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DigiSource EMS Handbook
DigiSource EMS Handbook
DigiSource EMS Handbook
TABLE OF CONTENTS
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pricing Matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Step 5: Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Conclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Introduction
Speaking of prices,
let's start there.
We know how vital price is to you, so here you go...
We've been applying these models for almost 10 years, we expect them to
be accurate within +/- 5%. You can see instant pricing for your product
using our online SMT Cost Model. If you'd like to meet a supplier who
provides the US High Volume prices just Contact Us.
Don’t wait to hear back from suppliers that one of your parts is obsolete,
that's way too late. You can access the life cycle status of each individual
component, here’s what a summary chart of your lifecycle data would look
like:
Multi-Source Summary
(source: SiliconExpert)
This is often one of the most vexing problems for NPI builds. Your
supplier presents you with costs related to min/mults, so you think they
should have the parts on hand from prior builds.Their systems should
automatically check each AVL’d manufacturer part number for 3 types of
on hand inventory: on hand under your internal part number, on hand
consigned inventory for you, and on hand unallocated inventory under
another customers internal part number. These checks should be
performed automatically by their quoting software.
Use Valor.
Siemens Valor Process Engineering is the gold standard for DFA. It's a
complete suite of products for manufacturing, but one of the modules runs
a series of checks against a set of rules specifically configured for the target
manufacturing floor. Called the Design Rules Check file (.drc), there are
hundreds of test performed on every component and on every individual
solder joint. Valor divides the tests into 6 categories and reports concerns (in
yellow) and violations (in red) as summarized here:
A typical 100 line item BOM might have 500 individual solder joint
connections. Typically, each board is checked for ~242 solder joint rules,
that’s 126,000 tests (500 X 242). Here’s some examples of what is checked
for you:
The Valor software reports a staggering amount of detail and can frankly
be overwhelming. Your EMS partner should have designed a custom
report organizing the Valor output by prioritizing the issues. Here's an
example:
Instead, you’ll likely rely on your EMS partner to review the report and let
you know if there’s anything you need to address (this is especially true if
they designed the PCB). This is because they likely have in-house design
engineers, manufacturing engineers, test engineers, and even PCB
designers who combined provide immediate access to the expertise
necessary to interpret and act on the Valor DFA output.
OEMs are often a little surprised when we point this out, but consider it for
a moment. Which manufacturer has the best price for each component?
Which vendor (as in distributor) offers you the best pricing and terms?
Which package/temp range/RoHS/bulk or reel or tray or cut tape
combinations is best for your circumstance? Have you leveraged your larger
relationship to negotiate preferred pricing? The older the product, the more
this type of knowledge accumulates in your BOM/AVL. This is especially true
for custom items like cable assemblies, plastics, sheet metal, and machined
parts.
Apple, Cisco, and other leading outsourcers provide their costed BOMs.
Why? Because it’s dramatically more efficient and much more likely to lower
costs. It’s more efficient because the EMS company does not have to chase
after low cost, highly custom, or poorly specified material.The odds of
suppliers magically discovering lower material costs are actually quite low,
especially for electronic components (see our article on how components
are priced). They’re much more likely to actually identify lower costs for you
when they can focus their efforts on the cost drivers instead of chasing after
every low value component.
Savvy buyers must know which region of the world is currently pricing their
commodities the best, so that’s what DigiSource can do for you. We
maintain a network of contacts that allow us access to sourcing around
the globe. This is often very sensitive, so we work closely with you to make
sure any existing domestic supply chain relationships are honored.
Lean Insight 1
All powerful Program Managers.
Program Managers should run the show. They are responsible for satisfying
your requirements, and they should have the authority to make it happen.
Your Program Manager inputs your BOM, orders your fabs, communicates
your specifications to Manufacturing Engineering, controls your documents,
and plans the floor. Everyone in the building follows the lead of your
Program Manager. They do this because in a service relationship, the most
important value is delivered at the point of contact with the customer. Being
outstanding in a service industry like contract manufacturing is all about
enabling and supporting the team members in direct contact with you.
Lean Insight 2
Dual BOM’s.
We know, this is heresy, but it’s phenomenally successful. Your BOM is used
in the costing tool, which is usually used for ERP import, which drives
material planning (see ‘instant BOM import’ below to understand why). The
original documents can also be passed to Manufacturing Engineering which
uses them for programming the manufacturing equipment. The two BOM’s
meet at the kitting/feeder set up stage when the Picklist gets matched up
with the Traveler. This is not only much more efficient, it creates a closed
loop feedback channel that automatically double checks for simple errors,
like data entry.
Lean Insight 3
No dedicated document control.
Step 5: Manufacturing
Double Check #1
Manufacturing Engineering starts fresh.
Double Check #2
BOM compare at kitting.
With two BOMs in play, at kitting the Picklist BOM (from Program
Management) and be compared to the Traveler BOM (from Engineering). The
Picklist is generated by ERP and drives material. The Traveler is generated
independently by manufacturing engineering. Cross-checking at this stage
verifies correct BOM entry, including internal part number, quantity per, and
AVL manufacturer part number, and packages.
