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Apw8804e Anpec
Apw8804e Anpec
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Pin Configuration
APW8804E
NC 1 10 PVDD
LX 2 9 PVDD
LX 3 11 8 VDD
POK 4 GND 7 NC
EN 5 6 FB
TDFN 3X3-10
(Top View)
11
GND Exposed pad
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-
mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
Thermal Characteristics
Symbol Parameter Typical Value Unit
(Note 2)
Junction-to-Ambient Resistance in Free Air
θJA o
C/W
TDFN3x3-10 50
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. The exposed pad
of TDFN3x3-10 is soldered directly on the PCB.
Electrical Characteristics
Unless otherwise specified, these specifications apply over VVDD=VPVDD=5V, TA=25oC.
APW8804E
Symbo Parameter Test Conditions Unit
Min. Typ. Max.
SUPPLY CURRENT
I VDD VDD Supply Current V FB=0.7V - 65 - µA
I VDD_SDH VDD Shutdown Supply Current EN=GND - - 1 µA
POWER-ON-RESET (POR)
VDD POR Voltage Threshold V VDD Rising 2.3 2.4 2.5 V
VDD POR Hysteresis - 0.2 - V
PVDD POR Voltage Threshold 2.3 2.4 2.5 V
PVDD POR Hysteresis - 0.2 - V
REFERENCE VOLTAGE
- 0.6 - V
VREF Reference Voltage
All temperature -1 - +1 %
Output Accuracy I OUT=10mA~3A, VVDD=2.6~5V -1.5 - +1.5 %
APW880 4E
S ym bo Parameter Tes t Condit ions Unit
Min. Typ. Max.
Pin Description
PIN
FUNCTION
NO. NAME
1 NC No Connection.
Power Switching Output. LX is the Junction of the high-side and low-side Power MOSFETs to
2,3 LX supply power to the output LC filter.
Power Good Output. This pin is open-drain logic output that is pulled to the ground when the output
4 POK
voltage is out of regulation point.
Enable Input. EN is a digital input that turns the regulator on or off. Drive EN high to turn on the
5 EN
regulator, drive it low to turn it off.
Output Feedback Input. The APW8804E senses the feedback voltage via FB and regulates the
6 FB voltage at 0.6V. Connecting FB with a resistor-divider from the converter’s output sets the output
voltage.
7 NC No connection.
Signal Input. VDD supplies the control circuitry, gate drivers. Connecting a ceramic bypass
8 VDD
capacitor from VDD to GND to eliminate switching noise and voltage ripple on the input to the IC.
Power Input. PVDD supplies the step-down converter switches. Connecting a ceramic bypass
9,10 PVDD
capacitor from PVDD to GND to eliminate switching noise and voltage ripple on the input to the IC.
GND Ground and Exposed pad. Connect the exposed pad to the system ground plan with large copper
11
(Exposed Pad) area for dissipating heat into the ambient air.
80 0.61
75 0.6
VOUT=1.8V
70 0.59
65 0.58
60 0.57
VIN=5V
55 0.56
50 0.55
0.01 0.1 1 10 2.5 3 3.5 4 4.5 5 5.5
7 150
VIN Supply Current, IDD(uA)
6 125
5
100
4
75
3
50
2
25
1
0 0
2.5 3 3.5 4 4.5 5 5.5 2.5 3 3.5 4 4.5 5 5.5
Operating Waveforms
Refer to the typical application circuit. The test condition is VIN=5V, TA= 25oC unless otherwise specified.
V EN V EN
1 1
VOUT V OUT
2 2
V POK
VPOK
3 3
IL
IL 4
VOUT
VOUT
1
VPOK
VPOK
2 1
2
IL
IL 3
Operating Waveforms
Refer to the typical application circuit. The test condition is VIN=5V, TA= 25oC unless otherwise specified.
VOUT
VOUT
1
1
V LX
VLX
2 2
IL
IL
3 3
IOUT=200mA IOUT=3A
Block Diagram
VDD PVDD
Current Sense
LOC
Amplifier
Over Power-On- Current
Temperature Reset Limit Zero Crossing
Protection
Comparator
POR
125%VREF OTP
OVP
Fault
66%V RE Logics
F
UVP
Inhibit
Gate LX
125%VREF
Control
POK
Gate
90%VREF Current Driver
Error Compartor
Amplifier Gat
e
FB Gm
Current Sense
Oscillator Amplifier
Shutdown GND
EN POK
VIN L1 VOUT
5V 1µH
1.8V/3A
PVDD LX
R1
R3 24k COUT
CIN
100k 22µF
VDD FB 22µFx2
APW8804E R2
POK 12k
ON GND
OFF EN
VIN L1 VOUT
1µH
2~5.5V 1V/3A
PVDD LX
VDD CIN R1
2.6~5.5V 22µF 10k COUT
VDD FB 22µFx2
R3 CVDD
100k 1µF APW8804E R2
POK 15k
ON GND
OFF EN
Function Description
VDD and PVDD Power-On-Reset (POR) with a 50 oC hysteresis to lower the average TJ during
The APW8804E keeps monitoring the voltage on VDD continuous thermal overload conditions, increasing life-
and PVDD pins to prevent wrong logic operations which time of the APW8804E.
may occur when VDD or PVDD voltage is not high enough Current-Limit Protection
for internal control circuitry to operate. The VDD POR ris-
The APW8804E monitors the output current, flows through
ing threshold is 2.4V (typical) with 0.2V hysteresis and
the high-side and low-side power MOSFETs, and limits
PVDD POR rising threshold is 1.7V with 0.2V hysteresis.
the current peak at current-limit level to prevent the IC
During start-up, the VDD and PVDD voltage must exceed
from damaging during overload, short-circuit and over-
the POR threshold. Then, the IC starts a start-up process
voltage conditions. Typical high side power MOSFET cur-
and ramps up the output voltage to the voltage target.
rent limit is 5A, and low side MOSFET current limit is -1A.
