,

R1-11 [10] Questions regarding acceptability of industry standards, materials, hardware,

2 Requirements for All Products

R2-12 [23] Each product shall be free from corrosion.

2.2 Electrical and Mechanical Integrity

R2-21 [32] Where a novel or new technology is introduced by an equipment manufacturer,

2.3 Administration of Requirements

3 Materials and Finishes Requirements

R3-7 [44] This requirement has been deleted per Issue 2.

3.2.1 Fire Resistance Requirements

3.2.2 Fire Risk Analysis

R3-9 [46] This requirement has been deleted per Issue 2.

R3-14 [51] This requirement has been deleted per Issue 2.

GR-468-CORE[7], Generic Reliability Assurance Requirements for Optoelectronic

R3-24 [60] Plating shall not be applied over solder.

4 Separable Connector Requirements