Ah, feeders. OEMs seldom realize it, but a contract manufacturer’s investment in
feeders can equal or even exceed the investment in SMT equipment. If you want to
ask a savvy question next time you visit a PCB assembly operation, inquire as to how
many feeders they have. You’re probably looking for an answer of about 200
feeders per line. They need enough feeders to have each line running and a set up
waiting for each line. If you want to know if they have enough feeders for your
work, count how many SMT parts are in your largest BOM, times that by two, then
times that by the number of SMT lines at the contract manufacturer, and that’s how
many feeders you need them to have (actually you should perform this calculation
on the contract manufacturers largest build but for good reasons that’s hard to
know).
Double Check #3
Now do a full audit.
Once the feeders are set up a full QA is crucial before the line starts. This
should always be done by someone other than the operator who set up the
feeders, ideally it should be done by the Quality department. The audit
confirms the correct part is in the correct feeder location. Best practice is to
also confirm the values of capacitors and resistors since these items are too
small for part markings.
Post Feeder Setup QA
This is another area where a human step can be eliminated. Using Valor, for
example, the job can be checked for potential manufacturing problems, then
Valor can directly program most SMT equipment on the line (most contract
manufacturers use the equipment vendors software to program, meaning up to
four different software packages to cover SPI, SMT, AOI, and AXI programming).
About 75% of programming time is related to developing a library of components
for each equipment supplier. By working to integrate Valor libraries with
equipment libraries a contract manufacturer can greatly reduce programming
time and improve optimization quality (this is a really big deal!).
The capacity of SMT lines is expressed in component placements per hour (CPH).
CPH ratings can be taken from manufacturer max rating, from an IPC standard
rating, or from actual boards. The rating from actual boards is the only one worth
paying attention to, and is derived from programming simulations of actual
boards and verified with actual results down the line. Most industry SMT lines run
two pick & place machines and have an actual CPH of about 25,000. Advanced
lines deploy two or three high speed SMT placement machines and reach line
capacity of 100K-125K CPH actual. Put another way, a modern line can have the
capacity of a four-line SMT operation with half the overhead... more cost savings
that can be passed to you.
The manufacturing sequence on a SMT line are solder paste printing, SMT
placement, solder reflow oven, and wash. Of defects induced on a SMT
manufacturing line, substantially all of them are related to either solder paste or
the reflow oven. Exactly how each EMS develops its printing processes and oven
profiles is proprietary, but there are a few best practices we can share...
60-70% of SMT manufacturing defects can be traced back to paste printing. Keys
to successful printing are selecting the most optimal paste and the best tools
(stencil and squeegee blade). Solder paste consists of solder powder and liquid
flux. The solder powder is comprised of metal alloys chosen for the specific
application. The particle size of the solder powder varies, and the needle that
dispenses the paste must be sized accordingly. The table below is best practice
starting point for selection of solder paste/needle size combinations:
Laser cut stencils are made directly from CAD data which improves
process control and can produce aperture widths as small as
0.004" with an accuracy of 0.0005". When appropriate, laser
cutting can produce tapered apertures, an angle of about 2° is best
practice for optimal solder paste release.
There are two approaches to oven profiles, ramp-to-spike profiles (also called
ramp-to-peak or tent profile) and the soak profile. Most common is soak profiles
on 9 zone ovens. There are four basic stages: preheat, pre-reflow, reflow, and
cooling. During pre-heat the assembly’s temperature is raised from ambient to a
target temperature at a rate that can vary from 0.5 to 2.0°C per second. About
0.78°C per second is a good baseline best practice for average board sizes and
densities. As the board moves between zones the goal is for each area of the
board to heat evenly, temp differences between areas is called delta T, a delta T of
≤40°C is best practice. At pre-reflow, also called the “soak” phase, the goal is to
bring the entire board to exactly the same temperature everywhere across the
assembly. During this phase the component leads are prepared for bonding with
solder by the flux activator, which removes surface oxide. The soak phase is critical
to preventing voiding in all it’s forms, and is especially critical for hidden lead
packages (BGA, LGA, QFN, etc.). At the reflow phase, the temperature of the
assembly is raised just high enough to cause the solder to liquify (the "liquidus")
and form a metallic bond with the component leads. Best practices are to raise the
assembly’s peak temperature to 20-30°C above liquidus and hold it there for a TAL
(time-above-liquidus) of 30-90 seconds. During the cooling phase the objective is
rapid cooling, because rapid cooling produces the most reliable long term solder
joint by inducing a fine grain structure in the solidifying solder. However, if the
cooling is too rapid solder joints will crack from thermal stress caused by different
coefficients of thermal expansion between the component leads and the solder.
Best practice is a cooling rate of 4°C per second.
Once the first assembly completes reflow, the line shouild be stopped while
independent quality auditors verify the process. The assembly is first visually
inspected, then should undergoe automated optical inspection When needed
the board should be inspected with automated x-ray. When these steps are
complete, the board should undergoes a final visual inspection, then the line
can resumes production.
What to do next...
You can easily review our suggested cost model to check EMS
competitiveness. You can get most of the Early Process Prep
benefits with our Production Readiness Report. And if you need
help finding an EMS that meets our pricing and quality standards
you can contact us and we will introduce you to some (it's free).