The over-temperature circuit limits the junction tempera- Enable and Shutdown
ture of the APW8804E. When the junction temperature
Driving EN to ground places the APW8804E in shutdown.
exceeds TJ=+160oC, a thermal sensor turns off the both
In shutdown mode, the internal power MOSFETs turn off,
power MOSFETs, allowing the devices to cool. The ther-
all internal circuitry shuts down and the quiescent supply
mal sensor allows the converters to start a start-up pro-
current reduces to less than 1µA.
cess and to regulate the output voltage again after the
junction temperature cools by 50oC. The OTP is designed
Application Information
Input Capacitor Selection shown in “Typical Application Circuits”. A suggestion of
Because buck converters have a pulsating input current, maximum value of R2 is 200kΩ to keep the minimum
a low ESR input capacitor is required. This results in the current that provides enough noise rejection ability through
best input voltage filtering, minimizing the interference the resistor divider. The output voltage can be calculated
with other circuits caused by high input voltage spikes. as below:
Also, the input capacitor must be sufficiently large to sta- R1 R1
VOUT = VREF ⋅ 1 + = 0.6 ⋅ 1 +
bilize the input voltage during heavy load transients. For R2 R2
Inductor Selection
Output Capacitor Selection
For high efficiencies, the inductor should have a low DC
The current-mode control scheme of the APW8804E al-
resistance to minimize conduction losses. Especially at
lows the use of tiny ceramic capacitors. The higher ca-
high-switching frequencies, the core material has a
pacitor value provides the good load transients response.
higher impact on efficiency. When using small chip
Ceramic capacitors with low ESR values have the lowest
inductors, the efficiency is reduced mainly due to higher
output voltage ripple and are recommended. If required,
inductor core losses. This needs to be considered when
tantalum capacitors may be used as well. The output
selecting the appropriate inductor. The inductor value de-
ripple is the sum of the voltages across the ESR and the
termines the inductor ripple current. The larger the induc-
ideal output capacitor.
tor value, the smaller the inductor ripple current and the
lower the conduction losses of the converter. Conversely, V
VOUT ⋅ 1 − OUT
VIN ⋅ ESR + 1
larger inductor values cause a slower load transient ∆VOUT ≅
FSW ⋅ L 8 ⋅ FSW ⋅ COUT
response. A reasonable starting point for setting ripple
current, ∆IL, is 40% of maximum output current. The rec- When choosing the input and output ceramic capacitors,
ommended inductor value can be calculated as below: choose the X5R or X7R dielectric formulations. These
V dielectrics have the best temperature and voltage char-
VOUT 1 − OUT
VIN acteristics of all the ceramics for a given value and size.
L≥
FSW ⋅ ∆IL
IL CIN
VDD
ILIM
LX
IPEAK
L1
∆IL
IOUT
VOUT
GND
R1
R2
IP-FET
COUT
Via To VOUT
TDFN3x3-10
ThermalVia diameter
Layout Consideration Ground plane for
12mil X 5 ThermalPAD
For all switching power supplies, the layout is an impor- 0.275
0.75
tant step in the design; especially at high peak currents
0.3
and switching frequencies. If the layout is not carefully
done, the regulator might show noise problems and duty
cycle jitter.
2.70
VVDD
VPVDD VUV(TH)
VEN VEN(TH)
VOUT
VEN(TH) occurs after
VUV(TH) is reached
Package Information
TDFN3x3-10
D A
b
Pin 1
D2 A1
A3
Pin 1
E2
Corner
L
S TDFN3x3-10
Y
M MILLIMETERS INCHES
B
O
L MIN. MAX. MIN. MAX.
A 0.70 0.80 0.028 0.031
A1 0.00 0.05 0.000 0.002
A3 0.20 REF 0.008 REF
b 0.18 0.30 0.007 0.012
D 2.90 3.10 0.114 0.122
D2 2.20 2.70 0.087 0.106
E 2.90 3.10 0.114 0.122
E2 1.40 1.75 0.055 0.069
e 0.50 BSC 0.020 BSC
L 0.30 0.50 0.012 0.020
K 0.20 0.008
Note : 1. Followed from JEDEC MO-229 VEED-5.
E1
F
W
B0
K0 A0 A
OD1 B
B
SECTION A-A
T
SECTION B-B
d
H
A
T1
Application A H T1 C d D W E1 F
12.4+2.00 13.0+0.50
330.0±2.00 50 MIN. 1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05
-0.00 -0.20
TDFN3x3-10 P0 P1 P2 D0 D1 T A0 B0 K0
1.5+0.10 0.6+0.00
4.0±0.10 8.0±0.10 2.0±0.05 1.5 MIN. 3.30±0.20 3.30±0.20 1.30±0.20
-0.00 -0.40
(mm)
Classification Profile
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