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X-Ray Photoelecctron Spectroscopy (XPS)
X-Ray Photoelecctron Spectroscopy (XPS)
E12-306
6th Evening
Introduction
• Very simple and widely used technique and data obtain from it is analyzed
easily.
Principle
The working principle of XPS is ejection of electron from the surface of sample in
UHV condition when it is expose to the soft x-rays.
Elements present in sample can be identified on the basis of kinetic energies and
binding energies of their photoelectrons.
The electrons emitted from atoms near the sample surface (10-100 Angstroms) can
escape the sample surface. This depth is about twenty atomic layers.
Photoelectric effect
• When an X-ray (with energy hv) ejects out an electron (by energy B.E). The
ejected electron is called photoelectron and this effect is called photoelectric
effect.
L K 1 s 2 s 2 p L K 1 s 2 s 2 p L K 1 s 2 s 2 p
The ejected photoelectron has kinetic energy:
K.E=hv-B.E- Ø
BE Binding Energy
Photoelectron Kinetic
• No emission of photon if hν < Ø Energy
E
V
φ
• No emission of photon from levels with BE + Ø > hν
Valence Ef Binding
band
• Increase in KE oh photoelectron cause decrease ki Energy
BE.
Photon Core hole
• Photoemission intensity is represented by α. Core
• Require monochromatic beam. levels
•
• Each element has different value of KE for core level
electrons.
Instrumentation
Components
A source of X-rays
X-Ray Source
An ultra high vacuum (UHV)
Ion Source
An electron energy analyzer
CMA Analyzer
Magnetic field shielding
Sample preparation is not require usually. We just mount the sample and place it
for analysis
Removal of Volatile Material with the help of pumping or by washing with a
solvent like ethanol.
Removal of Nonvolatile Organic Contaminants by freshly distilled solvents.
Surface Etching (surface contaminants can remove by ion sputtering and other
erosion techniques).
Abrasion cause roughen the surface by grinding up to 600 grade paper. It
increase intensity of signal as compare to smooth surface.
XPS peak Elemental Shift
Fe 707 53 654
Co 778 60 718
Ni 853 67 786
Cu 933 75 858
Zn 1022 89 933
Chemical Shift
• It occur due to electronegativity difference and bonding of atoms.
• Higher positive oxidation state has high BE due to interaction between emitted
electrons and nucleus.
• Differentiate between different oxidation state and chemical environment is
major use of XPS.
(j=l+s)
For orbital p
orbital angular quantum number l = 1
Spin angular quantum number s = ± 𝟏 𝟐
total angular quantum number j =𝟏 , 𝟑
𝟐 𝟐
Surface and bulk investigations of organ metal pipe degradation
Samples of degraded organ pipe are obtain from the Sicily island where aging of
metal alloys are influenced by environment.
These samples are investigated by XPS, EDX and XRD.
Tin and lead are cheap metals, shiny appearance and ductile in nature so use in
organ pipes.
Formation of tin oxide blisters, tin chloride phases and formation of lead nitrate
salts are the types of degradation observe during analysis.
XPS was recorded In order to determine the oxidation states of elements and
their surface atomic concentration were performed on PHI 5600 system using
Al Kα Source.
Binding energies were calculated with respect to C 1s which is ionize at 285 eV.
Because it is generally accepted to be independent of chemical state of the
sample which is under investigation.
a
The colour of tin is light grey but in several places circular white areas can be
observed. Because of the degradation on the edges of the mouth and it makes
metal brittle.
XPS analysis clearly shows the presence of nitrogen and chlorine in the samples
taken from zone completely degraded.
The XPS atomic concentration of sample a and b contain Sn 34,84%, Cl 35,11%
and O 30,05% respectively .
By Antonio Bovelaccia, Enrico Cilibertob, Enrico Grecob, Ezio Viscusob in 2012
www.sciencedirect.com
Advantages and Disadvantages
Advantages Limitations
Non-destructive technique. Very expensive technique.
Surface Sensitive (10-100 Å). High vacuum is required.
Detection unit: ppt and some Slow processing (1/2 to 8
conditions ppm. hours/sample).
Quantitative measurements are Large area analysis is required.
obtained. H and He can not be identified.
Provides information about chemical Data collection is slow 5 to 10 min.
bonding. Poor lateral resolution.
Elemental mapping.
Uses
XPS is used to measure: Applications in the industry:
Elemental composition of the Failure analysis
surface (top 1–12 nm usually). Polymer surface
Empirical formula of pure materials. Corrosion
Chemical or electronic state of each Adhesion
element in the surface. Semiconductors
Uniformity of composition across Dielectric materials
the top surface (line profiling). Thin film coatings
Uniformity of elemental composition
as a function of ion beam etching XPSPEAK 4.1, FitXPS, CasaXPS and
(depth profiling). Spectral Data Processor (SDP) V3.0
are the softwares use for XPS analysis
References
• http://www.seallabs.com/how-xps-works.html
• http://www.chem.qmul.ac.uk/surfaces/scc/scat5_3.htm
• http://ssrl.slac.stanford.edu/nilssongroup/corelevel.html
• http://goliath.emt.inrs.ca/surfsci/arxps/fundamentalscss.html
• http://www.casaxps.com/help_manual/XPSInformation/XPSInstr.htm
• http://www.lanl.gov/orgs/nmt/nmtdo/AQarchive/04summer/XPS.html
• X-Ray Photoelectron Spectroscopy (XPS) by David Echevarría Torres
• X-RAY PHOTOELECTRON SPECTROSCOPY (XPS) by Yağmur Celasun,Görkem
Erdoğan.Fatma Sırkınti